DE60024128D1 - Gedruckte leiterplatte mit verlustbehaftetem stromverteilungsnetzwerk zur reduzierung von stromspeisungsebene-resonanzen - Google Patents

Gedruckte leiterplatte mit verlustbehaftetem stromverteilungsnetzwerk zur reduzierung von stromspeisungsebene-resonanzen

Info

Publication number
DE60024128D1
DE60024128D1 DE60024128T DE60024128T DE60024128D1 DE 60024128 D1 DE60024128 D1 DE 60024128D1 DE 60024128 T DE60024128 T DE 60024128T DE 60024128 T DE60024128 T DE 60024128T DE 60024128 D1 DE60024128 D1 DE 60024128D1
Authority
DE
Germany
Prior art keywords
distribution network
power distribution
loss
power supply
supply level
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60024128T
Other languages
English (en)
Other versions
DE60024128T2 (de
Inventor
Istvan Novak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sun Microsystems Inc
Original Assignee
Sun Microsystems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sun Microsystems Inc filed Critical Sun Microsystems Inc
Application granted granted Critical
Publication of DE60024128D1 publication Critical patent/DE60024128D1/de
Publication of DE60024128T2 publication Critical patent/DE60024128T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233—Filters, inductors or a magnetic substance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
DE60024128T 1999-11-23 2000-11-17 Gedruckte leiterplatte mit verlustbehaftetem stromverteilungsnetzwerk zur reduzierung von stromspeisungsebene-resonanzen Expired - Fee Related DE60024128T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/447,513 US6441313B1 (en) 1999-11-23 1999-11-23 Printed circuit board employing lossy power distribution network to reduce power plane resonances
US447513 1999-11-23
PCT/US2000/031686 WO2001039562A1 (en) 1999-11-23 2000-11-17 Printed circuit board employing lossy power distribution network to reduce power plane resonances

Publications (2)

Publication Number Publication Date
DE60024128D1 true DE60024128D1 (de) 2005-12-22
DE60024128T2 DE60024128T2 (de) 2006-06-29

Family

ID=23776677

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60024128T Expired - Fee Related DE60024128T2 (de) 1999-11-23 2000-11-17 Gedruckte leiterplatte mit verlustbehaftetem stromverteilungsnetzwerk zur reduzierung von stromspeisungsebene-resonanzen

Country Status (6)

Country Link
US (3) US6441313B1 (de)
EP (1) EP1232679B1 (de)
AT (1) ATE310374T1 (de)
AU (1) AU1921701A (de)
DE (1) DE60024128T2 (de)
WO (1) WO2001039562A1 (de)

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US10070547B2 (en) * 2014-02-26 2018-09-04 Sparton Corporation Control of electric field effects in a printed circuit board assembly using embedded nickel-metal composite materials
CN111430991B (zh) 2015-07-07 2022-02-11 安费诺富加宜（亚洲）私人有限公司 电连接器
CN106714449B (zh) * 2015-07-16 2019-05-07 台达电子企业管理（上海）有限公司 过孔结构及具有该过孔结构的电路板
DE102016113125A1 (de) 2016-07-15 2018-01-18 Vsm-Vereinigte Schmirgel- Und Maschinen-Fabriken Ag Verfahren zum Herstellen eines Schleifkorns und Schleifkorn
CN109863650B (zh) 2016-08-23 2020-10-02 安费诺有限公司 可配置为高性能的连接器
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US10798818B2 (en) * 2017-04-13 2020-10-06 Astec International Limited Power supplies including shielded multilayer power transmission boards
US10993333B2 (en) * 2017-07-15 2021-04-27 Sanmina Corporation Methods of manufacturing ultra thin dielectric printed circuit boards with thin laminates
CN208862209U (zh) 2018-09-26 2019-05-14 安费诺东亚电子科技(深圳)有限公司 一种连接器及其应用的pcb板
TW202135385A (zh) 2020-01-27 2021-09-16 美商Ｆｃｉ美國有限責任公司 高速連接器
TW202147716A (zh) 2020-01-27 2021-12-16 美商Ｆｃｉ美國有限責任公司 高速及高密度之直接耦合垂直式連接器
CN215816516U (zh) 2020-09-22 2022-02-11 安费诺商用电子产品(成都)有限公司 电连接器
CN213636403U (zh) 2020-09-25 2021-07-06 安费诺商用电子产品(成都)有限公司 电连接器

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Also Published As

Publication number Publication date
US6894230B2 (en) 2005-05-17
EP1232679B1 (de) 2005-11-16
US6441313B1 (en) 2002-08-27
WO2001039562A1 (en) 2001-05-31
DE60024128T2 (de) 2006-06-29
AU1921701A (en) 2001-06-04
US20030015344A1 (en) 2003-01-23
ATE310374T1 (de) 2005-12-15
EP1232679A1 (de) 2002-08-21
US6753481B2 (en) 2004-06-22
US20040163846A1 (en) 2004-08-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee