DE60225956D1 - Schleifmittelzusammensetzung und Polierverfahren unter Verwendung derselben - Google Patents

Schleifmittelzusammensetzung und Polierverfahren unter Verwendung derselben

Info

Publication number
DE60225956D1
DE60225956D1 DE60225956T DE60225956T DE60225956D1 DE 60225956 D1 DE60225956 D1 DE 60225956D1 DE 60225956 T DE60225956 T DE 60225956T DE 60225956 T DE60225956 T DE 60225956T DE 60225956 D1 DE60225956 D1 DE 60225956D1
Authority
DE
Germany
Prior art keywords
same
polishing method
abrasive composition
abrasive
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60225956T
Other languages
English (en)
Other versions
DE60225956T2 (de
Inventor
Akihiro Kawase
Masao Okamura
Yutaka Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujimi Inc
Original Assignee
Fujimi Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=18891966&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60225956(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fujimi Inc filed Critical Fujimi Inc
Publication of DE60225956D1 publication Critical patent/DE60225956D1/de
Application granted granted Critical
Publication of DE60225956T2 publication Critical patent/DE60225956T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
DE60225956T 2001-02-02 2002-01-30 Polierzusammensetzung und Polierverfahren unter ihrer Verwendung Expired - Lifetime DE60225956T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001027276 2001-02-02
JP2001027276A JP3440419B2 (ja) 2001-02-02 2001-02-02 研磨用組成物およびそれを用いた研磨方法

Publications (2)

Publication Number Publication Date
DE60225956D1 true DE60225956D1 (de) 2008-05-21
DE60225956T2 DE60225956T2 (de) 2009-05-20

Family

ID=18891966

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60225956T Expired - Lifetime DE60225956T2 (de) 2001-02-02 2002-01-30 Polierzusammensetzung und Polierverfahren unter ihrer Verwendung

Country Status (8)

Country Link
US (1) US6852009B2 (de)
EP (1) EP1229094B1 (de)
JP (1) JP3440419B2 (de)
CN (1) CN1266243C (de)
DE (1) DE60225956T2 (de)
MY (1) MY129070A (de)
SG (1) SG114523A1 (de)
TW (1) TWI245335B (de)

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JPWO2006126432A1 (ja) * 2005-05-27 2008-12-25 日産化学工業株式会社 シリコンウェハー用研磨組成物
KR100641348B1 (ko) * 2005-06-03 2006-11-03 주식회사 케이씨텍 Ｃｍｐ용 슬러리와 이의 제조 방법 및 기판의 연마 방법
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JP2007214205A (ja) * 2006-02-07 2007-08-23 Fujimi Inc 研磨用組成物
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JP4582797B2 (ja) * 2006-02-09 2010-11-17 ニチコン株式会社 電解コンデンサの駆動用電解液及びこれを用いた電解コンデンサ
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KR20090045223A (ko) 2006-07-05 2009-05-07 듀퐁 에어 프로덕츠 나노머티어리얼즈 엘엘씨 실리콘 웨이퍼용 연마 조성물 및 실리콘 웨이퍼의 연마 방법
JP5335183B2 (ja) * 2006-08-24 2013-11-06 株式会社フジミインコーポレーテッド 研磨用組成物及び研磨方法
JP5204960B2 (ja) * 2006-08-24 2013-06-05 株式会社フジミインコーポレーテッド 研磨用組成物及び研磨方法
KR100839355B1 (ko) * 2006-11-28 2008-06-19 삼성전자주식회사 기판의 재생 방법
JP5148948B2 (ja) * 2007-08-23 2013-02-20 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 研磨用スラリーのリサイクル方法
US8017524B2 (en) * 2008-05-23 2011-09-13 Cabot Microelectronics Corporation Stable, high rate silicon slurry
JP5474400B2 (ja) * 2008-07-03 2014-04-16 株式会社フジミインコーポレーテッド 半導体用濡れ剤、それを用いた研磨用組成物および研磨方法
WO2010052983A1 (ja) * 2008-11-10 2010-05-14 旭硝子株式会社 研磨用組成物および半導体集積回路装置の製造方法
JP5492603B2 (ja) * 2010-03-02 2014-05-14 株式会社フジミインコーポレーテッド 研磨用組成物及びそれを用いた研磨方法
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JP5551042B2 (ja) * 2010-09-30 2014-07-16 株式会社クラレ 化学的機械的研磨法およびそれに用いられるスラリー
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PL2812091T3 (pl) 2012-09-17 2021-07-19 W.R. Grace & Co. - Conn. Podłoża chromatograficzne i urządzenia
US11229896B2 (en) 2014-01-16 2022-01-25 W.R. Grace & Co.—Conn. Affinity chromatography media and chromatography devices
PL3137209T3 (pl) 2014-05-02 2023-01-02 W.R. Grace & Co. - Conn. Funkcjonalizowany materiał nośnikowy i sposoby wytwarzania oraz stosowania funkcjonalizowanego materiału nośnikowego
WO2016132676A1 (ja) * 2015-02-19 2016-08-25 株式会社フジミインコーポレーテッド シリコンウェーハ研磨用組成物および研磨方法
BR112017026193B1 (pt) 2015-06-05 2021-09-14 W.R. Grace & Co-Conn Adsorventes, método de produção dos adsorventes e uso dos adsorventes
US10683439B2 (en) 2018-03-15 2020-06-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing composition and method of polishing a substrate having enhanced defect inhibition
EP3894496A1 (de) 2018-12-12 2021-10-20 Basf Se Chemisch-mechanisches polieren von kupfer- und rutheniumhaltigen substraten
JP2022512429A (ja) 2018-12-12 2022-02-03 ビーエーエスエフ ソシエタス・ヨーロピア 銅及びルテニウムを含有する基板の化学機械研磨
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WO2023032714A1 (ja) * 2021-09-01 2023-03-09 株式会社フジミインコーポレーテッド 研磨用組成物

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Also Published As

Publication number Publication date
US6852009B2 (en) 2005-02-08
CN1369534A (zh) 2002-09-18
MY129070A (en) 2007-03-30
TWI245335B (en) 2005-12-11
JP2002226836A (ja) 2002-08-14
CN1266243C (zh) 2006-07-26
US20020151252A1 (en) 2002-10-17
SG114523A1 (en) 2005-09-28
EP1229094A3 (de) 2003-10-22
JP3440419B2 (ja) 2003-08-25
EP1229094B1 (de) 2008-04-09
EP1229094A2 (de) 2002-08-07
DE60225956T2 (de) 2009-05-20

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