DE602004029486D1 - Grossfläches gan-substrat mit einheitlich geringer versetzungsdichte und herstellungsverfahren dafür - Google Patents

Grossfläches gan-substrat mit einheitlich geringer versetzungsdichte und herstellungsverfahren dafür

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Publication number
DE602004029486D1
DE602004029486D1 DE602004029486T DE602004029486T DE602004029486D1 DE 602004029486 D1 DE602004029486 D1 DE 602004029486D1 DE 602004029486 T DE602004029486 T DE 602004029486T DE 602004029486 T DE602004029486 T DE 602004029486T DE 602004029486 D1 DE602004029486 D1 DE 602004029486D1
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Prior art keywords
phase
growth
nitride material
iii
substrate
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Robert P Vaudo
Xueping Xu
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Wolfspeed Inc
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Cree Inc
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    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/0254Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/184Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0062Processes for devices with an active region comprising only III-V compounds
    • H01L33/0075Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/21Circular sheet or circular blank
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/26Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264Up to 3 mils
    • Y10T428/2651 mil or less
DE602004029486T 2003-11-13 2004-11-12 Grossfläches gan-substrat mit einheitlich geringer versetzungsdichte und herstellungsverfahren dafür Active DE602004029486D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/712,351 US7323256B2 (en) 2003-11-13 2003-11-13 Large area, uniformly low dislocation density GaN substrate and process for making the same
PCT/US2004/038534 WO2005050709A2 (en) 2003-11-13 2004-11-12 LARGE AREA, UNIFORMLY LOW DISLOCATION DENSITY GaN SUBSTRATE AND PROCESS FOR MAKING THE SAME

Publications (1)

Publication Number Publication Date
DE602004029486D1 true DE602004029486D1 (de) 2010-11-18

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Country Status (10)

Country Link
US (4) US7323256B2 (de)
EP (2) EP2267190B1 (de)
JP (3) JP4741506B2 (de)
KR (1) KR101119728B1 (de)
CN (1) CN100577894C (de)
AT (1) ATE483834T1 (de)
CA (1) CA2544878A1 (de)
DE (1) DE602004029486D1 (de)
PL (1) PL1682701T3 (de)
WO (1) WO2005050709A2 (de)

Families Citing this family (115)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6488767B1 (en) * 2001-06-08 2002-12-03 Advanced Technology Materials, Inc. High surface quality GaN wafer and method of fabricating same
US20060005763A1 (en) * 2001-12-24 2006-01-12 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US7638346B2 (en) * 2001-12-24 2009-12-29 Crystal Is, Inc. Nitride semiconductor heterostructures and related methods
US8545629B2 (en) * 2001-12-24 2013-10-01 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US7125453B2 (en) * 2002-01-31 2006-10-24 General Electric Company High temperature high pressure capsule for processing materials in supercritical fluids
US7063741B2 (en) * 2002-03-27 2006-06-20 General Electric Company High pressure high temperature growth of crystalline group III metal nitrides
US7323256B2 (en) * 2003-11-13 2008-01-29 Cree, Inc. Large area, uniformly low dislocation density GaN substrate and process for making the same
US7118813B2 (en) 2003-11-14 2006-10-10 Cree, Inc. Vicinal gallium nitride substrate for high quality homoepitaxy
US8120139B2 (en) * 2003-12-05 2012-02-21 International Rectifier Corporation Void isolated III-nitride device
JP2005209803A (ja) * 2004-01-21 2005-08-04 Sumitomo Electric Ind Ltd GaN結晶基板の製造方法
JP4720125B2 (ja) * 2004-08-10 2011-07-13 日立電線株式会社 Iii−v族窒化物系半導体基板及びその製造方法並びにiii−v族窒化物系半導体
FI20045482A0 (fi) * 2004-12-14 2004-12-14 Optogan Oy Matalamman dislokaatiotiheyden omaava puolijohdesubstraatti, ja menetelmä sen valmistamiseksi
DE102005003884A1 (de) * 2005-01-24 2006-08-03 Forschungsverbund Berlin E.V. Verfahren zur Herstellung von c-plane orientierten GaN-oder AlxGa1-xN-Substraten
US7704324B2 (en) * 2005-01-25 2010-04-27 General Electric Company Apparatus for processing materials in supercritical fluids and methods thereof
US7919815B1 (en) * 2005-02-24 2011-04-05 Saint-Gobain Ceramics & Plastics, Inc. Spinel wafers and methods of preparation
JP4849296B2 (ja) * 2005-04-11 2012-01-11 日立電線株式会社 GaN基板
JP4792802B2 (ja) * 2005-04-26 2011-10-12 住友電気工業株式会社 Iii族窒化物結晶の表面処理方法
WO2007008394A1 (en) 2005-07-11 2007-01-18 Cree, Inc. Laser diode orientation on mis-cut substrates
KR101220826B1 (ko) * 2005-11-22 2013-01-10 삼성코닝정밀소재 주식회사 질화갈륨 단결정 후막의 제조방법
CN101415864B (zh) 2005-11-28 2014-01-08 晶体公司 具有减少缺陷的大的氮化铝晶体及其制造方法
US7641735B2 (en) 2005-12-02 2010-01-05 Crystal Is, Inc. Doped aluminum nitride crystals and methods of making them
US7897490B2 (en) * 2005-12-12 2011-03-01 Kyma Technologies, Inc. Single crystal group III nitride articles and method of producing same by HVPE method incorporating a polycrystalline layer for yield enhancement
JP2007161536A (ja) * 2005-12-14 2007-06-28 Sumitomo Electric Ind Ltd AlxGayIn1−x−yN結晶基板、半導体デバイスおよびその製造方法
US7935382B2 (en) * 2005-12-20 2011-05-03 Momentive Performance Materials, Inc. Method for making crystalline composition
US7942970B2 (en) * 2005-12-20 2011-05-17 Momentive Performance Materials Inc. Apparatus for making crystalline composition
US8039412B2 (en) * 2005-12-20 2011-10-18 Momentive Performance Materials Inc. Crystalline composition, device, and associated method
EP1972702B1 (de) * 2006-01-12 2013-09-25 Sumitomo Electric Industries, Ltd. Verfahren zur herstellung von aluminiumnitridkristall, aluminiumnitridkristall, aluminiumnitridkristallsubstrat und halbleiterbauelement
EP2918708B1 (de) * 2006-03-30 2019-10-30 Crystal Is, Inc. Verfahren zum Glühen eines Aluminiumnitrid-Wafers
US9034103B2 (en) * 2006-03-30 2015-05-19 Crystal Is, Inc. Aluminum nitride bulk crystals having high transparency to ultraviolet light and methods of forming them
US9518340B2 (en) 2006-04-07 2016-12-13 Sixpoint Materials, Inc. Method of growing group III nitride crystals
WO2007117689A2 (en) * 2006-04-07 2007-10-18 The Regents Of The University Of California Growing large surface area gallium nitride crystals
US7879697B2 (en) * 2006-06-05 2011-02-01 Regents Of The University Of Minnesota Growth of low dislocation density Group-III nitrides and related thin-film structures
WO2007148615A1 (ja) * 2006-06-20 2007-12-27 Sumitomo Electric Industries, Ltd. AlxGa1-xN結晶の成長方法およびAlxGa1-xN結晶基板
JP5125098B2 (ja) * 2006-12-26 2013-01-23 信越半導体株式会社 窒化物半導体自立基板の製造方法
US9771666B2 (en) 2007-01-17 2017-09-26 Crystal Is, Inc. Defect reduction in seeded aluminum nitride crystal growth
CN107059116B (zh) 2007-01-17 2019-12-31 晶体公司 引晶的氮化铝晶体生长中的缺陷减少
WO2008094464A2 (en) * 2007-01-26 2008-08-07 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
US8080833B2 (en) * 2007-01-26 2011-12-20 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
US8269251B2 (en) * 2007-05-17 2012-09-18 Mitsubishi Chemical Corporation Method for producing group III nitride semiconductor crystal, group III nitride semiconductor substrate, and semiconductor light-emitting device
US8088220B2 (en) * 2007-05-24 2012-01-03 Crystal Is, Inc. Deep-eutectic melt growth of nitride crystals
JP2008300540A (ja) * 2007-05-30 2008-12-11 Sumitomo Electric Ind Ltd 半導体発光素子の製造方法
DE102007026298A1 (de) * 2007-06-06 2008-12-11 Freiberger Compound Materials Gmbh Anordnung und Verfahren zur Herstellung eines Kristalls aus der Schmelze eines Rohmaterials sowie Einkristall
TW200905730A (en) * 2007-07-23 2009-02-01 Ind Tech Res Inst Method for forming a microcrystalline silicon film
US20100213576A1 (en) * 2007-10-09 2010-08-26 Panasonic Corporation Method for producing group iii nitride crystal substrate, group iii nitride crystal substrate, and semiconductor device using group iii nitride crystal substrate
CN100575565C (zh) * 2007-11-09 2009-12-30 中国科学院上海光学精密机械研究所 在铝酸锂晶片表面低温制备氮化铝薄膜的方法
JP5018423B2 (ja) 2007-11-20 2012-09-05 住友電気工業株式会社 Iii族窒化物半導体結晶基板および半導体デバイス
JP2009137777A (ja) * 2007-12-04 2009-06-25 Sumitomo Electric Ind Ltd AlN結晶およびその成長方法
US20090229666A1 (en) * 2008-03-14 2009-09-17 Jason Stephan Corneille Smoothing a metallic substrate for a solar cell
US8546172B2 (en) 2008-01-18 2013-10-01 Miasole Laser polishing of a back contact of a solar cell
US8536054B2 (en) 2008-01-18 2013-09-17 Miasole Laser polishing of a solar cell substrate
US8586398B2 (en) 2008-01-18 2013-11-19 Miasole Sodium-incorporation in solar cell substrates and contacts
JP5560528B2 (ja) 2008-01-28 2014-07-30 住友電気工業株式会社 Iii族窒化物単結晶インゴットの製造方法、及びiii族窒化物単結晶基板の製造方法
JP2009280482A (ja) * 2008-04-25 2009-12-03 Sumitomo Electric Ind Ltd Iii族窒化物単結晶自立基板およびそれを用いた半導体デバイスの製造方法
WO2010001804A1 (ja) * 2008-07-01 2010-01-07 住友電気工業株式会社 AlxGa(1-x)N単結晶の製造方法、AlxGa(1-x)N単結晶および光学部品
US20100117118A1 (en) * 2008-08-07 2010-05-13 Dabiran Amir M High electron mobility heterojunction device
US20100072484A1 (en) * 2008-09-23 2010-03-25 Triquint Semiconductor, Inc. Heteroepitaxial gallium nitride-based device formed on an off-cut substrate
WO2010053964A1 (en) * 2008-11-07 2010-05-14 The Regents Of The University Of California Novel vessel designs and relative placements of the source material and seed crystals with respect to the vessel for the ammonothermal growth of group-iii nitride crystals
US8878230B2 (en) * 2010-03-11 2014-11-04 Soraa, Inc. Semi-insulating group III metal nitride and method of manufacture
CA2755122C (en) * 2009-03-13 2016-05-31 Saint-Gobain Ceramics & Plastics, Inc. Chemical mechanical planarization using nanodiamond
JP4758492B2 (ja) * 2009-03-24 2011-08-31 トヨタ自動車株式会社 単結晶の欠陥密度測定方法
US8096671B1 (en) 2009-04-06 2012-01-17 Nmera, Llc Light emitting diode illumination system
US20100314551A1 (en) * 2009-06-11 2010-12-16 Bettles Timothy J In-line Fluid Treatment by UV Radiation
US8133803B2 (en) * 2009-06-23 2012-03-13 Academia Sinica Method for fabricating semiconductor substrates and semiconductor devices
CN101958236B (zh) * 2009-07-20 2012-12-19 上海半导体照明工程技术研究中心 一种半导体衬底及其制备方法
US8344420B1 (en) 2009-07-24 2013-01-01 Triquint Semiconductor, Inc. Enhancement-mode gallium nitride high electron mobility transistor
US8933644B2 (en) 2009-09-18 2015-01-13 Soraa, Inc. LED lamps with improved quality of light
US9293667B2 (en) 2010-08-19 2016-03-22 Soraa, Inc. System and method for selected pump LEDs with multiple phosphors
DE102009055667A1 (de) * 2009-11-25 2011-03-31 Siltronic Ag Verfahren zur Herstellung einer Scheibe bestehend aus Galliumnitrid
WO2011072014A1 (en) * 2009-12-08 2011-06-16 Lehigh Univeristy THERMOELECTRIC MATERIALS BASED ON SINGLE CRYSTAL AlInN-GaN GROWN BY METALORGANIC VAPOR PHASE EPITAXY
US8740413B1 (en) 2010-02-03 2014-06-03 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US8905588B2 (en) 2010-02-03 2014-12-09 Sorra, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
US10147850B1 (en) 2010-02-03 2018-12-04 Soraa, Inc. System and method for providing color light sources in proximity to predetermined wavelength conversion structures
TWI440074B (zh) * 2010-04-02 2014-06-01 Univ Nat Chiao Tung 一種在三族氮化物磊晶過程中降低缺陷產生的方法
EP2588651B1 (de) 2010-06-30 2020-01-08 Crystal Is, Inc. Züchtung grosser aluminiumnitrid-einkristalle mit wärmegradientensteuerung
JP5714250B2 (ja) * 2010-07-14 2015-05-07 住友電工デバイス・イノベーション株式会社 半導体装置の製造方法
KR20130141546A (ko) 2010-10-26 2013-12-26 더 리전츠 오브 더 유니버시티 오브 캘리포니아 기판 및 에피택셜층 패터닝에 의한 iii-족 질화물 헤테로구조들 내의 스트레인 완화의 제한
WO2012058262A2 (en) * 2010-10-26 2012-05-03 The Regents Of The University Of California Vicinal semipolar iii-nitride substrates to compensate tilt of relaxed hetero-epitaxial layers
TWI467635B (zh) * 2011-02-17 2015-01-01 Soitec Silicon On Insulator 凹孔缺陷縮減之三五族半導體構造及形成此等構造之方法
DE102011012925A1 (de) * 2011-03-03 2012-09-06 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
FR2977260B1 (fr) * 2011-06-30 2013-07-19 Soitec Silicon On Insulator Procede de fabrication d'une couche epitaxiale epaisse de nitrure de gallium sur un substrat de silicium ou analogue et couche obtenue par ledit procede
US8962359B2 (en) 2011-07-19 2015-02-24 Crystal Is, Inc. Photon extraction from nitride ultraviolet light-emitting devices
WO2013089459A1 (en) * 2011-12-14 2013-06-20 Seoul Opto Device Co., Ltd. Semiconductor device and method of fabricating the same
CN103999245A (zh) 2011-12-14 2014-08-20 首尔伟傲世有限公司 半导体装置及制造半导体装置的方法
TWI528580B (zh) 2012-03-30 2016-04-01 聖戈班晶體探測器公司 形成獨立式半導體晶圓之方法
JP2013214686A (ja) * 2012-04-04 2013-10-17 Furukawa Co Ltd Iii族窒化物半導体層およびiii族窒化物半導体層の製造方法
KR101369967B1 (ko) * 2012-04-12 2014-03-06 주식회사 루미스탈 휨이 없는 질화갈륨 자립기판 제조 방법
EP2890537A1 (de) 2012-08-28 2015-07-08 Sixpoint Materials Inc. Gruppe-iii-nitrid-wafer und dessen herstellungsverfahren
WO2014051692A1 (en) 2012-09-25 2014-04-03 Sixpoint Materials, Inc. Method of growing group iii nitride crystals
JP6140291B2 (ja) 2012-09-26 2017-05-31 シックスポイント マテリアルズ, インコーポレイテッド Iii族窒化物ウエハおよび製作方法および試験方法
JP6322890B2 (ja) 2013-02-18 2018-05-16 住友電気工業株式会社 Iii族窒化物複合基板およびその製造方法、ならびにiii族窒化物半導体デバイスの製造方法
US9917004B2 (en) * 2012-10-12 2018-03-13 Sumitomo Electric Industries, Ltd. Group III nitride composite substrate and method for manufacturing the same, and method for manufacturing group III nitride semiconductor device
JP6424345B2 (ja) * 2013-02-08 2018-11-21 アダマンド並木精密宝石株式会社 GaN基板の製造方法
US9923063B2 (en) 2013-02-18 2018-03-20 Sumitomo Electric Industries, Ltd. Group III nitride composite substrate and method for manufacturing the same, laminated group III nitride composite substrate, and group III nitride semiconductor device and method for manufacturing the same
US9299880B2 (en) 2013-03-15 2016-03-29 Crystal Is, Inc. Pseudomorphic electronic and optoelectronic devices having planar contacts
CN103367209B (zh) * 2013-07-26 2015-11-25 东莞市中镓半导体科技有限公司 一种液体辅助激光剥离方法
US9574287B2 (en) * 2013-09-26 2017-02-21 Globalfoundries Inc. Gallium nitride material and device deposition on graphene terminated wafer and method of forming the same
JP6262561B2 (ja) * 2014-02-19 2018-01-17 古河機械金属株式会社 Iii族窒化物半導体基板の評価方法
JP6497886B2 (ja) * 2014-10-03 2019-04-10 古河機械金属株式会社 自立基板、及び、自立基板の製造方法
CN104911713A (zh) * 2015-03-16 2015-09-16 中国电子科技集团公司第五十五研究所 一种利用氢气原位刻蚀提高氮化铝晶体质量的方法
DE102015205104A1 (de) 2015-03-20 2016-09-22 Freiberger Compound Materials Gmbh Züchtung von A-B Kristallen ohne Kristallgitter-Krümmung
JP6688109B2 (ja) * 2016-02-25 2020-04-28 日本碍子株式会社 面発光素子、外部共振器型垂直面発光レーザー、および面発光素子の製造方法
WO2017181167A1 (en) * 2016-04-15 2017-10-19 Massachusetts Institute Of Technology Gan devices fabricated via wafer bonding
TWI673354B (zh) 2016-09-23 2019-10-01 聖高拜陶器塑膠公司 化學機械平坦化漿液以及其形成方法
US10497562B1 (en) * 2018-05-29 2019-12-03 Industry-University Cooperation Foundation Hanyang University Method for manufacturing gallium nitride substrate using the hydride vapor phase epitaxy
JP6959190B2 (ja) 2018-07-24 2021-11-02 旭化成エレクトロニクス株式会社 学習処理装置、学習処理方法、化合物半導体の製造方法およびプログラム
JP7106217B2 (ja) * 2018-08-22 2022-07-26 株式会社ディスコ ファセット領域の検出方法及び検出装置
JP7326759B2 (ja) * 2019-02-06 2023-08-16 三菱ケミカル株式会社 GaN単結晶製造方法
RU2714304C1 (ru) * 2019-06-03 2020-02-14 Федеральное государственное бюджетное образовательное учреждение высшего образования "ОРЛОВСКИЙ ГОСУДАРСТВЕННЫЙ УНИВЕРСИТЕТ имени И.С. ТУРГЕНЕВА" (ОГУ им. И.С. Тургенева) Способ определения индексов направления дислокаций
CN112287543A (zh) * 2020-10-28 2021-01-29 华天科技(西安)有限公司 一种氮化镓晶圆生产工艺参数设计方法
US11638470B2 (en) 2021-01-12 2023-05-02 Arash Kani Gallium nitride gemstones
CN112820636B (zh) * 2021-01-14 2024-01-16 镓特半导体科技(上海)有限公司 半导体结构、自支撑氮化镓层及其制备方法
CN112899783B (zh) * 2021-01-18 2022-06-07 上海玺唐半导体科技有限公司 一种常压hvpe制作珊瑚状多晶氮化镓晶体的方法
CN112397571B (zh) 2021-01-18 2021-04-23 苏州纳维科技有限公司 一种氮化镓衬底及半导体复合衬底
CN114242859B (zh) * 2021-11-30 2023-05-02 福建兆元光电有限公司 一种Micro LED外延片制备方法
WO2023182211A1 (ja) * 2022-03-25 2023-09-28 東ソー株式会社 窒化ガリウム焼結体及びその製造方法

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3462320A (en) * 1966-11-21 1969-08-19 Bell Telephone Labor Inc Solution growth of nitrogen doped gallium phosphide
US3615205A (en) * 1968-10-14 1971-10-26 Ibm Method for the synthesis and growth of high purity iii{14 v semiconductor compositions in bulk
US3628998A (en) * 1969-09-23 1971-12-21 Ibm Method for growth of a mixed crystal with controlled composition
US5064497A (en) * 1990-03-09 1991-11-12 At&T Bell Laboratories Crystal growth method and apparatus
PL173917B1 (pl) 1993-08-10 1998-05-29 Ct Badan Wysokocisnieniowych P Sposób wytwarzania krystalicznej struktury wielowarstwowej
US5679152A (en) 1994-01-27 1997-10-21 Advanced Technology Materials, Inc. Method of making a single crystals Ga*N article
US6440823B1 (en) 1994-01-27 2002-08-27 Advanced Technology Materials, Inc. Low defect density (Ga, Al, In)N and HVPE process for making same
DE19640594B4 (de) 1996-10-01 2016-08-04 Osram Gmbh Bauelement
JPH11191657A (ja) 1997-04-11 1999-07-13 Nichia Chem Ind Ltd 窒化物半導体の成長方法及び窒化物半導体素子
DE69834092T2 (de) * 1997-12-02 2006-09-21 Ciba Speciality Chemicals Holding Inc. Polyolefinmaterialien mit verbesserter Oberflächenhaltbarkeit und Verfahren zu ihrer Herstellung durch Strahlung
US6086673A (en) * 1998-04-02 2000-07-11 Massachusetts Institute Of Technology Process for producing high-quality III-V nitride substrates
TW417315B (en) 1998-06-18 2001-01-01 Sumitomo Electric Industries GaN single crystal substrate and its manufacture method of the same
JP4005701B2 (ja) * 1998-06-24 2007-11-14 シャープ株式会社 窒素化合物半導体膜の形成方法および窒素化合物半導体素子
JP3896718B2 (ja) 1999-03-02 2007-03-22 日亜化学工業株式会社 窒化物半導体
JP2000337830A (ja) 1999-05-27 2000-12-08 Kawasaki Steel Corp コイル形状の測定方法及び装置
JP2000357820A (ja) * 1999-06-15 2000-12-26 Pioneer Electronic Corp 窒化ガリウム系半導体発光素子及びその製造方法
JP4145437B2 (ja) 1999-09-28 2008-09-03 住友電気工業株式会社 単結晶GaNの結晶成長方法及び単結晶GaN基板の製造方法と単結晶GaN基板
JP2001122693A (ja) 1999-10-22 2001-05-08 Nec Corp 結晶成長用下地基板およびこれを用いた基板の製造方法
JP3568112B2 (ja) * 1999-12-27 2004-09-22 豊田合成株式会社 半導体基板の製造方法
KR20010058673A (ko) * 1999-12-30 2001-07-06 이형도 하이드라이드 기상 에피택시 성장법에 의한 크랙없는갈륨나이트라이드 후막 제조 방법
US6596079B1 (en) * 2000-03-13 2003-07-22 Advanced Technology Materials, Inc. III-V nitride substrate boule and method of making and using the same
US6447604B1 (en) 2000-03-13 2002-09-10 Advanced Technology Materials, Inc. Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substrates for opto-electronic and electronic devices
JP3968968B2 (ja) * 2000-07-10 2007-08-29 住友電気工業株式会社 単結晶GaN基板の製造方法
US6586819B2 (en) 2000-08-14 2003-07-01 Nippon Telegraph And Telephone Corporation Sapphire substrate, semiconductor device, electronic component, and crystal growing method
US6852161B2 (en) * 2000-08-18 2005-02-08 Showa Denko K.K. Method of fabricating group-iii nitride semiconductor crystal, method of fabricating gallium nitride-based compound semiconductor, gallium nitride-based compound semiconductor, gallium nitride-based compound semiconductor light-emitting device, and light source using the semiconductor light-emitting device
US7053413B2 (en) * 2000-10-23 2006-05-30 General Electric Company Homoepitaxial gallium-nitride-based light emitting device and method for producing
AU2002219966A1 (en) * 2000-11-30 2002-06-11 North Carolina State University Methods and apparatus for producing m'n based materials
JP3631724B2 (ja) 2001-03-27 2005-03-23 日本電気株式会社 Iii族窒化物半導体基板およびその製造方法
US6773504B2 (en) * 2001-04-12 2004-08-10 Sumitomo Electric Industries, Ltd. Oxygen doping method to gallium nitride single crystal substrate and oxygen-doped N-type gallium nitride freestanding single crystal substrate
US6806508B2 (en) * 2001-04-20 2004-10-19 General Electic Company Homoepitaxial gallium nitride based photodetector and method of producing
US6488767B1 (en) 2001-06-08 2002-12-03 Advanced Technology Materials, Inc. High surface quality GaN wafer and method of fabricating same
US6648966B2 (en) * 2001-08-01 2003-11-18 Crystal Photonics, Incorporated Wafer produced thereby, and associated methods and devices using the wafer
JP2003068654A (ja) * 2001-08-27 2003-03-07 Hoya Corp 化合物単結晶の製造方法
JP2003077847A (ja) 2001-09-06 2003-03-14 Sumitomo Chem Co Ltd 3−5族化合物半導体の製造方法
JP3864870B2 (ja) 2001-09-19 2007-01-10 住友電気工業株式会社 単結晶窒化ガリウム基板およびその成長方法並びにその製造方法
JP3801125B2 (ja) 2001-10-09 2006-07-26 住友電気工業株式会社 単結晶窒化ガリウム基板と単結晶窒化ガリウムの結晶成長方法および単結晶窒化ガリウム基板の製造方法
KR100679387B1 (ko) 2001-10-26 2007-02-05 암모노 에스피. 제트오. 오. 질화물 반도체 레이저 소자 및 이의 제조방법
US6730942B2 (en) * 2002-01-24 2004-05-04 Toyoda Gosei Co., Ltd. Light emitting apparatus
KR101288489B1 (ko) * 2002-04-15 2013-07-26 더 리전츠 오브 더 유니버시티 오브 캘리포니아 무극성 질화(알루미늄, 붕소, 인듐, 갈륨) 양자우물 및이형구조 재료 및 장치
US7638815B2 (en) * 2002-12-27 2009-12-29 Momentive Performance Materials Inc. Crystalline composition, wafer, and semi-conductor structure
US7170095B2 (en) * 2003-07-11 2007-01-30 Cree Inc. Semi-insulating GaN and method of making the same
JP2005101475A (ja) 2003-08-28 2005-04-14 Hitachi Cable Ltd Iii−v族窒化物系半導体基板及びその製造方法
US7323256B2 (en) * 2003-11-13 2008-01-29 Cree, Inc. Large area, uniformly low dislocation density GaN substrate and process for making the same
JP4691911B2 (ja) * 2004-06-11 2011-06-01 日立電線株式会社 Iii−v族窒化物系半導体自立基板の製造方法
PL371405A1 (pl) * 2004-11-26 2006-05-29 Ammono Sp.Z O.O. Sposób wytwarzania objętościowych monokryształów metodą wzrostu na zarodku
JP4525353B2 (ja) * 2005-01-07 2010-08-18 住友電気工業株式会社 Iii族窒化物基板の製造方法
US7348062B2 (en) * 2006-06-10 2008-03-25 Solutia Incorporated Interlayers comprising modified fumed silica

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