DE60137440D1 - Modul mit leiterrahmen mit auf beiden seiten bestückte n bauelementen - Google Patents
Modul mit leiterrahmen mit auf beiden seiten bestückte n bauelementenInfo
- Publication number
- DE60137440D1 DE60137440D1 DE60137440T DE60137440T DE60137440D1 DE 60137440 D1 DE60137440 D1 DE 60137440D1 DE 60137440 T DE60137440 T DE 60137440T DE 60137440 T DE60137440 T DE 60137440T DE 60137440 D1 DE60137440 D1 DE 60137440D1
- Authority
- DE
- Germany
- Prior art keywords
- module
- lead frame
- sides
- ladder frame
- electrical components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00890308 | 2000-10-11 | ||
PCT/EP2001/011146 WO2002031763A1 (en) | 2000-10-11 | 2001-09-26 | Module having a lead frame equipped with components on both sides |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60137440D1 true DE60137440D1 (de) | 2009-03-05 |
Family
ID=8175973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60137440T Expired - Lifetime DE60137440D1 (de) | 2000-10-11 | 2001-09-26 | Modul mit leiterrahmen mit auf beiden seiten bestückte n bauelementen |
Country Status (6)
Country | Link |
---|---|
US (1) | US6643142B2 (de) |
EP (1) | EP1327226B1 (de) |
JP (1) | JP2004511903A (de) |
AT (1) | ATE421128T1 (de) |
DE (1) | DE60137440D1 (de) |
WO (1) | WO2002031763A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003100371A (ja) * | 2001-09-19 | 2003-04-04 | Matsushita Electric Ind Co Ltd | 端子付き配線基板 |
DE102006028815B3 (de) * | 2006-06-21 | 2007-08-30 | Hansa Tronic Gmbh | Verfahren zur Herstellung eines elektrischen Hybridbauteils |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2641102B1 (de) | 1988-12-27 | 1991-02-22 | Ebauchesfabrik Eta Ag | |
US4928387A (en) * | 1989-09-07 | 1990-05-29 | Rockwell International Corp. | Temporary soldering aid for manufacture of printed wiring assemblies |
JP2850640B2 (ja) * | 1992-04-28 | 1999-01-27 | 株式会社デンソー | 混成集積回路装置 |
US5583372A (en) * | 1994-09-14 | 1996-12-10 | Micron Technology, Inc. | Adhesion enhanced semiconductor die for mold compound packaging |
US6005778A (en) * | 1995-06-15 | 1999-12-21 | Honeywell Inc. | Chip stacking and capacitor mounting arrangement including spacers |
DE19640260A1 (de) | 1996-09-30 | 1998-04-02 | Siemens Ag | Kontaktlose Chipkarte |
JPH10104101A (ja) * | 1996-10-02 | 1998-04-24 | Mitsubishi Electric Corp | 半導体圧力センサ |
JP3278363B2 (ja) * | 1996-11-18 | 2002-04-30 | 三菱電機株式会社 | 半導体加速度センサ |
KR100226737B1 (ko) * | 1996-12-27 | 1999-10-15 | 구본준 | 반도체소자 적층형 반도체 패키지 |
SG88741A1 (en) * | 1998-09-16 | 2002-05-21 | Texas Instr Singapore Pte Ltd | Multichip assembly semiconductor |
JP2002533915A (ja) | 1998-12-22 | 2002-10-08 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | チップと完全に包囲された接続手段と、を有するデータ保持器 |
US6313998B1 (en) * | 1999-04-02 | 2001-11-06 | Legacy Electronics, Inc. | Circuit board assembly having a three dimensional array of integrated circuit packages |
-
2001
- 2001-09-26 WO PCT/EP2001/011146 patent/WO2002031763A1/en active Application Filing
- 2001-09-26 EP EP01982364A patent/EP1327226B1/de not_active Expired - Lifetime
- 2001-09-26 DE DE60137440T patent/DE60137440D1/de not_active Expired - Lifetime
- 2001-09-26 JP JP2002535073A patent/JP2004511903A/ja not_active Withdrawn
- 2001-09-26 AT AT01982364T patent/ATE421128T1/de not_active IP Right Cessation
- 2001-10-09 US US09/973,317 patent/US6643142B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US6643142B2 (en) | 2003-11-04 |
JP2004511903A (ja) | 2004-04-15 |
EP1327226B1 (de) | 2009-01-14 |
ATE421128T1 (de) | 2009-01-15 |
US20020075663A1 (en) | 2002-06-20 |
WO2002031763A1 (en) | 2002-04-18 |
EP1327226A1 (de) | 2003-07-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1478023A4 (de) | Modulteil | |
ES2139149T3 (es) | Antenas. | |
ATE266268T1 (de) | Elektrischer steckadapter | |
ATE518262T1 (de) | Batterieeinrichtung | |
FR2863775B1 (fr) | Module photovoltaique avec un dispositif electronique dans l'empilage lamine. | |
ATE372896T1 (de) | Kraftfahrzeugspiegelgehäuse mit antennenanordnung | |
EP0986130A3 (de) | Antenne für funkbetriebene Kommunikationsendgeräte | |
IT8121675A0 (it) | Dispositivo di raffreddamento per componenti elettronici e/o per pannelli di circuiti sui quali i componenti sono montati. | |
ATE235751T1 (de) | Kontaktierungssystem für zwei leiterplatten | |
DE69108302T2 (de) | Elektronische Schaltung mit einer Federanordnung für die Stromzufuhr. | |
DE60137440D1 (de) | Modul mit leiterrahmen mit auf beiden seiten bestückte n bauelementen | |
DE50015164D1 (de) | Verbindungsvorrichtung | |
ATE395618T1 (de) | Elektronisches kommunikationssystem zwischen einen basis-station und transpondern | |
DE69931989D1 (de) | Multipoläre differenzial Schalter | |
IT8920885A0 (it) | Dispositivo di protezione contro le sovratensioni per circuiti elettronici integrati, particolarmente per applicazioni in campo automobilistico. | |
EE200000402A (et) | Antennikonnektor | |
PT1033821E (pt) | Módulo de emissão-recepção dect | |
CN219761158U (zh) | 一种摄像头与闪光灯连接结构及通讯设备 | |
CN210444571U (zh) | 一种拼接式led线路板 | |
DE69934538D1 (de) | Zwei elektrischen aneinander verbundene und nebeneinander liegende elektrische Vorrichtungen für ein elektriches Schalttafel | |
ATE217123T1 (de) | Verbinder mit einer in einem käfig befindlichen klemmfeder und einer auf die klemmfeder bezogenen platte | |
JP4908703B2 (ja) | 電池パック | |
ATE396525T1 (de) | Anschlusseinheit für elektrische module | |
DE502004010047D1 (en) | Homebus-system | |
IT201600122755A1 (it) | "Modulo elettronico per autoveicolo" |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
R082 | Change of representative |
Ref document number: 1327226 Country of ref document: EP Representative=s name: RICHTER WERDERMANN GERBAULET HOFMANN, DE |
|
R081 | Change of applicant/patentee |
Ref document number: 1327226 Country of ref document: EP Owner name: SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY, US Free format text: FORMER OWNER: NXP B.V., EINDHOVEN, NL Effective date: 20120529 Ref document number: 1327226 Country of ref document: EP Owner name: SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY, US Free format text: FORMER OWNER: WILMINGTON CAPITAL LTD. LIMITED LIABILITY COMPANY, WILMINGTON, US Effective date: 20120615 |
|
R082 | Change of representative |
Ref document number: 1327226 Country of ref document: EP Representative=s name: RICHTER WERDERMANN GERBAULET HOFMANN, DE Effective date: 20120615 Ref document number: 1327226 Country of ref document: EP Representative=s name: RICHTER WERDERMANN GERBAULET HOFMANN, DE Effective date: 20120529 |