DE68909438D1 - Katalysator fuer stromlose plattierung. - Google Patents

Katalysator fuer stromlose plattierung.

Info

Publication number
DE68909438D1
DE68909438D1 DE89300598T DE68909438T DE68909438D1 DE 68909438 D1 DE68909438 D1 DE 68909438D1 DE 89300598 T DE89300598 T DE 89300598T DE 68909438 T DE68909438 T DE 68909438T DE 68909438 D1 DE68909438 D1 DE 68909438D1
Authority
DE
Germany
Prior art keywords
catalyst
electric plating
plating
electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89300598T
Other languages
English (en)
Other versions
DE68909438T2 (de
Inventor
Hiroshi Yamamoto
Takeshi Shimazaki
Kazuichi Kuramochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP63018132A external-priority patent/JPH01195281A/ja
Priority claimed from JP63110862A external-priority patent/JP2513270B2/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE68909438D1 publication Critical patent/DE68909438D1/de
Publication of DE68909438T2 publication Critical patent/DE68909438T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE89300598T 1988-01-28 1989-01-23 Katalysator für stromlose Plattierung. Expired - Fee Related DE68909438T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP63018132A JPH01195281A (ja) 1988-01-28 1988-01-28 無電解めつき用触媒
JP63110862A JP2513270B2 (ja) 1988-05-06 1988-05-06 無電解めっき用触媒溶液
SG156694A SG156694G (en) 1988-01-28 1994-10-24 Catalyst for electroless plating

Publications (2)

Publication Number Publication Date
DE68909438D1 true DE68909438D1 (de) 1993-11-04
DE68909438T2 DE68909438T2 (de) 1994-02-10

Family

ID=27282095

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89300598T Expired - Fee Related DE68909438T2 (de) 1988-01-28 1989-01-23 Katalysator für stromlose Plattierung.

Country Status (4)

Country Link
US (1) US4986848A (de)
EP (1) EP0328263B1 (de)
DE (1) DE68909438T2 (de)
SG (1) SG156694G (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5405656A (en) * 1990-04-02 1995-04-11 Nippondenso Co., Ltd. Solution for catalytic treatment, method of applying catalyst to substrate and method of forming electrical conductor
US5380560A (en) * 1992-07-28 1995-01-10 International Business Machines Corporation Palladium sulfate solution for the selective seeding of the metal interconnections on polyimide dielectrics for electroless metal deposition
EP0592862B1 (de) * 1992-10-15 1997-03-12 Tamglass Engineering Oy Verfahren und Ofen zum Biegen von Glastafeln
EP0817557A3 (de) * 1996-07-03 1998-05-06 Nisshinbo Industries, Inc. Material zur Abschirmung gegen die elektromagnetische Ausstrahlung und dessen Herstellungsverfahren
US6174647B1 (en) * 1998-01-26 2001-01-16 Shipley Company, L.L.C. Metallization process and component
WO2001049898A1 (fr) * 2000-01-07 2001-07-12 Nikko Materials Co., Ltd. Procede de galvanoplastie, agent de pretraitement et tranche de semi-conducteurs et dispositif semi-conducteur utilisant cette derniere
US7045461B2 (en) * 2000-01-07 2006-05-16 Nikkon Materials Co., Ltd. Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these
WO2001081652A1 (fr) * 2000-04-25 2001-11-01 Nikko Materials Co., Ltd. Agent de pretraitement pour revetement metallique
WO2002092877A2 (en) * 2001-05-11 2002-11-21 Ebara Corporation Catalyst-imparting treatment solution and electroless plating method
WO2003002780A1 (fr) * 2001-06-28 2003-01-09 Nikko Materials Co., Ltd. Agent de traitement de surface, surface d'un article ainsi traitee et procede de nickelage a l'aide dudit agent
US20050156362A1 (en) * 2003-11-29 2005-07-21 Joe Arnold Piezoelectric device and method of manufacturing same
US7665908B2 (en) * 2006-12-15 2010-02-23 Finisar Corporation Integrating optoelectronic components into a molded communications module having integrated plastic circuit structures
JP5041214B2 (ja) 2007-06-15 2012-10-03 ソニー株式会社 金属薄膜の形成方法および電子デバイスの製造方法
CN101838802B (zh) * 2009-03-20 2012-06-06 比亚迪股份有限公司 一种用于化学镀的活化液及非金属表面活化方法
KR101445461B1 (ko) * 2010-03-23 2014-09-26 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 무전해 도금 전처리제, 그것을 이용하는 무전해 도금 방법 및 무전해 도금물
US8591636B2 (en) * 2010-12-14 2013-11-26 Rohm And Haas Electronics Materials Llc Plating catalyst and method
US8895441B2 (en) * 2012-02-24 2014-11-25 Lam Research Corporation Methods and materials for anchoring gapfill metals
JP6272673B2 (ja) * 2013-10-30 2018-01-31 ローム・アンド・ハース電子材料株式会社 無電解めっき用触媒液
JP7228468B2 (ja) 2019-05-28 2023-02-24 上村工業株式会社 プリント配線基板の製造方法
CN111763930B (zh) * 2020-07-14 2022-04-19 赤壁市聚茂新材料科技有限公司 一种非钯活化镀铜工艺及其敏化剂、活化剂
JP2022030643A (ja) * 2020-08-07 2022-02-18 イビデン株式会社 プリント配線板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2116389C3 (de) * 1971-03-30 1980-04-03 Schering Ag, 1000 Berlin Und 4619 Bergkamen Lösung zur Aktivierung von Oberflächen für die Metallisierung
US3962494A (en) * 1971-07-29 1976-06-08 Photocircuits Division Of Kollmorgan Corporation Sensitized substrates for chemical metallization
US3960573A (en) * 1972-08-07 1976-06-01 Photocircuits Division Of Kollmorgan Corporation Novel precious metal sensitizing solutions
US3978252A (en) * 1973-03-23 1976-08-31 Macdermid Incorporated Method of improving the adhesion between a molded resin substrate and a metal film deposited thereon
US3962496A (en) * 1974-11-07 1976-06-08 Photocircuits Division Of Kollmorgen Composition and method for neutralizing and sensitizing resinous surfaces and improved sensitized resinous surfaces for adherent metallization
US3962497A (en) * 1975-03-11 1976-06-08 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating
US4301196A (en) * 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
JPS6024380A (ja) * 1983-07-20 1985-02-07 Hitachi Ltd パラジウム活性化液

Also Published As

Publication number Publication date
DE68909438T2 (de) 1994-02-10
EP0328263B1 (de) 1993-09-29
EP0328263A3 (en) 1990-05-02
US4986848A (en) 1991-01-22
SG156694G (en) 1995-03-17
EP0328263A2 (de) 1989-08-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee