DE60120254D1 - Abscheidung und thermische Behandlung von dünnen Schichten aus Mehrkomponentenoxyden von Typ ZrSnTi und HfSnTi unter Verwendung eines flüssigen lösungsmittelfreien Vorläufergemisch - Google Patents
Abscheidung und thermische Behandlung von dünnen Schichten aus Mehrkomponentenoxyden von Typ ZrSnTi und HfSnTi unter Verwendung eines flüssigen lösungsmittelfreien VorläufergemischInfo
- Publication number
- DE60120254D1 DE60120254D1 DE60120254T DE60120254T DE60120254D1 DE 60120254 D1 DE60120254 D1 DE 60120254D1 DE 60120254 T DE60120254 T DE 60120254T DE 60120254 T DE60120254 T DE 60120254T DE 60120254 D1 DE60120254 D1 DE 60120254D1
- Authority
- DE
- Germany
- Prior art keywords
- thin films
- hfsnti
- zrsnti
- deposition
- thermal treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/522,634 US6500499B1 (en) | 2000-03-10 | 2000-03-10 | Deposition and annealing of multicomponent ZrSnTi and HfSnTi oxide thin films using solventless liquid mixture of precursors |
US522634 | 2000-03-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60120254D1 true DE60120254D1 (de) | 2006-07-20 |
DE60120254T2 DE60120254T2 (de) | 2006-09-21 |
Family
ID=24081662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60120254T Expired - Fee Related DE60120254T2 (de) | 2000-03-10 | 2001-03-08 | Abscheidung und thermische Behandlung von dünnen Schichten aus Mehrkomponentenoxyden von Typ ZrSnTi und HfSnTi unter Verwendung eines flüssigen lösungsmittelfreien Vorläufergemisch |
Country Status (7)
Country | Link |
---|---|
US (1) | US6500499B1 (de) |
EP (1) | EP1132494B1 (de) |
JP (1) | JP3523211B2 (de) |
KR (1) | KR100398495B1 (de) |
AT (1) | ATE329065T1 (de) |
DE (1) | DE60120254T2 (de) |
TW (1) | TW583333B (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6503561B1 (en) * | 1999-07-08 | 2003-01-07 | Air Products And Chemicals, Inc. | Liquid precursor mixtures for deposition of multicomponent metal containing materials |
JP5290488B2 (ja) | 2000-09-28 | 2013-09-18 | プレジデント アンド フェロウズ オブ ハーバード カレッジ | 酸化物、ケイ酸塩及びリン酸塩の気相成長 |
US6958302B2 (en) * | 2002-12-04 | 2005-10-25 | Micron Technology, Inc. | Atomic layer deposited Zr-Sn-Ti-O films using TiI4 |
US7101813B2 (en) | 2002-12-04 | 2006-09-05 | Micron Technology Inc. | Atomic layer deposited Zr-Sn-Ti-O films |
US6887523B2 (en) * | 2002-12-20 | 2005-05-03 | Sharp Laboratories Of America, Inc. | Method for metal oxide thin film deposition via MOCVD |
US7183186B2 (en) | 2003-04-22 | 2007-02-27 | Micro Technology, Inc. | Atomic layer deposited ZrTiO4 films |
US7588988B2 (en) | 2004-08-31 | 2009-09-15 | Micron Technology, Inc. | Method of forming apparatus having oxide films formed using atomic layer deposition |
US7494939B2 (en) | 2004-08-31 | 2009-02-24 | Micron Technology, Inc. | Methods for forming a lanthanum-metal oxide dielectric layer |
KR100584783B1 (ko) | 2005-02-24 | 2006-05-30 | 삼성전자주식회사 | 복합막 형성 방법과 이를 이용한 게이트 구조물 및 커패시터 제조 방법 |
US7393736B2 (en) | 2005-08-29 | 2008-07-01 | Micron Technology, Inc. | Atomic layer deposition of Zrx Hfy Sn1-x-y O2 films as high k gate dielectrics |
JP2007194582A (ja) | 2005-12-20 | 2007-08-02 | Tokyo Electron Ltd | 高誘電体薄膜の改質方法及び半導体装置 |
US7972974B2 (en) | 2006-01-10 | 2011-07-05 | Micron Technology, Inc. | Gallium lanthanide oxide films |
US11193206B2 (en) * | 2017-03-15 | 2021-12-07 | Versum Materials Us, Llc | Formulation for deposition of silicon doped hafnium oxide as ferroelectric materials |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE393967B (sv) | 1974-11-29 | 1977-05-31 | Sateko Oy | Forfarande och for utforande av stroleggning mellan lagren i ett virkespaket |
DE3322304A1 (de) * | 1983-06-21 | 1985-01-03 | Siemens AG, 1000 Berlin und 8000 München | Streifenleitungsdopplerradar |
JPH0776090B2 (ja) * | 1989-07-06 | 1995-08-16 | 株式会社ライムズ | ジルコニア薄膜の製造方法 |
US5820664A (en) | 1990-07-06 | 1998-10-13 | Advanced Technology Materials, Inc. | Precursor compositions for chemical vapor deposition, and ligand exchange resistant metal-organic precursor solutions comprising same |
US5204314A (en) | 1990-07-06 | 1993-04-20 | Advanced Technology Materials, Inc. | Method for delivering an involatile reagent in vapor form to a CVD reactor |
US5559363A (en) * | 1995-06-06 | 1996-09-24 | Martin Marietta Corporation | Off-chip impedance matching utilizing a dielectric element and high density interconnect technology |
US5980983A (en) | 1997-04-17 | 1999-11-09 | The President And Fellows Of Harvard University | Liquid precursors for formation of metal oxides |
US5912797A (en) * | 1997-09-24 | 1999-06-15 | Lucent Technologies Inc. | Dielectric materials of amorphous compositions and devices employing same |
-
2000
- 2000-03-10 US US09/522,634 patent/US6500499B1/en not_active Expired - Fee Related
-
2001
- 2001-03-06 TW TW090105208A patent/TW583333B/zh not_active IP Right Cessation
- 2001-03-08 AT AT01105786T patent/ATE329065T1/de not_active IP Right Cessation
- 2001-03-08 EP EP01105786A patent/EP1132494B1/de not_active Expired - Lifetime
- 2001-03-08 DE DE60120254T patent/DE60120254T2/de not_active Expired - Fee Related
- 2001-03-09 KR KR10-2001-0012173A patent/KR100398495B1/ko not_active IP Right Cessation
- 2001-03-12 JP JP2001069477A patent/JP3523211B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE60120254T2 (de) | 2006-09-21 |
TW583333B (en) | 2004-04-11 |
JP2001316820A (ja) | 2001-11-16 |
JP3523211B2 (ja) | 2004-04-26 |
KR20010089235A (ko) | 2001-09-29 |
ATE329065T1 (de) | 2006-06-15 |
EP1132494A2 (de) | 2001-09-12 |
KR100398495B1 (ko) | 2003-09-19 |
US6500499B1 (en) | 2002-12-31 |
EP1132494B1 (de) | 2006-06-07 |
EP1132494A3 (de) | 2003-11-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |