DE60030968D1 - Transfermethode für halbleiterscheiben und haltering - Google Patents

Transfermethode für halbleiterscheiben und haltering

Info

Publication number
DE60030968D1
DE60030968D1 DE60030968T DE60030968T DE60030968D1 DE 60030968 D1 DE60030968 D1 DE 60030968D1 DE 60030968 T DE60030968 T DE 60030968T DE 60030968 T DE60030968 T DE 60030968T DE 60030968 D1 DE60030968 D1 DE 60030968D1
Authority
DE
Germany
Prior art keywords
holdering
semi
transfer method
finished discs
discs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60030968T
Other languages
English (en)
Other versions
DE60030968T2 (de
Inventor
Vladimir Ivanovich Kuznetsov
Gerardus Oosterlaken
Gerardus Ridder
Hendrik Granneman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASM International NV
Original Assignee
ASM International NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM International NV filed Critical ASM International NV
Publication of DE60030968D1 publication Critical patent/DE60030968D1/de
Application granted granted Critical
Publication of DE60030968T2 publication Critical patent/DE60030968T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60030968T 1999-05-07 2000-05-08 Transfermethode für halbleiterscheiben und haltering Expired - Lifetime DE60030968T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL1012004A NL1012004C2 (nl) 1999-05-07 1999-05-07 Werkwijze voor het verplaatsen van wafers alsmede ring.
NL1012004 1999-05-07
PCT/NL2000/000297 WO2000068977A1 (en) 1999-05-07 2000-05-08 Method for transferring wafers and ring

Publications (2)

Publication Number Publication Date
DE60030968D1 true DE60030968D1 (de) 2006-11-09
DE60030968T2 DE60030968T2 (de) 2007-05-03

Family

ID=19769156

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60030968T Expired - Lifetime DE60030968T2 (de) 1999-05-07 2000-05-08 Transfermethode für halbleiterscheiben und haltering

Country Status (10)

Country Link
US (1) US7048488B1 (de)
EP (1) EP1177571B1 (de)
JP (1) JP4632551B2 (de)
KR (1) KR100667718B1 (de)
CN (1) CN1157761C (de)
AU (1) AU4626000A (de)
DE (1) DE60030968T2 (de)
NL (1) NL1012004C2 (de)
TW (1) TW452840B (de)
WO (1) WO2000068977A1 (de)

Families Citing this family (44)

