DE60121064D1 - Anordnung und verfahren zur zeitkalibrierung eines halbleiterscheibenprüfgeräts für integrierte schaltungen - Google Patents

Anordnung und verfahren zur zeitkalibrierung eines halbleiterscheibenprüfgeräts für integrierte schaltungen

Info

Publication number
DE60121064D1
DE60121064D1 DE60121064T DE60121064T DE60121064D1 DE 60121064 D1 DE60121064 D1 DE 60121064D1 DE 60121064 T DE60121064 T DE 60121064T DE 60121064 T DE60121064 T DE 60121064T DE 60121064 D1 DE60121064 D1 DE 60121064D1
Authority
DE
Germany
Prior art keywords
semiconducted
calibrating
arrangement
integrated circuits
test apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60121064T
Other languages
English (en)
Other versions
DE60121064T2 (de
Inventor
A Miller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of DE60121064D1 publication Critical patent/DE60121064D1/de
Application granted granted Critical
Publication of DE60121064T2 publication Critical patent/DE60121064T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequences
    • G01R31/318385—Random or pseudo-random test pattern
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31905—Interface with the device under test [DUT], e.g. arrangements between the test head and the DUT, mechanical aspects, fixture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31908—Tester set-up, e.g. configuring the tester to the device under test [DUT], down loading test patterns
    • G01R31/3191—Calibration
DE60121064T 2000-06-20 2001-03-28 Anordnung und verfahren zur zeitkalibrierung eines halbleiterscheibenprüfgeräts für integrierte schaltungen Expired - Lifetime DE60121064T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/598,399 US6622103B1 (en) 2000-06-20 2000-06-20 System for calibrating timing of an integrated circuit wafer tester
US598399 2000-06-20
PCT/US2001/010025 WO2002001234A2 (en) 2000-06-20 2001-03-28 System for calibrating timing of an integrated circuit wafer tester

Publications (2)

Publication Number Publication Date
DE60121064D1 true DE60121064D1 (de) 2006-08-03
DE60121064T2 DE60121064T2 (de) 2006-11-02

Family

ID=24395393

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60121064T Expired - Lifetime DE60121064T2 (de) 2000-06-20 2001-03-28 Anordnung und verfahren zur zeitkalibrierung eines halbleiterscheibenprüfgeräts für integrierte schaltungen

Country Status (9)

Country Link
US (2) US6622103B1 (de)
EP (1) EP1295139B1 (de)
JP (1) JP2004502174A (de)
KR (2) KR100794080B1 (de)
CN (1) CN1250979C (de)
AU (1) AU2001249575A1 (de)
DE (1) DE60121064T2 (de)
TW (1) TW512471B (de)
WO (1) WO2002001234A2 (de)

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
JP4002378B2 (ja) * 1999-12-27 2007-10-31 エルピーダメモリ株式会社 電子回路
AU2001243200A1 (en) * 2000-02-22 2001-09-03 Don Mccord Method and system for wafer and device-level testing of an integrated circuit
US6603323B1 (en) * 2000-07-10 2003-08-05 Formfactor, Inc. Closed-grid bus architecture for wafer interconnect structure
JP2002074988A (ja) * 2000-08-28 2002-03-15 Mitsubishi Electric Corp 半導体装置および半導体装置のテスト方法
WO2002025296A2 (en) * 2000-09-22 2002-03-28 Don Mccord Method and system for wafer and device-level testing of an integrated circuit
US6735709B1 (en) * 2000-11-09 2004-05-11 Micron Technology, Inc. Method of timing calibration using slower data rate pattern
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech Inc Wafersonde
US6934670B2 (en) * 2001-03-30 2005-08-23 Intel Corporation Virtual test environment
US6665627B2 (en) * 2001-03-30 2003-12-16 Intel Corporation Method and apparatus for evaluating and correcting the tester derating factor (TDF) in a test environment
DE10126591B4 (de) * 2001-05-31 2016-01-14 Polaris Innovations Ltd. Testvorrichtung für dynamische Speichermodule
DE10131386C2 (de) * 2001-06-28 2003-10-16 Infineon Technologies Ag Verfahren zur Überprüfung einer leitenden Verbindung zwischen Kontaktstellen
US6877121B1 (en) * 2001-07-19 2005-04-05 Cisco Technology, Inc. Boundary scan cell for testing AC coupled line using phase modulation technique
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
US6944692B2 (en) * 2001-09-13 2005-09-13 Sun Microsystems, Inc. Automated calibration of I/O over a multi-variable eye window
US20030058604A1 (en) * 2001-09-13 2003-03-27 Canagasaby Karthisha S. Method and apparatus to emulate external IO interconnection
JP4152323B2 (ja) * 2002-01-10 2008-09-17 株式会社アドバンテスト 被測定ｌｓｉの試験装置
US6965244B2 (en) * 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
US6784674B2 (en) * 2002-05-08 2004-08-31 Formfactor, Inc. Test signal distribution system for IC tester
US6798225B2 (en) * 2002-05-08 2004-09-28 Formfactor, Inc. Tester channel to multiple IC terminals
US6950770B2 (en) * 2002-09-25 2005-09-27 Intel Corporation Method and apparatus for calibration of a delay element
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
DE10330043B4 (de) * 2003-06-30 2007-09-27 Infineon Technologies Ag System und Kalibrierverfahren
US6911814B2 (en) * 2003-07-01 2005-06-28 Formfactor, Inc. Apparatus and method for electromechanical testing and validation of probe cards
DE10332008B4 (de) * 2003-07-14 2006-08-10 Infineon Technologies Ag Elektrische Schaltung sowie Verfahren zum Testen von elektronischen Bauteilen
CN100456042C (zh) * 2003-09-03 2009-01-28 爱德万测试株式会社 试验装置
US7185239B2 (en) * 2003-09-29 2007-02-27 Stmicroelectronics Pvt. Ltd. On-chip timing characterizer
US7250626B2 (en) * 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7154259B2 (en) * 2003-10-23 2006-12-26 Formfactor, Inc. Isolation buffers with controlled equal time delays
WO2005065258A2 (en) 2003-12-24 2005-07-21 Cascade Microtech, Inc. Active wafer probe
DE102004009337A1 (de) * 2004-02-26 2005-09-22 Infineon Technologies Ag Kontaktplatte zur Verwendung bei einer Kalibrierung von Testerkanälen eines Testersystems sowie ein Kalibriersystem mit einer solchen Kontaktplatte
TWI274166B (en) * 2004-06-18 2007-02-21 Unitest Inc Semiconductor test apparatus for simultaneously testing plurality of semiconductor devices
DE102004031436B4 (de) * 2004-06-29 2006-07-27 Infineon Technologies Ag Einrichtung und Verfahren zum Kalibrieren eines Halbleiter-Bauelement-Test-Systems, insbesondere einer probecard bzw. eines Halbleiter-Bauelement-Testgeräts
US7595629B2 (en) * 2004-07-09 2009-09-29 Formfactor, Inc. Method and apparatus for calibrating and/or deskewing communications channels
US7184936B1 (en) * 2004-07-12 2007-02-27 Cisco Technology, Inc. Timing variation measurement system and method
DE102004035556B3 (de) * 2004-07-22 2005-12-08 Infineon Technologies Ag Verfahren und Einrichtung, insbesondere probecard, zum Kalibrieren eines Halbleiter-Baulement-Test-Systems, insbesondere eines Halbleiter-Bauelement-Testgeräts
US7092827B2 (en) * 2004-08-10 2006-08-15 Texas Instruments Incorporated Edge placement accuracy of signals generated by test equipment
JP2008512680A (ja) 2004-09-13 2008-04-24 カスケード マイクロテック インコーポレイテッド 両面プロービング構造体
FI119079B (fi) * 2004-11-08 2008-07-15 Elektrobit System Test Oy Sähkölaitteen sähköisen piirin karakterisointi
US7323897B2 (en) * 2004-12-16 2008-01-29 Verigy (Singapore) Pte. Ltd. Mock wafer, system calibrated using mock wafer, and method for calibrating automated test equipment
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
DE102005007103A1 (de) * 2005-02-16 2006-08-24 Infineon Technologies Ag Verfahren zum Testen einer zu testenden Schaltungseinheit mit Auskopplung von Verifikationssignalen und Testvorrichtung zur Durchführung des Verfahrens
JP4721762B2 (ja) * 2005-04-25 2011-07-13 株式会社アドバンテスト 試験装置
US7281181B2 (en) * 2005-06-27 2007-10-09 Verigy (Singapore) Pte. Ltd. Systems, methods and computer programs for calibrating an automated circuit test system
EP1982204B1 (de) * 2006-02-07 2009-04-15 Verigy (Singapore) Pte. Ltd. Mehrstufiger datenprozessor mit signal-repeater
US7404122B2 (en) * 2006-05-31 2008-07-22 Agilent Technologies, Inc. Mapping logic for loading control of crossbar multiplexer select RAM
US7421632B2 (en) * 2006-05-31 2008-09-02 Verigy (Singapore) Pte. Ltd. Mapping logic for controlling loading of the select ram of an error data crossbar multiplexer
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
KR100736680B1 (ko) * 2006-08-10 2007-07-06 주식회사 유니테스트 반도체 소자 테스트 장치의 캘리브레이션 방법
DE102006045906A1 (de) * 2006-09-28 2008-04-17 Infineon Technologies Ag Modul mit einem Controller für eine Chipkarte
US7453261B1 (en) * 2006-10-27 2008-11-18 Xilinx, Inc. Method of and system for monitoring the functionality of a wafer probe site
US7852099B1 (en) 2007-01-31 2010-12-14 Ixys Ch Gmbh Frequency trimming for internal oscillator for test-time reduction
KR100907929B1 (ko) * 2007-06-26 2009-07-16 주식회사 하이닉스반도체 반도체 칩의 푸르브 테스트장치 및 테스트방법
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
JP5207748B2 (ja) * 2008-01-25 2013-06-12 株式会社アドバンテスト 測定装置、測定方法および試験装置
US7924035B2 (en) * 2008-07-15 2011-04-12 Formfactor, Inc. Probe card assembly for electronic device testing with DC test resource sharing
CN101661078A (zh) * 2008-08-26 2010-03-03 鸿富锦精密工业（深圳）有限公司 电路板及电路板测试装置
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
FR2941576B1 (fr) * 2009-01-28 2016-07-15 St Wireless Sa Procede et systeme de calibration d'une constante de temps integree, et circuit integre pourvu d'un tel systeme
TWI386649B (zh) * 2009-03-18 2013-02-21 Mjc Probe Inc 探針卡
US8692538B2 (en) * 2011-06-09 2014-04-08 Teradyne, Inc. Test equipment calibration
US8525168B2 (en) * 2011-07-11 2013-09-03 International Business Machines Corporation Integrated circuit (IC) test probe
CN103853081B (zh) * 2012-12-06 2018-01-30 海尔集团公司 Mcu内部时钟校准系统及方法及印刷电路板
TWI591362B (zh) * 2015-02-13 2017-07-11 何恆春 自動調校半導體元件測試機台之方法
FR3033412B1 (fr) * 2015-03-06 2019-04-12 Starchip Testeur de circuits integres sur une galette de silicium et circuit integre.
US10180486B2 (en) * 2016-03-16 2019-01-15 Formfactor Beaverton, Inc. Test standards and methods for impedance calibration of a probe system, and probe systems that include the test standards or utilize the methods
CN107976617B (zh) * 2017-11-20 2020-02-21 扬州乾照光电有限公司 一种稳定光谱能量分布的led晶圆测试方法
JP2019133457A (ja) * 2018-01-31 2019-08-08 オムロン株式会社 制御装置及び制御方法
TWI693410B (zh) * 2019-03-12 2020-05-11 新唐科技股份有限公司 晶片測試系統及方法
CN114264939A (zh) * 2021-11-08 2022-04-01 中国船舶重工集团公司第七0九研究所 一种高速数字集成电路测试系统的校准适配板

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2688941B2 (ja) * 1988-08-29 1997-12-10 株式会社アドバンテスト 位相補正装置
US5086271A (en) 1990-01-12 1992-02-04 Reliability Incorporated Driver system and distributed transmission line network for driving devices under test
JPH03229172A (ja) * 1990-02-02 1991-10-11 Advantest Corp Ｉｃ試験装置
US5162728A (en) 1990-09-11 1992-11-10 Cray Computer Corporation Functional at speed test system for integrated circuits on undiced wafers
JP2638274B2 (ja) * 1990-09-18 1997-08-06 株式会社日立製作所 タイミング補正方法
US5270643A (en) * 1990-11-28 1993-12-14 Schlumberger Technologies Pulsed laser photoemission electron-beam probe
AU658014B2 (en) * 1991-11-19 1995-03-30 Macrovision Corporation Method and apparatus for scrambling and descrambling of video signals with edge fill
US5262716A (en) 1992-04-21 1993-11-16 Hewlett-Packard Company Tester calibration procedure which includes fixturing
US5754353A (en) * 1993-07-01 1998-05-19 Cirrus Logic, Inc. Channel quality circuit in a sampled amplitude read channel
US5608337A (en) * 1995-06-07 1997-03-04 Altera Corporation Method and apparatus of testing an integrated circuit device
US5736850A (en) 1995-09-11 1998-04-07 Teradyne, Inc. Configurable probe card for automatic test equipment
US5838161A (en) 1996-05-01 1998-11-17 Micron Technology, Inc. Semiconductor interconnect having test structures for evaluating electrical characteristics of the interconnect
US5828226A (en) 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
US6040691A (en) * 1997-05-23 2000-03-21 Credence Systems Corporation Test head for integrated circuit tester arranging tester component circuit boards on three dimensions
US6163759A (en) * 1997-11-21 2000-12-19 Advantest Corporation Method for calibrating variable delay circuit and a variable delay circuit using the same
US6192496B1 (en) 1997-11-26 2001-02-20 Agilent Technologies, Inc. System for verifying signal timing accuracy on a digital testing device
JPH11190760A (ja) * 1997-12-26 1999-07-13 Advantest Corp 半導体試験装置
US6181144B1 (en) 1998-02-25 2001-01-30 Micron Technology, Inc. Semiconductor probe card having resistance measuring circuitry and method fabrication
US6064948A (en) * 1998-03-02 2000-05-16 Tanisys Technology, Inc. Tester systems
JP3616247B2 (ja) 1998-04-03 2005-02-02 株式会社アドバンテスト Ｉｃ試験装置におけるスキュー調整方法及びこれに用いる疑似デバイス
DE19817763C2 (de) 1998-04-21 2001-02-15 Texas Instruments Deutschland Verfahren zum Kalibrieren einer Meßvorrichtung
US6137346A (en) * 1998-04-27 2000-10-24 Credence Systems Corporation Temperature tracking voltage to current converter
DE19922907B4 (de) 1998-05-19 2006-08-10 Advantest Corp. Kalibrierverfahren zum Kalibrieren einer Ausgabezeit eines Prüfsignals, Kalibrierverfahren zum Kalibrieren einer Zeitverschiebung und Halbleiterprüfeinrichtung
AU9654198A (en) * 1998-06-29 2000-01-17 Iliya Valeryevich Klochkov A skew calibration means and a method of skew calibration

Also Published As

Publication number Publication date
KR100861602B1 (ko) 2008-10-07
CN1250979C (zh) 2006-04-12
AU2001249575A1 (en) 2002-01-08
WO2002001234A3 (en) 2002-04-18
WO2002001234A2 (en) 2002-01-03
DE60121064T2 (de) 2006-11-02
CN1437711A (zh) 2003-08-20
KR20070090263A (ko) 2007-09-05
TW512471B (en) 2002-12-01
US20020049554A1 (en) 2002-04-25
EP1295139B1 (de) 2005-12-07
KR100794080B1 (ko) 2008-01-10
EP1295139A2 (de) 2003-03-26
US6606575B2 (en) 2003-08-12
US6622103B1 (en) 2003-09-16
KR20030029062A (ko) 2003-04-11
JP2004502174A (ja) 2004-01-22

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