DE60037784D1 - Magnetoresistives Element und magnetische Speicheranordnung - Google Patents

Magnetoresistives Element und magnetische Speicheranordnung

Info

Publication number
DE60037784D1
DE60037784D1 DE60037784T DE60037784T DE60037784D1 DE 60037784 D1 DE60037784 D1 DE 60037784D1 DE 60037784 T DE60037784 T DE 60037784T DE 60037784 T DE60037784 T DE 60037784T DE 60037784 D1 DE60037784 D1 DE 60037784D1
Authority
DE
Germany
Prior art keywords
memory device
magnetic memory
magnetoresistive element
magnetoresistive
magnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60037784T
Other languages
English (en)
Other versions
DE60037784T2 (de
Inventor
Koichiro Inomata
Kentaro Nakajima
Yoshiaki Saito
Masayuki Sagoi
Tatsuya Kishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2000265664A external-priority patent/JP3977576B2/ja
Priority claimed from JP2000265663A external-priority patent/JP2001156357A/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE60037784D1 publication Critical patent/DE60037784D1/de
Publication of DE60037784T2 publication Critical patent/DE60037784T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/02Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09Magnetoresistive devices
    • G01R33/093Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/33Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
    • G11B5/39Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
    • G11B5/3903Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/127Structure or manufacture of heads, e.g. inductive
    • G11B5/33Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
    • G11B5/39Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
    • G11B5/3903Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
    • G11B5/3906Details related to the use of magnetic thin film layers or to their effects
    • G11B5/3909Arrangements using a magnetic tunnel junction
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • G11C11/15Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/32Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3254Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the spacer being semiconducting or insulating, e.g. for spin tunnel junction [STJ]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/32Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3263Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being symmetric, e.g. for dual spin valve, e.g. NiO/Co/Cu/Co/Cu/Co/NiO
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/32Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3268Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
    • H01F10/3281Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn only by use of asymmetry of the magnetic film pair itself, i.e. so-called pseudospin valve [PSV] structure, e.g. NiFe/Cu/Co
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B61/00Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/10Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having two electrodes, e.g. diodes or MIM elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B61/00Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00Galvanomagnetic devices
    • H10N50/10Magnetoresistive devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00Thin magnetic films, e.g. of one-domain structure
    • H01F10/32Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
    • H01F10/324Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
    • H01F10/3268Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
    • H01F10/3272Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/11Magnetic recording head
    • Y10T428/1107Magnetoresistive
    • Y10T428/1121Multilayer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/11Magnetic recording head
    • Y10T428/115Magnetic layer composition
DE60037784T 1999-09-16 2000-09-15 Magnetoresistives Element und magnetische Speicheranordnung Expired - Lifetime DE60037784T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP26232799 1999-09-16
JP26232799 1999-09-16
JP26374199 1999-09-17
JP26374199 1999-09-17
JP2000265664 2000-09-01
JP2000265664A JP3977576B2 (ja) 1999-09-17 2000-09-01 磁気メモリ装置
JP2000265663A JP2001156357A (ja) 1999-09-16 2000-09-01 磁気抵抗効果素子および磁気記録素子
JP2000265663 2000-09-01

Publications (2)

Publication Number Publication Date
DE60037784D1 true DE60037784D1 (de) 2008-03-06
DE60037784T2 DE60037784T2 (de) 2008-06-05

Family

ID=27478612

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60037784T Expired - Lifetime DE60037784T2 (de) 1999-09-16 2000-09-15 Magnetoresistives Element und magnetische Speicheranordnung

Country Status (5)

Country Link
US (6) US6611405B1 (de)
EP (1) EP1085586B1 (de)
KR (2) KR100401777B1 (de)
CN (1) CN1185630C (de)
DE (1) DE60037784T2 (de)

Families Citing this family (280)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000208831A (ja) * 1999-01-18 2000-07-28 Sony Corp 磁気抵抗素子及びこれを用いた磁気デバイス
US6611405B1 (en) * 1999-09-16 2003-08-26 Kabushiki Kaisha Toshiba Magnetoresistive element and magnetic memory device
US6639763B1 (en) * 2000-03-15 2003-10-28 Tdk Corporation Magnetic transducer and thin film magnetic head
CN1319083C (zh) * 2000-06-21 2007-05-30 皇家菲利浦电子有限公司 具有改进的磁场范围的磁多层结构
US6979586B2 (en) 2000-10-06 2005-12-27 Headway Technologies, Inc. Magnetic random access memory array with coupled soft adjacent magnetic layer
EP1345277A4 (de) * 2000-12-21 2005-02-16 Fujitsu Ltd Magnetoresistives bauelement, magnetkopf und magnetplattenabspielgerät
KR100390977B1 (ko) * 2000-12-28 2003-07-12 주식회사 하이닉스반도체 반도체소자의 제조방법
JP3576111B2 (ja) 2001-03-12 2004-10-13 株式会社東芝 磁気抵抗効果素子
JP3892736B2 (ja) 2001-03-29 2007-03-14 株式会社東芝 半導体記憶装置
JP5013494B2 (ja) * 2001-04-06 2012-08-29 ルネサスエレクトロニクス株式会社 磁性メモリの製造方法
JP4405103B2 (ja) 2001-04-20 2010-01-27 株式会社東芝 半導体記憶装置
TWI222630B (en) * 2001-04-24 2004-10-21 Matsushita Electric Ind Co Ltd Magnetoresistive element and magnetoresistive memory device using the same
US6791805B2 (en) * 2001-05-03 2004-09-14 Seagate Technology Llc Current-perpendicular-to-plane spin valve reader with reduced scattering of majority spin electrons
US6744086B2 (en) 2001-05-15 2004-06-01 Nve Corporation Current switched magnetoresistive memory cell
EP1391942A4 (de) * 2001-05-31 2007-08-15 Nat Inst Of Advanced Ind Scien Tunnel-magnetwiderstandselement
JP3590006B2 (ja) * 2001-06-22 2004-11-17 株式会社東芝 磁気抵抗効果素子、磁気ヘッド及び磁気再生装置
US6927995B2 (en) * 2001-08-09 2005-08-09 Hewlett-Packard Development Company, L.P. Multi-bit MRAM device with switching nucleation sites
JP4229618B2 (ja) * 2001-08-29 2009-02-25 Tdk株式会社 磁気検出素子及びその製造方法
DE10144268B4 (de) * 2001-09-08 2015-03-05 Robert Bosch Gmbh Vorrichtung zur Messung der Stärke einer Vektorkomponente eines Magnetfeldes
US6538917B1 (en) * 2001-09-25 2003-03-25 Hewlett-Packard Development Company, L.P. Read methods for magneto-resistive device having soft reference layer
JP3916908B2 (ja) * 2001-09-28 2007-05-23 株式会社東芝 磁気抵抗効果素子、磁気メモリ及び磁気ヘッド
CN1309086C (zh) * 2001-10-31 2007-04-04 国际商业机器公司 半导体装置及其制造方法
KR100542849B1 (ko) * 2001-11-30 2006-01-20 가부시끼가이샤 도시바 자기 기억 장치, 그 제조 방법 및 자기 기억 장치의 데이터 판독 방법
JP3866567B2 (ja) * 2001-12-13 2007-01-10 株式会社東芝 半導体記憶装置及びその製造方法
DE60205569T2 (de) * 2001-12-21 2006-05-18 Kabushiki Kaisha Toshiba MRAM mit gestapelten Speicherzellen
KR100457158B1 (ko) * 2001-12-26 2004-11-16 주식회사 하이닉스반도체 대칭적인 스위칭 특성을 위한 마그네틱 메모리 셀
JP3583102B2 (ja) 2001-12-27 2004-10-27 株式会社東芝 磁気スイッチング素子及び磁気メモリ
US6735111B2 (en) * 2002-01-16 2004-05-11 Micron Technology, Inc. Magnetoresistive memory devices and assemblies
JP3875568B2 (ja) * 2002-02-05 2007-01-31 株式会社東芝 半導体装置及びその製造方法
US7061161B2 (en) * 2002-02-15 2006-06-13 Siemens Technology-To-Business Center Llc Small piezoelectric air pumps with unobstructed airflow
US6812040B2 (en) 2002-03-12 2004-11-02 Freescale Semiconductor, Inc. Method of fabricating a self-aligned via contact for a magnetic memory element
JP2003283000A (ja) * 2002-03-27 2003-10-03 Toshiba Corp 磁気抵抗効果素子およびこれを有する磁気メモリ
DE60300157T2 (de) * 2002-03-29 2005-11-10 Kabushiki Kaisha Toshiba Magnetische Speichereinheit und magnetische Speichermatrix
JP3769241B2 (ja) * 2002-03-29 2006-04-19 株式会社東芝 磁気抵抗効果素子及び磁気メモリ
JP3923914B2 (ja) * 2002-04-05 2007-06-06 株式会社東芝 磁気記憶装置及びその製造方法
JPWO2003092084A1 (ja) * 2002-04-23 2005-09-02 松下電器産業株式会社 磁気抵抗効果素子とその製造方法ならびにこれを用いた磁気ヘッド、磁気メモリおよび磁気記録装置
US6801450B2 (en) * 2002-05-22 2004-10-05 Hewlett-Packard Development Company, L.P. Memory cell isolation
JP3932356B2 (ja) * 2002-07-22 2007-06-20 国立大学法人東北大学 不揮発性固体磁気メモリの記録方法
US7196882B2 (en) * 2002-07-23 2007-03-27 Micron Technology, Inc. Magnetic tunnel junction device and its method of fabrication
US6881993B2 (en) * 2002-08-28 2005-04-19 Micron Technology, Inc. Device having reduced diffusion through ferromagnetic materials
US6831312B2 (en) * 2002-08-30 2004-12-14 Freescale Semiconductor, Inc. Amorphous alloys for magnetic devices
US6801415B2 (en) * 2002-08-30 2004-10-05 Freescale Semiconductor, Inc. Nanocrystalline layers for improved MRAM tunnel junctions
KR100731959B1 (ko) * 2002-09-05 2007-06-27 독립행정법인 과학기술진흥기구 전계효과 트랜지스터
JP2004103769A (ja) * 2002-09-09 2004-04-02 Fujitsu Ltd Cpp構造磁気抵抗効果素子
JPWO2004025744A1 (ja) * 2002-09-13 2006-01-12 富士通株式会社 感磁素子及びその製造方法、並びにその感磁素子を用いた磁気ヘッド、エンコーダ装置、及び磁気記憶装置
JP4146202B2 (ja) * 2002-09-24 2008-09-10 株式会社東芝 スピントンネルトランジスタ、磁気再生ヘッド、磁気情報再生システム、及び磁気記憶装置
US6838740B2 (en) * 2002-09-27 2005-01-04 Grandis, Inc. Thermally stable magnetic elements utilizing spin transfer and an MRAM device using the magnetic element
JP3873015B2 (ja) * 2002-09-30 2007-01-24 株式会社東芝 磁気メモリ
WO2004038725A2 (en) * 2002-10-22 2004-05-06 Btg International Limited Magnetic memory device
US7224556B2 (en) * 2002-10-24 2007-05-29 Hitachi Global Storage Technologies Netherlands B.V. Self-pinned CPP magnetoresistive sensor
US7394626B2 (en) * 2002-11-01 2008-07-01 Nec Corporation Magnetoresistance device with a diffusion barrier between a conductor and a magnetoresistance element and method of fabricating the same
US6841395B2 (en) 2002-11-25 2005-01-11 International Business Machines Corporation Method of forming a barrier layer of a tunneling magnetoresistive sensor
CN100533589C (zh) * 2002-11-26 2009-08-26 株式会社东芝 磁单元和磁存储器
JP2004179483A (ja) * 2002-11-28 2004-06-24 Hitachi Ltd 不揮発性磁気メモリ
KR100663857B1 (ko) 2002-12-13 2007-01-02 도꾸리쯔교세이호징 가가꾸 기쥬쯔 신꼬 기꼬 스핀 주입 디바이스 및 이를 사용한 자기 장치, 그리고이들에 사용되는 자성 박막
JP2004200245A (ja) * 2002-12-16 2004-07-15 Nec Corp 磁気抵抗素子及び磁気抵抗素子の製造方法
JP2004214459A (ja) * 2003-01-06 2004-07-29 Sony Corp 不揮発性磁気メモリ装置及びその製造方法
JP2004289100A (ja) * 2003-01-31 2004-10-14 Japan Science & Technology Agency Cpp型巨大磁気抵抗素子及びそれを用いた磁気部品並びに磁気装置
JP4212397B2 (ja) * 2003-03-28 2009-01-21 株式会社東芝 磁気メモリ及びその書き込み方法
US6885073B2 (en) * 2003-04-02 2005-04-26 Micron Technology, Inc. Method and apparatus providing MRAM devices with fine tuned offset
US6667901B1 (en) * 2003-04-29 2003-12-23 Hewlett-Packard Development Company, L.P. Dual-junction magnetic memory device and read method
DE10319319A1 (de) 2003-04-29 2005-01-27 Infineon Technologies Ag Sensoreinrichtung mit magnetostriktivem Kraftsensor
US6714446B1 (en) * 2003-05-13 2004-03-30 Motorola, Inc. Magnetoelectronics information device having a compound magnetic free layer
US6865109B2 (en) * 2003-06-06 2005-03-08 Seagate Technology Llc Magnetic random access memory having flux closure for the free layer and spin transfer write mechanism
JP3824600B2 (ja) * 2003-07-30 2006-09-20 株式会社東芝 磁気抵抗効果素子および磁気メモリ
US7911832B2 (en) * 2003-08-19 2011-03-22 New York University High speed low power magnetic devices based on current induced spin-momentum transfer
US8755222B2 (en) 2003-08-19 2014-06-17 New York University Bipolar spin-transfer switching
JP4244312B2 (ja) * 2003-10-02 2009-03-25 株式会社東芝 磁気抵抗効果素子、磁気ヘッド及び磁気再生装置
JP2005116703A (ja) * 2003-10-06 2005-04-28 Alps Electric Co Ltd 磁気検出素子
US20050141148A1 (en) 2003-12-02 2005-06-30 Kabushiki Kaisha Toshiba Magnetic memory
US7026673B2 (en) * 2003-12-11 2006-04-11 International Business Machines Corporation Low magnetization materials for high performance magnetic memory devices
US20050162122A1 (en) * 2004-01-22 2005-07-28 Dunn Glenn M. Fuel cell power and management system, and technique for controlling and/or operating same
US7083988B2 (en) * 2004-01-26 2006-08-01 Micron Technology, Inc. Magnetic annealing sequences for patterned MRAM synthetic antiferromagnetic pinned layers
US7283333B2 (en) * 2004-02-11 2007-10-16 Hitachi Global Storage Technologies Netherlands B.V. Self-pinned double tunnel junction head
US7268980B2 (en) * 2004-02-11 2007-09-11 Hitachi Global Storage Technologies Netherlands, B.V. Magnetic head having self-pinned CPP sensor with multilayer pinned layer
US6992359B2 (en) * 2004-02-26 2006-01-31 Grandis, Inc. Spin transfer magnetic element with free layers having high perpendicular anisotropy and in-plane equilibrium magnetization
US20110140217A1 (en) * 2004-02-26 2011-06-16 Grandis, Inc. Spin transfer magnetic element with free layers having high perpendicular anisotropy and in-plane equilibrium magnetization
KR100867662B1 (ko) 2004-03-12 2008-11-10 도쿠리쓰교세이호징 가가쿠 기주쓰 신코 기코 자기저항소자, 터널 장벽층 및 자기저항소자의 제조방법
US7268986B2 (en) * 2004-03-31 2007-09-11 Hitachi Global Storage Technologies Netherlands B.V. Double tunnel junction using self-pinned center ferromagnet
US7148531B2 (en) * 2004-04-29 2006-12-12 Nve Corporation Magnetoresistive memory SOI cell
US7324310B2 (en) * 2004-04-30 2008-01-29 Hitachi Global Storage Technologies Netherlands B.V. Self-pinned dual CPP sensor exchange pinned at stripe back-end to avoid amplitude flipping
JP3683577B1 (ja) * 2004-05-13 2005-08-17 Tdk株式会社 磁気抵抗効果素子、薄膜磁気ヘッド、ヘッドジンバルアセンブリおよび磁気ディスク装置
US7242556B2 (en) * 2004-06-21 2007-07-10 Hitachi Global Storage Technologies Netherlands B.V. CPP differential GMR sensor having antiparallel stabilized free layers for perpendicular recording
US7357995B2 (en) * 2004-07-02 2008-04-15 International Business Machines Corporation Magnetic tunnel barriers and associated magnetic tunnel junctions with high tunneling magnetoresistance
US7270896B2 (en) * 2004-07-02 2007-09-18 International Business Machines Corporation High performance magnetic tunnel barriers with amorphous materials
US20060012926A1 (en) * 2004-07-15 2006-01-19 Parkin Stuart S P Magnetic tunnel barriers and associated magnetic tunnel junctions with high tunneling magnetoresistance
JP4460965B2 (ja) * 2004-07-22 2010-05-12 株式会社東芝 磁気ランダムアクセスメモリ
US7196367B2 (en) * 2004-09-30 2007-03-27 Intel Corporation Spin polarization amplifying transistor
CN1294559C (zh) * 2004-10-10 2007-01-10 中国科学院物理研究所 具有共振隧穿效应的双势垒隧道结传感器
US7300711B2 (en) * 2004-10-29 2007-11-27 International Business Machines Corporation Magnetic tunnel junctions with high tunneling magnetoresistance using non-bcc magnetic materials
US7351483B2 (en) * 2004-11-10 2008-04-01 International Business Machines Corporation Magnetic tunnel junctions using amorphous materials as reference and free layers
US20060128038A1 (en) * 2004-12-06 2006-06-15 Mahendra Pakala Method and system for providing a highly textured magnetoresistance element and magnetic memory
JP2006179701A (ja) * 2004-12-22 2006-07-06 Toshiba Corp 磁気ランダムアクセスメモリ
JP4575181B2 (ja) * 2005-01-28 2010-11-04 株式会社東芝 スピン注入磁気ランダムアクセスメモリ
US7687157B2 (en) * 2005-02-04 2010-03-30 Hitachi Global Storage Technologies Netherlands B.V. Perpendicular recording media having an exchange-spring structure
JP4693450B2 (ja) * 2005-03-22 2011-06-01 株式会社東芝 磁気抵抗効果素子および磁気メモリ
JP4528660B2 (ja) * 2005-03-31 2010-08-18 株式会社東芝 スピン注入fet
KR100719345B1 (ko) * 2005-04-18 2007-05-17 삼성전자주식회사 자기 기억 장치의 형성 방법
US7443638B2 (en) * 2005-04-22 2008-10-28 Taiwan Semiconductor Manufacturing Company Ltd. Magnetoresistive structures and fabrication methods
US7230265B2 (en) * 2005-05-16 2007-06-12 International Business Machines Corporation Spin-polarization devices using rare earth-transition metal alloys
US7313863B2 (en) 2005-06-07 2008-01-01 Headway Technologies, Inc. Method to form a cavity having inner walls of varying slope
US7522380B2 (en) * 2005-06-14 2009-04-21 Seagate Technology Llc Head to disc interface tunneling giant magnetoresistive sensor
JP2006351668A (ja) * 2005-06-14 2006-12-28 Alps Electric Co Ltd 磁気検出素子及びその製造方法
JP2007027575A (ja) * 2005-07-20 2007-02-01 Toshiba Corp 磁気抵抗効果素子および磁気メモリ
US7372674B2 (en) * 2005-07-22 2008-05-13 Hitachi Global Storage Technologies Netherlands B.V. Magnetic tunnel transistor with high magnetocurrent and stronger pinning
KR100727486B1 (ko) * 2005-08-16 2007-06-13 삼성전자주식회사 자기 기억 소자 및 그 형성 방법
JP5193419B2 (ja) * 2005-10-28 2013-05-08 株式会社東芝 スピン注入磁気ランダムアクセスメモリとその書き込み方法
US20080246104A1 (en) * 2007-02-12 2008-10-09 Yadav Technology High Capacity Low Cost Multi-State Magnetic Memory
US8058696B2 (en) * 2006-02-25 2011-11-15 Avalanche Technology, Inc. High capacity low cost multi-state magnetic memory
JP4444257B2 (ja) * 2006-09-08 2010-03-31 株式会社東芝 スピンfet
JP2007324276A (ja) * 2006-05-31 2007-12-13 Fujitsu Ltd 磁気メモリ装置及びその製造方法
US7672088B2 (en) * 2006-06-21 2010-03-02 Headway Technologies, Inc. Heusler alloy with insertion layer to reduce the ordering temperature for CPP, TMR, MRAM, and other spintronics applications
US7760474B1 (en) 2006-07-14 2010-07-20 Grandis, Inc. Magnetic element utilizing free layer engineering
US7663848B1 (en) 2006-07-14 2010-02-16 Grandis, Inc. Magnetic memories utilizing a magnetic element having an engineered free layer
US7502249B1 (en) 2006-07-17 2009-03-10 Grandis, Inc. Method and system for using a pulsed field to assist spin transfer induced switching of magnetic memory elements
US7532505B1 (en) 2006-07-17 2009-05-12 Grandis, Inc. Method and system for using a pulsed field to assist spin transfer induced switching of magnetic memory elements
US20080174933A1 (en) * 2007-01-19 2008-07-24 Western Lights Semiconductor Corp. Apparatus and Method to Store Electrical Energy
JP4384183B2 (ja) * 2007-01-26 2009-12-16 株式会社東芝 磁気抵抗素子および磁気メモリ
US20090218645A1 (en) * 2007-02-12 2009-09-03 Yadav Technology Inc. multi-state spin-torque transfer magnetic random access memory
JP2008211008A (ja) * 2007-02-27 2008-09-11 Fujitsu Ltd 磁気抵抗効果素子及び磁気メモリ装置
US20080205130A1 (en) * 2007-02-28 2008-08-28 Freescale Semiconductor, Inc. Mram free layer synthetic antiferromagnet structure and methods
JP5157268B2 (ja) * 2007-06-13 2013-03-06 株式会社日立製作所 スピン蓄積磁化反転型のメモリ素子及びスピンram
US20090289289A1 (en) * 2007-10-05 2009-11-26 Northern Lights Semiconductor Corp. Dram cell with magnetic capacitor
US9812184B2 (en) 2007-10-31 2017-11-07 New York University Current induced spin-momentum transfer stack with dual insulating layers
US7936028B2 (en) * 2007-11-09 2011-05-03 Samsung Electronics Co., Ltd. Spin field effect transistor using half metal and method of manufacturing the same
JP5455313B2 (ja) 2008-02-21 2014-03-26 株式会社東芝 磁気記憶素子及び磁気記憶装置
KR20100131967A (ko) 2008-03-06 2010-12-16 후지 덴키 홀딩스 가부시키가이샤 강자성 터널 접합 소자 및 강자성 터널 접합 소자의 구동 방법
KR100927195B1 (ko) * 2008-04-01 2009-11-18 이화여자대학교 산학협력단 스핀 토크 변환을 이용한 이중 자기터널접합 소자를 사용한xor 및 xnor 논리 연산장치
KR100966528B1 (ko) * 2008-04-30 2010-06-29 노던 라이트 세미컨덕터 코포레이션 전기 에너지를 저장하기 위한 자기 커패시터
KR100982455B1 (ko) * 2008-04-30 2010-09-16 노던 라이트 세미컨덕터 코포레이션 전기 에너지 저장 장치
US20090303779A1 (en) * 2008-06-05 2009-12-10 Young-Shying Chen Spin Torque Transfer MTJ Devices with High Thermal Stability and Low Write Currents
US9929211B2 (en) * 2008-09-24 2018-03-27 Qualcomm Incorporated Reducing spin pumping induced damping of a free layer of a memory device
JP2011003892A (ja) * 2009-06-18 2011-01-06 Northern Lights Semiconductor Corp Dramセル
US10446209B2 (en) 2009-08-10 2019-10-15 Samsung Semiconductor Inc. Method and system for providing magnetic tunneling junction elements having improved performance through capping layer induced perpendicular anisotropy and memories using such magnetic elements
US8913350B2 (en) * 2009-08-10 2014-12-16 Grandis, Inc. Method and system for providing magnetic tunneling junction elements having improved performance through capping layer induced perpendicular anisotropy and memories using such magnetic elements
US20110031569A1 (en) * 2009-08-10 2011-02-10 Grandis, Inc. Method and system for providing magnetic tunneling junction elements having improved performance through capping layer induced perpendicular anisotropy and memories using such magnetic elements
US8284594B2 (en) * 2009-09-03 2012-10-09 International Business Machines Corporation Magnetic devices and structures
US8385106B2 (en) * 2009-09-11 2013-02-26 Grandis, Inc. Method and system for providing a hierarchical data path for spin transfer torque random access memory
US8159866B2 (en) 2009-10-30 2012-04-17 Grandis, Inc. Method and system for providing dual magnetic tunneling junctions usable in spin transfer torque magnetic memories
US8422285B2 (en) * 2009-10-30 2013-04-16 Grandis, Inc. Method and system for providing dual magnetic tunneling junctions usable in spin transfer torque magnetic memories
US20110141802A1 (en) * 2009-12-15 2011-06-16 Grandis, Inc. Method and system for providing a high density memory cell for spin transfer torque random access memory
KR101212715B1 (ko) * 2009-12-29 2012-12-14 한양대학교 산학협력단 이중 터널 접합 구조를 이용한 자기 메모리 소자 및 자기 메모리 소자의 정보 기록방법과 정보 판독방법
US8254162B2 (en) 2010-01-11 2012-08-28 Grandis, Inc. Method and system for providing magnetic tunneling junctions usable in spin transfer torque magnetic memories
US9130151B2 (en) 2010-01-11 2015-09-08 Samsung Electronics Co., Ltd. Method and system for providing magnetic tunneling junctions usable in spin transfer torque magnetic memories
US8891290B2 (en) 2010-03-17 2014-11-18 Samsung Electronics Co., Ltd. Method and system for providing inverted dual magnetic tunneling junction elements
US8411497B2 (en) 2010-05-05 2013-04-02 Grandis, Inc. Method and system for providing a magnetic field aligned spin transfer torque random access memory
US8546896B2 (en) 2010-07-16 2013-10-01 Grandis, Inc. Magnetic tunneling junction elements having magnetic substructures(s) with a perpendicular anisotropy and memories using such magnetic elements
US8374048B2 (en) 2010-08-11 2013-02-12 Grandis, Inc. Method and system for providing magnetic tunneling junction elements having a biaxial anisotropy
CN102792478B (zh) * 2010-08-17 2014-09-03 松下电器产业株式会社 磁性隧道结元件
JP5617923B2 (ja) * 2010-08-17 2014-11-05 富士通株式会社 磁気抵抗素子及び半導体記憶装置
US8399941B2 (en) 2010-11-05 2013-03-19 Grandis, Inc. Magnetic junction elements having an easy cone anisotropy and a magnetic memory using such magnetic junction elements
US9478730B2 (en) 2010-12-31 2016-10-25 Samsung Electronics Co., Ltd. Method and system for providing magnetic layers having insertion layers for use in spin transfer torque memories
US8432009B2 (en) 2010-12-31 2013-04-30 Grandis, Inc. Method and system for providing magnetic layers having insertion layers for use in spin transfer torque memories
JP5768494B2 (ja) * 2011-05-19 2015-08-26 ソニー株式会社 記憶素子、記憶装置
JP5537501B2 (ja) 2011-06-09 2014-07-02 株式会社東芝 半導体記憶装置およびその製造方法
US8766383B2 (en) * 2011-07-07 2014-07-01 Samsung Electronics Co., Ltd. Method and system for providing a magnetic junction using half metallic ferromagnets
US8488373B2 (en) 2011-10-03 2013-07-16 Tdk Corporation Spin injection layer robustness for microwave assisted magnetic recording
US8829901B2 (en) * 2011-11-04 2014-09-09 Honeywell International Inc. Method of using a magnetoresistive sensor in second harmonic detection mode for sensing weak magnetic fields
EP2608208B1 (de) * 2011-12-22 2015-02-11 Crocus Technology S.A. Selbstbezogene MRAM-Zelle und Verfahren zum Beschreiben der Zelle unter Verwendung eines SST-Vorgangs
US20130241542A1 (en) * 2012-03-14 2013-09-19 Wolfgang Raberg Xmr monocell sensors, systems and methods
US9007818B2 (en) 2012-03-22 2015-04-14 Micron Technology, Inc. Memory cells, semiconductor device structures, systems including such cells, and methods of fabrication
US8923038B2 (en) 2012-06-19 2014-12-30 Micron Technology, Inc. Memory cells, semiconductor device structures, memory systems, and methods of fabrication
US9054030B2 (en) 2012-06-19 2015-06-09 Micron Technology, Inc. Memory cells, semiconductor device structures, memory systems, and methods of fabrication
KR101649978B1 (ko) * 2012-08-06 2016-08-22 코넬 유니버시티 자기 나노구조체들의 스핀 홀 토크 효과들에 기초한 전기적 게이트 3-단자 회로들 및 디바이스들
US8747680B1 (en) * 2012-08-14 2014-06-10 Everspin Technologies, Inc. Method of manufacturing a magnetoresistive-based device
US9082950B2 (en) 2012-10-17 2015-07-14 New York University Increased magnetoresistance in an inverted orthogonal spin transfer layer stack
US9082888B2 (en) 2012-10-17 2015-07-14 New York University Inverted orthogonal spin transfer layer stack
KR101967352B1 (ko) * 2012-10-31 2019-04-10 삼성전자주식회사 자기 메모리 소자 및 그 제조 방법
US9379315B2 (en) 2013-03-12 2016-06-28 Micron Technology, Inc. Memory cells, methods of fabrication, semiconductor device structures, and memory systems
WO2014151820A1 (en) * 2013-03-15 2014-09-25 Magarray, Inc. Magnetic tunnel junction sensors and methods for using the same
US8982613B2 (en) 2013-06-17 2015-03-17 New York University Scalable orthogonal spin transfer magnetic random access memory devices with reduced write error rates
US9368714B2 (en) 2013-07-01 2016-06-14 Micron Technology, Inc. Memory cells, methods of operation and fabrication, semiconductor device structures, and memory systems
US9466787B2 (en) 2013-07-23 2016-10-11 Micron Technology, Inc. Memory cells, methods of fabrication, semiconductor device structures, memory systems, and electronic systems
US9570101B2 (en) * 2013-08-28 2017-02-14 Seagate Technology Llc Magnetic adhesion layer and method of forming same
US9461242B2 (en) 2013-09-13 2016-10-04 Micron Technology, Inc. Magnetic memory cells, methods of fabrication, semiconductor devices, memory systems, and electronic systems
US9608197B2 (en) 2013-09-18 2017-03-28 Micron Technology, Inc. Memory cells, methods of fabrication, and semiconductor devices
US10454024B2 (en) 2014-02-28 2019-10-22 Micron Technology, Inc. Memory cells, methods of fabrication, and memory devices
US9281466B2 (en) 2014-04-09 2016-03-08 Micron Technology, Inc. Memory cells, semiconductor structures, semiconductor devices, and methods of fabrication
US9269888B2 (en) 2014-04-18 2016-02-23 Micron Technology, Inc. Memory cells, methods of fabrication, and semiconductor devices
US10008248B2 (en) 2014-07-17 2018-06-26 Cornell University Circuits and devices based on enhanced spin hall effect for efficient spin transfer torque
US9263667B1 (en) 2014-07-25 2016-02-16 Spin Transfer Technologies, Inc. Method for manufacturing MTJ memory device
US9337412B2 (en) 2014-09-22 2016-05-10 Spin Transfer Technologies, Inc. Magnetic tunnel junction structure for MRAM device
US9349945B2 (en) 2014-10-16 2016-05-24 Micron Technology, Inc. Memory cells, semiconductor devices, and methods of fabrication
US9768377B2 (en) 2014-12-02 2017-09-19 Micron Technology, Inc. Magnetic cell structures, and methods of fabrication
US10439131B2 (en) 2015-01-15 2019-10-08 Micron Technology, Inc. Methods of forming semiconductor devices including tunnel barrier materials
US10468590B2 (en) 2015-04-21 2019-11-05 Spin Memory, Inc. High annealing temperature perpendicular magnetic anisotropy structure for magnetic random access memory
US9728712B2 (en) 2015-04-21 2017-08-08 Spin Transfer Technologies, Inc. Spin transfer torque structure for MRAM devices having a spin current injection capping layer
US9887350B2 (en) 2015-05-31 2018-02-06 Headway Technologies, Inc. MTJ etching with improved uniformity and profile by adding passivation step
US9853206B2 (en) 2015-06-16 2017-12-26 Spin Transfer Technologies, Inc. Precessional spin current structure for MRAM
WO2017018391A1 (ja) 2015-07-24 2017-02-02 国立大学法人東京大学 メモリ素子
US9773974B2 (en) 2015-07-30 2017-09-26 Spin Transfer Technologies, Inc. Polishing stop layer(s) for processing arrays of semiconductor elements
US10163479B2 (en) 2015-08-14 2018-12-25 Spin Transfer Technologies, Inc. Method and apparatus for bipolar memory write-verify
CN105470385A (zh) * 2015-10-30 2016-04-06 上海磁宇信息科技有限公司 交叉矩阵列式磁性随机存储器制造工艺
CN105655481A (zh) * 2015-12-24 2016-06-08 上海磁宇信息科技有限公司 超密型交叉矩阵列式磁性随机存储器制造工艺
US9741926B1 (en) 2016-01-28 2017-08-22 Spin Transfer Technologies, Inc. Memory cell having magnetic tunnel junction and thermal stability enhancement layer
EP3217446B1 (de) * 2016-03-10 2022-02-23 Crocus Technology Magnetoresistives element mit einer einstellbaren magnetostriktion und magnetische vorrichtung mit dem magnetoresistiven element
FR3050068B1 (fr) * 2016-04-06 2018-05-18 Commissariat A L'energie Atomique Et Aux Energies Alternatives Aimant permanent comprenant un empilement de n motifs
JP2017228688A (ja) * 2016-06-23 2017-12-28 アルプス電気株式会社 磁気センサおよび電流センサ
US10304603B2 (en) * 2016-06-29 2019-05-28 International Business Machines Corporation Stress control in magnetic inductor stacks
US10811177B2 (en) 2016-06-30 2020-10-20 International Business Machines Corporation Stress control in magnetic inductor stacks
FR3054364B1 (fr) * 2016-07-20 2018-08-17 Commissariat A L'energie Atomique Et Aux Energies Alternatives Aimant permanent comprenant un empilement de n motifs
US10446210B2 (en) 2016-09-27 2019-10-15 Spin Memory, Inc. Memory instruction pipeline with a pre-read stage for a write operation for reducing power consumption in a memory device that uses dynamic redundancy registers
US10360964B2 (en) 2016-09-27 2019-07-23 Spin Memory, Inc. Method of writing contents in memory during a power up sequence using a dynamic redundancy register in a memory device
US10437723B2 (en) 2016-09-27 2019-10-08 Spin Memory, Inc. Method of flushing the contents of a dynamic redundancy register to a secure storage area during a power down in a memory device
US11151042B2 (en) 2016-09-27 2021-10-19 Integrated Silicon Solution, (Cayman) Inc. Error cache segmentation for power reduction
US10460781B2 (en) 2016-09-27 2019-10-29 Spin Memory, Inc. Memory device with a dual Y-multiplexer structure for performing two simultaneous operations on the same row of a memory bank
US11119910B2 (en) 2016-09-27 2021-09-14 Spin Memory, Inc. Heuristics for selecting subsegments for entry in and entry out operations in an error cache system with coarse and fine grain segments
US10818331B2 (en) 2016-09-27 2020-10-27 Spin Memory, Inc. Multi-chip module for MRAM devices with levels of dynamic redundancy registers
US11119936B2 (en) 2016-09-27 2021-09-14 Spin Memory, Inc. Error cache system with coarse and fine segments for power optimization
US10546625B2 (en) 2016-09-27 2020-01-28 Spin Memory, Inc. Method of optimizing write voltage based on error buffer occupancy
US10628316B2 (en) 2016-09-27 2020-04-21 Spin Memory, Inc. Memory device with a plurality of memory banks where each memory bank is associated with a corresponding memory instruction pipeline and a dynamic redundancy register
US10366774B2 (en) 2016-09-27 2019-07-30 Spin Memory, Inc. Device with dynamic redundancy registers
US10437491B2 (en) 2016-09-27 2019-10-08 Spin Memory, Inc. Method of processing incomplete memory operations in a memory device during a power up sequence and a power down sequence using a dynamic redundancy register
US10991410B2 (en) 2016-09-27 2021-04-27 Spin Memory, Inc. Bi-polar write scheme
WO2018101028A1 (ja) * 2016-12-02 2018-06-07 Tdk株式会社 スピン流磁化反転素子とその製造方法、磁気抵抗効果素子、磁気メモリ
US10978121B2 (en) 2016-12-23 2021-04-13 Institute Of Semiconductors, Chinese Academy Of Sciences Voltage control magnetic random storage unit, memory and logic device composed thereby
CN106531884B (zh) * 2016-12-23 2019-04-30 中国科学院半导体研究所 电压控制磁随机存储单元、存储器及其构成的逻辑器件
US20180233662A1 (en) * 2017-02-14 2018-08-16 Lam Research Corporation Systems and methods for patterning of high density standalone mram devices
US10665777B2 (en) 2017-02-28 2020-05-26 Spin Memory, Inc. Precessional spin current structure with non-magnetic insertion layer for MRAM
US10672976B2 (en) 2017-02-28 2020-06-02 Spin Memory, Inc. Precessional spin current structure with high in-plane magnetization for MRAM
US10032978B1 (en) 2017-06-27 2018-07-24 Spin Transfer Technologies, Inc. MRAM with reduced stray magnetic fields
US10043851B1 (en) 2017-08-03 2018-08-07 Headway Technologies, Inc. Etch selectivity by introducing oxidants to noble gas during physical magnetic tunnel junction (MTJ) etching
EP3673522B1 (de) 2017-08-23 2022-10-05 Everspin Technologies, Inc. Herstellung von magnetoresistiven bits durch mehrstufiges ätzen
US10481976B2 (en) 2017-10-24 2019-11-19 Spin Memory, Inc. Forcing bits as bad to widen the window between the distributions of acceptable high and low resistive bits thereby lowering the margin and increasing the speed of the sense amplifiers
US10489245B2 (en) 2017-10-24 2019-11-26 Spin Memory, Inc. Forcing stuck bits, waterfall bits, shunt bits and low TMR bits to short during testing and using on-the-fly bit failure detection and bit redundancy remapping techniques to correct them
US10656994B2 (en) 2017-10-24 2020-05-19 Spin Memory, Inc. Over-voltage write operation of tunnel magnet-resistance (“TMR”) memory device and correcting failure bits therefrom by using on-the-fly bit failure detection and bit redundancy remapping techniques
US10529439B2 (en) 2017-10-24 2020-01-07 Spin Memory, Inc. On-the-fly bit failure detection and bit redundancy remapping techniques to correct for fixed bit defects
US10325639B2 (en) 2017-11-20 2019-06-18 Taiwan Semiconductor Manufacturing Company, Ltd. Initialization process for magnetic random access memory (MRAM) production
US10679685B2 (en) 2017-12-27 2020-06-09 Spin Memory, Inc. Shared bit line array architecture for magnetoresistive memory
US10516094B2 (en) 2017-12-28 2019-12-24 Spin Memory, Inc. Process for creating dense pillars using multiple exposures for MRAM fabrication
US10811594B2 (en) 2017-12-28 2020-10-20 Spin Memory, Inc. Process for hard mask development for MRAM pillar formation using photolithography
US10395712B2 (en) 2017-12-28 2019-08-27 Spin Memory, Inc. Memory array with horizontal source line and sacrificial bitline per virtual source
US10395711B2 (en) 2017-12-28 2019-08-27 Spin Memory, Inc. Perpendicular source and bit lines for an MRAM array
US10360962B1 (en) 2017-12-28 2019-07-23 Spin Memory, Inc. Memory array with individually trimmable sense amplifiers
US10153427B1 (en) 2017-12-28 2018-12-11 Headway Technologies, Inc. Magnetic tunnel junction (MTJ) performance by introducing oxidants to methanol with or without noble gas during MTJ etch
US10424726B2 (en) 2017-12-28 2019-09-24 Spin Memory, Inc. Process for improving photoresist pillar adhesion during MRAM fabrication
US10891997B2 (en) 2017-12-28 2021-01-12 Spin Memory, Inc. Memory array with horizontal source line and a virtual source line
US10840436B2 (en) 2017-12-29 2020-11-17 Spin Memory, Inc. Perpendicular magnetic anisotropy interface tunnel junction devices and methods of manufacture
US10886330B2 (en) 2017-12-29 2021-01-05 Spin Memory, Inc. Memory device having overlapping magnetic tunnel junctions in compliance with a reference pitch
US10784439B2 (en) 2017-12-29 2020-09-22 Spin Memory, Inc. Precessional spin current magnetic tunnel junction devices and methods of manufacture
US10236048B1 (en) 2017-12-29 2019-03-19 Spin Memory, Inc. AC current write-assist in orthogonal STT-MRAM
US10367139B2 (en) 2017-12-29 2019-07-30 Spin Memory, Inc. Methods of manufacturing magnetic tunnel junction devices
US10546624B2 (en) 2017-12-29 2020-01-28 Spin Memory, Inc. Multi-port random access memory
US10360961B1 (en) 2017-12-29 2019-07-23 Spin Memory, Inc. AC current pre-charge write-assist in orthogonal STT-MRAM
US10424723B2 (en) 2017-12-29 2019-09-24 Spin Memory, Inc. Magnetic tunnel junction devices including an optimization layer
US10236047B1 (en) 2017-12-29 2019-03-19 Spin Memory, Inc. Shared oscillator (STNO) for MRAM array write-assist in orthogonal STT-MRAM
US10270027B1 (en) 2017-12-29 2019-04-23 Spin Memory, Inc. Self-generating AC current assist in orthogonal STT-MRAM
US10199083B1 (en) 2017-12-29 2019-02-05 Spin Transfer Technologies, Inc. Three-terminal MRAM with ac write-assist for low read disturb
US10840439B2 (en) 2017-12-29 2020-11-17 Spin Memory, Inc. Magnetic tunnel junction (MTJ) fabrication methods and systems
US10141499B1 (en) 2017-12-30 2018-11-27 Spin Transfer Technologies, Inc. Perpendicular magnetic tunnel junction device with offset precessional spin current layer
US10229724B1 (en) 2017-12-30 2019-03-12 Spin Memory, Inc. Microwave write-assist in series-interconnected orthogonal STT-MRAM devices
US10236439B1 (en) 2017-12-30 2019-03-19 Spin Memory, Inc. Switching and stability control for perpendicular magnetic tunnel junction device
US10319900B1 (en) 2017-12-30 2019-06-11 Spin Memory, Inc. Perpendicular magnetic tunnel junction device with precessional spin current layer having a modulated moment density
US10255962B1 (en) 2017-12-30 2019-04-09 Spin Memory, Inc. Microwave write-assist in orthogonal STT-MRAM
US10339993B1 (en) 2017-12-30 2019-07-02 Spin Memory, Inc. Perpendicular magnetic tunnel junction device with skyrmionic assist layers for free layer switching
US10468588B2 (en) 2018-01-05 2019-11-05 Spin Memory, Inc. Perpendicular magnetic tunnel junction device with skyrmionic enhancement layers for the precessional spin current magnetic layer
US10438995B2 (en) 2018-01-08 2019-10-08 Spin Memory, Inc. Devices including magnetic tunnel junctions integrated with selectors
US10438996B2 (en) 2018-01-08 2019-10-08 Spin Memory, Inc. Methods of fabricating magnetic tunnel junctions integrated with selectors
US10475991B2 (en) 2018-02-22 2019-11-12 Taiwan Semiconductor Manufacturing Company, Ltd. Fabrication of large height top metal electrode for sub-60nm magnetoresistive random access memory (MRAM) devices
US10446744B2 (en) 2018-03-08 2019-10-15 Spin Memory, Inc. Magnetic tunnel junction wafer adaptor used in magnetic annealing furnace and method of using the same
US10388861B1 (en) 2018-03-08 2019-08-20 Spin Memory, Inc. Magnetic tunnel junction wafer adaptor used in magnetic annealing furnace and method of using the same
US11107974B2 (en) 2018-03-23 2021-08-31 Spin Memory, Inc. Magnetic tunnel junction devices including a free magnetic trench layer and a planar reference magnetic layer
US10784437B2 (en) 2018-03-23 2020-09-22 Spin Memory, Inc. Three-dimensional arrays with MTJ devices including a free magnetic trench layer and a planar reference magnetic layer
US11107978B2 (en) 2018-03-23 2021-08-31 Spin Memory, Inc. Methods of manufacturing three-dimensional arrays with MTJ devices including a free magnetic trench layer and a planar reference magnetic layer
US10529915B2 (en) 2018-03-23 2020-01-07 Spin Memory, Inc. Bit line structures for three-dimensional arrays with magnetic tunnel junction devices including an annular free magnetic layer and a planar reference magnetic layer
US10411185B1 (en) 2018-05-30 2019-09-10 Spin Memory, Inc. Process for creating a high density magnetic tunnel junction array test platform
US10593396B2 (en) 2018-07-06 2020-03-17 Spin Memory, Inc. Multi-bit cell read-out techniques for MRAM cells with mixed pinned magnetization orientations
US10600478B2 (en) 2018-07-06 2020-03-24 Spin Memory, Inc. Multi-bit cell read-out techniques for MRAM cells with mixed pinned magnetization orientations
US10559338B2 (en) 2018-07-06 2020-02-11 Spin Memory, Inc. Multi-bit cell read-out techniques
US10692569B2 (en) 2018-07-06 2020-06-23 Spin Memory, Inc. Read-out techniques for multi-bit cells
US10650875B2 (en) 2018-08-21 2020-05-12 Spin Memory, Inc. System for a wide temperature range nonvolatile memory
US10699761B2 (en) 2018-09-18 2020-06-30 Spin Memory, Inc. Word line decoder memory architecture
US11621293B2 (en) 2018-10-01 2023-04-04 Integrated Silicon Solution, (Cayman) Inc. Multi terminal device stack systems and methods
US10971680B2 (en) 2018-10-01 2021-04-06 Spin Memory, Inc. Multi terminal device stack formation methods
US11127788B2 (en) * 2018-10-31 2021-09-21 Taiwan Semiconductor Manufacturing Company Limited Semiconductor device having magnetic tunnel junction (MTJ) stack
US10580827B1 (en) 2018-11-16 2020-03-03 Spin Memory, Inc. Adjustable stabilizer/polarizer method for MRAM with enhanced stability and efficient switching
US11107979B2 (en) 2018-12-28 2021-08-31 Spin Memory, Inc. Patterned silicide structures and methods of manufacture
CN112186097B (zh) * 2019-07-01 2023-10-27 上海磁宇信息科技有限公司 一种优化磁性随机存储器写性能的结构及其制备方法
US11500042B2 (en) 2020-02-28 2022-11-15 Brown University Magnetic sensing devices based on interlayer exchange-coupled magnetic thin films
TWI758077B (zh) * 2021-01-21 2022-03-11 凌北卿 具有pn二極體之非揮發性記憶體元件

Family Cites Families (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US53A (en) * 1836-10-15 Combined plow
US4780848A (en) * 1986-06-03 1988-10-25 Honeywell Inc. Magnetoresistive memory with multi-layer storage cells having layers of limited thickness
JPH0730765B2 (ja) 1989-05-31 1995-04-10 シーケーデイ株式会社 ロツドレスシリンダ
JP3483895B2 (ja) 1990-11-01 2004-01-06 株式会社東芝 磁気抵抗効果膜
DE69219936T3 (de) 1991-03-29 2008-03-06 Kabushiki Kaisha Toshiba Magnetowiderstandseffekt-Element
JPH05183212A (ja) 1991-07-30 1993-07-23 Toshiba Corp 磁気抵抗効果素子
US5304975A (en) 1991-10-23 1994-04-19 Kabushiki Kaisha Toshiba Magnetoresistance effect element and magnetoresistance effect sensor
US5301975A (en) * 1991-12-11 1994-04-12 Eddy Rivera Overhead screen for a wheelchair
JP3207477B2 (ja) * 1991-12-24 2001-09-10 財団法人生産開発科学研究所 磁気抵抗効果素子
JP3381957B2 (ja) 1992-08-03 2003-03-04 株式会社東芝 磁気抵抗効果素子、磁気ヘッドおよび磁気センサ
US5500633A (en) 1992-08-03 1996-03-19 Kabushiki Kaisha Toshiba Magnetoresistance effect element
US5287238A (en) 1992-11-06 1994-02-15 International Business Machines Corporation Dual spin valve magnetoresistive sensor
US5343422A (en) * 1993-02-23 1994-08-30 International Business Machines Corporation Nonvolatile magnetoresistive storage device using spin valve effect
WO1996011469A1 (en) * 1994-10-05 1996-04-18 Philips Electronics N.V. Magnetic multilayer device including a resonant-tunneling double-barrier structure
FR2729790A1 (fr) * 1995-01-24 1996-07-26 Commissariat Energie Atomique Magnetoresistance geante, procede de fabrication et application a un capteur magnetique
US5773156A (en) 1995-01-26 1998-06-30 Kabushiki Kaisha Toshiba Magnetoresistance effect element
US5587943A (en) * 1995-02-13 1996-12-24 Integrated Microtransducer Electronics Corporation Nonvolatile magnetoresistive memory with fully closed flux operation
US5654566A (en) * 1995-04-21 1997-08-05 Johnson; Mark B. Magnetic spin injected field effect transistor and method of operation
JP3217703B2 (ja) 1995-09-01 2001-10-15 株式会社東芝 磁性体デバイス及びそれを用いた磁気センサ
JPH09251618A (ja) 1996-03-19 1997-09-22 Fujitsu Ltd 磁気センサ
DE19701509C2 (de) * 1996-01-19 2003-08-21 Fujitsu Ltd Magnetsensoren
US6590750B2 (en) * 1996-03-18 2003-07-08 International Business Machines Corporation Limiting magnetoresistive electrical interaction to a preferred portion of a magnetic region in magnetic devices
US5650958A (en) 1996-03-18 1997-07-22 International Business Machines Corporation Magnetic tunnel junctions with controlled magnetic response
US5640343A (en) * 1996-03-18 1997-06-17 International Business Machines Corporation Magnetic memory array using magnetic tunnel junction devices in the memory cells
JP3585629B2 (ja) * 1996-03-26 2004-11-04 株式会社東芝 磁気抵抗効果素子及び磁気情報読み出し方法
JP3524341B2 (ja) 1996-08-26 2004-05-10 株式会社東芝 磁気抵抗効果素子と、それを用いた磁気ヘッド、磁気記録再生ヘッドおよび磁気記憶装置
US5705973A (en) * 1996-08-26 1998-01-06 Read-Rite Corporation Bias-free symmetric dual spin valve giant magnetoresistance transducer
JP3181525B2 (ja) * 1996-12-13 2001-07-03 アルプス電気株式会社 スピンバルブ型薄膜素子及び前記スピンバルブ型薄膜素子を用いた薄膜磁気ヘッド
US5894447A (en) * 1996-09-26 1999-04-13 Kabushiki Kaisha Toshiba Semiconductor memory device including a particular memory cell block structure
JP3258241B2 (ja) * 1996-09-30 2002-02-18 株式会社東芝 単一電子制御磁気抵抗素子
US5757056A (en) * 1996-11-12 1998-05-26 University Of Delaware Multiple magnetic tunnel structures
JPH10154311A (ja) 1996-11-21 1998-06-09 Nec Corp 磁気抵抗効果素子およびシールド型磁気抵抗効果センサ
JP3699802B2 (ja) 1997-05-07 2005-09-28 株式会社東芝 磁気抵抗効果ヘッド
JP3263004B2 (ja) 1997-06-06 2002-03-04 アルプス電気株式会社 スピンバルブ型薄膜素子
US5838608A (en) * 1997-06-16 1998-11-17 Motorola, Inc. Multi-layer magnetic random access memory and method for fabricating thereof
JPH1186235A (ja) 1997-09-04 1999-03-30 Hitachi Ltd 磁気記録再生装置
JPH1197762A (ja) 1997-09-17 1999-04-09 Sumitomo Metal Ind Ltd 磁気抵抗効果素子
DE19744095A1 (de) * 1997-10-06 1999-04-15 Siemens Ag Speicherzellenanordnung
US5966012A (en) 1997-10-07 1999-10-12 International Business Machines Corporation Magnetic tunnel junction device with improved fixed and free ferromagnetic layers
JP2962415B2 (ja) 1997-10-22 1999-10-12 アルプス電気株式会社 交換結合膜
KR19990033653A (ko) 1997-10-25 1999-05-15 구자홍 횡전계방식 액정표시소자
JPH11163436A (ja) 1997-11-27 1999-06-18 Matsushita Electric Ind Co Ltd 磁気抵抗効果素子及び磁気抵抗効果型ヘッド
US6130835A (en) * 1997-12-02 2000-10-10 International Business Machines Corporation Voltage biasing for magnetic RAM with magnetic tunnel memory cells
US5991193A (en) * 1997-12-02 1999-11-23 International Business Machines Corporation Voltage biasing for magnetic ram with magnetic tunnel memory cells
JPH11177161A (ja) * 1997-12-12 1999-07-02 Matsushita Electric Ind Co Ltd 磁気抵抗効果素子及び磁気抵抗効果型薄膜ヘッド
JPH11203634A (ja) 1998-01-16 1999-07-30 Hitachi Metals Ltd 磁気抵抗効果型ヘッド
JP3679593B2 (ja) 1998-01-28 2005-08-03 キヤノン株式会社 磁性薄膜素子および磁性薄膜メモリ素子およびその記録再生方法
US6072718A (en) * 1998-02-10 2000-06-06 International Business Machines Corporation Magnetic memory devices having multiple magnetic tunnel junctions therein
JP3556457B2 (ja) * 1998-02-20 2004-08-18 株式会社東芝 スピン依存伝導素子とそれを用いた電子部品および磁気部品
US6069820A (en) 1998-02-20 2000-05-30 Kabushiki Kaisha Toshiba Spin dependent conduction device
JP3520192B2 (ja) * 1998-02-20 2004-04-19 株式会社東芝 磁気素子とそれを用いた磁気部品および電子部品
US5930164A (en) * 1998-02-26 1999-07-27 Motorola, Inc. Magnetic memory unit having four states and operating method thereof
US6211559B1 (en) * 1998-02-27 2001-04-03 Motorola, Inc. Symmetric magnetic tunnel device
DE69923386T2 (de) * 1998-05-13 2005-12-22 Sony Corp. Bauelement mit magnetischem Material und Adressierverfahren dafür
US6114719A (en) * 1998-05-29 2000-09-05 International Business Machines Corporation Magnetic tunnel junction memory cell with in-stack biasing of the free ferromagnetic layer and memory array using the cell
JP3593472B2 (ja) * 1998-06-30 2004-11-24 株式会社東芝 磁気素子とそれを用いた磁気メモリおよび磁気センサ
US5953248A (en) 1998-07-20 1999-09-14 Motorola, Inc. Low switching field magnetic tunneling junction for high density arrays
US5946227A (en) * 1998-07-20 1999-08-31 Motorola, Inc. Magnetoresistive random access memory with shared word and digit lines
US6052263A (en) * 1998-08-21 2000-04-18 International Business Machines Corporation Low moment/high coercivity pinned layer for magnetic tunnel junction sensors
US6143477A (en) * 1998-09-08 2000-11-07 Amtech Systems, Inc. Dual wavelength UV lamp reactor and method for cleaning/ashing semiconductor wafers
US6365286B1 (en) * 1998-09-11 2002-04-02 Kabushiki Kaisha Toshiba Magnetic element, magnetic memory device, magnetoresistance effect head, and magnetic storage system
JP2000100154A (ja) 1998-09-22 2000-04-07 Sanyo Electric Co Ltd 磁気メモリ素子及びこれを用いた記録再生方法
US5969978A (en) * 1998-09-30 1999-10-19 The United States Of America As Represented By The Secretary Of The Navy Read/write memory architecture employing closed ring elements
US6178074B1 (en) * 1998-11-19 2001-01-23 International Business Machines Corporation Double tunnel junction with magnetoresistance enhancement layer
US6381171B1 (en) 1999-05-19 2002-04-30 Kabushiki Kaisha Toshiba Magnetic element, magnetic read head, magnetic storage device, magnetic memory device
JP3477638B2 (ja) * 1999-07-09 2003-12-10 科学技術振興事業団 強磁性2重量子井戸トンネル磁気抵抗デバイス
US6275363B1 (en) * 1999-07-23 2001-08-14 International Business Machines Corporation Read head with dual tunnel junction sensor
US6097626A (en) * 1999-07-28 2000-08-01 Hewlett-Packard Company MRAM device using magnetic field bias to suppress inadvertent switching of half-selected memory cells
US6259586B1 (en) * 1999-09-02 2001-07-10 International Business Machines Corporation Magnetic tunnel junction sensor with AP-coupled free layer
US6166948A (en) * 1999-09-03 2000-12-26 International Business Machines Corporation Magnetic memory array with magnetic tunnel junction memory cells having flux-closed free layers
US6611405B1 (en) * 1999-09-16 2003-08-26 Kabushiki Kaisha Toshiba Magnetoresistive element and magnetic memory device
US6473336B2 (en) 1999-12-16 2002-10-29 Kabushiki Kaisha Toshiba Magnetic memory device
US6469926B1 (en) * 2000-03-22 2002-10-22 Motorola, Inc. Magnetic element with an improved magnetoresistance ratio and fabricating method thereof
JP4309075B2 (ja) 2000-07-27 2009-08-05 株式会社東芝 磁気記憶装置
US6593608B1 (en) * 2002-03-15 2003-07-15 Hewlett-Packard Development Company, L.P. Magneto resistive storage device having double tunnel junction
US6667901B1 (en) * 2003-04-29 2003-12-23 Hewlett-Packard Development Company, L.P. Dual-junction magnetic memory device and read method

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US7345852B2 (en) 2008-03-18
US6611405B1 (en) 2003-08-26
US6751074B2 (en) 2004-06-15
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US20070297101A1 (en) 2007-12-27
US6987653B2 (en) 2006-01-17
EP1085586B1 (de) 2008-01-16
EP1085586A3 (de) 2005-04-27
EP1085586A2 (de) 2001-03-21
US20040175596A1 (en) 2004-09-09
US20050185347A1 (en) 2005-08-25
US20030197984A1 (en) 2003-10-23
KR20010030391A (ko) 2001-04-16
US7593193B2 (en) 2009-09-22
US20060146451A1 (en) 2006-07-06
US7038894B2 (en) 2006-05-02
CN1308317A (zh) 2001-08-15
CN1185630C (zh) 2005-01-19

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