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NL1013989C2 (nl) * 1999-12-29 2001-07-02 Asm Int Werkwijze en inrichting voor het behandelen van een wafer.
NL1018086C2 (nl) 2001-05-16 2002-11-26 Asm Int Werkwijze en inrichting voor het thermisch behandelen van substraten.
US6835039B2 (en) 2002-03-15 2004-12-28 Asm International N.V. Method and apparatus for batch processing of wafers in a furnace
US7427329B2 (en) 2002-05-08 2008-09-23 Asm International N.V. Temperature control for single substrate semiconductor processing reactor
US6843201B2 (en) 2002-05-08 2005-01-18 Asm International Nv Temperature control for single substrate semiconductor processing reactor
US7256375B2 (en) 2002-08-30 2007-08-14 Asm International N.V. Susceptor plate for high temperature heat treatment
US6788991B2 (en) 2002-10-09 2004-09-07 Asm International N.V. Devices and methods for detecting orientation and shape of an object
US6950774B2 (en) 2003-01-16 2005-09-27 Asm America, Inc. Out-of-pocket detection system using wafer rotation as an indicator
US7033126B2 (en) 2003-04-02 2006-04-25 Asm International N.V. Method and apparatus for loading a batch of wafers into a wafer boat
US7181132B2 (en) 2003-08-20 2007-02-20 Asm International N.V. Method and system for loading substrate supports into a substrate holder
US7410355B2 (en) 2003-10-31 2008-08-12 Asm International N.V. Method for the heat treatment of substrates
US7022627B2 (en) 2003-10-31 2006-04-04 Asm International N.V. Method for the heat treatment of substrates
US6940047B2 (en) 2003-11-14 2005-09-06 Asm International N.V. Heat treatment apparatus with temperature control system
US20060004493A1 (en) * 2004-06-30 2006-01-05 Jack Hwang Use of active temperature control to provide emmisivity independent wafer temperature
US20060286807A1 (en) * 2005-06-16 2006-12-21 Jack Hwang Use of active temperature control to provide emmisivity independent wafer temperature
US7217670B2 (en) 2004-11-22 2007-05-15 Asm International N.V. Dummy substrate for thermal reactor
JP2008531249A (ja) * 2005-02-22 2008-08-14 ボールドウィン フィルターズ，インコーポレイティド フィルタ装置
US8057669B2 (en) 2005-02-22 2011-11-15 Baldwin Filters, Inc. Filter element and filter assembly including locking mechanism
JP4755498B2 (ja) * 2006-01-06 2011-08-24 東京エレクトロン株式会社 加熱装置及び加熱方法
US8002463B2 (en) * 2008-06-13 2011-08-23 Asm International N.V. Method and device for determining the temperature of a substrate
US8128819B2 (en) * 2008-06-16 2012-03-06 Baldwin Filters Inc. Fluid filter, fluid filter assembly, and mounting method
US8815090B2 (en) * 2008-06-16 2014-08-26 Baldwin Filters, Inc. Filter with water separation device
US8241493B2 (en) 2008-06-16 2012-08-14 Baldwin Filters, Inc. Filter with ejection mechanism
US20110097491A1 (en) * 2009-10-27 2011-04-28 Levy David H Conveyance system including opposed fluid distribution manifolds
CN102087986B (zh) * 2009-12-04 2012-02-22 无锡华润上华半导体有限公司 晶片传送装置
EP2444993A1 (de) * 2010-10-21 2012-04-25 Applied Materials, Inc. Schleusenkammer, Substratverarbeitungssystem und Belüftungsverfahren
CN102569142B (zh) * 2012-02-03 2017-04-26 上海华虹宏力半导体制造有限公司 硅片转移装置、转移托环、半导体工艺反应设备
US8991619B2 (en) 2012-03-26 2015-03-31 Baldwin Filters, Inc. Filter assembly with water evacuation and methods
JP6339101B2 (ja) 2013-01-04 2018-06-06 ボールドウィン・フィルターズ・インコーポレーテッドＢａｌｄｗｉｎ Ｆｉｌｔｅｒｓ Ｉｎｃ ３つの部分の端部キャップ及び同様な要素を含むフィルタエレメント
WO2014165406A1 (en) * 2013-04-01 2014-10-09 Brewer Science Inc. Apparatus and method for thin wafer transfer
US9975801B2 (en) 2014-07-31 2018-05-22 Corning Incorporated High strength glass having improved mechanical characteristics
US10611664B2 (en) 2014-07-31 2020-04-07 Corning Incorporated Thermally strengthened architectural glass and related systems and methods
US11097974B2 (en) 2014-07-31 2021-08-24 Corning Incorporated Thermally strengthened consumer electronic glass and related systems and methods
KR102492060B1 (ko) 2016-01-12 2023-01-26 코닝 인코포레이티드 얇은, 열적 및 화학적으로 강화된 유리-계 제품
US11795102B2 (en) 2016-01-26 2023-10-24 Corning Incorporated Non-contact coated glass and related coating system and method
GB2553792A (en) * 2016-09-14 2018-03-21 Rec Solar Pte Ltd Tray for holding at least one wafer
EP3519075A4 (de) 2016-10-03 2020-05-27 Parker-Hannifin Corporation Filterelement mit verdrehsperre und anordnung
WO2018222804A2 (en) 2017-05-31 2018-12-06 Parker-Hannifin Corporation Filter element with torsion lock and/or sliding piston, assembly and methods
CN111065609A (zh) 2017-08-24 2020-04-24 康宁股份有限公司 具有改进的回火能力的玻璃
KR102538177B1 (ko) * 2017-11-16 2023-05-31 삼성전자주식회사 상부 샤워 헤드 및 하부 샤워 헤드를 포함하는 증착 장치
TWI785156B (zh) 2017-11-30 2022-12-01 美商康寧公司 具有高熱膨脹係數及對於熱回火之優先破裂行為的非離子交換玻璃
CN114514115B (zh) 2019-08-06 2023-09-01 康宁股份有限公司 具有用于阻止裂纹的埋入式应力尖峰的玻璃层压体及其制造方法
US11764101B2 (en) * 2019-10-24 2023-09-19 ASM IP Holding, B.V. Susceptor for semiconductor substrate processing
CN114378751B (zh) 2020-10-20 2022-11-01 长鑫存储技术有限公司 晶圆用承载环的安装夹具

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NL8103979A (nl) 1981-08-26 1983-03-16 Bok Edward Methode en inrichting voor het aanbrengen van een film vloeibaar medium op een substraat.
US4468259A (en) * 1981-12-04 1984-08-28 Ushio Denki Kabushiki Kaisha Uniform wafer heating by controlling light source and circumferential heating of wafer
NL8203318A (nl) 1982-08-24 1984-03-16 Integrated Automation Inrichting voor processing van substraten.
JPS6074626A (ja) 1983-09-30 1985-04-26 Fujitsu Ltd ウエハー処理方法及び装置
FR2596070A1 (fr) 1986-03-21 1987-09-25 Labo Electronique Physique Dispositif comprenant un suscepteur plan tournant parallelement a un plan de reference autour d'un axe perpendiculaire a ce plan
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JPS63136532A (ja) 1986-11-27 1988-06-08 Nec Kyushu Ltd 半導体基板熱処理装置
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Also Published As

Publication number Publication date
KR20010112476A (ko) 2001-12-20
AU4626000A (en) 2000-11-21
KR100667718B1 (ko) 2007-01-15
JP2002544664A (ja) 2002-12-24
WO2000068977A1 (en) 2000-11-16
CN1157761C (zh) 2004-07-14
CN1349656A (zh) 2002-05-15
JP4632551B2 (ja) 2011-02-16
EP1177571A1 (de) 2002-02-06
EP1177571B1 (de) 2006-09-27
US7048488B1 (en) 2006-05-23
DE60030968T2 (de) 2007-05-03
TW452840B (en) 2001-09-01
NL1012004C2 (nl) 2000-11-13

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Legal Events

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8364 No opposition during term of opposition