DE68918150D1 - Verfahren zum Aufwachsen einer Galliumarsenid-Schicht auf einem Silizium-Substrat. - Google Patents

Verfahren zum Aufwachsen einer Galliumarsenid-Schicht auf einem Silizium-Substrat.

Info

Publication number
DE68918150D1
DE68918150D1 DE68918150T DE68918150T DE68918150D1 DE 68918150 D1 DE68918150 D1 DE 68918150D1 DE 68918150 T DE68918150 T DE 68918150T DE 68918150 T DE68918150 T DE 68918150T DE 68918150 D1 DE68918150 D1 DE 68918150D1
Authority
DE
Germany
Prior art keywords
growing
silicon substrate
gallium arsenide
arsenide layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE68918150T
Other languages
English (en)
Inventor
Kuninori Kitahara
Nobuyuki Ohtsuka
Masashi Ozeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE68918150D1 publication Critical patent/DE68918150D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02538Group 13/15 materials
    • H01L21/02546Arsenides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02381Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02455Group 13/15 materials
    • H01L21/02458Nitrides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02455Group 13/15 materials
    • H01L21/02461Phosphides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02455Group 13/15 materials
    • H01L21/02463Arsenides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/933Germanium or silicon or Ge-Si on III-V
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12674Ge- or Si-base component
DE68918150T 1988-04-27 1989-04-27 Verfahren zum Aufwachsen einer Galliumarsenid-Schicht auf einem Silizium-Substrat. Expired - Lifetime DE68918150D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP63105036 1988-04-27
JP26461888 1988-10-20

Publications (1)

Publication Number Publication Date
DE68918150D1 true DE68918150D1 (de) 1994-10-20

Family

ID=26445388

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68918150T Expired - Lifetime DE68918150D1 (de) 1988-04-27 1989-04-27 Verfahren zum Aufwachsen einer Galliumarsenid-Schicht auf einem Silizium-Substrat.

Country Status (4)

Country Link
US (3) US5130269A (de)
EP (1) EP0340113B1 (de)
JP (1) JPH07118450B2 (de)
DE (1) DE68918150D1 (de)

Families Citing this family (140)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5130269A (en) * 1988-04-27 1992-07-14 Fujitsu Limited Hetero-epitaxially grown compound semiconductor substrate and a method of growing the same
US5221637A (en) * 1991-05-31 1993-06-22 Interuniversitair Micro Elektronica Centrum Vzw Mesa release and deposition (MRD) method for stress relief in heteroepitaxially grown GaAs on Si
JP2946280B2 (ja) * 1994-09-19 1999-09-06 光技術研究開発株式会社 半導体結晶成長方法
FI100409B (fi) * 1994-11-28 1997-11-28 Asm Int Menetelmä ja laitteisto ohutkalvojen valmistamiseksi
EP0720243A3 (de) * 1994-12-27 1998-07-01 Fujitsu Limited Verfahren zur Herstellung eines Verbindungshalbleiter-Bauelements und optische Halbleitervorrichtung
US6342277B1 (en) * 1996-08-16 2002-01-29 Licensee For Microelectronics: Asm America, Inc. Sequential chemical vapor deposition
US5916365A (en) * 1996-08-16 1999-06-29 Sherman; Arthur Sequential chemical vapor deposition
EP0993027A4 (de) * 1997-03-28 2002-05-29 Sharp Kk Herstellung von verbindungshalbleitern
DE19725900C2 (de) * 1997-06-13 2003-03-06 Dieter Bimberg Verfahren zur Abscheidung von Galliumnitrid auf Silizium-Substraten
US6107653A (en) * 1997-06-24 2000-08-22 Massachusetts Institute Of Technology Controlling threading dislocation densities in Ge on Si using graded GeSi layers and planarization
US7393561B2 (en) * 1997-08-11 2008-07-01 Applied Materials, Inc. Method and apparatus for layer by layer deposition of thin films
US7227176B2 (en) * 1998-04-10 2007-06-05 Massachusetts Institute Of Technology Etch stop layer system
SG94712A1 (en) * 1998-09-15 2003-03-18 Univ Singapore Method of fabricating group-iii nitride-based semiconductor device
US6329063B2 (en) * 1998-12-11 2001-12-11 Nova Crystals, Inc. Method for producing high quality heteroepitaxial growth using stress engineering and innovative substrates
FI110311B (fi) 1999-07-20 2002-12-31 Asm Microchemistry Oy Menetelmä ja laitteisto aineiden poistamiseksi kaasuista
US6503773B2 (en) * 2000-01-20 2003-01-07 Amberwave Systems Corporation Low threading dislocation density relaxed mismatched epilayers without high temperature growth
US6602613B1 (en) * 2000-01-20 2003-08-05 Amberwave Systems Corporation Heterointegration of materials using deposition and bonding
US6750130B1 (en) 2000-01-20 2004-06-15 Amberwave Systems Corporation Heterointegration of materials using deposition and bonding
US6392257B1 (en) * 2000-02-10 2002-05-21 Motorola Inc. Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same
US6693033B2 (en) 2000-02-10 2004-02-17 Motorola, Inc. Method of removing an amorphous oxide from a monocrystalline surface
US7060132B2 (en) * 2000-04-14 2006-06-13 Asm International N.V. Method and apparatus of growing a thin film
TW496907B (en) * 2000-04-14 2002-08-01 Asm Microchemistry Oy Method and apparatus of growing a thin film onto a substrate
EP1290733A1 (de) * 2000-05-31 2003-03-12 Motorola, Inc. Halbleiterbauelement und dessen herstellungsverfahren
US6620723B1 (en) 2000-06-27 2003-09-16 Applied Materials, Inc. Formation of boride barrier layers using chemisorption techniques
US7405158B2 (en) 2000-06-28 2008-07-29 Applied Materials, Inc. Methods for depositing tungsten layers employing atomic layer deposition techniques
US7101795B1 (en) 2000-06-28 2006-09-05 Applied Materials, Inc. Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
US7732327B2 (en) 2000-06-28 2010-06-08 Applied Materials, Inc. Vapor deposition of tungsten materials
US7964505B2 (en) 2005-01-19 2011-06-21 Applied Materials, Inc. Atomic layer deposition of tungsten materials
US6551929B1 (en) 2000-06-28 2003-04-22 Applied Materials, Inc. Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
US6592942B1 (en) * 2000-07-07 2003-07-15 Asm International N.V. Method for vapour deposition of a film onto a substrate
WO2002009187A2 (en) * 2000-07-24 2002-01-31 Motorola, Inc. Heterojunction tunneling diodes and process for fabricating same
