DE602005004942D1 - Prüfvorrichtung für Halbleiter und Verfahren zur Herstellung einer Prüfsonde - Google Patents

Prüfvorrichtung für Halbleiter und Verfahren zur Herstellung einer Prüfsonde

Info

Publication number
DE602005004942D1
DE602005004942D1 DE602005004942T DE602005004942T DE602005004942D1 DE 602005004942 D1 DE602005004942 D1 DE 602005004942D1 DE 602005004942 T DE602005004942 T DE 602005004942T DE 602005004942 T DE602005004942 T DE 602005004942T DE 602005004942 D1 DE602005004942 D1 DE 602005004942D1
Authority
DE
Germany
Prior art keywords
making
test probe
semiconductor tester
tester
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005004942T
Other languages
English (en)
Other versions
DE602005004942T2 (de
Inventor
Kei Murayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Publication of DE602005004942D1 publication Critical patent/DE602005004942D1/de
Application granted granted Critical
Publication of DE602005004942T2 publication Critical patent/DE602005004942T2/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE602005004942T 2004-01-16 2005-01-14 Prüfvorrichtung für Halbleiter und Verfahren zur Herstellung einer Prüfsonde Active DE602005004942T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004009614 2004-01-16
JP2004009614A JP2005201813A (ja) 2004-01-16 2004-01-16 半導体検査装置及びコンタクトの製造方法

Publications (2)

Publication Number Publication Date
DE602005004942D1 true DE602005004942D1 (de) 2008-04-10
DE602005004942T2 DE602005004942T2 (de) 2009-02-26

Family

ID=34616919

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005004942T Active DE602005004942T2 (de) 2004-01-16 2005-01-14 Prüfvorrichtung für Halbleiter und Verfahren zur Herstellung einer Prüfsonde

Country Status (4)

Country Link
US (2) US7061261B2 (de)
EP (1) EP1555533B1 (de)
JP (1) JP2005201813A (de)
DE (1) DE602005004942T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100769891B1 (ko) * 2007-01-25 2007-10-24 리노공업주식회사 검사용 탐침 장치 및 이를 이용한 검사용 소켓
CN103424574A (zh) * 2012-05-15 2013-12-04 苏州星诺奇传动科技有限公司 测量夹具
CN104090131A (zh) * 2014-06-30 2014-10-08 昆山迈致治具科技有限公司 一种用于屏幕测试的固定装置及治具

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4574235A (en) * 1981-06-05 1986-03-04 Micro Component Technology, Inc. Transmission line connector and contact set assembly for test site
EP0078339B1 (de) * 1981-10-30 1986-07-30 Ibm Deutschland Gmbh Tastkopfanordnung für Leiterzugüberprüfung mit mindestens einem, eine Vielzahl von federnden Kontakten aufweisenden Tastkopf
US5172050A (en) * 1991-02-15 1992-12-15 Motorola, Inc. Micromachined semiconductor probe card
JPH077052A (ja) * 1993-06-16 1995-01-10 Seiko Epson Corp 電気特性測定用プローブ
KR100324059B1 (ko) 1994-11-15 2002-04-17 이고르 와이. 칸드로스 초소형 전자 부품용 상호 접속 요소
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
US6255126B1 (en) * 1998-12-02 2001-07-03 Formfactor, Inc. Lithographic contact elements
JP4414502B2 (ja) * 1999-02-25 2010-02-10 東京エレクトロン株式会社 プロービングカード
JP2001255340A (ja) 2000-03-13 2001-09-21 Yokowo Co Ltd コンタクトプローブ及び該コンタクトプローブを設けたｉｃパッケージ検査用ソケット
JP2002168904A (ja) 2000-12-01 2002-06-14 Hitachi Ltd 半導体装置の製造方法
JP2003227847A (ja) 2002-02-05 2003-08-15 Sony Corp プローブ針、プローブカード、プローブ針を用いた検査装置及び方法

Also Published As

Publication number Publication date
JP2005201813A (ja) 2005-07-28
EP1555533A1 (de) 2005-07-20
US20060130322A1 (en) 2006-06-22
US20050156614A1 (en) 2005-07-21
US7061261B2 (en) 2006-06-13
EP1555533B1 (de) 2008-02-27
DE602005004942T2 (de) 2009-02-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition