DE602006004098D1 - Multibit-Speicheranordnung mit Schichten aus resistivem Material als Speicherknoten und Verfahren zur Herstellung und zum Betrieb desselben - Google Patents

Multibit-Speicheranordnung mit Schichten aus resistivem Material als Speicherknoten und Verfahren zur Herstellung und zum Betrieb desselben

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Publication number
DE602006004098D1
DE602006004098D1 DE602006004098T DE602006004098T DE602006004098D1 DE 602006004098 D1 DE602006004098 D1 DE 602006004098D1 DE 602006004098 T DE602006004098 T DE 602006004098T DE 602006004098 T DE602006004098 T DE 602006004098T DE 602006004098 D1 DE602006004098 D1 DE 602006004098D1
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DE
Germany
Prior art keywords
layers
making
memory device
storage nodes
resistive material
Prior art date
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Active
Application number
DE602006004098T
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English (en)
Inventor
Jung-Hyun Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of DE602006004098D1 publication Critical patent/DE602006004098D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/20Multistable switching devices, e.g. memristors
    • H10N70/231Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/56Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
    • G11C11/5678Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency using amorphous/crystalline phase transition storage elements
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0004Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B63/00Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
    • H10B63/30Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/011Manufacture or treatment of multistable switching devices
    • H10N70/061Patterning of the switching material
    • H10N70/063Patterning of the switching material by etching of pre-deposited switching material layers, e.g. lithography
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/821Device geometry
    • H10N70/826Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/882Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
    • H10N70/8828Tellurides, e.g. GeSbTe
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N70/00Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
    • H10N70/801Constructional details of multistable switching devices
    • H10N70/881Switching materials
    • H10N70/883Oxides or nitrides
    • H10N70/8833Binary metal oxides, e.g. TaOx
DE602006004098T 2005-04-06 2006-04-05 Multibit-Speicheranordnung mit Schichten aus resistivem Material als Speicherknoten und Verfahren zur Herstellung und zum Betrieb desselben Active DE602006004098D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050028544A KR100657956B1 (ko) 2005-04-06 2005-04-06 다치 저항체 메모리 소자와 그 제조 및 동작 방법

Publications (1)

Publication Number Publication Date
DE602006004098D1 true DE602006004098D1 (de) 2009-01-22

Family

ID=36693053

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006004098T Active DE602006004098D1 (de) 2005-04-06 2006-04-05 Multibit-Speicheranordnung mit Schichten aus resistivem Material als Speicherknoten und Verfahren zur Herstellung und zum Betrieb desselben

Country Status (5)

Country Link
US (2) US7718988B2 (de)
EP (1) EP1710840B1 (de)
JP (1) JP5209852B2 (de)
KR (1) KR100657956B1 (de)
DE (1) DE602006004098D1 (de)

Families Citing this family (75)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI277207B (en) * 2004-10-08 2007-03-21 Ind Tech Res Inst Multilevel phase-change memory, operating method and manufacture method thereof
US8468777B2 (en) * 2005-02-16 2013-06-25 Yuyama Mfg. Co., Ltd. Tablet filling device
KR100657956B1 (ko) * 2005-04-06 2006-12-14 삼성전자주식회사 다치 저항체 메모리 소자와 그 제조 및 동작 방법
JP4575837B2 (ja) * 2005-05-19 2010-11-04 シャープ株式会社 不揮発性記憶素子及びその製造方法
US7531825B2 (en) 2005-12-27 2009-05-12 Macronix International Co., Ltd. Method for forming self-aligned thermal isolation cell for a variable resistance memory array
US7579611B2 (en) * 2006-02-14 2009-08-25 International Business Machines Corporation Nonvolatile memory cell comprising a chalcogenide and a transition metal oxide
US9178141B2 (en) 2006-04-04 2015-11-03 Micron Technology, Inc. Memory elements using self-aligned phase change material layers and methods of manufacturing same
US7812334B2 (en) * 2006-04-04 2010-10-12 Micron Technology, Inc. Phase change memory elements using self-aligned phase change material layers and methods of making and using same
US7473921B2 (en) * 2006-06-07 2009-01-06 International Business Machines Corporation Nonvolatile memory cell with concentric phase change material formed around a pillar arrangement
KR100818271B1 (ko) * 2006-06-27 2008-03-31 삼성전자주식회사 펄스전압을 인가하는 비휘발성 메모리 소자의 문턱 스위칭동작 방법
US7663909B2 (en) * 2006-07-10 2010-02-16 Qimonda North America Corp. Integrated circuit having a phase change memory cell including a narrow active region width
US7688618B2 (en) * 2006-07-18 2010-03-30 Qimonda North America Corp. Integrated circuit having memory having a step-like programming characteristic
TWI305678B (en) * 2006-08-14 2009-01-21 Ind Tech Res Inst Phase-change memory and fabricating method thereof
JP4105760B2 (ja) * 2006-08-25 2008-06-25 松下電器産業株式会社 記憶素子およびメモリ装置並びに半導体集積回路
US8067762B2 (en) 2006-11-16 2011-11-29 Macronix International Co., Ltd. Resistance random access memory structure for enhanced retention
KR20080066476A (ko) * 2007-01-12 2008-07-16 삼성전자주식회사 저항성 메모리 소자 및 그 제조방법
TWI326917B (en) * 2007-02-01 2010-07-01 Ind Tech Res Inst Phase-change memory
KR100898897B1 (ko) 2007-02-16 2009-05-27 삼성전자주식회사 비휘발성 메모리 소자 및 그 형성방법
JP2008218492A (ja) * 2007-02-28 2008-09-18 Elpida Memory Inc 相変化メモリ装置
KR100819560B1 (ko) * 2007-03-26 2008-04-08 삼성전자주식회사 상전이 메모리소자 및 그 제조방법
US7704788B2 (en) * 2007-04-06 2010-04-27 Samsung Electronics Co., Ltd. Methods of fabricating multi-bit phase-change memory devices and devices formed thereby
US7940552B2 (en) * 2007-04-30 2011-05-10 Samsung Electronics Co., Ltd. Multiple level cell phase-change memory device having pre-reading operation resistance drift recovery, memory systems employing such devices and methods of reading memory devices
KR101469831B1 (ko) * 2007-04-30 2014-12-09 삼성전자주식회사 향상된 읽기 성능을 갖는 멀티-레벨 상변환 메모리 장치 및그것의 읽기 방법
KR101350979B1 (ko) * 2007-05-11 2014-01-14 삼성전자주식회사 저항성 메모리 소자 및 그 제조 방법
JP5201616B2 (ja) * 2007-05-24 2013-06-05 国立大学法人群馬大学 メモリ素子、メモリセル、及びメモリセルアレイ
KR100914267B1 (ko) * 2007-06-20 2009-08-27 삼성전자주식회사 가변저항 메모리 장치 및 그것의 형성방법
KR100901699B1 (ko) * 2007-07-11 2009-06-08 한국전자통신연구원 금속-절연체 상전이 메모리 셀 및 그의 제조 방법
KR101308549B1 (ko) * 2007-07-12 2013-09-13 삼성전자주식회사 멀티-레벨 상변환 메모리 장치 및 그것의 쓰기 방법
US8101937B2 (en) * 2007-07-25 2012-01-24 Intermolecular, Inc. Multistate nonvolatile memory elements
TWI347607B (en) 2007-11-08 2011-08-21 Ind Tech Res Inst Writing system and method for a phase change memory
US8426838B2 (en) 2008-01-25 2013-04-23 Higgs Opl. Capital Llc Phase-change memory
JP4596070B2 (ja) 2008-02-01 2010-12-08 ソニー株式会社 メモリ素子及びメモリ素子の製造方法、並びに表示装置及び表示装置の製造方法
KR101490429B1 (ko) * 2008-03-11 2015-02-11 삼성전자주식회사 저항 메모리 소자 및 그 형성 방법
US7936597B2 (en) * 2008-03-25 2011-05-03 Seagate Technology Llc Multilevel magnetic storage device
WO2009122347A2 (en) * 2008-04-01 2009-10-08 Nxp B.V. Multiple bit phase change memory cell
US8098520B2 (en) 2008-04-25 2012-01-17 Seagate Technology Llc Storage device including a memory cell having multiple memory layers
KR100989180B1 (ko) 2008-07-21 2010-10-20 재단법인서울대학교산학협력재단 저항변화기록소자 및 그 제조방법
US20100051896A1 (en) * 2008-09-02 2010-03-04 Samsung Electronics Co., Ltd. Variable resistance memory device using a channel-shaped variable resistance pattern
US7969771B2 (en) * 2008-09-30 2011-06-28 Seagate Technology Llc Semiconductor device with thermally coupled phase change layers
IT1391864B1 (it) * 2008-09-30 2012-01-27 St Microelectronics Rousset Cella di memoria resistiva e metodo per la fabbricazione di una cella di memoria resistiva
US8415226B2 (en) * 2008-10-03 2013-04-09 Taiwan Semiconductor Manufacturing Co., Ltd. Phase change memory cells and fabrication thereof
US8604457B2 (en) 2008-11-12 2013-12-10 Higgs Opl. Capital Llc Phase-change memory element
TWI402845B (zh) 2008-12-30 2013-07-21 Higgs Opl Capital Llc 相變化記憶體陣列之驗證電路及方法
TWI412124B (zh) 2008-12-31 2013-10-11 Higgs Opl Capital Llc 相變化記憶體
KR20100082604A (ko) * 2009-01-09 2010-07-19 삼성전자주식회사 가변저항 메모리 장치 및 그의 형성 방법
KR101046725B1 (ko) 2009-03-16 2011-07-07 한양대학교 산학협력단 저항성 메모리 장치
KR20110015934A (ko) * 2009-08-10 2011-02-17 삼성전자주식회사 비휘발성 메모리 장치 및 이의 프로그램 방법
KR101617381B1 (ko) * 2009-12-21 2016-05-02 삼성전자주식회사 가변 저항 메모리 장치 및 그 형성 방법
US8048755B2 (en) 2010-02-08 2011-11-01 Micron Technology, Inc. Resistive memory and methods of processing resistive memory
US8362477B2 (en) 2010-03-23 2013-01-29 International Business Machines Corporation High density memory device
US8624217B2 (en) 2010-06-25 2014-01-07 International Business Machines Corporation Planar phase-change memory cell with parallel electrical paths
US8575008B2 (en) 2010-08-31 2013-11-05 International Business Machines Corporation Post-fabrication self-aligned initialization of integrated devices
US8619457B2 (en) * 2010-09-13 2013-12-31 Hewlett-Packard Development Company, L.P. Three-device non-volatile memory cell
CN102479924B (zh) * 2010-11-30 2014-01-01 中芯国际集成电路制造(北京)有限公司 相变存储器的制作方法
CN102569647B (zh) * 2010-12-22 2014-02-05 中芯国际集成电路制造(上海)有限公司 相变存储器的制作方法
US9159413B2 (en) * 2010-12-29 2015-10-13 Stmicroelectronics Pte Ltd. Thermo programmable resistor based ROM
US8467234B2 (en) 2011-02-08 2013-06-18 Crocus Technology Inc. Magnetic random access memory devices configured for self-referenced read operation
US8488372B2 (en) 2011-06-10 2013-07-16 Crocus Technology Inc. Magnetic random access memory devices including multi-bit cells
US8576615B2 (en) 2011-06-10 2013-11-05 Crocus Technology Inc. Magnetic random access memory devices including multi-bit cells
US8964448B2 (en) * 2012-08-09 2015-02-24 Micron Technology, Inc. Memory cells having a plurality of resistance variable materials
TWI500116B (zh) * 2012-09-06 2015-09-11 Univ Nat Chiao Tung 可撓曲非揮發性記憶體及其製造方法
KR101490053B1 (ko) 2012-10-17 2015-02-06 한양대학교 산학협력단 상변화 메모리 셀 및 이의 제조방법
WO2014103577A1 (ja) * 2012-12-26 2014-07-03 ソニー株式会社 記憶装置およびその製造方法
US9001554B2 (en) 2013-01-10 2015-04-07 Intermolecular, Inc. Resistive random access memory cell having three or more resistive states
US9000407B2 (en) 2013-05-28 2015-04-07 Intermolecular, Inc. ReRAM materials stack for low-operating-power and high-density applications
TWI619282B (zh) * 2016-01-20 2018-03-21 旺宏電子股份有限公司 記憶裝置與電阻式記憶胞的操作方法
KR20180134124A (ko) * 2017-06-08 2018-12-18 에스케이하이닉스 주식회사 강유전성 메모리 소자
US10177311B1 (en) * 2017-10-12 2019-01-08 United Microelectronics Corp. Resistive random access memory (RRAM) and fabrication method thereof
KR102638628B1 (ko) 2017-10-20 2024-02-22 삼성전자주식회사 가변 저항 메모리 소자 및 이의 제조 방법
US11476416B2 (en) 2018-03-29 2022-10-18 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and method for manufacturing the same
US11437573B2 (en) * 2018-03-29 2022-09-06 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and method for manufacturing the same
CN109888091B (zh) * 2019-03-01 2023-12-01 上海华力微电子有限公司 一种形成随机存储器层的方法
CN113192929B (zh) * 2020-01-14 2023-07-25 联华电子股份有限公司 电阻式存储器结构及其制作方法
US11751405B2 (en) 2020-09-25 2023-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated circuit and method for fabricating the same
US11894267B2 (en) * 2021-01-05 2024-02-06 Taiwan Semiconductor Manufacturing Company, Ltd. Method for fabricating integrated circuit device

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0068058B1 (de) * 1981-06-25 1986-09-03 International Business Machines Corporation Elektrisch programmierbarer Festwertspeicher
US4448262A (en) * 1982-05-19 1984-05-15 Cooper Industries, Inc. Pneumatic hammer
DE4320484A1 (de) * 1993-06-21 1994-12-22 Dornier Gmbh Steuerbares Supraleiter-Bauelement
US5789758A (en) * 1995-06-07 1998-08-04 Micron Technology, Inc. Chalcogenide memory cell with a plurality of chalcogenide electrodes
US5912839A (en) * 1998-06-23 1999-06-15 Energy Conversion Devices, Inc. Universal memory element and method of programming same
US6661048B2 (en) * 1999-06-17 2003-12-09 Hitachi, Ltd. Semiconductor memory device having self-aligned wiring conductor
JP3993972B2 (ja) * 2000-08-25 2007-10-17 富士通株式会社 半導体装置の製造方法と半導体装置
JP4025527B2 (ja) * 2000-10-27 2007-12-19 松下電器産業株式会社 メモリ、書き込み装置、読み出し装置およびその方法
US6809401B2 (en) * 2000-10-27 2004-10-26 Matsushita Electric Industrial Co., Ltd. Memory, writing apparatus, reading apparatus, writing method, and reading method
US6774387B2 (en) * 2001-06-26 2004-08-10 Ovonyx, Inc. Programmable resistance memory element
JP2003060054A (ja) * 2001-08-10 2003-02-28 Rohm Co Ltd 強誘電体キャパシタを有する半導体装置
US6507061B1 (en) * 2001-08-31 2003-01-14 Intel Corporation Multiple layer phase-change memory
KR100395767B1 (ko) * 2001-09-13 2003-08-21 삼성전자주식회사 강유전성 메모리 장치 및 그 형성 방법
US6809362B2 (en) * 2002-02-20 2004-10-26 Micron Technology, Inc. Multiple data state memory cell
JP4103497B2 (ja) * 2002-04-18 2008-06-18 ソニー株式会社 記憶装置とその製造方法および使用方法、半導体装置とその製造方法
US6771534B2 (en) * 2002-11-15 2004-08-03 International Business Machines Corporation Thermally-assisted magnetic writing using an oxide layer and current-induced heating
JP3630671B2 (ja) * 2003-01-31 2005-03-16 沖電気工業株式会社 強誘電体キャパシタ、強誘電体キャパシタを具える半導体装置、強誘電体キャパシタの製造方法及び半導体装置の製造方法
US7402851B2 (en) * 2003-02-24 2008-07-22 Samsung Electronics Co., Ltd. Phase changeable memory devices including nitrogen and/or silicon and methods for fabricating the same
KR100543445B1 (ko) * 2003-03-04 2006-01-23 삼성전자주식회사 상변화 기억 소자 및 그 형성방법
KR100773537B1 (ko) * 2003-06-03 2007-11-07 삼성전자주식회사 한 개의 스위칭 소자와 한 개의 저항체를 포함하는비휘발성 메모리 장치 및 그 제조 방법
US7259039B2 (en) * 2003-07-09 2007-08-21 Spansion Llc Memory device and methods of using and making the device
US6927410B2 (en) * 2003-09-04 2005-08-09 Silicon Storage Technology, Inc. Memory device with discrete layers of phase change memory material
US7485891B2 (en) * 2003-11-20 2009-02-03 International Business Machines Corporation Multi-bit phase change memory cell and multi-bit phase change memory including the same, method of forming a multi-bit phase change memory, and method of programming a multi-bit phase change memory
TWI277207B (en) * 2004-10-08 2007-03-21 Ind Tech Res Inst Multilevel phase-change memory, operating method and manufacture method thereof
TWI254443B (en) * 2004-10-08 2006-05-01 Ind Tech Res Inst Multilevel phase-change memory, manufacture method and status transferring method thereof
TWI280614B (en) * 2004-11-09 2007-05-01 Ind Tech Res Inst Multilevel phase-change memory, manufacture method and operating method thereof
KR100657956B1 (ko) * 2005-04-06 2006-12-14 삼성전자주식회사 다치 저항체 메모리 소자와 그 제조 및 동작 방법
US7589364B2 (en) * 2005-11-02 2009-09-15 Elpida Memory, Inc. Electrically rewritable non-volatile memory element and method of manufacturing the same
US7579611B2 (en) * 2006-02-14 2009-08-25 International Business Machines Corporation Nonvolatile memory cell comprising a chalcogenide and a transition metal oxide

Also Published As

Publication number Publication date
KR20060106113A (ko) 2006-10-12
US20100187492A1 (en) 2010-07-29
US20060226411A1 (en) 2006-10-12
US7718988B2 (en) 2010-05-18
EP1710840B1 (de) 2008-12-10
JP5209852B2 (ja) 2013-06-12
US7939816B2 (en) 2011-05-10
JP2006295168A (ja) 2006-10-26
EP1710840A2 (de) 2006-10-11
KR100657956B1 (ko) 2006-12-14
EP1710840A3 (de) 2007-02-21

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