DE60310759D1 - Pulver auf silber-basis, verfahren zu dessen herstellung, und härtbare siloxanzusammensetzung - Google Patents

Pulver auf silber-basis, verfahren zu dessen herstellung, und härtbare siloxanzusammensetzung

Info

Publication number
DE60310759D1
DE60310759D1 DE60310759T DE60310759T DE60310759D1 DE 60310759 D1 DE60310759 D1 DE 60310759D1 DE 60310759 T DE60310759 T DE 60310759T DE 60310759 T DE60310759 T DE 60310759T DE 60310759 D1 DE60310759 D1 DE 60310759D1
Authority
DE
Germany
Prior art keywords
silver
based powder
production
siloxane composition
oxidation inhibitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60310759T
Other languages
English (en)
Other versions
DE60310759T2 (de
Inventor
Kazumi Nakayoshi
Hiroki Ishikawa
Ryoto Shima
Katsutoshi Mine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd filed Critical Dow Corning Toray Co Ltd
Application granted granted Critical
Publication of DE60310759D1 publication Critical patent/DE60310759D1/de
Publication of DE60310759T2 publication Critical patent/DE60310759T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
DE60310759T 2002-11-29 2003-11-17 Pulver auf silber-basis, verfahren zu dessen herstellung, und härtbare siloxanzusammensetzung Expired - Lifetime DE60310759T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002347138 2002-11-29
JP2002347138A JP4568472B2 (ja) 2002-11-29 2002-11-29 銀粉末の製造方法および硬化性シリコーン組成物
PCT/JP2003/014608 WO2004050753A1 (en) 2002-11-29 2003-11-17 Silver-based powder, method of preparation thereof, and curable silicone composition

Publications (2)

Publication Number Publication Date
DE60310759D1 true DE60310759D1 (de) 2007-02-08
DE60310759T2 DE60310759T2 (de) 2007-10-31

Family

ID=32462871

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60310759T Expired - Lifetime DE60310759T2 (de) 2002-11-29 2003-11-17 Pulver auf silber-basis, verfahren zu dessen herstellung, und härtbare siloxanzusammensetzung

Country Status (11)

Country Link
US (2) US7700678B2 (de)
EP (1) EP1565516B1 (de)
JP (1) JP4568472B2 (de)
KR (1) KR101049693B1 (de)
CN (1) CN1311014C (de)
AT (1) ATE349487T1 (de)
AU (1) AU2003279576A1 (de)
DE (1) DE60310759T2 (de)
MY (1) MY139223A (de)
TW (1) TWI293040B (de)
WO (1) WO2004050753A1 (de)

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US8317861B2 (en) 2001-04-11 2012-11-27 Helix Medical, Llc Antimicrobial indwelling voice prosthesis
US7393547B2 (en) * 2001-04-11 2008-07-01 Helix Medical, Llc Antimicrobial elastomer composition and method for making
US7520897B2 (en) * 2001-04-11 2009-04-21 Helix Medical, Llc Medical devices having antimicrobial properties
JP4568472B2 (ja) * 2002-11-29 2010-10-27 東レ・ダウコーニング株式会社 銀粉末の製造方法および硬化性シリコーン組成物
JP4320447B2 (ja) * 2004-02-03 2009-08-26 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法
JP2006302525A (ja) * 2005-04-15 2006-11-02 Kyoto Elex Kk 導電性ペースト組成物
JP5442941B2 (ja) * 2007-07-12 2014-03-19 株式会社カネカ 硬化性組成物
JP2010103244A (ja) * 2008-10-22 2010-05-06 Sony Corp 半導体装置及びその製造方法
JP5278709B2 (ja) 2009-12-04 2013-09-04 株式会社村田製作所 導電性樹脂組成物およびチップ型電子部品
CN102179510B (zh) * 2011-04-13 2013-05-08 成都印钞有限公司 一种抗氧化的片状银粉及其制备方法
JP5321723B1 (ja) * 2012-10-29 2013-10-23 横浜ゴム株式会社 導電性組成物および太陽電池セル
CN104854176B (zh) * 2012-12-20 2017-06-06 道康宁公司 可固化有机硅组合物、导电有机硅粘合剂、制备及使用它们的方法以及包含它们的电气装置
US9520205B2 (en) 2013-05-10 2016-12-13 Lg Chem, Ltd. Copper containing particle and method for manufacturing same
JP6391187B2 (ja) * 2014-11-28 2018-09-19 株式会社ハーモニック・ドライブ・システムズ 波動歯車装置の潤滑方法
JP6733241B2 (ja) * 2016-03-18 2020-07-29 信越化学工業株式会社 付加硬化性シリコーンゴム組成物、その製造方法及び硬化物
KR102203924B1 (ko) * 2016-10-31 2021-01-18 다우 도레이 캄파니 리미티드 1액 경화형 열 전도성 실리콘 그리스 조성물 및 전자/전장 부품
KR102033545B1 (ko) * 2017-06-05 2019-10-17 대주전자재료 주식회사 은 입자 및 이의 제조방법
KR101869401B1 (ko) * 2018-01-04 2018-07-20 홍성신 초정밀 선반의 공작물 자동 교환장치
KR101872459B1 (ko) * 2018-01-04 2018-06-28 홍성신 자동선반의 보정장치를 포함하는 절삭용 또는 연삭용 가공기계
EP3868289A4 (de) * 2018-10-17 2022-08-17 NOK Corporation Bioelektrode und verfahren zur herstellung von bioelektroden
JP7355708B2 (ja) * 2020-05-25 2023-10-03 信越化学工業株式会社 熱伝導性付加硬化型シリコーン組成物

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US3532528A (en) * 1969-07-16 1970-10-06 Claremont Poly Chem Corp Coated metal flakes and method of preparing the same
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Also Published As

Publication number Publication date
US7700678B2 (en) 2010-04-20
TWI293040B (en) 2008-02-01
TW200417434A (en) 2004-09-16
KR101049693B1 (ko) 2011-07-19
DE60310759T2 (de) 2007-10-31
EP1565516A1 (de) 2005-08-24
US20060047043A1 (en) 2006-03-02
US20100155653A1 (en) 2010-06-24
AU2003279576A1 (en) 2004-06-23
JP4568472B2 (ja) 2010-10-27
KR20050085200A (ko) 2005-08-29
EP1565516B1 (de) 2006-12-27
ATE349487T1 (de) 2007-01-15
MY139223A (en) 2009-08-28
WO2004050753A1 (en) 2004-06-17
JP2004176165A (ja) 2004-06-24
CN1717440A (zh) 2006-01-04
CN1311014C (zh) 2007-04-18

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8381 Inventor (new situation)

Inventor name: INVENTOR NAME WILL BE MENTIONED LATER

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