DE60030267D1 - Wärmeableitung von einer leiterplatte mit blossen chips - Google Patents
Wärmeableitung von einer leiterplatte mit blossen chipsInfo
- Publication number
- DE60030267D1 DE60030267D1 DE60030267T DE60030267T DE60030267D1 DE 60030267 D1 DE60030267 D1 DE 60030267D1 DE 60030267 T DE60030267 T DE 60030267T DE 60030267 T DE60030267 T DE 60030267T DE 60030267 D1 DE60030267 D1 DE 60030267D1
- Authority
- DE
- Germany
- Prior art keywords
- chips
- circuit board
- light plate
- compression modulus
- heat spreader
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/295,081 US6162663A (en) | 1999-04-20 | 1999-04-20 | Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
US295081 | 1999-04-20 | ||
PCT/US2000/010561 WO2000063968A1 (en) | 1999-04-20 | 2000-04-19 | Dissipation of heat from a circuit board having bare silicon chips mounted thereon |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60030267D1 true DE60030267D1 (de) | 2006-10-05 |
DE60030267T2 DE60030267T2 (de) | 2007-07-05 |
Family
ID=23136132
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60030267T Expired - Lifetime DE60030267T2 (de) | 1999-04-20 | 2000-04-19 | Wärmeableitung von einer leiterplatte mit blossen chips |
Country Status (9)
Country | Link |
---|---|
US (1) | US6162663A (de) |
EP (1) | EP1171914B1 (de) |
JP (2) | JP5084987B2 (de) |
KR (1) | KR100742521B1 (de) |
AT (1) | ATE337614T1 (de) |
DE (1) | DE60030267T2 (de) |
MX (1) | MXPA01010665A (de) |
TW (1) | TW549011B (de) |
WO (1) | WO2000063968A1 (de) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6342398B1 (en) * | 1998-12-17 | 2002-01-29 | Taiwan Semiconductor Manufacturing Company | Method of backside emission analysis for BGA packaged IC's |
US6399209B1 (en) * | 1999-04-16 | 2002-06-04 | The Bergquist Company | Integrated release films for phase-change interfaces |
US6605238B2 (en) * | 1999-09-17 | 2003-08-12 | Honeywell International Inc. | Compliant and crosslinkable thermal interface materials |
US6794030B1 (en) | 1999-11-30 | 2004-09-21 | 3M Innovative Properties Company | Heat conductive sheet and method of producing the sheet |
JP2001168246A (ja) * | 1999-11-30 | 2001-06-22 | Three M Innovative Properties Co | 熱伝導性シート及びその製造方法 |
US6673434B2 (en) | 1999-12-01 | 2004-01-06 | Honeywell International, Inc. | Thermal interface materials |
US7075112B2 (en) * | 2001-01-31 | 2006-07-11 | Gentex Corporation | High power radiation emitter device and heat dissipating package for electronic components |
US7060747B2 (en) * | 2001-03-30 | 2006-06-13 | Intel Corporation | Chain extension for thermal materials |
US6469379B1 (en) | 2001-03-30 | 2002-10-22 | Intel Corporation | Chain extension for thermal materials |
JP4796704B2 (ja) * | 2001-03-30 | 2011-10-19 | 株式会社タイカ | 押出可能な架橋済グリース状放熱材を充填・封入した容器の製法 |
EP1383169B1 (de) * | 2001-04-23 | 2014-06-04 | Shin-Etsu Chemical Co., Ltd. | Wärmeabstrahlglied |
US6617683B2 (en) * | 2001-09-28 | 2003-09-09 | Intel Corporation | Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material |
US6597575B1 (en) | 2002-01-04 | 2003-07-22 | Intel Corporation | Electronic packages having good reliability comprising low modulus thermal interface materials |
US7208192B2 (en) | 2002-05-31 | 2007-04-24 | Parker-Hannifin Corporation | Thermally or electrically-conductive form-in-place gap filter |
US6992893B2 (en) * | 2003-01-10 | 2006-01-31 | Hewlett-Packard Development Company, L.P. | Heat sink attachment |
US8119191B2 (en) | 2003-01-16 | 2012-02-21 | Parker-Hannifin Corporation | Dispensable cured resin |
US6921974B2 (en) * | 2003-03-28 | 2005-07-26 | United Test & Assembly Center Ltd. | Packaged device with thermal enhancement and method of packaging |
WO2005024940A1 (ja) * | 2003-08-28 | 2005-03-17 | Fujitsu Limited | パッケージ構造、それを搭載したプリント基板、並びに、かかるプリント基板を有する電子機器 |
US20060237168A1 (en) * | 2005-04-21 | 2006-10-26 | Belady Christian L | Air mover with thermally coupled guide vanes |
US7326032B2 (en) * | 2005-10-31 | 2008-02-05 | Hewlett-Packard Development Company, L.P. | Cooling fan with adjustable tip clearance |
US7447019B2 (en) * | 2005-10-31 | 2008-11-04 | Hewlett-Packard Development Company, L.P. | Computer having an axial duct fan |
US7443671B2 (en) * | 2005-10-31 | 2008-10-28 | Hewlett-Packard Development Company, L.P. | Axial duct cooling fan |
US7558061B2 (en) * | 2006-08-04 | 2009-07-07 | Hewlett-Packard Development Company, L.P. | Cooling fan module |
US20080068803A1 (en) * | 2006-09-18 | 2008-03-20 | Shyh-Ming Chen | Heat dissipating device holder structure with a thin film thermal conducting medium coating |
US20080067669A1 (en) * | 2006-09-18 | 2008-03-20 | Buttel Nicole A | Systems, devices and methods for controlling thermal interface thickness in a semiconductor die package |
US9795059B2 (en) | 2007-11-05 | 2017-10-17 | Laird Technologies, Inc. | Thermal interface materials with thin film or metallization |
US8445102B2 (en) * | 2007-11-05 | 2013-05-21 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
US8545987B2 (en) * | 2007-11-05 | 2013-10-01 | Laird Technologies, Inc. | Thermal interface material with thin transfer film or metallization |
US8076773B2 (en) * | 2007-12-26 | 2011-12-13 | The Bergquist Company | Thermal interface with non-tacky surface |
US20090208722A1 (en) * | 2008-02-18 | 2009-08-20 | John Francis Timmerman | Oriented Members for Thermally Conductive Interface Structures |
WO2011019719A1 (en) | 2009-08-12 | 2011-02-17 | Parker-Hannifin Corporation | Fully-cured thermally or electrically-conductive form-in-place gap filler |
JP5614909B2 (ja) * | 2012-03-02 | 2014-10-29 | 富士高分子工業株式会社 | パテ状伝熱材及びその製造方法 |
WO2014136503A1 (ja) * | 2013-03-07 | 2014-09-12 | 日産自動車株式会社 | 回転電機 |
US20150092352A1 (en) * | 2013-09-29 | 2015-04-02 | International Business Machines Corporation | Thermal Interface Solution With Reduced Adhesion Force |
US11121125B2 (en) | 2018-12-12 | 2021-09-14 | Micron Technology, Inc. | Thermal chamber for a thermal control component |
USD893484S1 (en) | 2018-12-12 | 2020-08-18 | Micron Technology, Inc. | Thermal control component |
US11493550B2 (en) | 2019-12-11 | 2022-11-08 | Micron Technology, Inc. | Standalone thermal chamber for a temperature control component |
US11334129B2 (en) | 2019-12-11 | 2022-05-17 | Micron Technology, Inc. | Temperature control component for electronic systems |
WO2022113921A1 (ja) * | 2020-11-25 | 2022-06-02 | 信越化学工業株式会社 | 半導体パッケージ及びその製造方法 |
TW202302722A (zh) | 2021-03-04 | 2023-01-16 | 美商摩曼帝夫特性材料公司 | 散熱凝膠組合物 |
Family Cites Families (31)
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US3020260A (en) * | 1960-08-18 | 1962-02-06 | Dow Corning | Organosiloxane potting compound |
US4600261A (en) * | 1982-10-12 | 1986-07-15 | Raychem Corporation | Apparatus and method for protection of electrical contacts |
US5357057A (en) * | 1982-10-12 | 1994-10-18 | Raychem Corporation | Protected electrical connector |
US4634207A (en) * | 1982-10-12 | 1987-01-06 | Raychem Corporation | Apparatus and method for protection of a substrate |
US4654754A (en) * | 1982-11-02 | 1987-03-31 | Fairchild Weston Systems, Inc. | Thermal link |
US4777063A (en) * | 1985-05-02 | 1988-10-11 | Raychem Corporation | Curable organopolysiloxane composition |
US4595635A (en) * | 1985-05-02 | 1986-06-17 | Raychem Corporation | Organopolysiloxane materials having decreased surface tack |
EP0461185A1 (de) * | 1989-03-01 | 1991-12-18 | Raychem Corporation | Verfahren zum härten von organopolysiloxanzusammensetzungen sowie zusammensetzungen daraus |
US4979074A (en) * | 1989-06-12 | 1990-12-18 | Flavors Technology | Printed circuit board heat sink |
JPH087535Y2 (ja) * | 1989-07-17 | 1996-03-04 | 三菱電機株式会社 | 光ピックアップ装置 |
US5227663A (en) * | 1989-12-19 | 1993-07-13 | Lsi Logic Corporation | Integral dam and heat sink for semiconductor device assembly |
US5175612A (en) * | 1989-12-19 | 1992-12-29 | Lsi Logic Corporation | Heat sink for semiconductor device assembly |
US5104930A (en) * | 1990-02-27 | 1992-04-14 | Raychem Corporation | Polyurea gel compositions and articles therefrom |
US5291371A (en) * | 1990-04-27 | 1994-03-01 | International Business Machines Corporation | Thermal joint |
US5060114A (en) * | 1990-06-06 | 1991-10-22 | Zenith Electronics Corporation | Conformable pad with thermally conductive additive for heat dissipation |
US5315480A (en) * | 1991-11-14 | 1994-05-24 | Digital Equipment Corporation | Conformal heat sink for electronic module |
US5268815A (en) * | 1992-02-14 | 1993-12-07 | International Business Machines Corporation | High density, high performance memory circuit package |
US5440172A (en) * | 1993-06-28 | 1995-08-08 | Sundstrand Corporation | Integral heat sink interface |
US5467251A (en) * | 1993-10-08 | 1995-11-14 | Northern Telecom Limited | Printed circuit boards and heat sink structures |
KR970005712B1 (ko) * | 1994-01-11 | 1997-04-19 | 삼성전자 주식회사 | 고 열방출용 반도체 패키지 |
MY112145A (en) * | 1994-07-11 | 2001-04-30 | Ibm | Direct attachment of heat sink attached directly to flip chip using flexible epoxy |
KR970706356A (ko) * | 1994-09-30 | 1997-11-03 | 허버트 지. 버카드 | 고도의 응력완화율을 나타내는 실리콘 밀봉물질(Silicone Sealing Material Exhibiting High Stress Relaxation) |
US5604978A (en) * | 1994-12-05 | 1997-02-25 | International Business Machines Corporation | Method for cooling of chips using a plurality of materials |
AU4705096A (en) * | 1995-01-27 | 1996-08-14 | Raychem Corporation | Gels from anhydride-containing polymers |
TW373308B (en) * | 1995-02-24 | 1999-11-01 | Agere Systems Inc | Thin packaging of multi-chip modules with enhanced thermal/power management |
US5741579A (en) * | 1995-04-28 | 1998-04-21 | Shin-Etsu Polymer Co., Ltd. | Heat-conductive sheet |
JPH0982882A (ja) * | 1995-09-20 | 1997-03-28 | Nec Corp | マルチチップモジュール |
JPH08208993A (ja) * | 1995-11-27 | 1996-08-13 | Toshiba Silicone Co Ltd | 熱伝導性シリコーン組成物 |
US5847929A (en) * | 1996-06-28 | 1998-12-08 | International Business Machines Corporation | Attaching heat sinks directly to flip chips and ceramic chip carriers |
US5812374A (en) * | 1996-10-28 | 1998-09-22 | Shuff; Gregg Douglas | Electrical circuit cooling device |
JP3479206B2 (ja) * | 1997-07-09 | 2003-12-15 | 北川工業株式会社 | 熱伝導スペーサ |
-
1999
- 1999-04-20 US US09/295,081 patent/US6162663A/en not_active Expired - Lifetime
-
2000
- 2000-04-19 MX MXPA01010665A patent/MXPA01010665A/es unknown
- 2000-04-19 WO PCT/US2000/010561 patent/WO2000063968A1/en active Search and Examination
- 2000-04-19 KR KR1020017013327A patent/KR100742521B1/ko not_active IP Right Cessation
- 2000-04-19 AT AT00926149T patent/ATE337614T1/de not_active IP Right Cessation
- 2000-04-19 JP JP2000613001A patent/JP5084987B2/ja not_active Expired - Fee Related
- 2000-04-19 DE DE60030267T patent/DE60030267T2/de not_active Expired - Lifetime
- 2000-04-19 EP EP00926149A patent/EP1171914B1/de not_active Expired - Lifetime
- 2000-04-20 TW TW089107456A patent/TW549011B/zh not_active IP Right Cessation
-
2011
- 2011-10-14 JP JP2011227237A patent/JP2012054578A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
KR20020005694A (ko) | 2002-01-17 |
EP1171914B1 (de) | 2006-08-23 |
EP1171914A1 (de) | 2002-01-16 |
JP5084987B2 (ja) | 2012-11-28 |
KR100742521B1 (ko) | 2007-08-02 |
JP2012054578A (ja) | 2012-03-15 |
TW549011B (en) | 2003-08-21 |
DE60030267T2 (de) | 2007-07-05 |
ATE337614T1 (de) | 2006-09-15 |
WO2000063968A1 (en) | 2000-10-26 |
MXPA01010665A (es) | 2002-07-02 |
US6162663A (en) | 2000-12-19 |
JP2002542626A (ja) | 2002-12-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |