DE60310759D1 - Pulver auf silber-basis, verfahren zu dessen herstellung, und härtbare siloxanzusammensetzung - Google Patents
Pulver auf silber-basis, verfahren zu dessen herstellung, und härtbare siloxanzusammensetzungInfo
- Publication number
- DE60310759D1 DE60310759D1 DE60310759T DE60310759T DE60310759D1 DE 60310759 D1 DE60310759 D1 DE 60310759D1 DE 60310759 T DE60310759 T DE 60310759T DE 60310759 T DE60310759 T DE 60310759T DE 60310759 D1 DE60310759 D1 DE 60310759D1
- Authority
- DE
- Germany
- Prior art keywords
- silver
- based powder
- production
- siloxane composition
- oxidation inhibitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000843 powder Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 4
- 229910052709 silver Inorganic materials 0.000 abstract 4
- 239000004332 silver Substances 0.000 abstract 4
- 239000003112 inhibitor Substances 0.000 abstract 3
- 230000003647 oxidation Effects 0.000 abstract 3
- 238000007254 oxidation reaction Methods 0.000 abstract 3
- 238000010303 mechanochemical reaction Methods 0.000 abstract 2
- 239000000314 lubricant Substances 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/16—Metallic particles coated with a non-metal
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002347138A JP4568472B2 (ja) | 2002-11-29 | 2002-11-29 | 銀粉末の製造方法および硬化性シリコーン組成物 |
JP2002347138 | 2002-11-29 | ||
PCT/JP2003/014608 WO2004050753A1 (en) | 2002-11-29 | 2003-11-17 | Silver-based powder, method of preparation thereof, and curable silicone composition |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60310759D1 true DE60310759D1 (de) | 2007-02-08 |
DE60310759T2 DE60310759T2 (de) | 2007-10-31 |
Family
ID=32462871
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60310759T Expired - Lifetime DE60310759T2 (de) | 2002-11-29 | 2003-11-17 | Pulver auf silber-basis, verfahren zu dessen herstellung, und härtbare siloxanzusammensetzung |
Country Status (11)
Country | Link |
---|---|
US (2) | US7700678B2 (de) |
EP (1) | EP1565516B1 (de) |
JP (1) | JP4568472B2 (de) |
KR (1) | KR101049693B1 (de) |
CN (1) | CN1311014C (de) |
AT (1) | ATE349487T1 (de) |
AU (1) | AU2003279576A1 (de) |
DE (1) | DE60310759T2 (de) |
MY (1) | MY139223A (de) |
TW (1) | TWI293040B (de) |
WO (1) | WO2004050753A1 (de) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7393547B2 (en) | 2001-04-11 | 2008-07-01 | Helix Medical, Llc | Antimicrobial elastomer composition and method for making |
US8317861B2 (en) * | 2001-04-11 | 2012-11-27 | Helix Medical, Llc | Antimicrobial indwelling voice prosthesis |
US7520897B2 (en) * | 2001-04-11 | 2009-04-21 | Helix Medical, Llc | Medical devices having antimicrobial properties |
JP4568472B2 (ja) * | 2002-11-29 | 2010-10-27 | 東レ・ダウコーニング株式会社 | 銀粉末の製造方法および硬化性シリコーン組成物 |
JP4320447B2 (ja) * | 2004-02-03 | 2009-08-26 | Dowaエレクトロニクス株式会社 | 銀粉およびその製造方法 |
JP2006302525A (ja) * | 2005-04-15 | 2006-11-02 | Kyoto Elex Kk | 導電性ペースト組成物 |
JP5442941B2 (ja) * | 2007-07-12 | 2014-03-19 | 株式会社カネカ | 硬化性組成物 |
JP2010103244A (ja) * | 2008-10-22 | 2010-05-06 | Sony Corp | 半導体装置及びその製造方法 |
JP5278709B2 (ja) * | 2009-12-04 | 2013-09-04 | 株式会社村田製作所 | 導電性樹脂組成物およびチップ型電子部品 |
CN102179510B (zh) * | 2011-04-13 | 2013-05-08 | 成都印钞有限公司 | 一种抗氧化的片状银粉及其制备方法 |
JP5321723B1 (ja) * | 2012-10-29 | 2013-10-23 | 横浜ゴム株式会社 | 導電性組成物および太陽電池セル |
US9441086B2 (en) * | 2012-12-20 | 2016-09-13 | Dow Corning Corporation | Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same |
KR101623252B1 (ko) * | 2013-05-10 | 2016-05-20 | 주식회사 엘지화학 | 구리 함유 입자 및 이의 제조방법 |
WO2016084235A1 (ja) * | 2014-11-28 | 2016-06-02 | 株式会社ハーモニック・ドライブ・システムズ | 波動歯車装置の潤滑方法 |
JP6733241B2 (ja) * | 2016-03-18 | 2020-07-29 | 信越化学工業株式会社 | 付加硬化性シリコーンゴム組成物、その製造方法及び硬化物 |
US11319412B2 (en) | 2016-10-31 | 2022-05-03 | Dow Toray Co., Ltd. | Thermally conductive silicone compound |
KR102033545B1 (ko) * | 2017-06-05 | 2019-10-17 | 대주전자재료 주식회사 | 은 입자 및 이의 제조방법 |
KR101869401B1 (ko) * | 2018-01-04 | 2018-07-20 | 홍성신 | 초정밀 선반의 공작물 자동 교환장치 |
KR101872459B1 (ko) * | 2018-01-04 | 2018-06-28 | 홍성신 | 자동선반의 보정장치를 포함하는 절삭용 또는 연삭용 가공기계 |
JP7277435B2 (ja) * | 2018-10-17 | 2023-05-19 | Nok株式会社 | 生体電極及び生体電極の製造方法 |
JP7355708B2 (ja) | 2020-05-25 | 2023-10-03 | 信越化学工業株式会社 | 熱伝導性付加硬化型シリコーン組成物 |
Family Cites Families (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3382087A (en) * | 1964-08-20 | 1968-05-07 | Pittsburgh Plate Glass Co | Silver and copper coated articles protected by treatment with aminoazole compounds |
US3532528A (en) * | 1969-07-16 | 1970-10-06 | Claremont Poly Chem Corp | Coated metal flakes and method of preparing the same |
DE2116389C3 (de) * | 1971-03-30 | 1980-04-03 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Lösung zur Aktivierung von Oberflächen für die Metallisierung |
JPS58103565A (ja) * | 1981-12-14 | 1983-06-20 | Matsushita Electric Ind Co Ltd | 導電性ペイント |
JPS58103566A (ja) | 1981-12-14 | 1983-06-20 | Matsushita Electric Ind Co Ltd | 導電性ペイント |
JPS58104970A (ja) * | 1981-12-16 | 1983-06-22 | Matsushita Electric Ind Co Ltd | 導電性ペイント |
JPS6099182A (ja) | 1983-11-04 | 1985-06-03 | Atsugi Chuo Kenkyusho Kk | シアノアクリレート混合用金属粉 |
US4717913A (en) | 1985-08-29 | 1988-01-05 | Johnson Service Company | Data telemetry system using diffused infrared light |
JPS6253033A (ja) | 1985-09-02 | 1987-03-07 | Nippon Telegr & Teleph Corp <Ntt> | 光フアイバ双方向伝送方式 |
JPH0666735B2 (ja) | 1985-09-02 | 1994-08-24 | オムロン株式会社 | 光フアイバ通信システム |
US5227093A (en) * | 1991-11-29 | 1993-07-13 | Dow Corning Corporation | Curable organosiloxane compositions yielding electrically conductive materials |
JPH05271548A (ja) * | 1992-03-27 | 1993-10-19 | Shin Etsu Chem Co Ltd | オルガノポリシロキサン組成物及びその硬化物の形成方法 |
JP2713093B2 (ja) * | 1993-04-13 | 1998-02-16 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物 |
JP3130193B2 (ja) | 1993-10-06 | 2001-01-31 | 東レ・ダウコーニング・シリコーン株式会社 | シリコーンゴム用銀粉末、その製造方法、およびシリコーンゴム組成物 |
JP2868986B2 (ja) * | 1993-10-06 | 1999-03-10 | 東レ・ダウコーニング・シリコーン株式会社 | 導電性シリコーンゴム組成物 |
EP0647682B1 (de) | 1993-10-06 | 1997-12-03 | Dow Corning Toray Silicone Company, Limited | Mit Silber gefüllte, elektrisch leitfähige Organosiloxan-Zusammensetzungen |
JP2819444B2 (ja) * | 1993-11-08 | 1998-10-30 | 東レ・ダウコーニング・シリコーン株式会社 | 導電性シリコーンゴム組成物 |
JP3275630B2 (ja) | 1995-05-08 | 2002-04-15 | 信越化学工業株式会社 | 導電性充填材及び導電性シリコーン組成物 |
JP3574227B2 (ja) * | 1995-06-21 | 2004-10-06 | 東レ・ダウコーニング・シリコーン株式会社 | シリコーンゴム組成物 |
JP3592809B2 (ja) * | 1995-09-13 | 2004-11-24 | 東レ・ダウコーニング・シリコーン株式会社 | フッ素樹脂被覆定着ロール用シリコーンゴム組成物およびフッ素樹脂被覆定着ロール |
JP3153454B2 (ja) * | 1995-11-10 | 2001-04-09 | 東レ・ダウコーニング・シリコーン株式会社 | 定着ロールおよびそのためのシリコーンゲル組成物 |
US6010646A (en) * | 1997-04-11 | 2000-01-04 | Potters Industries, Inc. | Electroconductive composition and methods for producing such composition |
JPH11111051A (ja) * | 1997-09-30 | 1999-04-23 | Sumitomo Rubber Ind Ltd | 印刷用の導電性ペーストおよびそれを用いたプリント基板 |
JP3482115B2 (ja) * | 1997-10-13 | 2003-12-22 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性シリコーン組成物および電子部品 |
US6140446A (en) * | 1997-11-18 | 2000-10-31 | Shin-Etsu Chemical Co., Ltd. | Hydrosilylation catalysts and silicone compositions using the same |
US6017587A (en) * | 1998-07-09 | 2000-01-25 | Dow Corning Corporation | Electrically conductive silicone compositions |
US6605238B2 (en) * | 1999-09-17 | 2003-08-12 | Honeywell International Inc. | Compliant and crosslinkable thermal interface materials |
JP3922332B2 (ja) * | 2000-01-17 | 2007-05-30 | 信越化学工業株式会社 | 導電性液状シリコーンゴム組成物 |
US6433057B1 (en) * | 2000-03-28 | 2002-08-13 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
US6361716B1 (en) * | 2000-07-20 | 2002-03-26 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
US6534581B1 (en) * | 2000-07-20 | 2003-03-18 | Dow Corning Corporation | Silicone composition and electrically conductive silicone adhesive formed therefrom |
US6465550B1 (en) * | 2000-08-08 | 2002-10-15 | Dow Corning Corporation | Silicone composition and electrically conductive, cured silicone product |
JP3705344B2 (ja) * | 2000-08-17 | 2005-10-12 | 信越化学工業株式会社 | 導電性シリコーンゴム組成物 |
JP4150877B2 (ja) * | 2001-09-06 | 2008-09-17 | 信越化学工業株式会社 | 導電性樹脂組成物及びこれを用いた電子部品 |
JP4568472B2 (ja) * | 2002-11-29 | 2010-10-27 | 東レ・ダウコーニング株式会社 | 銀粉末の製造方法および硬化性シリコーン組成物 |
-
2002
- 2002-11-29 JP JP2002347138A patent/JP4568472B2/ja not_active Expired - Fee Related
-
2003
- 2003-11-17 US US10/536,669 patent/US7700678B2/en not_active Expired - Fee Related
- 2003-11-17 DE DE60310759T patent/DE60310759T2/de not_active Expired - Lifetime
- 2003-11-17 KR KR1020057009658A patent/KR101049693B1/ko not_active IP Right Cessation
- 2003-11-17 WO PCT/JP2003/014608 patent/WO2004050753A1/en active IP Right Grant
- 2003-11-17 CN CNB2003801044011A patent/CN1311014C/zh not_active Expired - Fee Related
- 2003-11-17 EP EP03772840A patent/EP1565516B1/de not_active Expired - Lifetime
- 2003-11-17 AT AT03772840T patent/ATE349487T1/de not_active IP Right Cessation
- 2003-11-17 AU AU2003279576A patent/AU2003279576A1/en not_active Abandoned
- 2003-11-18 TW TW092132306A patent/TWI293040B/zh not_active IP Right Cessation
- 2003-11-28 MY MYPI20034553A patent/MY139223A/en unknown
-
2010
- 2010-02-26 US US12/714,174 patent/US20100155653A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20060047043A1 (en) | 2006-03-02 |
EP1565516B1 (de) | 2006-12-27 |
US20100155653A1 (en) | 2010-06-24 |
CN1311014C (zh) | 2007-04-18 |
JP2004176165A (ja) | 2004-06-24 |
WO2004050753A1 (en) | 2004-06-17 |
DE60310759T2 (de) | 2007-10-31 |
JP4568472B2 (ja) | 2010-10-27 |
TWI293040B (en) | 2008-02-01 |
CN1717440A (zh) | 2006-01-04 |
AU2003279576A1 (en) | 2004-06-23 |
US7700678B2 (en) | 2010-04-20 |
KR101049693B1 (ko) | 2011-07-19 |
MY139223A (en) | 2009-08-28 |
KR20050085200A (ko) | 2005-08-29 |
TW200417434A (en) | 2004-09-16 |
EP1565516A1 (de) | 2005-08-24 |
ATE349487T1 (de) | 2007-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8381 | Inventor (new situation) |
Inventor name: INVENTOR NAME WILL BE MENTIONED LATER |
|
8364 | No opposition during term of opposition |