DE60131677D1 - I-kanal-oberflächenmontage-verbinder - Google Patents
I-kanal-oberflächenmontage-verbinderInfo
- Publication number
- DE60131677D1 DE60131677D1 DE60131677T DE60131677T DE60131677D1 DE 60131677 D1 DE60131677 D1 DE 60131677D1 DE 60131677 T DE60131677 T DE 60131677T DE 60131677 T DE60131677 T DE 60131677T DE 60131677 D1 DE60131677 D1 DE 60131677D1
- Authority
- DE
- Germany
- Prior art keywords
- circuit device
- mount connector
- connectors
- surface mount
- channel surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10666—Plated through-hole for surface mounting on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10856—Divided leads, e.g. by slot in length direction of lead, or by branching of the lead
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding
- Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/737,303 US6750396B2 (en) | 2000-12-15 | 2000-12-15 | I-channel surface-mount connector |
PCT/US2001/025959 WO2002049165A1 (en) | 2000-12-15 | 2001-08-20 | I-channel surface-mount connector |
US737303 | 2003-12-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60131677D1 true DE60131677D1 (de) | 2008-01-10 |
DE60131677T2 DE60131677T2 (de) | 2008-10-30 |
Family
ID=24963371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60131677T Expired - Lifetime DE60131677T2 (de) | 2000-12-15 | 2001-08-20 | I-kanal-oberflächenmontage-verbinder |
Country Status (7)
Country | Link |
---|---|
US (3) | US6750396B2 (de) |
EP (1) | EP1342294B1 (de) |
JP (1) | JP2004523858A (de) |
AT (1) | ATE379855T1 (de) |
AU (1) | AU2001285094A1 (de) |
DE (1) | DE60131677T2 (de) |
WO (1) | WO2002049165A1 (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030125045A1 (en) * | 2001-12-27 | 2003-07-03 | Riley Wyatt Thomas | Creating and using base station almanac information in a wireless communication system having a position location capability |
US7943436B2 (en) | 2002-07-29 | 2011-05-17 | Synopsys, Inc. | Integrated circuit devices and methods and apparatuses for designing integrated circuit devices |
US20040048498A1 (en) * | 2002-09-06 | 2004-03-11 | Hong Huang | Metallic surface mount technology power connector |
US7065351B2 (en) | 2003-01-30 | 2006-06-20 | Qualcomm Incorporated | Event-triggered data collection |
KR100883703B1 (ko) | 2003-05-30 | 2009-02-12 | 파마셋 인코포레이티드 | 변형 불소화 뉴클레오시드 유사체 |
US7123928B2 (en) * | 2003-07-21 | 2006-10-17 | Qualcomm Incorporated | Method and apparatus for creating and using a base station almanac for position determination |
BRPI0418696A (pt) * | 2004-04-02 | 2007-06-12 | Qualcomm Inc | métodos e equipamentos para sistemas de determinação de posição assistida por sinalizador |
US20060046525A1 (en) * | 2004-08-27 | 2006-03-02 | Allan Mark | Printed circuit board type connector using surface mount and through hole technologies |
SI3109244T1 (sl) | 2004-09-14 | 2019-06-28 | Gilead Pharmasset Llc | Priprava 2'fluoro-2'-alkil-substituiranih ali drugih neobvezno substituiranih ribofuranozil pirimidinov in purinov in njihovih derivatov |
US6988900B1 (en) | 2004-12-17 | 2006-01-24 | Scinetific-Atlanta, Inc. | Surface mount connector assembly |
US7059867B1 (en) | 2005-03-30 | 2006-06-13 | Artesyn Technologies, Inc. | High density multi-lead surface mount interconnect and devices including same |
US20080113566A1 (en) * | 2006-11-10 | 2008-05-15 | Janos Legrady | Surface mount board-stacking connector |
US20090076840A1 (en) * | 2007-09-18 | 2009-03-19 | Boyden Edward S | Wireless ICU |
KR101465078B1 (ko) * | 2007-10-02 | 2014-11-25 | 오스람 게엠베하 | 플러그형 수단, 플러그형 커넥터 및 상기 플러그형 수단을 제조하기 위한 프로세스 |
JP2009176947A (ja) * | 2008-01-24 | 2009-08-06 | Olympus Corp | 3次元モジュール |
US7581965B1 (en) | 2008-05-01 | 2009-09-01 | Commscope, Inc. Of North Carolina | Bottom entry interconnection element for connecting components to a circuit board |
US8478228B2 (en) * | 2008-10-20 | 2013-07-02 | Qualcomm Incorporated | Mobile receiver with location services capability |
CA2748057C (en) | 2008-12-23 | 2018-07-03 | Pharmasset, Inc. | Nucleoside phosphoramidates |
EP2671888A1 (de) | 2008-12-23 | 2013-12-11 | Gilead Pharmasset LLC | 3',5'-zyklische Nucleosidphosphatanaloga |
US8536458B1 (en) * | 2009-03-30 | 2013-09-17 | Amkor Technology, Inc. | Fine pitch copper pillar package and method |
US8600297B2 (en) | 2009-07-28 | 2013-12-03 | Qualcomm Incorporated | Method and system for femto cell self-timing and self-locating |
TWI391058B (zh) * | 2009-08-18 | 2013-03-21 | Pegatron Corp | 主機板及應用其的可攜式電子裝置 |
CL2011000716A1 (es) | 2010-03-31 | 2012-04-20 | Gilead Pharmasset Llc | Formas cristalinas 1 6 de (s)-isopropil-2-(((s)-(((2r.3r.4r.5r)-5-(2,4-dioxo-3,4-dihidropirimidin-1(2h)-il)-4-fluoro-3-hidroxi-4-metil tetrahidrofuran-2-il)metoxi)(fenoxi)fosforil)amino)propanoato; composicion y combinacion farmaceutica; y su uso para tratar una infeccion por el virus de la hepatitis c. |
JP2013094824A (ja) * | 2011-11-01 | 2013-05-20 | Aisin Aw Co Ltd | 半導体装置 |
US9470720B2 (en) | 2013-03-08 | 2016-10-18 | Sandisk Technologies Llc | Test system with localized heating and method of manufacture thereof |
US9898056B2 (en) | 2013-06-19 | 2018-02-20 | Sandisk Technologies Llc | Electronic assembly with thermal channel and method of manufacture thereof |
US9313874B2 (en) | 2013-06-19 | 2016-04-12 | SMART Storage Systems, Inc. | Electronic system with heat extraction and method of manufacture thereof |
US10013033B2 (en) | 2013-06-19 | 2018-07-03 | Sandisk Technologies Llc | Electronic assembly with thermal channel and method of manufacture thereof |
US9158349B2 (en) | 2013-10-04 | 2015-10-13 | Sandisk Enterprise Ip Llc | System and method for heat dissipation |
US9549457B2 (en) | 2014-02-12 | 2017-01-17 | Sandisk Technologies Llc | System and method for redirecting airflow across an electronic assembly |
US9497889B2 (en) | 2014-02-27 | 2016-11-15 | Sandisk Technologies Llc | Heat dissipation for substrate assemblies |
US9485851B2 (en) | 2014-03-14 | 2016-11-01 | Sandisk Technologies Llc | Thermal tube assembly structures |
US9519319B2 (en) | 2014-03-14 | 2016-12-13 | Sandisk Technologies Llc | Self-supporting thermal tube structure for electronic assemblies |
US9348377B2 (en) | 2014-03-14 | 2016-05-24 | Sandisk Enterprise Ip Llc | Thermal isolation techniques |
KR102268389B1 (ko) * | 2019-09-11 | 2021-06-23 | 삼성전기주식회사 | 인쇄회로기판 및 이를 포함하는 안테나 모듈 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
JP2533511B2 (ja) | 1987-01-19 | 1996-09-11 | 株式会社日立製作所 | 電子部品の接続構造とその製造方法 |
JPH01313969A (ja) | 1988-06-13 | 1989-12-19 | Hitachi Ltd | 半導体装置 |
US5151773A (en) | 1990-03-30 | 1992-09-29 | Hitachi, Ltd. | Electronic circuit apparatus comprising a structure for sealing an electronic circuit |
KR920022482A (ko) | 1991-05-09 | 1992-12-19 | 가나이 쯔도무 | 전자부품 탑재모듈 |
US5324892A (en) | 1992-08-07 | 1994-06-28 | International Business Machines Corporation | Method of fabricating an electronic interconnection |
JP2716336B2 (ja) | 1993-03-10 | 1998-02-18 | 日本電気株式会社 | 集積回路装置 |
DE69426344T2 (de) | 1993-09-14 | 2001-08-09 | Zierick Mfg Corp | Oberflächenmontierter elektrischer Verbinder |
US5518964A (en) | 1994-07-07 | 1996-05-21 | Tessera, Inc. | Microelectronic mounting with multiple lead deformation and bonding |
US5588848A (en) * | 1994-09-08 | 1996-12-31 | Lucent Technologies Inc. | Low inductance surface-mount connectors for interconnecting circuit devices and method for using same |
US5538447A (en) * | 1994-12-09 | 1996-07-23 | Burndy Corporation | Electrical wedge connector |
US5484964A (en) * | 1995-02-06 | 1996-01-16 | Dawson, Deceased; Peter F. | Surface mounting pin grid arrays |
US5927036A (en) * | 1997-06-30 | 1999-07-27 | Perf-X-Dek, L.L.C. | Floor joist system |
JPH11186688A (ja) | 1997-10-14 | 1999-07-09 | Murata Mfg Co Ltd | ハイブリッドicおよびそれを用いた電子装置 |
JP4025885B2 (ja) * | 1998-02-06 | 2007-12-26 | 協伸工業株式会社 | コネクタチップ及びテーピングコネクタチップ |
US6189203B1 (en) | 1999-04-08 | 2001-02-20 | Lucent Technologies Inc. | Method of manufacturing a surface mountable power supply module |
US6429388B1 (en) * | 2000-05-03 | 2002-08-06 | International Business Machines Corporation | High density column grid array connections and method thereof |
-
2000
- 2000-12-15 US US09/737,303 patent/US6750396B2/en not_active Expired - Lifetime
-
2001
- 2001-08-20 EP EP01964214A patent/EP1342294B1/de not_active Expired - Lifetime
- 2001-08-20 DE DE60131677T patent/DE60131677T2/de not_active Expired - Lifetime
- 2001-08-20 AT AT01964214T patent/ATE379855T1/de not_active IP Right Cessation
- 2001-08-20 JP JP2002550367A patent/JP2004523858A/ja active Pending
- 2001-08-20 WO PCT/US2001/025959 patent/WO2002049165A1/en active IP Right Grant
- 2001-08-20 AU AU2001285094A patent/AU2001285094A1/en not_active Abandoned
-
2002
- 2002-05-02 US US10/138,139 patent/US6860003B2/en not_active Expired - Lifetime
- 2002-05-02 US US10/138,173 patent/US6722930B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20020131255A1 (en) | 2002-09-19 |
EP1342294A4 (de) | 2006-03-08 |
EP1342294B1 (de) | 2007-11-28 |
DE60131677T2 (de) | 2008-10-30 |
ATE379855T1 (de) | 2007-12-15 |
US6750396B2 (en) | 2004-06-15 |
US20020076951A1 (en) | 2002-06-20 |
WO2002049165A1 (en) | 2002-06-20 |
US20020137404A1 (en) | 2002-09-26 |
EP1342294A1 (de) | 2003-09-10 |
US6860003B2 (en) | 2005-03-01 |
JP2004523858A (ja) | 2004-08-05 |
AU2001285094A1 (en) | 2002-06-24 |
US6722930B2 (en) | 2004-04-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |