DE602006011724D1 - Strahlungshärtbare cycloaliphatische sperrdichtstoffe - Google Patents

Strahlungshärtbare cycloaliphatische sperrdichtstoffe

Info

Publication number
DE602006011724D1
DE602006011724D1 DE602006011724T DE602006011724T DE602006011724D1 DE 602006011724 D1 DE602006011724 D1 DE 602006011724D1 DE 602006011724 T DE602006011724 T DE 602006011724T DE 602006011724 T DE602006011724 T DE 602006011724T DE 602006011724 D1 DE602006011724 D1 DE 602006011724D1
Authority
DE
Germany
Prior art keywords
cycloaliphatic
hardened
radiation
lubricating seals
functional group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006011724T
Other languages
English (en)
Inventor
Donald E Herr
Shengqian Kong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of DE602006011724D1 publication Critical patent/DE602006011724D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/12—Polythioether-ethers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
DE602006011724T 2005-04-04 2006-04-03 Strahlungshärtbare cycloaliphatische sperrdichtstoffe Active DE602006011724D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/098,115 US20060223937A1 (en) 2005-04-04 2005-04-04 Radiation curable cycloaliphatic barrier sealants
PCT/US2006/012181 WO2006107802A1 (en) 2005-04-04 2006-04-03 Radiation curable cycloaliphatic barrier sealants

Publications (1)

Publication Number Publication Date
DE602006011724D1 true DE602006011724D1 (de) 2010-03-04

Family

ID=36790973

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006011724T Active DE602006011724D1 (de) 2005-04-04 2006-04-03 Strahlungshärtbare cycloaliphatische sperrdichtstoffe

Country Status (9)

Country Link
US (2) US20060223937A1 (de)
EP (1) EP1866960B1 (de)
JP (1) JP5575393B2 (de)
KR (1) KR101332702B1 (de)
CN (1) CN101151726B (de)
AT (1) ATE455371T1 (de)
DE (1) DE602006011724D1 (de)
TW (1) TWI406364B (de)
WO (1) WO2006107802A1 (de)

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CN109689775B (zh) * 2016-12-09 2021-07-13 株式会社Lg化学 封装组合物
TWI705983B (zh) * 2016-12-09 2020-10-01 南韓商Ｌｇ化學股份有限公司 封裝組成物
JP7144864B2 (ja) 2017-04-21 2022-09-30 カティーバ， インコーポレイテッド 有機薄膜を形成するための組成物および技術
CN109305896B (zh) * 2017-07-26 2022-07-19 郑州大学 一种低极性树脂及其制备方法和应用
JP7191219B2 (ja) * 2018-11-12 2022-12-16 エルジー・ケム・リミテッド 密封材組成物
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Also Published As

Publication number Publication date
KR101332702B1 (ko) 2013-11-25
JP5575393B2 (ja) 2014-08-20
TW200703597A (en) 2007-01-16
CN101151726A (zh) 2008-03-26
EP1866960B1 (de) 2010-01-13
US20060223937A1 (en) 2006-10-05
CN101151726B (zh) 2010-06-23
TWI406364B (zh) 2013-08-21
ATE455371T1 (de) 2010-01-15
EP1866960A1 (de) 2007-12-19
JP2008536968A (ja) 2008-09-11
US20070117917A1 (en) 2007-05-24
WO2006107802A1 (en) 2006-10-12
KR20070118139A (ko) 2007-12-13

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