DE60106084D1 - Polierkissen und anwendungsverfahren dafür - Google Patents
Polierkissen und anwendungsverfahren dafürInfo
- Publication number
- DE60106084D1 DE60106084D1 DE60106084T DE60106084T DE60106084D1 DE 60106084 D1 DE60106084 D1 DE 60106084D1 DE 60106084 T DE60106084 T DE 60106084T DE 60106084 T DE60106084 T DE 60106084T DE 60106084 D1 DE60106084 D1 DE 60106084D1
- Authority
- DE
- Germany
- Prior art keywords
- unit cell
- wafer
- article
- area
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/756,376 US6612916B2 (en) | 2001-01-08 | 2001-01-08 | Article suitable for chemical mechanical planarization processes |
US756376 | 2001-01-08 | ||
PCT/US2001/019212 WO2002053324A1 (en) | 2001-01-08 | 2001-06-15 | Polishing pad and method of use thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60106084D1 true DE60106084D1 (de) | 2004-11-04 |
DE60106084T2 DE60106084T2 (de) | 2005-10-13 |
Family
ID=25043197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60106084T Expired - Lifetime DE60106084T2 (de) | 2001-01-08 | 2001-06-15 | Polierkissen und anwendungsverfahren dafür |
Country Status (9)
Country | Link |
---|---|
US (2) | US6612916B2 (de) |
EP (1) | EP1349705B1 (de) |
JP (1) | JP4933716B2 (de) |
KR (1) | KR100777846B1 (de) |
CN (1) | CN1217769C (de) |
AT (1) | ATE277720T1 (de) |
DE (1) | DE60106084T2 (de) |
TW (1) | TW526554B (de) |
WO (1) | WO2002053324A1 (de) |
Families Citing this family (50)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6685539B1 (en) * | 1999-08-24 | 2004-02-03 | Ricoh Company, Ltd. | Processing tool, method of producing tool, processing method and processing apparatus |
US6790768B2 (en) | 2001-07-11 | 2004-09-14 | Applied Materials Inc. | Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects |
US6908366B2 (en) * | 2003-01-10 | 2005-06-21 | 3M Innovative Properties Company | Method of using a soft subpad for chemical mechanical polishing |
JP2006513573A (ja) * | 2003-01-10 | 2006-04-20 | スリーエム イノベイティブ プロパティズ カンパニー | 化学的機械的平坦化用途向けのパッド構成体 |
US7311522B2 (en) * | 2003-03-31 | 2007-12-25 | Miltex Technology Corporation | Endodontic instruments and method of manufacturing same |
KR100590202B1 (ko) * | 2003-08-29 | 2006-06-15 | 삼성전자주식회사 | 연마 패드 및 그 형성방법 |
US7186651B2 (en) * | 2003-10-30 | 2007-03-06 | Texas Instruments Incorporated | Chemical mechanical polishing method and apparatus |
US7294048B2 (en) * | 2004-06-18 | 2007-11-13 | 3M Innovative Properties Company | Abrasive article |
EP1799402A4 (de) * | 2004-10-06 | 2009-12-16 | Rajeev Bajaj | Verfahren und vorrichtung zur verbesserten chemisch-mechanischen planarisierung |
US20060079159A1 (en) * | 2004-10-08 | 2006-04-13 | Markus Naujok | Chemical mechanical polish with multi-zone abrasive-containing matrix |
US20080318505A1 (en) * | 2004-11-29 | 2008-12-25 | Rajeev Bajaj | Chemical mechanical planarization pad and method of use thereof |
US20090061744A1 (en) * | 2007-08-28 | 2009-03-05 | Rajeev Bajaj | Polishing pad and method of use |
US7815778B2 (en) * | 2005-11-23 | 2010-10-19 | Semiquest Inc. | Electro-chemical mechanical planarization pad with uniform polish performance |
US7530880B2 (en) * | 2004-11-29 | 2009-05-12 | Semiquest Inc. | Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor |
US20070224925A1 (en) * | 2006-03-21 | 2007-09-27 | Rajeev Bajaj | Chemical Mechanical Polishing Pad |
US7846008B2 (en) * | 2004-11-29 | 2010-12-07 | Semiquest Inc. | Method and apparatus for improved chemical mechanical planarization and CMP pad |
US8075745B2 (en) * | 2004-11-29 | 2011-12-13 | Semiquest Inc. | Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance |
US7169029B2 (en) * | 2004-12-16 | 2007-01-30 | 3M Innovative Properties Company | Resilient structured sanding article |
US6997785B1 (en) | 2004-12-23 | 2006-02-14 | 3M Innovative Properties Company | Wafer planarization composition and method of use |
US7762871B2 (en) * | 2005-03-07 | 2010-07-27 | Rajeev Bajaj | Pad conditioner design and method of use |
US8398463B2 (en) * | 2005-03-07 | 2013-03-19 | Rajeev Bajaj | Pad conditioner and method |
US7179159B2 (en) * | 2005-05-02 | 2007-02-20 | Applied Materials, Inc. | Materials for chemical mechanical polishing |
US7435162B2 (en) * | 2005-10-24 | 2008-10-14 | 3M Innovative Properties Company | Polishing fluids and methods for CMP |
US20070128991A1 (en) * | 2005-12-07 | 2007-06-07 | Yoon Il-Young | Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same |
US20090011679A1 (en) * | 2007-04-06 | 2009-01-08 | Rajeev Bajaj | Method of removal profile modulation in cmp pads |
US20090266002A1 (en) * | 2008-04-29 | 2009-10-29 | Rajeev Bajaj | Polishing pad and method of use |
JP5514806B2 (ja) * | 2008-04-29 | 2014-06-04 | セミクエスト・インコーポレーテッド | 研磨パッド組成物およびその製造方法ならびに使用 |
IES20080376A2 (en) * | 2008-05-13 | 2010-05-12 | Michael O'ceallaigh | An abrasive material, wheel and tool for grinding semiconductor substrates, and method of manufacture of same |
US20090313905A1 (en) * | 2008-06-18 | 2009-12-24 | Stephen Fisher | Method and apparatus for assembly of cmp polishing pads |
JP5596030B2 (ja) * | 2008-06-26 | 2014-09-24 | スリーエム イノベイティブ プロパティズ カンパニー | 多孔質エレメントを有する研磨パッド及びその製造方法と使用方法 |
TWI449597B (zh) * | 2008-07-09 | 2014-08-21 | Iv Technologies Co Ltd | 研磨墊及其製造方法 |
US8292692B2 (en) * | 2008-11-26 | 2012-10-23 | Semiquest, Inc. | Polishing pad with endpoint window and systems and method using the same |
GB0823086D0 (en) * | 2008-12-18 | 2009-01-28 | Univ Nottingham | Abrasive Tools |
TWI535527B (zh) * | 2009-07-20 | 2016-06-01 | 智勝科技股份有限公司 | 研磨方法、研磨墊與研磨系統 |
DE102010010885B4 (de) * | 2010-03-10 | 2017-06-08 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe |
JP2013049112A (ja) * | 2011-08-31 | 2013-03-14 | Kyushu Institute Of Technology | ポリシングパッド及びその製造方法 |
RU2620846C2 (ru) * | 2012-07-06 | 2017-05-30 | 3М Инновейтив Пропертиз Компани | Абразивное изделие с покрытием |
US10226853B2 (en) | 2013-01-18 | 2019-03-12 | Applied Materials, Inc. | Methods and apparatus for conditioning of chemical mechanical polishing pads |
US9649742B2 (en) | 2013-01-22 | 2017-05-16 | Nexplanar Corporation | Polishing pad having polishing surface with continuous protrusions |
EP3126092B1 (de) | 2014-04-03 | 2022-08-17 | 3M Innovative Properties Company | Polierkissen und systeme und verfahren zur herstellung und verwendung davon |
US20170022392A1 (en) * | 2014-04-04 | 2017-01-26 | Fujimi Incorporated | Polishing composition for hard materials |
US11331767B2 (en) * | 2019-02-01 | 2022-05-17 | Micron Technology, Inc. | Pads for chemical mechanical planarization tools, chemical mechanical planarization tools, and related methods |
KR102440315B1 (ko) * | 2020-05-11 | 2022-09-06 | 한국생산기술연구원 | 패턴구조를 갖는 화학기계적 연마용 패드 및 이의 제조방법 |
KR102186895B1 (ko) * | 2019-05-29 | 2020-12-07 | 한국생산기술연구원 | 마이크로 패턴을 갖는 연마용 패드의 설계방법 |
WO2020242110A1 (ko) * | 2019-05-29 | 2020-12-03 | 한국생산기술연구원 | 연마면에 형성된 패턴 구조를 갖는 연마 패드, 이를 포함하는 연마 장치 및 연마 패드의 제조 방법 |
KR102221514B1 (ko) * | 2019-05-29 | 2021-03-03 | 한국생산기술연구원 | 연마액의 유동 저항 구조를 갖는 연마용 패드 |
WO2020242172A1 (ko) * | 2019-05-29 | 2020-12-03 | 한국생산기술연구원 | 패턴구조를 갖는 화학기계적 연마용 패드 |
US11524385B2 (en) * | 2019-06-07 | 2022-12-13 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP polishing pad with lobed protruding structures |
US11833638B2 (en) * | 2020-03-25 | 2023-12-05 | Rohm and Haas Electronic Materials Holding, Inc. | CMP polishing pad with polishing elements on supports |
US20230178360A1 (en) * | 2021-12-06 | 2023-06-08 | Tung An Development Ltd. | Device Having Cleaning Bodies |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4314827A (en) | 1979-06-29 | 1982-02-09 | Minnesota Mining And Manufacturing Company | Non-fused aluminum oxide-based abrasive mineral |
US4623364A (en) | 1984-03-23 | 1986-11-18 | Norton Company | Abrasive material and method for preparing the same |
CA1254238A (en) | 1985-04-30 | 1989-05-16 | Alvin P. Gerk | Process for durable sol-gel produced alumina-based ceramics, abrasive grain and abrasive products |
US4652275A (en) | 1985-08-07 | 1987-03-24 | Minnesota Mining And Manufacturing Company | Erodable agglomerates and abrasive products containing the same |
US4770671A (en) | 1985-12-30 | 1988-09-13 | Minnesota Mining And Manufacturing Company | Abrasive grits formed of ceramic containing oxides of aluminum and yttrium, method of making and using the same and products made therewith |
US4799939A (en) | 1987-02-26 | 1989-01-24 | Minnesota Mining And Manufacturing Company | Erodable agglomerates and abrasive products containing the same |
US4881951A (en) | 1987-05-27 | 1989-11-21 | Minnesota Mining And Manufacturing Co. | Abrasive grits formed of ceramic containing oxides of aluminum and rare earth metal, method of making and products made therewith |
US5177908A (en) | 1990-01-22 | 1993-01-12 | Micron Technology, Inc. | Polishing pad |
US5020283A (en) | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
US5152917B1 (en) | 1991-02-06 | 1998-01-13 | Minnesota Mining & Mfg | Structured abrasive article |
US5437754A (en) | 1992-01-13 | 1995-08-01 | Minnesota Mining And Manufacturing Company | Abrasive article having precise lateral spacing between abrasive composite members |
US6022264A (en) | 1997-02-10 | 2000-02-08 | Rodel Inc. | Polishing pad and methods relating thereto |
US5435816A (en) | 1993-01-14 | 1995-07-25 | Minnesota Mining And Manufacturing Company | Method of making an abrasive article |
US5549962A (en) | 1993-06-30 | 1996-08-27 | Minnesota Mining And Manufacturing Company | Precisely shaped particles and method of making the same |
