DE60310739D1 - Anisotrope leitfähige folie und impedanzmesssonde - Google Patents

Anisotrope leitfähige folie und impedanzmesssonde

Info

Publication number
DE60310739D1
DE60310739D1 DE60310739T DE60310739T DE60310739D1 DE 60310739 D1 DE60310739 D1 DE 60310739D1 DE 60310739 T DE60310739 T DE 60310739T DE 60310739 T DE60310739 T DE 60310739T DE 60310739 D1 DE60310739 D1 DE 60310739D1
Authority
DE
Germany
Prior art keywords
frequency region
sheet
ghz
measuring probe
impedance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60310739T
Other languages
English (en)
Other versions
DE60310739T2 (de
Inventor
Daisuke Yamada
Kiyoshi Kimura
Naoshi Yasuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Application granted granted Critical
Publication of DE60310739D1 publication Critical patent/DE60310739D1/de
Publication of DE60310739T2 publication Critical patent/DE60310739T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06772High frequency probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
    • H01R11/18End pieces terminating in a probe
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00Connectors or connections adapted for particular applications
    • H01R2201/20Connectors or connections adapted for particular applications for testing or measuring purposes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
DE60310739T 2002-08-27 2003-08-26 Anisotrope leitfähige folie und impedanzmesssonde Expired - Lifetime DE60310739T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002247757 2002-08-27
JP2002247757 2002-08-27
PCT/JP2003/010748 WO2004021018A1 (ja) 2002-08-27 2003-08-26 異方導電性シートおよびインピーダンス測定用プローブ

Publications (2)

Publication Number Publication Date
DE60310739D1 true DE60310739D1 (de) 2007-02-08
DE60310739T2 DE60310739T2 (de) 2007-10-11

Family

ID=31972483

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60310739T Expired - Lifetime DE60310739T2 (de) 2002-08-27 2003-08-26 Anisotrope leitfähige folie und impedanzmesssonde

Country Status (9)

Country Link
US (1) US7071722B2 (de)
EP (1) EP1544625B1 (de)
KR (1) KR100892196B1 (de)
CN (1) CN1685240A (de)
AT (1) ATE349705T1 (de)
AU (1) AU2003257535A1 (de)
DE (1) DE60310739T2 (de)
TW (1) TWI248517B (de)
WO (1) WO2004021018A1 (de)

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KR100671312B1 (ko) * 1999-08-25 2007-01-19 히다치 가세고교 가부시끼가이샤 배선단자 접속용 필름
DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
TWI237120B (en) * 2002-10-09 2005-08-01 Advanced Semiconductor Eng Impedance standard substrate and method for calibrating vector network analyzer
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
WO2005048407A1 (ja) * 2003-11-17 2005-05-26 Jsr Corporation 異方導電性シートおよびその製造方法並びにその応用製品
CN1894589A (zh) * 2003-12-18 2007-01-10 Jsr株式会社 各向异性导电性连接器和电路装置的检查方法
GB2425844B (en) 2003-12-24 2007-07-11 Cascade Microtech Inc Active wafer probe
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
US7595790B2 (en) * 2005-01-31 2009-09-29 Panasonic Corporation Pressure sensitive conductive sheet, method of manufacturing the same, and touch panel using the same
US7323887B2 (en) * 2005-04-01 2008-01-29 Rosemount Analytical Inc. Conductivity sensor and manufacturing method therefor
US7449899B2 (en) * 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
US7235978B2 (en) * 2005-09-07 2007-06-26 Matsushita Electric Industrial Co., Ltd. Device for measuring impedance of electronic component
WO2007146285A2 (en) * 2006-06-09 2007-12-21 Cascade Microtech, Inc. Differential signal probe with integral balun
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
WO2008150398A1 (en) * 2007-05-29 2008-12-11 Rosemount Analytical, Inc. Multilayer conductivity sensor4
US7785494B2 (en) * 2007-08-03 2010-08-31 Teamchem Company Anisotropic conductive material
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7816932B2 (en) * 2008-02-21 2010-10-19 Teradyne, Inc. Test system with high frequency interposer
US9176206B2 (en) * 2008-03-07 2015-11-03 California Institute Of Technology Effective-inductance-change based magnetic particle sensing
CN101576571B (zh) * 2008-05-06 2013-04-10 深圳麦逊电子有限公司 Pcb测试机用密度转换装置
JP5236354B2 (ja) * 2008-05-20 2013-07-17 モレックス インコーポレイテド 電気コネクタ
US9599591B2 (en) 2009-03-06 2017-03-21 California Institute Of Technology Low cost, portable sensor for molecular assays
US20100252783A1 (en) * 2009-04-07 2010-10-07 Syh-Tau Yeh Ambient-curable anisotropic conductive adhesive
US8822843B2 (en) * 2011-03-07 2014-09-02 Nokia Corporation Apparatus and associated methods
CN103969294B (zh) * 2013-01-25 2016-06-01 泰科电子(上海)有限公司 硅油检测器、电力终端组件和硅油检测器的使用方法
JP6782884B2 (ja) * 2015-02-26 2020-11-11 積水ポリマテック株式会社 弾性コネクタ
KR102390960B1 (ko) * 2015-06-05 2022-04-27 삼성디스플레이 주식회사 표시 장치
DE102017100986A1 (de) * 2017-01-19 2018-07-19 Yazaki Systems Technologies Gmbh Anordnung und Verfahren zur Herstellung solch einer Anordnung
KR102647120B1 (ko) * 2018-06-25 2024-03-14 세키스이가가쿠 고교가부시키가이샤 도전성 입자, 도전 재료 및 접속 구조체
KR102093860B1 (ko) * 2018-10-18 2020-03-26 주식회사 아이에스시 검사용 커넥터 및 검사용 커넥터의 제조방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3033118B2 (ja) 1990-03-30 2000-04-17 ジェイエスアール株式会社 電気抵抗率の測定方法と4端子プローブ
JPH08110366A (ja) 1994-10-11 1996-04-30 Murata Mfg Co Ltd 表面実装型電子部品の測定治具
DE19943637A1 (de) * 1999-08-16 2001-02-22 Bayer Ag Antistatikum
JP2001067942A (ja) * 1999-08-31 2001-03-16 Jsr Corp 異方導電性シート
JP2001091578A (ja) 1999-09-22 2001-04-06 Jsr Corp 検査装置
JP4461614B2 (ja) 1999-12-14 2010-05-12 Jsr株式会社 回路基板の電気抵抗測定装置および測定方法
JP2001296314A (ja) 2000-04-14 2001-10-26 Nidec-Read Corp 同軸型コンタクトプローブ
JP3675301B2 (ja) 2000-05-17 2005-07-27 Jsr株式会社 異方導電性シート
DE60107519T2 (de) * 2000-09-25 2005-12-15 Jsr Corp. Anisotropisches leitfähiges Verbindungsblatt, Herstellungsverfahren dafür und Produkt davon
US6663799B2 (en) * 2000-09-28 2003-12-16 Jsr Corporation Conductive metal particles, conductive composite metal particles and applied products using the same
JP4470316B2 (ja) * 2000-11-08 2010-06-02 Jsr株式会社 異方導電性シートおよび回路装置の電気的検査装置
US6798212B2 (en) * 2002-05-23 2004-09-28 Texas Instruments Incorporated Time domain reflectometer probe having a built-in reference ground point

Also Published As

Publication number Publication date
EP1544625A4 (de) 2005-10-12
EP1544625A1 (de) 2005-06-22
ATE349705T1 (de) 2007-01-15
DE60310739T2 (de) 2007-10-11
TW200405014A (en) 2004-04-01
TWI248517B (en) 2006-02-01
US7071722B2 (en) 2006-07-04
KR20050059084A (ko) 2005-06-17
AU2003257535A1 (en) 2004-03-19
WO2004021018A1 (ja) 2004-03-11
EP1544625B1 (de) 2006-12-27
KR100892196B1 (ko) 2009-04-07
US20060006884A1 (en) 2006-01-12
CN1685240A (zh) 2005-10-19

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