DE602007000325D1 - Flachbildschirmvorrichtung und Herstellungsverfahren dafür - Google Patents

Flachbildschirmvorrichtung und Herstellungsverfahren dafür

Info

Publication number
DE602007000325D1
DE602007000325D1 DE602007000325T DE602007000325T DE602007000325D1 DE 602007000325 D1 DE602007000325 D1 DE 602007000325D1 DE 602007000325 T DE602007000325 T DE 602007000325T DE 602007000325 T DE602007000325 T DE 602007000325T DE 602007000325 D1 DE602007000325 D1 DE 602007000325D1
Authority
DE
Germany
Prior art keywords
manufacturing
flat panel
method therefor
panel device
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007000325T
Other languages
English (en)
Inventor
Won Kyu Kwak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Display Co Ltd
Original Assignee
Samsung SDI Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung SDI Co Ltd filed Critical Samsung SDI Co Ltd
Publication of DE602007000325D1 publication Critical patent/DE602007000325D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/17—Passive-matrix OLED displays
    • H10K59/179—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
DE602007000325T 2006-01-27 2007-01-26 Flachbildschirmvorrichtung und Herstellungsverfahren dafür Active DE602007000325D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060008809A KR100759667B1 (ko) 2006-01-27 2006-01-27 평판 표시장치 및 그의 제조방법

Publications (1)

Publication Number Publication Date
DE602007000325D1 true DE602007000325D1 (de) 2009-01-22

Family

ID=38037464

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007000325T Active DE602007000325D1 (de) 2006-01-27 2007-01-26 Flachbildschirmvorrichtung und Herstellungsverfahren dafür

Country Status (8)

Country Link
US (1) US7586259B2 (de)
EP (1) EP1814159B1 (de)
JP (1) JP4405990B2 (de)
KR (1) KR100759667B1 (de)
CN (1) CN100524804C (de)
DE (1) DE602007000325D1 (de)
ES (1) ES2319338T3 (de)
TW (1) TWI357283B (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100688792B1 (ko) 2006-01-27 2007-03-02 삼성에스디아이 주식회사 평판 표시장치 및 그의 제조방법
KR100759666B1 (ko) * 2006-01-27 2007-09-17 삼성에스디아이 주식회사 평판 표시장치 및 그의 제조방법
US7922553B2 (en) * 2006-04-05 2011-04-12 Sharp Kabushiki Kaisha Organic electroluminescent display device and production method thereof
EP2213141B1 (de) * 2007-10-05 2017-12-06 Corning Incorporated Verfahren und vorrichtung zum abdichten einer glaskapselung
US20100095705A1 (en) 2008-10-20 2010-04-22 Burkhalter Robert S Method for forming a dry glass-based frit
KR100959106B1 (ko) * 2008-11-05 2010-05-25 삼성모바일디스플레이주식회사 유기 발광 표시 장치
BR112012017702A2 (pt) * 2010-01-19 2016-04-19 Guardian Industries painel refletor secundário (srp) aperfeiçoado com revestimento tratável por calor para aplicações de energia solar concentrada, e/ou métodods para fabricar o mesmo.
CN103270618B (zh) * 2010-08-13 2016-08-10 德莎欧洲公司 封装电子装置的方法
CN102237496A (zh) * 2011-06-30 2011-11-09 彩虹（佛山）平板显示有限公司 一种有机电致发光二极管显示器件的封装方法
KR20140000064A (ko) * 2012-06-22 2014-01-02 삼성디스플레이 주식회사 광학 시트의 제조 방법 및 광학 시트를 구비하는 유기 발광 표시 장치의 제조 방법
JP6098984B2 (ja) 2012-08-30 2017-03-22 コーニング インコーポレイテッド アンチモンフリーガラス、アンチモンフリーフリット、およびそのフリットで気密封止されるガラスパッケージ
CN104576744A (zh) * 2013-10-24 2015-04-29 中国科学院苏州纳米技术与纳米仿生研究所 碳纳米管薄膜晶体管、amoled像素柔性驱动电路及制作方法
KR102240894B1 (ko) * 2014-02-26 2021-04-16 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
US9431244B2 (en) * 2014-09-24 2016-08-30 Qualcomm Mems Technologies, Inc. Laser annealing technique for metal oxide TFT
CN104810484B (zh) * 2015-05-07 2017-01-04 合肥鑫晟光电科技有限公司 封装胶、封装方法、显示面板及显示装置
US10522607B2 (en) * 2017-07-11 2019-12-31 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd OLED display panel and OLED display apparatus
CN107316612B (zh) * 2017-07-11 2019-08-30 深圳市华星光电半导体显示技术有限公司 一种oled显示面板及oled显示器
CN109390352A (zh) * 2017-08-09 2019-02-26 昆山国显光电有限公司 阵列基板及其制造方法、显示面板及其制造方法
CN109860207B (zh) * 2019-02-27 2022-07-19 合肥鑫晟光电科技有限公司 一种阵列基板、其制作方法、显示面板及显示装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5953094A (en) * 1997-04-04 1999-09-14 Sanyo Electric Co., Ltd. Liquid crystal display device
JP3907804B2 (ja) * 1997-10-06 2007-04-18 株式会社半導体エネルギー研究所 液晶表示装置
US6113450A (en) * 1998-05-14 2000-09-05 Candescent Technologies Corporation Seal material frit frame for flat panel displays
EP1164619A1 (de) * 1999-02-12 2001-12-19 Toppan Printing Co., Ltd. Plasmabildanzeige, verfahren und vorrichtung zur herstellung derselben
US6555025B1 (en) * 2000-01-31 2003-04-29 Candescent Technologies Corporation Tuned sealing material for sealing of a flat panel display
US6747724B2 (en) 2000-07-26 2004-06-08 Casio Computer Co., Ltd. Liquid crystal display device having non-display area with reduced width
JP2005510831A (ja) * 2001-05-24 2005-04-21 オリオン エレクトリック カンパニー，リミテッド 有機発光ダイオードのエンカプセレーションのための容器及びその製造方法
KR20030080895A (ko) * 2002-04-11 2003-10-17 엘지전자 주식회사 유기 ｅｌ 소자의 실링 방법
JP4299021B2 (ja) * 2003-02-19 2009-07-22 ヤマト電子株式会社 封着加工材及び封着加工用ペースト
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US7538488B2 (en) * 2004-02-14 2009-05-26 Samsung Mobile Display Co., Ltd. Flat panel display
JP2005242099A (ja) * 2004-02-27 2005-09-08 Nec Lcd Technologies Ltd 液晶表示装置
US20050248270A1 (en) * 2004-05-05 2005-11-10 Eastman Kodak Company Encapsulating OLED devices

Also Published As

Publication number Publication date
EP1814159A2 (de) 2007-08-01
US7586259B2 (en) 2009-09-08
EP1814159B1 (de) 2008-12-10
CN100524804C (zh) 2009-08-05
US20070176551A1 (en) 2007-08-02
TW200731853A (en) 2007-08-16
KR100759667B1 (ko) 2007-09-17
CN101009314A (zh) 2007-08-01
JP4405990B2 (ja) 2010-01-27
KR20070078504A (ko) 2007-08-01
JP2007200851A (ja) 2007-08-09
TWI357283B (en) 2012-01-21
ES2319338T3 (es) 2009-05-06
EP1814159A3 (de) 2007-10-24

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: SAMSUNG MOBILE DISPLAY CO. LTD., SUWON, GYEONG, KR

8364 No opposition during term of opposition