DE60030658D1 - Verfahren und Vorrichtung zur Überprüfung von Gegenständen - Google Patents
Verfahren und Vorrichtung zur Überprüfung von GegenständenInfo
- Publication number
- DE60030658D1 DE60030658D1 DE60030658T DE60030658T DE60030658D1 DE 60030658 D1 DE60030658 D1 DE 60030658D1 DE 60030658 T DE60030658 T DE 60030658T DE 60030658 T DE60030658 T DE 60030658T DE 60030658 D1 DE60030658 D1 DE 60030658D1
- Authority
- DE
- Germany
- Prior art keywords
- checking objects
- checking
- objects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4788—Diffraction
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/48—Laser speckle optics
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4788—Diffraction
- G01N2021/479—Speckle
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/443,247 US6369888B1 (en) | 1999-11-17 | 1999-11-17 | Method and apparatus for article inspection including speckle reduction |
US443247 | 1999-11-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60030658D1 true DE60030658D1 (de) | 2006-10-26 |
DE60030658T2 DE60030658T2 (de) | 2007-09-13 |
Family
ID=23760017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60030658T Expired - Fee Related DE60030658T2 (de) | 1999-11-17 | 2000-11-16 | Verfahren und Vorrichtung zur Überprüfung von Gegenständen |
Country Status (4)
Country | Link |
---|---|
US (7) | US6369888B1 (de) |
EP (1) | EP1102058B1 (de) |
JP (1) | JP5117645B2 (de) |
DE (1) | DE60030658T2 (de) |
Families Citing this family (87)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL99823A0 (en) * | 1990-11-16 | 1992-08-18 | Orbot Instr Ltd | Optical inspection method and apparatus |
US6629641B2 (en) * | 2000-06-07 | 2003-10-07 | Metrologic Instruments, Inc. | Method of and system for producing images of objects using planar laser illumination beams and image detection arrays |
US7584893B2 (en) * | 1998-03-24 | 2009-09-08 | Metrologic Instruments, Inc. | Tunnel-type digital imaging system for use within retail shopping environments such as supermarkets |
JPH11326827A (ja) * | 1998-05-20 | 1999-11-26 | Sony Corp | 光のコヒーレンス低減方法及びその装置、並びに、照明方法及びその装置 |
US6800859B1 (en) * | 1998-12-28 | 2004-10-05 | Hitachi, Ltd. | Method and equipment for detecting pattern defect |
US6693664B2 (en) | 1999-06-30 | 2004-02-17 | Negevtech | Method and system for fast on-line electro-optical detection of wafer defects |
US6369888B1 (en) * | 1999-11-17 | 2002-04-09 | Applied Materials, Inc. | Method and apparatus for article inspection including speckle reduction |
JP3858571B2 (ja) * | 2000-07-27 | 2006-12-13 | 株式会社日立製作所 | パターン欠陥検査方法及びその装置 |
US7401976B1 (en) * | 2000-08-25 | 2008-07-22 | Art Advanced Research Technologies Inc. | Detection of defects by thermographic analysis |
DE10042114A1 (de) * | 2000-08-28 | 2002-03-14 | Leica Microsystems | Verfahren zur Beleuchtung eines Objekts mit Licht einer Laserlichtquelle |
US8042740B2 (en) * | 2000-11-24 | 2011-10-25 | Metrologic Instruments, Inc. | Method of reading bar code symbols on objects at a point-of-sale station by passing said objects through a complex of stationary coplanar illumination and imaging planes projected into a 3D imaging volume |
US6693930B1 (en) * | 2000-12-12 | 2004-02-17 | Kla-Tencor Technologies Corporation | Peak power and speckle contrast reduction for a single laser pulse |
US20020126479A1 (en) * | 2001-03-08 | 2002-09-12 | Ball Semiconductor, Inc. | High power incoherent light source with laser array |
JP2003042967A (ja) * | 2001-07-27 | 2003-02-13 | Hitachi Ltd | パターン欠陥検査装置 |
US6927847B2 (en) * | 2001-09-13 | 2005-08-09 | Hitachi High-Technologies Corporation | Method and apparatus for inspecting pattern defects |
US6900888B2 (en) * | 2001-09-13 | 2005-05-31 | Hitachi High-Technologies Corporation | Method and apparatus for inspecting a pattern formed on a substrate |
JP2003130808A (ja) * | 2001-10-29 | 2003-05-08 | Hitachi Ltd | 欠陥検査方法及びその装置 |
US20040165242A1 (en) * | 2001-11-13 | 2004-08-26 | Jean-Louis Massieu | Compact optical and illumination system with reduced laser speckles |
JP2003185593A (ja) * | 2001-12-21 | 2003-07-03 | Nec Electronics Corp | ウェーハ外観検査装置 |
US6906305B2 (en) * | 2002-01-08 | 2005-06-14 | Brion Technologies, Inc. | System and method for aerial image sensing |
US7130039B2 (en) * | 2002-04-18 | 2006-10-31 | Kla-Tencor Technologies Corporation | Simultaneous multi-spot inspection and imaging |
US7359045B2 (en) * | 2002-05-06 | 2008-04-15 | Applied Materials, Israel, Ltd. | High speed laser scanning inspection system |
US6895149B1 (en) * | 2002-05-13 | 2005-05-17 | James Jeffery Jacob | Apparatus for beam homogenization and speckle reduction |
US6828542B2 (en) * | 2002-06-07 | 2004-12-07 | Brion Technologies, Inc. | System and method for lithography process monitoring and control |
DE10232781B4 (de) * | 2002-07-18 | 2013-03-28 | Vistec Semiconductor Systems Gmbh | Vorrichtung zur Wafer-Inspektion |
US6952256B2 (en) * | 2002-08-30 | 2005-10-04 | Kla-Tencor Technologies Corporation | Optical compensation in high numerical aperture photomask inspection systems for inspecting photomasks through thick pellicles |
CN102393398B (zh) * | 2002-09-30 | 2015-04-15 | 应用材料以色列公司 | 用于光学检测的照射系统 |
US6807503B2 (en) * | 2002-11-04 | 2004-10-19 | Brion Technologies, Inc. | Method and apparatus for monitoring integrated circuit fabrication |
GB2395289A (en) * | 2002-11-11 | 2004-05-19 | Qinetiq Ltd | Structured light generator |
US6847449B2 (en) * | 2002-11-27 | 2005-01-25 | The United States Of America As Represented By The Secretary Of The Navy | Method and apparatus for reducing speckle in optical coherence tomography images |
US7486861B2 (en) * | 2003-01-15 | 2009-02-03 | Negevtech Ltd. | Fiber optical illumination system |
ATE414274T1 (de) * | 2003-01-15 | 2008-11-15 | Negevtech Ltd | Verfahren und gerät zur schnellen on-line und elektro-optischen defekterkennung an wafern |
US7525659B2 (en) | 2003-01-15 | 2009-04-28 | Negevtech Ltd. | System for detection of water defects |
US6892013B2 (en) * | 2003-01-15 | 2005-05-10 | Negevtech Ltd. | Fiber optical illumination system |
US7142295B2 (en) * | 2003-03-05 | 2006-11-28 | Corning Incorporated | Inspection of transparent substrates for defects |
EP1455235A3 (de) * | 2003-03-07 | 2009-04-22 | ASML Netherlands B.V. | Lithographischer Apparat und Verfahren zur Herstellung eines Artikels |
US7053355B2 (en) | 2003-03-18 | 2006-05-30 | Brion Technologies, Inc. | System and method for lithography process monitoring and control |
US7365834B2 (en) * | 2003-06-24 | 2008-04-29 | Kla-Tencor Technologies Corporation | Optical system for detecting anomalies and/or features of surfaces |
JP4260587B2 (ja) * | 2003-09-18 | 2009-04-30 | 株式会社日立ハイテクノロジーズ | パターン欠陥検査装置 |
JP2007510963A (ja) * | 2003-11-10 | 2007-04-26 | テクノロジー イノヴェイションズ リミテッド ライアビリティ カンパニー | デジタル画像化組立品、及びその方法 |
US20050148881A1 (en) * | 2003-12-19 | 2005-07-07 | Fomitchov Ravel A. | High-frequency intensity-modulated incoherent optical source for biomedical optical imaging |
US7319229B2 (en) * | 2003-12-29 | 2008-01-15 | Kla-Tencor Technologies Corporation | Illumination apparatus and methods |
US20050165631A1 (en) * | 2004-01-28 | 2005-07-28 | Microsoft Corporation | Time management representations and automation for allocating time to projects and meetings within an online calendaring system |
JP2005337851A (ja) * | 2004-05-26 | 2005-12-08 | Hitachi High-Technologies Corp | 欠陥検査方法及びその装置 |
WO2006006148A2 (en) * | 2004-07-12 | 2006-01-19 | Negevtech Ltd. | Multi mode inspection method and apparatus |
US20060012781A1 (en) * | 2004-07-14 | 2006-01-19 | Negevtech Ltd. | Programmable spatial filter for wafer inspection |
US7586959B2 (en) * | 2004-09-27 | 2009-09-08 | Applied Materials, Israel, Ltd. | Speckle reduction with transparent blocks |
US7397552B2 (en) * | 2004-09-27 | 2008-07-08 | Applied Materials, Israel, Ltd. | Optical inspection with alternating configurations |
US7812324B2 (en) * | 2004-10-18 | 2010-10-12 | Macquarie University | Fluorescence detection |
US7391499B2 (en) * | 2004-12-02 | 2008-06-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
KR100694072B1 (ko) * | 2004-12-15 | 2007-03-12 | 삼성전자주식회사 | 레이저 반점을 제거한 조명계 및 이를 채용한 프로젝션시스템 |
US7375812B2 (en) * | 2005-02-22 | 2008-05-20 | Axsun Technologies, Inc. | Method and system for reducing parasitic spectral noise in tunable semiconductor source spectroscopy system |
US7804993B2 (en) * | 2005-02-28 | 2010-09-28 | Applied Materials South East Asia Pte. Ltd. | Method and apparatus for detecting defects in wafers including alignment of the wafer images so as to induce the same smear in all images |
US7813541B2 (en) * | 2005-02-28 | 2010-10-12 | Applied Materials South East Asia Pte. Ltd. | Method and apparatus for detecting defects in wafers |
WO2007016682A2 (en) * | 2005-08-02 | 2007-02-08 | Kla-Tencor Technologies Corporation | Systems configured to generate output corresponding to defects on a specimen |
US7535938B2 (en) * | 2005-08-15 | 2009-05-19 | Pavilion Integration Corporation | Low-noise monolithic microchip lasers capable of producing wavelengths ranging from IR to UV based on efficient and cost-effective frequency conversion |
US7413311B2 (en) * | 2005-09-29 | 2008-08-19 | Coherent, Inc. | Speckle reduction in laser illuminated projection displays having a one-dimensional spatial light modulator |
JP4996856B2 (ja) * | 2006-01-23 | 2012-08-08 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置およびその方法 |
US8031931B2 (en) * | 2006-04-24 | 2011-10-04 | Applied Materials South East Asia Pte. Ltd. | Printed fourier filtering in optical inspection tools |
US7659973B2 (en) | 2006-05-26 | 2010-02-09 | Applied Materials Southeast Asia, Pte Ltd. | Wafer inspection using short-pulsed continuous broadband illumination |
US7728954B2 (en) * | 2006-06-06 | 2010-06-01 | Asml Netherlands B.V. | Reflective loop system producing incoherent radiation |
US20080037933A1 (en) * | 2006-08-14 | 2008-02-14 | Negevtech, Ltd. | Speckle reduction using a fiber bundle and light guide |
US7714998B2 (en) * | 2006-11-28 | 2010-05-11 | Applied Materials South East Asia Pte. Ltd. | Image splitting in optical inspection systems |
US7719674B2 (en) * | 2006-11-28 | 2010-05-18 | Applied Materials South East Asia Pte. Ltd. | Image splitting in optical inspection systems |
DE102007027083A1 (de) * | 2007-06-12 | 2008-12-18 | Carl Zeiss Sms Gmbh | Mikroskopbeleuchtung |
US7738092B1 (en) | 2008-01-08 | 2010-06-15 | Kla-Tencor Corporation | System and method for reducing speckle noise in die-to-die inspection systems |
US7843558B2 (en) | 2008-06-25 | 2010-11-30 | Applied Materials South East Asia Pte. Ltd. | Optical inspection tools featuring light shaping diffusers |
GB2474193B (en) * | 2008-07-02 | 2012-09-26 | A H Beeley Pty Ltd | Apparatus and method of laparoscopic port site suture |
WO2010037106A2 (en) * | 2008-09-29 | 2010-04-01 | Kla-Tencor Corporation | Illumination subsystems of a metrology system, metrology systems, and methods for illuminating a specimen for metrology measurements |
US9080991B2 (en) | 2008-09-29 | 2015-07-14 | Kla-Tencor Corp. | Illuminating a specimen for metrology or inspection |
TWI392432B (zh) | 2010-11-23 | 2013-04-01 | Inventec Corp | 一種伺服器機櫃 |
EP2535679A1 (de) | 2011-06-15 | 2012-12-19 | Lambda-X | Verbesserungen an oder im Zusammenhang mit der Interferometrie |
US8873596B2 (en) | 2011-07-22 | 2014-10-28 | Kla-Tencor Corporation | Laser with high quality, stable output beam, and long life high conversion efficiency non-linear crystal |
US8984453B2 (en) | 2012-06-28 | 2015-03-17 | Applied Materials Israel, Ltd. | Method and system for creation of binary spatial filters |
US8929406B2 (en) * | 2013-01-24 | 2015-01-06 | Kla-Tencor Corporation | 193NM laser and inspection system |
US9529182B2 (en) | 2013-02-13 | 2016-12-27 | KLA—Tencor Corporation | 193nm laser and inspection system |
US9608399B2 (en) | 2013-03-18 | 2017-03-28 | Kla-Tencor Corporation | 193 nm laser and an inspection system using a 193 nm laser |
US9747670B2 (en) | 2013-06-26 | 2017-08-29 | Kla-Tencor Corporation | Method and system for improving wafer surface inspection sensitivity |
US9804101B2 (en) | 2014-03-20 | 2017-10-31 | Kla-Tencor Corporation | System and method for reducing the bandwidth of a laser and an inspection system and method using a laser |
US9419407B2 (en) | 2014-09-25 | 2016-08-16 | Kla-Tencor Corporation | Laser assembly and inspection system using monolithic bandwidth narrowing apparatus |
US9748729B2 (en) | 2014-10-03 | 2017-08-29 | Kla-Tencor Corporation | 183NM laser and inspection system |
JP6481021B2 (ja) * | 2015-03-24 | 2019-03-13 | 大塚電子株式会社 | 分光輝度計の校正に用いる基準光源装置及びそれを用いる校正方法 |
US10739275B2 (en) * | 2016-09-15 | 2020-08-11 | Kla-Tencor Corporation | Simultaneous multi-directional laser wafer inspection |
US10175555B2 (en) | 2017-01-03 | 2019-01-08 | KLA—Tencor Corporation | 183 nm CW laser and inspection system |
CA3057148A1 (en) * | 2017-04-06 | 2018-10-11 | The Government Of The United States Of America, As Represented By The Cretary Of The Navy | Laser speckle reduction and photo-thermal speckle spectroscopy |
EP4154055A1 (de) | 2020-06-15 | 2023-03-29 | Univerza V Ljubljani | Vorrichtung und verfahren zur specklefreien laserbeleuchtung |
US20240004208A1 (en) * | 2020-09-21 | 2024-01-04 | Optonomous Technologies, Inc. | Laser light sources and methods |
Family Cites Families (151)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US502418A (en) * | 1893-08-01 | Steam-generating apparatus | ||
US3778785A (en) * | 1972-04-20 | 1973-12-11 | Ibm | Method for writing information at nanosecond speeds and a memory system therefor |
US3790280A (en) * | 1972-05-03 | 1974-02-05 | Western Electric Co | Spatial filtering system utilizing compensating elements |
JPS5343300B2 (de) * | 1972-11-02 | 1978-11-18 | ||
FR2325018A1 (fr) * | 1975-06-23 | 1977-04-15 | Ibm | Dispositif de mesure d'intervalle pour definir la distance entre deux faces ou plus |
JPS5419366A (en) * | 1977-07-14 | 1979-02-14 | Nippon Jidoseigyo Ltd | Device for inspecting fault of pattern |
US4155630A (en) * | 1977-11-17 | 1979-05-22 | University Of Delaware | Speckle elimination by random spatial phase modulation |
US4360799A (en) | 1980-05-22 | 1982-11-23 | Leighty Robert D | Hybrid optical-digital pattern recognition apparatus and method |
EP0050935B1 (de) * | 1980-10-17 | 1985-05-29 | Brent Chemicals International Plc | Verfahren und Einrichtung zum Prüfen von einem Werkstück |
US4377340A (en) * | 1980-10-24 | 1983-03-22 | Hamamatsu Systems, Inc. | Method and apparatus for detecting particles on a material |
US4360372A (en) | 1980-11-10 | 1982-11-23 | Northern Telecom Limited | Fiber optic element for reducing speckle noise |
US4448532A (en) * | 1981-03-31 | 1984-05-15 | Kla Instruments Corporation | Automatic photomask inspection method and system |
EP0070017B1 (de) * | 1981-07-14 | 1986-10-29 | Hitachi, Ltd. | Mustererkennungssystem |
US4566757A (en) * | 1982-02-12 | 1986-01-28 | University Of Dayton | Holographic optical processing method and apparatus |
US4478481A (en) | 1982-02-12 | 1984-10-23 | University Of Dayton | Production of diffraction limited holographic images |
US4598997A (en) | 1982-02-15 | 1986-07-08 | Rca Corporation | Apparatus and method for detecting defects and dust on a patterned surface |
JPS58147708A (ja) * | 1982-02-26 | 1983-09-02 | Nippon Kogaku Kk <Nikon> | 照明用光学装置 |
US4513384A (en) * | 1982-06-18 | 1985-04-23 | Therma-Wave, Inc. | Thin film thickness measurements and depth profiling utilizing a thermal wave detection system |
US4560235A (en) | 1982-09-22 | 1985-12-24 | Honeywell Inc. | Fiber optic condenser for an optical imaging system |
JPS59157505A (ja) | 1983-02-28 | 1984-09-06 | Hitachi Ltd | パタ−ン検査装置 |
US4521075A (en) * | 1983-03-07 | 1985-06-04 | Obenschain Stephen P | Controllable spatial incoherence echelon for laser |
US4926489A (en) | 1983-03-11 | 1990-05-15 | Kla Instruments Corporation | Reticle inspection system |
US4589783A (en) * | 1984-04-04 | 1986-05-20 | Wayne State University | Thermal wave imaging apparatus |
JPH0792556B2 (ja) * | 1984-04-28 | 1995-10-09 | 株式会社ニコン | 露光装置 |
US4619508A (en) | 1984-04-28 | 1986-10-28 | Nippon Kogaku K. K. | Illumination optical arrangement |
US5042952A (en) * | 1984-05-21 | 1991-08-27 | Therma-Wave, Inc. | Method and apparatus for evaluating surface and subsurface and subsurface features in a semiconductor |
JPS60247643A (ja) * | 1984-05-24 | 1985-12-07 | Canon Inc | 光学装置 |
US4598783A (en) * | 1984-09-24 | 1986-07-08 | Lesley Jerry Tippen | Traction device for vehicles |
US4681427A (en) * | 1985-05-06 | 1987-07-21 | Polaroid Corporation | Electronic printing method |
US4710030A (en) | 1985-05-17 | 1987-12-01 | Bw Brown University Research Foundation | Optical generator and detector of stress pulses |
US4659172A (en) * | 1985-05-20 | 1987-04-21 | Insystems, Inc. | Rotatable and translatable mounting mechanism for a specimen pattern in optical processing apparatus |
US4627731A (en) * | 1985-09-03 | 1986-12-09 | United Technologies Corporation | Common optical path interferometric gauge |
FR2589022B1 (fr) * | 1985-10-18 | 1988-05-27 | Thomson Csf | Procede et dispositif de generation d'images a partir de signaux ultra-sonores obtenus par echographie |
US4647975A (en) * | 1985-10-30 | 1987-03-03 | Polaroid Corporation | Exposure control system for an electronic imaging camera having increased dynamic range |
US4760265A (en) * | 1986-01-18 | 1988-07-26 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Method and device for detecting defects of patterns in microelectronic devices |
US4910690A (en) * | 1986-02-14 | 1990-03-20 | Citizen Watch Co., Ltd. | Micro-dimensional measurement apparatus |
US4712851A (en) | 1986-03-03 | 1987-12-15 | Insystems, Inc. | Positioning alignment apparatus and method using holographic optical elements |
US4807991A (en) * | 1986-04-07 | 1989-02-28 | Electro-Organic Company | Method of inspecting and repairing a structural defect in the surface of an object |
US4734923A (en) * | 1986-05-19 | 1988-03-29 | Hampshire Instruments, Inc | Lithographic system mask inspection device |
US4805123B1 (en) | 1986-07-14 | 1998-10-13 | Kla Instr Corp | Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-systems |
JPH0623999B2 (ja) * | 1986-07-28 | 1994-03-30 | 株式会社日立製作所 | パタ−ン欠陥検出方法 |
US4714516A (en) * | 1986-09-26 | 1987-12-22 | General Electric Company | Method to produce via holes in polymer dielectrics for multiple electronic circuit chip packaging |
US4772126A (en) * | 1986-10-23 | 1988-09-20 | Inspex Incorporated | Particle detection method and apparatus |
JPS63110722A (ja) | 1986-10-29 | 1988-05-16 | Hitachi Ltd | 露光照明装置 |
JPS63282640A (ja) | 1987-05-14 | 1988-11-18 | Fuji Electric Co Ltd | 粉末中の異物自動検査装置 |
US4909615A (en) * | 1987-05-29 | 1990-03-20 | Minolta Camera Kabushiki Kaisha | Zoom lens system for use in an image projecting apparatus with kohler illumination |
US4806774A (en) * | 1987-06-08 | 1989-02-21 | Insystems, Inc. | Inspection system for array of microcircuit dies having redundant circuit patterns |
US4978224A (en) | 1987-07-14 | 1990-12-18 | Sharp Kabushiki Kaisha | Method of and apparatus for inspecting mounting of chip components |
US4882498A (en) | 1987-10-09 | 1989-11-21 | Pressco, Inc. | Pulsed-array video inspection lighting system |
US4972093A (en) | 1987-10-09 | 1990-11-20 | Pressco Inc. | Inspection lighting system |
US5156943A (en) * | 1987-10-25 | 1992-10-20 | Whitney Theodore R | High resolution imagery systems and methods |
JP2536023B2 (ja) * | 1988-02-29 | 1996-09-18 | 株式会社ニコン | 露光装置、及び露光方法 |
US5307207A (en) * | 1988-03-16 | 1994-04-26 | Nikon Corporation | Illuminating optical apparatus |
US4896211A (en) * | 1988-04-26 | 1990-01-23 | Picker International, Inc. | Asynchronously triggered single field transfer video camera |
JPH0617927B2 (ja) * | 1988-04-28 | 1994-03-09 | 三菱レイヨン株式会社 | 光ファイバ式ライトガイド用受光体及び同受光体を含む光源光学系 |
JPH01310485A (ja) * | 1988-06-08 | 1989-12-14 | Dainippon Printing Co Ltd | 欠陥情報検出装置 |
US4978862A (en) | 1988-07-13 | 1990-12-18 | Vti, Inc. | Method and apparatus for nondestructively measuring micro defects in materials |
US4991968A (en) * | 1988-07-20 | 1991-02-12 | Robotic Vision Systems, Inc. | Three dimensional object surface determination with automatic sensor control |
JP2732498B2 (ja) | 1988-11-24 | 1998-03-30 | 株式会社日立製作所 | 縮小投影式露光方法及びその装置 |
JPH02170279A (ja) * | 1988-12-23 | 1990-07-02 | Hitachi Ltd | 被検査対象パターンの欠陥検出方法及びその装置 |
US5027418A (en) | 1989-02-13 | 1991-06-25 | Matsushita Electric Industrial Co., Ltd. | Electro-optical inspection apparatus for printed-circuit boards with components mounted thereon |
US4941980A (en) * | 1989-02-17 | 1990-07-17 | Opal, Inc. | System for measuring a topographical feature on a specimen |
US5153773A (en) | 1989-06-08 | 1992-10-06 | Canon Kabushiki Kaisha | Illumination device including amplitude-division and beam movements |
US5159455A (en) * | 1990-03-05 | 1992-10-27 | General Imaging Corporation | Multisensor high-resolution camera |
US5719704A (en) * | 1991-09-11 | 1998-02-17 | Nikon Corporation | Projection exposure apparatus |
IL99823A0 (en) * | 1990-11-16 | 1992-08-18 | Orbot Instr Ltd | Optical inspection method and apparatus |
IL96483A (en) * | 1990-11-27 | 1995-07-31 | Orbotech Ltd | Optical inspection method and apparatus |
IL96541A (en) | 1990-12-04 | 2000-08-13 | Orbot Instr Ltd | Apparatus and method for microscopic inspection of articles |
US5633711A (en) * | 1991-07-08 | 1997-05-27 | Massachusettes Institute Of Technology | Measurement of material properties with optically induced phonons |
US5563702A (en) * | 1991-08-22 | 1996-10-08 | Kla Instruments Corporation | Automated photomask inspection apparatus and method |
JP2908099B2 (ja) | 1992-01-17 | 1999-06-21 | キヤノン株式会社 | 基板の位置合わせ方法 |
US5233460A (en) | 1992-01-31 | 1993-08-03 | Regents Of The University Of California | Method and means for reducing speckle in coherent laser pulses |
JP3380868B2 (ja) * | 1992-02-04 | 2003-02-24 | 株式会社日立製作所 | 投影露光装置 |
US5264912A (en) | 1992-02-07 | 1993-11-23 | Tencor Instruments | Speckle reduction track filter apparatus for optical inspection of patterned substrates |
JP2667940B2 (ja) * | 1992-04-27 | 1997-10-27 | 三菱電機株式会社 | マスク検査方法およびマスク検出装置 |
US5422724A (en) * | 1992-05-20 | 1995-06-06 | Applied Materials, Inc. | Multiple-scan method for wafer particle analysis |
US5812261A (en) * | 1992-07-08 | 1998-09-22 | Active Impulse Systems, Inc. | Method and device for measuring the thickness of opaque and transparent films |
US5355425A (en) * | 1992-09-04 | 1994-10-11 | Braiman Mark S | Light coupling device for optical fibers |
JPH06109647A (ja) * | 1992-09-24 | 1994-04-22 | Nikon Corp | 欠陥検査装置 |
JP2821073B2 (ja) * | 1992-12-18 | 1998-11-05 | 松下電器産業株式会社 | ギャップ制御装置及びギャップ制御方法 |
US5629768A (en) * | 1993-01-28 | 1997-05-13 | Nikon Corporation | Defect inspecting apparatus |
US5825743A (en) * | 1993-04-06 | 1998-10-20 | Zen Research N.V. | Illuminating multiple data tracks of an optical disk with a laser source of reduced coherence |
US5757474A (en) * | 1993-05-10 | 1998-05-26 | Midwest Research Institute | System for characterizing semiconductor materials and photovoltaic devices through calibration |
JP3234353B2 (ja) * | 1993-06-15 | 2001-12-04 | 富士写真フイルム株式会社 | 断層情報読取装置 |
US5471066A (en) * | 1993-08-26 | 1995-11-28 | Nikon Corporation | Defect inspection apparatus of rotary type |
US5381004A (en) * | 1993-08-31 | 1995-01-10 | Applied Materials, Inc. | Particle analysis of notched wafers |
US5574790A (en) * | 1993-09-27 | 1996-11-12 | Angstrom Technologies, Inc. | Fluorescence authentication reader with coaxial optics |
IL111809A (en) * | 1993-12-09 | 1998-12-06 | Hughes Aircraft Co | Integrated detector for laser sensors |
JP3271425B2 (ja) * | 1994-03-30 | 2002-04-02 | ソニー株式会社 | 異物検査装置及び異物検査方法 |
US5864394A (en) | 1994-06-20 | 1999-01-26 | Kla-Tencor Corporation | Surface inspection system |
US5671050A (en) * | 1994-11-07 | 1997-09-23 | Zygo Corporation | Method and apparatus for profiling surfaces using diffracative optics |
JPH08154210A (ja) | 1994-11-28 | 1996-06-11 | Kubota Corp | 撮像装置 |
US5546811A (en) * | 1995-01-24 | 1996-08-20 | Massachusetts Instittue Of Technology | Optical measurements of stress in thin film materials |
US5497007A (en) * | 1995-01-27 | 1996-03-05 | Applied Materials, Inc. | Method for automatically establishing a wafer coordinate system |
US5715345A (en) * | 1995-02-27 | 1998-02-03 | Hughes Danbury Optical Systems, Inc. | Optical beam regeneration by optical fiber remapping |
JPH08240525A (ja) * | 1995-03-06 | 1996-09-17 | Power Reactor & Nuclear Fuel Dev Corp | 多目的光センサー |
JPH08292361A (ja) | 1995-04-24 | 1996-11-05 | Olympus Optical Co Ltd | プリズム固定装置 |
WO1996039619A1 (en) * | 1995-06-06 | 1996-12-12 | Kla Instruments Corporation | Optical inspection of a specimen using multi-channel responses from the specimen |
US5838709A (en) | 1995-06-07 | 1998-11-17 | Nikon Corporation | Ultraviolet laser source |
US6104945A (en) * | 1995-08-01 | 2000-08-15 | Medispectra, Inc. | Spectral volume microprobe arrays |
US5862285A (en) * | 1995-08-04 | 1999-01-19 | Ceramoptec Industries, Inc. | Multichannel optical fiber bundle with ordered structure in its sensitive probe tip |
US6008906A (en) * | 1995-08-25 | 1999-12-28 | Brown University Research Foundation | Optical method for the characterization of the electrical properties of semiconductors and insulating films |
JPH0961132A (ja) * | 1995-08-28 | 1997-03-07 | Olympus Optical Co Ltd | 3次元形状計測装置 |
US5652665A (en) * | 1995-09-08 | 1997-07-29 | Umax Data System Inc. | Transparency adapter for flatbed scanners |
US5825482A (en) | 1995-09-29 | 1998-10-20 | Kla-Tencor Corporation | Surface inspection system with misregistration error correction and adaptive illumination |
EP0853856B1 (de) | 1995-10-02 | 2004-12-22 | KLA-Tencor Corporation | Verbesserung der ausrichtung von inspektionsystemen vor der bildaufnahme |
US5625451A (en) * | 1995-11-27 | 1997-04-29 | Schmitt Measurement Systems, Inc. | Methods and apparatus for characterizing a surface |
US5689351A (en) | 1995-12-07 | 1997-11-18 | Rockwell International Corporation | Holographic memory readout with reduced speckle |
JP3594384B2 (ja) * | 1995-12-08 | 2004-11-24 | ソニー株式会社 | 半導体露光装置、投影露光装置及び回路パターン製造方法 |
US5748318A (en) * | 1996-01-23 | 1998-05-05 | Brown University Research Foundation | Optical stress generator and detector |
US6175416B1 (en) * | 1996-08-06 | 2001-01-16 | Brown University Research Foundation | Optical stress generator and detector |
US6321601B1 (en) * | 1996-08-06 | 2001-11-27 | Brown University Research Foundation | Optical method for the characterization of laterally-patterned samples in integrated circuits |
US5844684A (en) | 1997-02-28 | 1998-12-01 | Brown University Research Foundation | Optical method for determining the mechanical properties of a material |
US5691541A (en) * | 1996-05-14 | 1997-11-25 | The Regents Of The University Of California | Maskless, reticle-free, lithography |
JP2720870B2 (ja) * | 1996-06-28 | 1998-03-04 | 株式会社ニコン | 照明光学装置および露光装置ならびに露光方法 |
US5859924A (en) * | 1996-07-12 | 1999-01-12 | Robotic Vision Systems, Inc. | Method and system for measuring object features |
IL118872A (en) * | 1996-07-16 | 2000-06-01 | Orbot Instr Ltd | Optical inspection method and apparatus |
KR100200734B1 (ko) * | 1996-10-10 | 1999-06-15 | 윤종용 | 에어리얼 이미지 측정 장치 및 방법 |
CN1124506C (zh) * | 1996-11-07 | 2003-10-15 | Ldt激光展示技术公司 | 具有一个激光器的图像显示设备 |
JPH10163096A (ja) * | 1996-11-26 | 1998-06-19 | Canon Inc | 照明光学系及びそれを用いた露光装置 |
US5748317A (en) * | 1997-01-21 | 1998-05-05 | Brown University Research Foundation | Apparatus and method for characterizing thin film and interfaces using an optical heat generator and detector |
US6028664A (en) * | 1997-01-29 | 2000-02-22 | Inspex, Inc. | Method and system for establishing a common reference point on a semiconductor wafer inspected by two or more scanning mechanisms |
JP3005203B2 (ja) * | 1997-03-24 | 2000-01-31 | キヤノン株式会社 | 照明装置、露光装置及びデバイス製造方法 |
US6172349B1 (en) * | 1997-03-31 | 2001-01-09 | Kla-Tencor Corporation | Autofocusing apparatus and method for high resolution microscope system |
US6381015B1 (en) * | 1997-05-26 | 2002-04-30 | Hitachi, Ltd. | Inspection apparatus using optical interferometer |
US5854674A (en) | 1997-05-29 | 1998-12-29 | Optical Specialties, Inc. | Method of high speed, high detection sensitivity inspection of repetitive and random specimen patterns |
JP3647608B2 (ja) | 1997-06-20 | 2005-05-18 | 株式会社ソキア | 測量機の自動追尾装置 |
US5985680A (en) | 1997-08-08 | 1999-11-16 | Applied Materials, Inc. | Method and apparatus for transforming a substrate coordinate system into a wafer analysis tool coordinate system |
JP2956671B2 (ja) * | 1997-11-25 | 1999-10-04 | 日本電気株式会社 | レティクル検査方法および検査装置 |
US6236454B1 (en) * | 1997-12-15 | 2001-05-22 | Applied Materials, Inc. | Multiple beam scanner for an inspection system |
US6057927A (en) * | 1998-02-25 | 2000-05-02 | American Iron And Steel Institute | Laser-ultrasound spectroscopy apparatus and method with detection of shear resonances for measuring anisotropy, thickness, and other properties |
EP1063742A4 (de) * | 1998-03-11 | 2005-04-20 | Nikon Corp | Ultraviolett-lasergerät und dieses ultraviolett-lasergerät enthaltendes belichtungsgerät |
US6238063B1 (en) * | 1998-04-27 | 2001-05-29 | Nikon Corporation | Illumination optical apparatus and projection exposure apparatus |
US6248988B1 (en) * | 1998-05-05 | 2001-06-19 | Kla-Tencor Corporation | Conventional and confocal multi-spot scanning optical microscope |
JPH11326826A (ja) * | 1998-05-13 | 1999-11-26 | Sony Corp | 照明方法及び照明装置 |
US5929994A (en) * | 1998-05-20 | 1999-07-27 | Ahead Optoelectronics, Inc. | Intergrating sphere ellipsometer |
US6256093B1 (en) * | 1998-06-25 | 2001-07-03 | Applied Materials, Inc. | On-the-fly automatic defect classification for substrates using signal attributes |
US6137570A (en) * | 1998-06-30 | 2000-10-24 | Kla-Tencor Corporation | System and method for analyzing topological features on a surface |
US6366690B1 (en) * | 1998-07-07 | 2002-04-02 | Applied Materials, Inc. | Pixel based machine for patterned wafers |
US6122046A (en) * | 1998-10-02 | 2000-09-19 | Applied Materials, Inc. | Dual resolution combined laser spot scanning and area imaging inspection |
US6103539A (en) * | 1998-10-23 | 2000-08-15 | Xmr, Inc. | Method and system for nondestructive layer defect detection |
US6072581A (en) * | 1998-10-30 | 2000-06-06 | Zygo Corporation | Geometrically-desensitized interferometer incorporating an optical assembly with high stray-beam management capability |
US6587193B1 (en) * | 1999-05-11 | 2003-07-01 | Applied Materials, Inc. | Inspection systems performing two-dimensional imaging with line light spot |
JP2002544555A (ja) | 1999-05-18 | 2002-12-24 | アプライド マテリアルズ インコーポレイテッド | マスターとの比較による物品の検査方法および装置 |
US6366352B1 (en) * | 1999-06-10 | 2002-04-02 | Applied Materials, Inc. | Optical inspection method and apparatus utilizing a variable angle design |
US6693664B2 (en) * | 1999-06-30 | 2004-02-17 | Negevtech | Method and system for fast on-line electro-optical detection of wafer defects |
US6587794B1 (en) * | 1999-07-30 | 2003-07-01 | Koninklijke Philips Electronics N.V. | Method for measuring thin metal films |
US6466315B1 (en) * | 1999-09-03 | 2002-10-15 | Applied Materials, Inc. | Method and system for reticle inspection by photolithography simulation |
US6268093B1 (en) * | 1999-10-13 | 2001-07-31 | Applied Materials, Inc. | Method for reticle inspection using aerial imaging |
US6369888B1 (en) * | 1999-11-17 | 2002-04-09 | Applied Materials, Inc. | Method and apparatus for article inspection including speckle reduction |
US20080037933A1 (en) * | 2006-08-14 | 2008-02-14 | Negevtech, Ltd. | Speckle reduction using a fiber bundle and light guide |
-
1999
- 1999-11-17 US US09/443,247 patent/US6369888B1/en not_active Expired - Lifetime
-
2000
- 2000-11-16 EP EP00125042A patent/EP1102058B1/de not_active Expired - Lifetime
- 2000-11-16 DE DE60030658T patent/DE60030658T2/de not_active Expired - Fee Related
- 2000-11-17 JP JP2000391608A patent/JP5117645B2/ja not_active Expired - Fee Related
-
2002
- 2002-01-11 US US10/043,798 patent/US6429931B1/en not_active Expired - Fee Related
- 2002-01-11 US US10/044,454 patent/US6587194B2/en not_active Expired - Fee Related
- 2002-01-11 US US10/043,779 patent/US6556294B2/en not_active Expired - Lifetime
-
2003
- 2003-05-12 US US10/436,920 patent/US6798505B2/en not_active Expired - Lifetime
-
2004
- 2004-04-29 US US10/836,022 patent/US6924891B2/en not_active Expired - Lifetime
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Also Published As
Publication number | Publication date |
---|---|
DE60030658T2 (de) | 2007-09-13 |
US20050128473A1 (en) | 2005-06-16 |
US7463352B2 (en) | 2008-12-09 |
US20020080348A1 (en) | 2002-06-27 |
US6369888B1 (en) | 2002-04-09 |
US6429931B1 (en) | 2002-08-06 |
US20040201842A1 (en) | 2004-10-14 |
JP2001274081A (ja) | 2001-10-05 |
US6556294B2 (en) | 2003-04-29 |
EP1102058B1 (de) | 2006-09-13 |
EP1102058A1 (de) | 2001-05-23 |
US6924891B2 (en) | 2005-08-02 |
US20030197858A1 (en) | 2003-10-23 |
US6587194B2 (en) | 2003-07-01 |
US20020067478A1 (en) | 2002-06-06 |
US6798505B2 (en) | 2004-09-28 |
JP5117645B2 (ja) | 2013-01-16 |
US20020057427A1 (en) | 2002-05-16 |
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