DE68907658T2 - Mehrschichtkondensator. - Google Patents

Mehrschichtkondensator.

Info

Publication number
DE68907658T2
DE68907658T2 DE89480066T DE68907658T DE68907658T2 DE 68907658 T2 DE68907658 T2 DE 68907658T2 DE 89480066 T DE89480066 T DE 89480066T DE 68907658 T DE68907658 T DE 68907658T DE 68907658 T2 DE68907658 T2 DE 68907658T2
Authority
DE
Germany
Prior art keywords
multilayer capacitor
multilayer
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89480066T
Other languages
English (en)
Other versions
DE68907658D1 (de
Inventor
Allen Joseph Arnold
Michael Eric Bariether
Shin-Wu Chiang
Hormazdyar Minocher Dalal
Robert Anderson Miller
Frank Alfred Montegari
James Michael Oberschmidt
David Tjeng-Ming Shen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE68907658D1 publication Critical patent/DE68907658D1/de
Application granted granted Critical
Publication of DE68907658T2 publication Critical patent/DE68907658T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
DE89480066T 1988-06-27 1989-04-25 Mehrschichtkondensator. Expired - Fee Related DE68907658T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/212,361 US4831494A (en) 1988-06-27 1988-06-27 Multilayer capacitor

Publications (2)

Publication Number Publication Date
DE68907658D1 DE68907658D1 (de) 1993-08-26
DE68907658T2 true DE68907658T2 (de) 1994-02-17

Family

ID=22790683

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89480066T Expired - Fee Related DE68907658T2 (de) 1988-06-27 1989-04-25 Mehrschichtkondensator.

Country Status (7)

Country Link
US (1) US4831494A (de)
EP (1) EP0351343B1 (de)
JP (1) JP2657953B2 (de)
BR (1) BR8903107A (de)
CA (1) CA1290414C (de)
DE (1) DE68907658T2 (de)
ES (1) ES2044199T3 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006054086A1 (de) * 2006-11-16 2008-05-29 Epcos Ag Vielschicht-Kondensator

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JP3337018B2 (ja) * 1999-11-19 2002-10-21 株式会社村田製作所 積層コンデンサ、配線基板、デカップリング回路および高周波回路
US6801422B2 (en) * 1999-12-28 2004-10-05 Intel Corporation High performance capacitor
US6441459B1 (en) * 2000-01-28 2002-08-27 Tdk Corporation Multilayer electronic device and method for producing same
US6724611B1 (en) 2000-03-29 2004-04-20 Intel Corporation Multi-layer chip capacitor
JP4573956B2 (ja) * 2000-06-30 2010-11-04 京セラ株式会社 積層型電子部品およびその製法
JP2002057066A (ja) * 2000-08-10 2002-02-22 Taiyo Yuden Co Ltd チップアレイ及びその製造方法
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DE10143173A1 (de) 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
DE60036238T2 (de) * 2000-12-28 2008-05-21 Tdk Corp. Vielschicht-Keramikkondensator für dreidimensionale Montage
US6477032B2 (en) * 2001-01-31 2002-11-05 Avx Corporation Low inductance chip with center via contact
US6459561B1 (en) * 2001-06-12 2002-10-01 Avx Corporation Low inductance grid array capacitor
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
US6757152B2 (en) * 2001-09-05 2004-06-29 Avx Corporation Cascade capacitor
US7057878B2 (en) * 2002-04-12 2006-06-06 Avx Corporation Discrete component array
US7177137B2 (en) * 2002-04-15 2007-02-13 Avx Corporation Plated terminations
US6960366B2 (en) 2002-04-15 2005-11-01 Avx Corporation Plated terminations
US6982863B2 (en) * 2002-04-15 2006-01-03 Avx Corporation Component formation via plating technology
TWI260657B (en) 2002-04-15 2006-08-21 Avx Corp Plated terminations
US7152291B2 (en) * 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US7463474B2 (en) * 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US7576968B2 (en) * 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
AU2003244246A1 (en) * 2002-06-18 2003-12-31 Tdk Corporation Solid electrolytic capacitor, board with built-in solid electrolytic capacitor, and method for producing them
TWI221302B (en) * 2002-06-18 2004-09-21 Tdk Corp Solid electrolytic capacitor and a production method therefor
TWI221621B (en) * 2002-06-18 2004-10-01 Tdk Corp Solid electrolytic capacitor and a production method therefor
US6606237B1 (en) * 2002-06-27 2003-08-12 Murata Manufacturing Co., Ltd. Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same
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US7573698B2 (en) * 2002-10-03 2009-08-11 Avx Corporation Window via capacitors
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TW200503022A (en) * 2003-03-17 2005-01-16 Tdk Corp Capacitor element, solid electrolytic capacitor, process for producing the same, and combination of capacitor elements
GB2400493B (en) * 2003-04-08 2005-11-09 Avx Corp Plated terminations
US6950300B2 (en) * 2003-05-06 2005-09-27 Marvell World Trade Ltd. Ultra low inductance multi layer ceramic capacitor
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
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JP4354227B2 (ja) 2003-07-23 2009-10-28 Ｔｄｋ株式会社 固体電解コンデンサ
JP3942565B2 (ja) 2003-08-29 2007-07-11 Ｔｄｋ株式会社 ノイズフィルタ
JP3897745B2 (ja) * 2003-08-29 2007-03-28 Ｔｄｋ株式会社 積層コンデンサ及び積層コンデンサの実装構造
US7227739B2 (en) * 2003-09-26 2007-06-05 Tdk Corporation Solid electrolytic capacitor
JP4059181B2 (ja) * 2003-09-29 2008-03-12 株式会社村田製作所 多端子型積層セラミック電子部品の製造方法
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
JP4343652B2 (ja) * 2003-11-07 2009-10-14 Ｔｄｋ株式会社 固体電解コンデンサ及び固体電解コンデンサデバイス
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
US6870728B1 (en) 2004-01-29 2005-03-22 Tdk Corporation Electrolytic capacitor
US7068490B2 (en) * 2004-04-16 2006-06-27 Kemet Electronics Corporation Thermal dissipating capacitor and electrical component comprising same
US7420381B2 (en) 2004-09-13 2008-09-02 Cascade Microtech, Inc. Double sided probing structures
KR100691146B1 (ko) * 2004-12-24 2007-03-09 삼성전기주식회사 적층형 캐패시터 및 적층형 캐패시터가 내장된 인쇄회로기판
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7505239B2 (en) 2005-04-14 2009-03-17 Tdk Corporation Light emitting device
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US7408763B2 (en) * 2005-07-19 2008-08-05 Apurba Roy Low inductance multilayer capacitor
JP4146858B2 (ja) 2005-08-26 2008-09-10 Ｔｄｋ株式会社 積層コンデンサ
US7697262B2 (en) * 2005-10-31 2010-04-13 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7414857B2 (en) * 2005-10-31 2008-08-19 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7724496B2 (en) * 2005-11-04 2010-05-25 Avx Corporation Multilayer vertically integrated array technology
US8169014B2 (en) 2006-01-09 2012-05-01 Taiwan Semiconductor Manufacturing Co., Ltd. Interdigitated capacitive structure for an integrated circuit
JP4462194B2 (ja) * 2006-01-17 2010-05-12 Ｔｄｋ株式会社 積層型貫通コンデンサアレイ
US7292429B2 (en) * 2006-01-18 2007-11-06 Kemet Electronics Corporation Low inductance capacitor
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
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JP4662368B2 (ja) * 2006-06-22 2011-03-30 Ｎｅｃトーキン株式会社 固体電解コンデンサの製造方法
US7961453B2 (en) * 2007-01-09 2011-06-14 Samsung Electro-Mechanics Co., Ltd. Multilayer chip capacitor
US8238116B2 (en) 2007-04-13 2012-08-07 Avx Corporation Land grid feedthrough low ESL technology
US8045319B2 (en) * 2007-06-13 2011-10-25 Avx Corporation Controlled ESR decoupling capacitor
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
JP5012432B2 (ja) * 2007-11-07 2012-08-29 Ｔｄｋ株式会社 セラミック電子部品
US20090154056A1 (en) * 2007-12-17 2009-06-18 General Electric Company Low inductance capacitor and method of manufacturing same
JP2009295683A (ja) 2008-06-03 2009-12-17 Tdk Corp チップ型電子部品
US8446705B2 (en) * 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
TWI455012B (zh) * 2008-08-19 2014-10-01 Wistron Corp 顯示器分割畫面顯示方法及應用該方法之電子裝置
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US20100188799A1 (en) * 2009-01-28 2010-07-29 Avx Corporation Controlled esr low inductance capacitor
US9675808B2 (en) 2011-09-27 2017-06-13 Medtronic, Inc. Battery and capacitor arrangement for an implantable medical device
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US20150021082A1 (en) 2013-07-17 2015-01-22 Samsung Electro-Mechanics Co., Ltd. Multilayer ceramic capacitor and board having the same
KR101698167B1 (ko) * 2015-01-02 2017-01-19 삼화콘덴서공업주식회사 적층 세라믹 커패시터
CN117133545A (zh) * 2017-05-15 2023-11-28 京瓷Avx元器件公司 多层电容器和包括其的电路板
EP3646356A4 (de) 2017-06-29 2021-12-22 AVX Corporation Oberflächenmontierter mehrschichtiger koppelkondensator und leiterplatte damit
JP2021500752A (ja) 2017-10-23 2021-01-07 エイブイエックス コーポレイション 接続性を改善した多層電子デバイス、およびそれを作製する方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006054086A1 (de) * 2006-11-16 2008-05-29 Epcos Ag Vielschicht-Kondensator

Also Published As

Publication number Publication date
ES2044199T3 (es) 1994-01-01
DE68907658D1 (de) 1993-08-26
BR8903107A (pt) 1990-02-06
EP0351343B1 (de) 1993-07-21
JP2657953B2 (ja) 1997-09-30
JPH02256216A (ja) 1990-10-17
US4831494A (en) 1989-05-16
EP0351343A1 (de) 1990-01-17
CA1290414C (en) 1991-10-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee