DE602006010119D1 - Mikro-Heizelement und Fühler - Google Patents

Mikro-Heizelement und Fühler

Info

Publication number
DE602006010119D1
DE602006010119D1 DE602006010119T DE602006010119T DE602006010119D1 DE 602006010119 D1 DE602006010119 D1 DE 602006010119D1 DE 602006010119 T DE602006010119 T DE 602006010119T DE 602006010119 T DE602006010119 T DE 602006010119T DE 602006010119 D1 DE602006010119 D1 DE 602006010119D1
Authority
DE
Germany
Prior art keywords
sensor
heating element
micro heating
micro
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006010119T
Other languages
English (en)
Inventor
Koichi Ikawa
Yoshinori Tsujimura
Takio Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Publication of DE602006010119D1 publication Critical patent/DE602006010119D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P5/00—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft
    • G01P5/10—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables
    • G01P5/12—Measuring speed of fluids, e.g. of air stream; Measuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables using variation of resistance of a heated conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
    • H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/013—Heaters using resistive films or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
DE602006010119T 2005-02-07 2006-02-07 Mikro-Heizelement und Fühler Active DE602006010119D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005029993 2005-02-07

Publications (1)

Publication Number Publication Date
DE602006010119D1 true DE602006010119D1 (de) 2009-12-17

Family

ID=36582330

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006010119T Active DE602006010119D1 (de) 2005-02-07 2006-02-07 Mikro-Heizelement und Fühler

Country Status (5)

Country Link
US (1) US7487675B2 (de)
EP (1) EP1688714B1 (de)
JP (1) JP5108234B2 (de)
KR (1) KR100890084B1 (de)
DE (1) DE602006010119D1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4929753B2 (ja) * 2006-02-22 2012-05-09 オムロン株式会社 薄膜構造体の形成方法並びに薄膜構造体、振動センサ、圧力センサ及び加速度センサ
TWI275416B (en) * 2006-04-11 2007-03-11 Touch Micro System Tech Micro sample heating apparatus and method of making the same
US20080128341A1 (en) * 2006-12-04 2008-06-05 Electronics And Telecommunications Research Institute Micro filtration device for separating blood plasma and fabrication method therefor
JP5276964B2 (ja) 2008-12-08 2013-08-28 日立オートモティブシステムズ株式会社 熱式流体流量センサおよびその製造方法
JP5590454B2 (ja) * 2010-10-05 2014-09-17 株式会社リコー 電気素子、集積素子及び電子回路
US8625083B2 (en) * 2011-03-12 2014-01-07 Ken Roberts Thin film stress measurement 3D anisotropic volume
CN102368042B (zh) * 2011-06-27 2012-11-21 华中科技大学 微型流量传感器
JP5753807B2 (ja) * 2012-03-14 2015-07-22 日立オートモティブシステムズ株式会社 熱式流体流量センサおよびその製造方法
JP5949573B2 (ja) * 2013-01-21 2016-07-06 株式会社デンソー 物理量センサの製造方法
EP2762865A1 (de) * 2013-01-31 2014-08-06 Sensirion Holding AG Chemische Sensor und Verfahren zur Herstellung solch eines chemischen Sensors
JP6241919B2 (ja) * 2013-09-30 2017-12-06 住友電工デバイス・イノベーション株式会社 光学半導体デバイス
JP6293575B2 (ja) * 2014-05-20 2018-03-14 日本特殊陶業株式会社 マイクロヒータ、及び、ガスセンサ
US10408780B2 (en) * 2017-04-20 2019-09-10 United Microelectronics Corporation Structure of gas sensor
CN108185526B (zh) * 2018-01-03 2023-09-01 云南中烟工业有限责任公司 一种集成二极管温度传感器的mems发热芯片及其制造方法
JP6990165B2 (ja) * 2018-12-05 2022-01-12 日立Astemo株式会社 熱式センサおよびその製造方法並びに半導体装置
JP7134920B2 (ja) * 2019-06-17 2022-09-12 日立Astemo株式会社 熱式センサ装置

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US19290A (en) * 1858-02-09 Bailroad-cae axle-box
US118202A (en) * 1871-08-22 Improvement in sled-brakes
US4525346A (en) * 1981-09-28 1985-06-25 Alcon Laboratories, Inc. Aqueous antimicrobial ophthalmic solutions
US4407791A (en) * 1981-09-28 1983-10-04 Alcon Laboratories, Inc. Ophthalmic solutions
AU565948B2 (en) * 1982-02-03 1987-10-01 Baremek Pty. Ltd. Electrophoretic cleaner and sterilizer
FR2521856A1 (fr) * 1982-02-19 1983-08-26 Pos Lab Medicament ophtalmique pour le traitement des glaucomes, a base d'ethers-oxydes ou d'ether-oximes de derives alcoylamines
US4758595A (en) * 1984-12-11 1988-07-19 Bausch & Lomb Incorporated Disinfecting and preserving systems and methods of use
US4904359A (en) * 1985-10-31 1990-02-27 The Procter & Gamble Company Liquid detergent composition containing polymeric surfactant
DE3612538A1 (de) * 1986-04-14 1987-10-15 Dispersa Ag Stabilisierung von quecksilberhaltigen konservierungsmitteln in augentropfen
DE3612537C1 (de) * 1986-04-14 1987-07-16 Dispersa Ag Arzneimittel zur Behandlung von Entzuendungen im Auge
PH25150A (en) * 1986-06-05 1991-03-13 Ciba Geigy Ag Novel pharmaceutical preparation for topical application
US4734475A (en) * 1986-12-15 1988-03-29 Ciba-Geigy Corporation Wettable surface modified contact lens fabricated from an oxirane containing hydrophobic polymer
US4888988A (en) 1987-12-23 1989-12-26 Siemens-Bendix Automotive Electronics L.P. Silicon based mass airflow sensor and its fabrication method
US4952904A (en) 1988-12-23 1990-08-28 Honeywell Inc. Adhesion layer for platinum based sensors
US5171526A (en) * 1990-01-05 1992-12-15 Allergan, Inc. Ophthalmic compositions and methods for preserving and using same
JP3058656B2 (ja) * 1990-06-18 2000-07-04 トーメー産業株式会社 コンタクトレンズ用液剤組成物及びそれを用いたコンタクトレンズの洗浄若しくは保存方法
US5422073A (en) * 1990-12-27 1995-06-06 Allergan, Inc. Method and composition for disinfecting contact lenses
JPH0775620B2 (ja) * 1991-04-08 1995-08-16 トーメー産業株式会社 含水性コンタクトレンズ用液剤組成物及び含水性コンタクトレンズの洗浄方法
US5505953A (en) * 1992-05-06 1996-04-09 Alcon Laboratories, Inc. Use of borate-polyol complexes in ophthalmic compositions
ES2246491T5 (es) * 1992-05-06 2011-01-31 Alcon Laboratories, Inc. Uso de complejos de borato-poliol en composiciones oftálmicas.
US5260021A (en) * 1992-06-29 1993-11-09 Allergan, Inc. Hydrogen peroxide-containing gels and contact lens disinfecting using same
US5356555A (en) * 1992-09-14 1994-10-18 Allergan, Inc. Non-oxidative method and composition for simultaneously cleaning and disinfecting contact lenses using a protease with a disinfectant
US5393351A (en) 1993-01-13 1995-02-28 The United States Of America As Represented By The Secretary Of Commerce Multilayer film multijunction thermal converters
JPH0776700A (ja) * 1993-07-14 1995-03-20 Senju Pharmaceut Co Ltd コンタクトレンズ用剤の安定化方法
US5393491A (en) * 1993-09-22 1995-02-28 Alcon Laboratories, Inc. Use of amidoamines in ophthalmic compositions
US5631005A (en) * 1994-09-21 1997-05-20 Alcon Laboratories, Inc. Use of amidoamines in ophthalmic compositions
US5573726A (en) * 1993-09-22 1996-11-12 Alcon Laboratories, Inc. Use of amidoamines in ophthalmic compositions
FR2717075B1 (fr) * 1994-03-14 1996-04-05 Oreal Gel aqueux de maquillage à organopolysiloxane.
JP3452409B2 (ja) 1994-08-10 2003-09-29 株式会社リコー マイクロブリッジヒータ
US5603929A (en) * 1994-11-16 1997-02-18 Alcon Laboratories, Inc. Preserved ophthalmic drug compositions containing polymeric quaternary ammonium compounds
DE19511590A1 (de) 1995-03-29 1996-10-02 Bosch Gmbh Robert Meßelement für einen Durchflußsensor und Herstellungsverfahren
NZ336031A (en) * 1996-12-13 2000-05-26 Alcon Lab Inc Ophthalmic composition with an amino alcohol molecular weight from 60 to 200 and borate composition; method of enhancing anti-microbial activity with composition
DE19744228C1 (de) 1997-10-07 1998-11-26 Bosch Gmbh Robert Sensor mit einer Membran
JP3867393B2 (ja) 1998-03-20 2007-01-10 株式会社デンソー マイクロヒータおよびその製造方法ならびにエアフローセンサ
JP2000002571A (ja) 1998-06-16 2000-01-07 Tokyo Gas Co Ltd 熱線式マイクロヒータ
DE19952055A1 (de) 1999-10-28 2001-05-17 Bosch Gmbh Robert Massenflußsensor mit verbesserter Membranstabilität
US20020142478A1 (en) * 2001-03-28 2002-10-03 Hiroyuki Wado Gas sensor and method of fabricating a gas sensor
JP3678180B2 (ja) 2001-07-27 2005-08-03 株式会社デンソー フローセンサ
JP2003344136A (ja) * 2002-05-24 2003-12-03 Denso Corp 流量測定装置
JP3699703B2 (ja) * 2002-11-06 2005-09-28 三菱電機株式会社 発熱構造体および熱式センサ
AU2003302452A1 (en) 2002-11-27 2004-06-18 Ngk Spark Plug Co., Ltd. Oxidizing gas sensor
US6983653B2 (en) 2002-12-13 2006-01-10 Denso Corporation Flow sensor having thin film portion and method for manufacturing the same
JP4547974B2 (ja) * 2004-04-26 2010-09-22 株式会社デンソー 流量センサおよびその製造方法

Also Published As

Publication number Publication date
KR20060090194A (ko) 2006-08-10
JP2006242941A (ja) 2006-09-14
EP1688714A3 (de) 2006-10-18
US7487675B2 (en) 2009-02-10
EP1688714A2 (de) 2006-08-09
JP5108234B2 (ja) 2012-12-26
US20060174703A1 (en) 2006-08-10
EP1688714B1 (de) 2009-11-04
KR100890084B1 (ko) 2009-03-24

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Legal Events

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