US5454844A (en) | 1993-10-29 | 1995-10-03 | Minnesota Mining And Manufacturing Company | Abrasive article, a process of making same, and a method of using same to finish a workpiece surface |
US5391210A (en) | 1993-12-16 | 1995-02-21 | Minnesota Mining And Manufacturing Company | Abrasive article |
WO1995022436A1 (en) | 1994-02-22 | 1995-08-24 | Minnesota Mining And Manufacturing Company | Abrasive article, a method of making same, and a method of using same for finishing |
US5489233A (en) | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
US5958794A (en) | 1995-09-22 | 1999-09-28 | Minnesota Mining And Manufacturing Company | Method of modifying an exposed surface of a semiconductor wafer |
JP3843545B2 (ja) * | 1996-07-31 | 2006-11-08 | 東ソー株式会社 | 研磨用成形体、それを用いた研磨用定盤及び研磨方法 |
US5692950A (en) | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
US6224465B1 (en) | 1997-06-26 | 2001-05-01 | Stuart L. Meyer | Methods and apparatus for chemical mechanical planarization using a microreplicated surface |
JPH1148128A (ja) | 1997-08-07 | 1999-02-23 | Asahi Glass Co Ltd | 研磨パッド及びこれを用いた板状材の研磨方法 |
US5888121A (en) | 1997-09-23 | 1999-03-30 | Lsi Logic Corporation | Controlling groove dimensions for enhanced slurry flow |
JP3056714B2 (ja) * | 1997-10-06 | 2000-06-26 | 松下電子工業株式会社 | 半導体基板の研磨方法 |
US6299508B1 (en) * | 1998-08-05 | 2001-10-09 | 3M Innovative Properties Company | Abrasive article with integrally molded front surface protrusions containing a grinding aid and methods of making and using |
JP2000301450A (ja) * | 1999-04-19 | 2000-10-31 | Rohm Co Ltd | Cmp研磨パッドおよびそれを用いたcmp処理装置 |
US6234875B1 (en) | 1999-06-09 | 2001-05-22 | 3M Innovative Properties Company | Method of modifying a surface |
US6390891B1 (en) * | 2000-04-26 | 2002-05-21 | Speedfam-Ipec Corporation | Method and apparatus for improved stability chemical mechanical polishing |
-
2001
- 2001-01-08 US US09/756,376 patent/US6612916B2/en not_active Expired - Lifetime
- 2001-06-15 CN CN018218245A patent/CN1217769C/zh not_active Expired - Fee Related
- 2001-06-15 JP JP2002554264A patent/JP4933716B2/ja not_active Expired - Fee Related
- 2001-06-15 AT AT01946399T patent/ATE277720T1/de not_active IP Right Cessation
- 2001-06-15 DE DE60106084T patent/DE60106084T2/de not_active Expired - Lifetime
- 2001-06-15 KR KR1020037008979A patent/KR100777846B1/ko active IP Right Grant
- 2001-06-15 EP EP01946399A patent/EP1349705B1/de not_active Expired - Lifetime
- 2001-06-15 WO PCT/US2001/019212 patent/WO2002053324A1/en active IP Right Grant
-
2002
- 2002-01-07 TW TW091100108A patent/TW526554B/zh not_active IP Right Cessation
-
2003
- 2003-06-19 US US10/465,204 patent/US6817926B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1349705A1 (de) | 2003-10-08 |
DE60106084T2 (de) | 2005-10-13 |
TW526554B (en) | 2003-04-01 |
KR20030068576A (ko) | 2003-08-21 |
US6612916B2 (en) | 2003-09-02 |
JP2004517480A (ja) | 2004-06-10 |
ATE277720T1 (de) | 2004-10-15 |
US6817926B2 (en) | 2004-11-16 |
KR100777846B1 (ko) | 2007-11-21 |
EP1349705B1 (de) | 2004-09-29 |
US20030199235A1 (en) | 2003-10-23 |
US20020151253A1 (en) | 2002-10-17 |
CN1486233A (zh) | 2004-03-31 |
WO2002053324A1 (en) | 2002-07-11 |
JP4933716B2 (ja) | 2012-05-16 |
CN1217769C (zh) | 2005-09-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |