DE60130754D1 - Apparat zur Erzeugung eines gespülten optischen Weges in einer photolithographischen Projektionsanlage sowie ein entsprechendes Verfahren - Google Patents

Apparat zur Erzeugung eines gespülten optischen Weges in einer photolithographischen Projektionsanlage sowie ein entsprechendes Verfahren

Info

Publication number
DE60130754D1
DE60130754D1 DE60130754T DE60130754T DE60130754D1 DE 60130754 D1 DE60130754 D1 DE 60130754D1 DE 60130754 T DE60130754 T DE 60130754T DE 60130754 T DE60130754 T DE 60130754T DE 60130754 D1 DE60130754 D1 DE 60130754D1
Authority
DE
Germany
Prior art keywords
generating
optical path
projection system
corresponding method
photolithographic projection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60130754T
Other languages
English (en)
Other versions
DE60130754T2 (de
Inventor
Eric C Hansell
Jose V Herrera
Richard L Huse
Jorge S Ivaldi
Stephen G Krehley
Thomas P Shamaly
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Holding NV
Original Assignee
ASML Holding NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Holding NV filed Critical ASML Holding NV
Application granted granted Critical
Publication of DE60130754D1 publication Critical patent/DE60130754D1/de
Publication of DE60130754T2 publication Critical patent/DE60130754T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C29/00—Bearings for parts moving only linearly
    • F16C29/02—Sliding-contact bearings
    • F16C29/025—Hydrostatic or aerostatic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C32/00—Bearings not otherwise provided for
    • F16C32/06—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings
    • F16C32/0603—Bearings not otherwise provided for with moving member supported by a fluid cushion formed, at least to a large extent, otherwise than by movement of the shaft, e.g. hydrostatic air-cushion bearings supported by a gas cushion, e.g. an air cushion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70816—Bearings
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE60130754T 2000-05-03 2001-05-02 Apparat zur Erzeugung eines gespülten optischen Weges in einer photolithographischen Projektionsanlage sowie ein entsprechendes Verfahren Expired - Lifetime DE60130754T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US20170400P 2000-05-03 2000-05-03
US201704P 2000-05-03
PCT/US2001/014067 WO2001084241A1 (en) 2000-05-03 2001-05-02 Non-contact seal using purge gas

Publications (2)

Publication Number Publication Date
DE60130754D1 true DE60130754D1 (de) 2007-11-15
DE60130754T2 DE60130754T2 (de) 2008-01-24

Family

ID=22746949

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60130754T Expired - Lifetime DE60130754T2 (de) 2000-05-03 2001-05-02 Apparat zur Erzeugung eines gespülten optischen Weges in einer photolithographischen Projektionsanlage sowie ein entsprechendes Verfahren

Country Status (7)

Country Link
US (1) US6559922B2 (de)
EP (1) EP1279070B1 (de)
JP (1) JP4503906B2 (de)
KR (1) KR100833275B1 (de)
AU (1) AU2001259331A1 (de)
DE (1) DE60130754T2 (de)
WO (1) WO2001084241A1 (de)

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EP1310828A1 (de) * 2001-11-09 2003-05-14 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
US6934003B2 (en) 2002-01-07 2005-08-23 Canon Kabushiki Kaisha Exposure apparatus and device manufacturing method
DE10239344A1 (de) * 2002-08-28 2004-03-11 Carl Zeiss Smt Ag Vorrichtung zum Abdichten einer Projektionsbelichtungsanlage
US7110081B2 (en) 2002-11-12 2006-09-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US10503084B2 (en) 2002-11-12 2019-12-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9482966B2 (en) 2002-11-12 2016-11-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP3977324B2 (ja) 2002-11-12 2007-09-19 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
SG121822A1 (en) 2002-11-12 2006-05-26 Asml Netherlands Bv Lithographic apparatus and device manufacturing method
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US6770895B2 (en) * 2002-11-21 2004-08-03 Asml Holding N.V. Method and apparatus for isolating light source gas from main chamber gas in a lithography tool
SG115613A1 (en) * 2003-02-12 2005-10-28 Asml Netherlands Bv Lithographic apparatus comprising a gas flushing system
TWI275913B (en) 2003-02-12 2007-03-11 Asml Netherlands Bv Lithographic apparatus and method to detect correct clamping of an object
EP1447715A3 (de) * 2003-02-12 2009-09-02 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Feststellung der korrekten Festklemmung eines Objekts
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TW200500813A (en) 2003-02-26 2005-01-01 Nikon Corp Exposure apparatus and method, and method of producing device
US6919573B2 (en) * 2003-03-20 2005-07-19 Asml Holding N.V Method and apparatus for recycling gases used in a lithography tool
KR101225884B1 (ko) 2003-04-11 2013-01-28 가부시키가이샤 니콘 액침 리소그래피 머신에서 웨이퍼 교환동안 투영 렌즈 아래의 갭에서 액침 액체를 유지하는 장치 및 방법
US7213963B2 (en) 2003-06-09 2007-05-08 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101289979B1 (ko) 2003-06-19 2013-07-26 가부시키가이샤 니콘 노광 장치 및 디바이스 제조방법
EP1491954A1 (de) * 2003-06-27 2004-12-29 ASML Netherlands B.V. Dichtungsanordnung, lithographischer Projektionsapparat, und Verfahren zur Herstellung einer Vorrichtung
EP1498778A1 (de) 2003-06-27 2005-01-19 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
EP1494079B1 (de) * 2003-06-27 2008-01-02 ASML Netherlands B.V. Lithographischer Apparat
WO2005006418A1 (ja) 2003-07-09 2005-01-20 Nikon Corporation 露光装置及びデバイス製造方法
EP1510867A1 (de) * 2003-08-29 2005-03-02 ASML Netherlands B.V. Lithographischer Apparat und Verfahren zur Herstellung eines Artikels
US7352433B2 (en) 2003-10-28 2008-04-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005047979A2 (en) * 2003-11-06 2005-05-26 Carl Zeiss Smt Ag Optical system
US7589822B2 (en) 2004-02-02 2009-09-15 Nikon Corporation Stage drive method and stage unit, exposure apparatus, and device manufacturing method
US7057702B2 (en) * 2004-06-23 2006-06-06 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20070085984A1 (en) * 2005-10-18 2007-04-19 Asml Netherlands B.V. Lithographic projection apparatus, device manufacturing method and device manufactured thereby
US7502095B2 (en) 2005-03-29 2009-03-10 Asml Netherlands B.V. Lithographic apparatus, device manufacturing method, and device manufactured thereby
TWI330762B (en) 2005-03-29 2010-09-21 Asml Netherlands Bv Seal of a lithographic apparatus, lithographic apparatus, device manufacturing method and data storage medium
US7719661B2 (en) * 2007-11-27 2010-05-18 Nikon Corporation Illumination optical apparatus, exposure apparatus, and method for producing device
JP5827827B2 (ja) * 2010-06-29 2015-12-02 エーエスエムエル ネザーランズ ビー．ブイ． アクチュエータ
EP2423749B1 (de) * 2010-08-24 2013-09-11 ASML Netherlands BV Lithografische Vorrichtung und Verfahren zur Herstellung einer Vorrichtung
NL2008954A (en) * 2011-07-08 2013-01-09 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US9513568B2 (en) 2012-07-06 2016-12-06 Asml Netherlands B.V. Lithographic apparatus
JP6496017B2 (ja) * 2014-11-13 2019-04-03 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置およびデバイス製造方法
CN111352309B (zh) * 2015-04-20 2024-03-01 Asml荷兰有限公司 光刻设备和光刻工艺中的方法
CN107783283B (zh) * 2016-08-30 2020-01-24 上海微电子装备（集团）股份有限公司 镜片防污染装置及方法
CN109283797B (zh) 2017-07-21 2021-04-30 上海微电子装备（集团）股份有限公司 物镜保护装置、物镜系统以及光刻设备
EP3620858B1 (de) * 2018-09-10 2023-11-01 Canon Kabushiki Kaisha Belichtungsvorrichtung und verfahren zur herstellung eines artikels
CN114830463A (zh) * 2019-12-20 2022-07-29 西默有限公司 用于激光源的气体吹扫系统
CN111736432A (zh) * 2020-06-15 2020-10-02 上海集成电路研发中心有限公司 一种阻隔光阻放气污染的装置

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Also Published As

Publication number Publication date
JP4503906B2 (ja) 2010-07-14
EP1279070B1 (de) 2007-10-03
US6559922B2 (en) 2003-05-06
AU2001259331A1 (en) 2001-11-12
US20010038442A1 (en) 2001-11-08
JP2003532304A (ja) 2003-10-28
KR100833275B1 (ko) 2008-05-28
DE60130754T2 (de) 2008-01-24
KR20020068492A (ko) 2002-08-27
WO2001084241A1 (en) 2001-11-08
EP1279070A1 (de) 2003-01-29

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