DE60314841D1 - Prozesssteuerung beim elektrochemischen mechanischen polieren - Google Patents
Prozesssteuerung beim elektrochemischen mechanischen polierenInfo
- Publication number
- DE60314841D1 DE60314841D1 DE60314841T DE60314841T DE60314841D1 DE 60314841 D1 DE60314841 D1 DE 60314841D1 DE 60314841 T DE60314841 T DE 60314841T DE 60314841 T DE60314841 T DE 60314841T DE 60314841 D1 DE60314841 D1 DE 60314841D1
- Authority
- DE
- Germany
- Prior art keywords
- processing
- electrochemically
- exposed layer
- process control
- mechanical polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
- B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
- B23H5/08—Electrolytic grinding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/056,316 US6837983B2 (en) | 2002-01-22 | 2002-01-22 | Endpoint detection for electro chemical mechanical polishing and electropolishing processes |
| US56316 | 2002-01-22 | ||
| PCT/US2003/001760 WO2003061905A1 (en) | 2002-01-22 | 2003-01-21 | Process control in electro-chemical mechanical polishing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60314841D1 true DE60314841D1 (de) | 2007-08-23 |
| DE60314841T2 DE60314841T2 (de) | 2008-03-13 |
Family
ID=22003599
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60314841T Expired - Fee Related DE60314841T2 (de) | 2002-01-22 | 2003-01-21 | Prozesssteuerung beim elektrochemischen mechanischen polieren |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US6837983B2 (de) |
| EP (1) | EP1467840B1 (de) |
| JP (2) | JP2005516383A (de) |
| KR (1) | KR101011095B1 (de) |
| CN (2) | CN100425404C (de) |
| AT (1) | ATE366641T1 (de) |
| DE (1) | DE60314841T2 (de) |
| TW (1) | TWI278378B (de) |
| WO (1) | WO2003061905A1 (de) |
Families Citing this family (59)
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| DE102009046750B4 (de) * | 2008-12-31 | 2019-02-14 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Elektrochemisches Einebnungssystem mit verbesserter Elektrolytströmung |
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| JP6774244B2 (ja) * | 2016-07-22 | 2020-10-21 | 株式会社ディスコ | 研削装置 |
| KR20190039171A (ko) * | 2016-08-31 | 2019-04-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 환형 플래튼 또는 연마 패드를 갖는 연마 시스템 |
| CN108550515B (zh) * | 2018-04-11 | 2019-11-08 | 江阴市光科光电精密设备有限公司 | 离子注入工艺腔体的研磨工艺 |
| CN108608314B (zh) * | 2018-06-08 | 2019-10-11 | 大连理工大学 | 一种用于双面电化学机械抛光平面构件的设备及方法 |
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| CN110257895B (zh) * | 2019-06-24 | 2021-03-23 | 江苏守航实业有限公司 | 一种半导体材料的电解抛光方法及装置 |
| CN110465842B (zh) * | 2019-08-09 | 2020-06-23 | 湖北华宁防腐技术股份有限公司 | 一种用于防腐胶板生产线的打磨装置及其使用方法 |
| CN113399766B (zh) * | 2021-06-02 | 2022-06-14 | 贵州大学 | 一种高速钢轧辊材质电解磨削所用电解液的试验方法 |
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-
2002
- 2002-01-22 US US10/056,316 patent/US6837983B2/en not_active Expired - Fee Related
-
2003
- 2003-01-21 AT AT03703929T patent/ATE366641T1/de not_active IP Right Cessation
- 2003-01-21 CN CNB038025477A patent/CN100425404C/zh not_active Expired - Fee Related
- 2003-01-21 EP EP03703929A patent/EP1467840B1/de not_active Expired - Lifetime
- 2003-01-21 KR KR1020047011376A patent/KR101011095B1/ko not_active IP Right Cessation
- 2003-01-21 WO PCT/US2003/001760 patent/WO2003061905A1/en active IP Right Grant
- 2003-01-21 CN CNA2007101815298A patent/CN101176988A/zh active Pending
- 2003-01-21 TW TW092101279A patent/TWI278378B/zh not_active IP Right Cessation
- 2003-01-21 DE DE60314841T patent/DE60314841T2/de not_active Expired - Fee Related
- 2003-01-21 JP JP2003561828A patent/JP2005516383A/ja active Pending
-
2004
- 2004-09-14 US US10/940,603 patent/US20050077188A1/en not_active Abandoned
-
2010
- 2010-01-28 JP JP2010016865A patent/JP2010147489A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US6837983B2 (en) | 2005-01-04 |
| DE60314841T2 (de) | 2008-03-13 |
| EP1467840B1 (de) | 2007-07-11 |
| TW200302150A (en) | 2003-08-01 |
| CN1652898A (zh) | 2005-08-10 |
| JP2010147489A (ja) | 2010-07-01 |
| ATE366641T1 (de) | 2007-08-15 |
| KR101011095B1 (ko) | 2011-01-25 |
| CN100425404C (zh) | 2008-10-15 |
| JP2005516383A (ja) | 2005-06-02 |
| US20030136684A1 (en) | 2003-07-24 |
| CN101176988A (zh) | 2008-05-14 |
| WO2003061905A1 (en) | 2003-07-31 |
| EP1467840A1 (de) | 2004-10-20 |
| TWI278378B (en) | 2007-04-11 |
| US20050077188A1 (en) | 2005-04-14 |
| KR20040078131A (ko) | 2004-09-08 |
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