US6573126B2 (en) 2000-08-16 2003-06-03 Massachusetts Institute Of Technology Process for producing semiconductor article using graded epitaxial growth
US6638838B1 (en) * 2000-10-02 2003-10-28 Motorola, Inc. Semiconductor structure including a partially annealed layer and method of forming the same
US20030001207A1 (en) * 2000-11-22 2003-01-02 Motorola, Inc. Structure and method for fabricating semiconductor structures and devices utilizing the formation of a compliant subtrate for materials used to form the same
US6583034B2 (en) * 2000-11-22 2003-06-24 Motorola, Inc. Semiconductor structure including a compliant substrate having a graded monocrystalline layer and methods for fabricating the structure and semiconductor devices including the structure
US20020100942A1 (en) * 2000-12-04 2002-08-01 Fitzgerald Eugene A. CMOS inverter and integrated circuits utilizing strained silicon surface channel MOSFETs
US6649480B2 (en) * 2000-12-04 2003-11-18 Amberwave Systems Corporation Method of fabricating CMOS inverter and integrated circuits utilizing strained silicon surface channel MOSFETs
US6825447B2 (en) * 2000-12-29 2004-11-30 Applied Materials, Inc. Apparatus and method for uniform substrate heating and contaminate collection
US6998579B2 (en) 2000-12-29 2006-02-14 Applied Materials, Inc. Chamber for uniform substrate heating
US6765178B2 (en) * 2000-12-29 2004-07-20 Applied Materials, Inc. Chamber for uniform substrate heating
US20020083897A1 (en) * 2000-12-29 2002-07-04 Applied Materials, Inc. Full glass substrate deposition in plasma enhanced chemical vapor deposition
US6811814B2 (en) 2001-01-16 2004-11-02 Applied Materials, Inc. Method for growing thin films by catalytic enhancement
US20020127336A1 (en) * 2001-01-16 2002-09-12 Applied Materials, Inc. Method for growing thin films by catalytic enhancement
US20020096683A1 (en) * 2001-01-19 2002-07-25 Motorola, Inc. Structure and method for fabricating GaN devices utilizing the formation of a compliant substrate
KR100408733B1 (ko) 2001-02-02 2003-12-11 주성엔지니어링(주) 박막 증착 방법
US6951804B2 (en) 2001-02-02 2005-10-04 Applied Materials, Inc. Formation of a tantalum-nitride layer
US6673646B2 (en) 2001-02-28 2004-01-06 Motorola, Inc. Growth of compound semiconductor structures on patterned oxide films and process for fabricating same
US6724008B2 (en) 2001-03-02 2004-04-20 Amberwave Systems Corporation Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
US6878206B2 (en) 2001-07-16 2005-04-12 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6723661B2 (en) * 2001-03-02 2004-04-20 Amberwave Systems Corporation Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
US6660126B2 (en) 2001-03-02 2003-12-09 Applied Materials, Inc. Lid assembly for a processing system to facilitate sequential deposition techniques
US6703688B1 (en) 2001-03-02 2004-03-09 Amberwave Systems Corporation Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
US6830976B2 (en) * 2001-03-02 2004-12-14 Amberwave Systems Corproation Relaxed silicon germanium platform for high speed CMOS electronics and high speed analog circuits
US6734020B2 (en) 2001-03-07 2004-05-11 Applied Materials, Inc. Valve control system for atomic layer deposition chamber
EP1396878A4 (de) * 2001-03-30 2008-09-03 Toyoda Gosei Kk Herstellungsverfahren für ein halbleitersubstrat und halbleiterelement
US20020140013A1 (en) * 2001-04-02 2002-10-03 Motorola, Inc. Structure and method for fabricating semiconductor structures and devices utilizing a stable template
US6940089B2 (en) 2001-04-04 2005-09-06 Massachusetts Institute Of Technology Semiconductor device structure
US20020153524A1 (en) * 2001-04-19 2002-10-24 Motorola Inc. Structure and method for fabricating semiconductor structures and devices utilizing perovskite stacks
US6849545B2 (en) 2001-06-20 2005-02-01 Applied Materials, Inc. System and method to form a composite film stack utilizing sequential deposition techniques
US6709989B2 (en) 2001-06-21 2004-03-23 Motorola, Inc. Method for fabricating a semiconductor structure including a metal oxide interface with silicon
US7211144B2 (en) 2001-07-13 2007-05-01 Applied Materials, Inc. Pulsed nucleation deposition of tungsten layers
US20070009658A1 (en) * 2001-07-13 2007-01-11 Yoo Jong H Pulse nucleation enhanced nucleation technique for improved step coverage and better gap fill for WCVD process
US20030022525A1 (en) * 2001-07-16 2003-01-30 Motorola, Inc. Semiconductor structure and device including a monocrystalline layer formed overlying a compliant substrate and a method of forming the same
US20030010992A1 (en) * 2001-07-16 2003-01-16 Motorola, Inc. Semiconductor structure and method for implementing cross-point switch functionality
US6646293B2 (en) 2001-07-18 2003-11-11 Motorola, Inc. Structure for fabricating high electron mobility transistors utilizing the formation of complaint substrates
US6693298B2 (en) 2001-07-20 2004-02-17 Motorola, Inc. Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same
US6855992B2 (en) * 2001-07-24 2005-02-15 Motorola Inc. Structure and method for fabricating configurable transistor devices utilizing the formation of a compliant substrate for materials used to form the same
US6667196B2 (en) 2001-07-25 2003-12-23 Motorola, Inc. Method for real-time monitoring and controlling perovskite oxide film growth and semiconductor structure formed using the method
US7085616B2 (en) 2001-07-27 2006-08-01 Applied Materials, Inc. Atomic layer deposition apparatus
US6639249B2 (en) 2001-08-06 2003-10-28 Motorola, Inc. Structure and method for fabrication for a solid-state lighting device
US6589856B2 (en) 2001-08-06 2003-07-08 Motorola, Inc. Method and apparatus for controlling anti-phase domains in semiconductor structures and devices
US6673667B2 (en) 2001-08-15 2004-01-06 Motorola, Inc. Method for manufacturing a substantially integral monolithic apparatus including a plurality of semiconductor materials
US20030036217A1 (en) * 2001-08-16 2003-02-20 Motorola, Inc. Microcavity semiconductor laser coupled to a waveguide
WO2003025984A2 (en) * 2001-09-21 2003-03-27 Amberwave Systems Corporation Semiconductor structures employing strained material layers with defined impurity gradients and methods for fabricating same
WO2003028106A2 (en) * 2001-09-24 2003-04-03 Amberwave Systems Corporation Rf circuits including transistors having strained material layers
US20030059535A1 (en) * 2001-09-25 2003-03-27 Lee Luo Cycling deposition of low temperature films in a cold wall single wafer process chamber
US7049226B2 (en) * 2001-09-26 2006-05-23 Applied Materials, Inc. Integration of ALD tantalum nitride for copper metallization
US20030059538A1 (en) * 2001-09-26 2003-03-27 Applied Materials, Inc. Integration of barrier layer and seed layer
US6936906B2 (en) 2001-09-26 2005-08-30 Applied Materials, Inc. Integration of barrier layer and seed layer
US20030071327A1 (en) * 2001-10-17 2003-04-17 Motorola, Inc. Method and apparatus utilizing monocrystalline insulator
US6916398B2 (en) 2001-10-26 2005-07-12 Applied Materials, Inc. Gas delivery apparatus and method for atomic layer deposition
US6729824B2 (en) 2001-12-14 2004-05-04 Applied Materials, Inc. Dual robot processing system
US6911391B2 (en) 2002-01-26 2005-06-28 Applied Materials, Inc. Integration of titanium and titanium nitride layers
US6998014B2 (en) * 2002-01-26 2006-02-14 Applied Materials, Inc. Apparatus and method for plasma assisted deposition
US6827978B2 (en) 2002-02-11 2004-12-07 Applied Materials, Inc. Deposition of tungsten films
US6833161B2 (en) 2002-02-26 2004-12-21 Applied Materials, Inc. Cyclical deposition of tungsten nitride for metal oxide gate electrode
AU2003222003A1 (en) 2002-03-14 2003-09-29 Amberwave Systems Corporation Methods for fabricating strained layers on semiconductor substrates
US7439191B2 (en) 2002-04-05 2008-10-21 Applied Materials, Inc. Deposition of silicon layers for active matrix liquid crystal display (AMLCD) applications
US6720027B2 (en) 2002-04-08 2004-04-13 Applied Materials, Inc. Cyclical deposition of a variable content titanium silicon nitride layer
US6846516B2 (en) 2002-04-08 2005-01-25 Applied Materials, Inc. Multiple precursor cyclical deposition system
US6875271B2 (en) 2002-04-09 2005-04-05 Applied Materials, Inc. Simultaneous cyclical deposition in different processing regions
US20030194825A1 (en) * 2002-04-10 2003-10-16 Kam Law Deposition of gate metallization for active matrix liquid crystal display (AMLCD) applications
US6869838B2 (en) * 2002-04-09 2005-03-22 Applied Materials, Inc. Deposition of passivation layers for active matrix liquid crystal display (AMLCD) applications
US7279432B2 (en) 2002-04-16 2007-10-09 Applied Materials, Inc. System and method for forming an integrated barrier layer
US6916717B2 (en) * 2002-05-03 2005-07-12 Motorola, Inc. Method for growing a monocrystalline oxide layer and for fabricating a semiconductor device on a monocrystalline substrate
US7307273B2 (en) * 2002-06-07 2007-12-11 Amberwave Systems Corporation Control of strain in device layers by selective relaxation
US7074623B2 (en) * 2002-06-07 2006-07-11 Amberwave Systems Corporation Methods of forming strained-semiconductor-on-insulator finFET device structures
US20030227057A1 (en) * 2002-06-07 2003-12-11 Lochtefeld Anthony J. Strained-semiconductor-on-insulator device structures
US7335545B2 (en) * 2002-06-07 2008-02-26 Amberwave Systems Corporation Control of strain in device layers by prevention of relaxation
US6995430B2 (en) * 2002-06-07 2006-02-07 Amberwave Systems Corporation Strained-semiconductor-on-insulator device structures
US7615829B2 (en) * 2002-06-07 2009-11-10 Amberwave Systems Corporation Elevated source and drain elements for strained-channel heterojuntion field-effect transistors
US6946371B2 (en) * 2002-06-10 2005-09-20 Amberwave Systems Corporation Methods of fabricating semiconductor structures having epitaxially grown source and drain elements
US6982474B2 (en) * 2002-06-25 2006-01-03 Amberwave Systems Corporation Reacted conductive gate electrodes
US20040012037A1 (en) * 2002-07-18 2004-01-22 Motorola, Inc. Hetero-integration of semiconductor materials on silicon
US7049627B2 (en) 2002-08-23 2006-05-23 Amberwave Systems Corporation Semiconductor heterostructures and related methods
US7594967B2 (en) * 2002-08-30 2009-09-29 Amberwave Systems Corporation Reduction of dislocation pile-up formation during relaxed lattice-mismatched epitaxy
US6821563B2 (en) 2002-10-02 2004-11-23 Applied Materials, Inc. Gas distribution system for cyclical layer deposition
US20040065255A1 (en) * 2002-10-02 2004-04-08 Applied Materials, Inc. Cyclical layer deposition system
US20040070312A1 (en) * 2002-10-10 2004-04-15 Motorola, Inc. Integrated circuit and process for fabricating the same
US20040069991A1 (en) * 2002-10-10 2004-04-15 Motorola, Inc. Perovskite cuprate electronic device structure and process
US7112830B2 (en) * 2002-11-25 2006-09-26 Apa Enterprises, Inc. Super lattice modification of overlying transistor
US7262133B2 (en) 2003-01-07 2007-08-28 Applied Materials, Inc. Enhancement of copper line reliability using thin ALD tan film to cap the copper line
JP4659732B2 (ja) * 2003-01-27 2011-03-30 台湾積體電路製造股▲ふん▼有限公司 半導体層を形成する方法
US6965128B2 (en) * 2003-02-03 2005-11-15 Freescale Semiconductor, Inc. Structure and method for fabricating semiconductor microresonator devices
US7020374B2 (en) * 2003-02-03 2006-03-28 Freescale Semiconductor, Inc. Optical waveguide structure and method for fabricating the same
US20040164315A1 (en) * 2003-02-25 2004-08-26 Motorola, Inc. Structure and device including a tunneling piezoelectric switch and method of forming same
CN100437970C (zh) * 2003-03-07 2008-11-26 琥珀波系统公司 一种结构及用于形成半导体结构的方法
US7211508B2 (en) 2003-06-18 2007-05-01 Applied Materials, Inc. Atomic layer deposition of tantalum based barrier materials
US6818517B1 (en) 2003-08-29 2004-11-16 Asm International N.V. Methods of depositing two or more layers on a substrate in situ
US20060113603A1 (en) * 2004-12-01 2006-06-01 Amberwave Systems Corporation Hybrid semiconductor-on-insulator structures and related methods
US7393733B2 (en) * 2004-12-01 2008-07-01 Amberwave Systems Corporation Methods of forming hybrid fin field-effect transistor structures
US20080010083A1 (en) * 2005-07-01 2008-01-10 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Approval technique for media content alteration
WO2007025062A2 (en) * 2005-08-25 2007-03-01 Wakonda Technologies, Inc. Photovoltaic template
JP2007087992A (ja) * 2005-09-20 2007-04-05 Showa Denko Kk 半導体素子および半導体素子製造方法
WO2007034761A1 (en) * 2005-09-20 2007-03-29 Showa Denko K.K. Semiconductor device and method for fabrication thereof
US7872252B2 (en) * 2006-08-11 2011-01-18 Cyrium Technologies Incorporated Method of fabricating semiconductor devices on a group IV substrate with controlled interface properties and diffusion tails
US8362460B2 (en) * 2006-08-11 2013-01-29 Cyrium Technologies Incorporated Method of fabricating semiconductor devices on a group IV substrate with controlled interface properties and diffusion tails
US8821637B2 (en) * 2007-01-29 2014-09-02 Applied Materials, Inc. Temperature controlled lid assembly for tungsten nitride deposition
US7795605B2 (en) * 2007-06-29 2010-09-14 International Business Machines Corporation Phase change material based temperature sensor
US20090035946A1 (en) * 2007-07-31 2009-02-05 Asm International N.V. In situ deposition of different metal-containing films using cyclopentadienyl metal precursors
JP2011503847A (ja) * 2007-11-02 2011-01-27 ワコンダ テクノロジーズ, インコーポレイテッド 結晶質薄膜光起電力構造およびその形成方法
US7790566B2 (en) * 2008-03-19 2010-09-07 International Business Machines Corporation Semiconductor surface treatment for epitaxial growth
US8383525B2 (en) * 2008-04-25 2013-02-26 Asm America, Inc. Plasma-enhanced deposition process for forming a metal oxide thin film and related structures
KR101436564B1 (ko) * 2008-05-07 2014-09-02 한국에이에스엠지니텍 주식회사 비정질 실리콘 박막 형성 방법
US8236603B1 (en) 2008-09-04 2012-08-07 Solexant Corp. Polycrystalline semiconductor layers and methods for forming the same
US8415187B2 (en) * 2009-01-28 2013-04-09 Solexant Corporation Large-grain crystalline thin-film structures and devices and methods for forming the same
JP2011193290A (ja) * 2010-03-15 2011-09-29 Seiko Instruments Inc パッケージの製造方法、圧電振動子、発振器、電子機器および電波時計
US20120086096A1 (en) * 2010-10-08 2012-04-12 Electronics And Telecommunications Research Institute Condenser lens-coupled photoconductive antenna device for terahertz wave generation and detection and fabricating method thereof
US20120261721A1 (en) * 2011-04-18 2012-10-18 Raytheon Company Semiconductor structures having nucleation layer to prevent interfacial charge for column iii-v materials on column iv or column iv-iv materials
JP6585551B2 (ja) * 2016-06-15 2019-10-02 株式会社Kokusai Electric 半導体装置の製造方法、基板処理装置、およびプログラム

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE393967B (sv) * 1974-11-29 1977-05-31 Sateko Oy Forfarande och for utforande av stroleggning mellan lagren i ett virkespaket
US4180825A (en) * 1977-09-16 1979-12-25 Harris Corporation Heteroepitaxial deposition of GaP on silicon substrates
US4588451A (en) * 1984-04-27 1986-05-13 Advanced Energy Fund Limited Partnership Metal organic chemical vapor deposition of 111-v compounds on silicon
US4734478A (en) * 1984-07-02 1988-03-29 Nippon Shokubai Kagaku Kogyo Co., Ltd. Water absorbing agent
JPS6164118A (ja) * 1984-09-05 1986-04-02 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPS61256663A (ja) * 1985-05-09 1986-11-14 Agency Of Ind Science & Technol 半導体装置
JPS621225A (ja) * 1985-06-26 1987-01-07 Sharp Corp 半導体ウエハ
JPS621224A (ja) * 1985-06-26 1987-01-07 Sharp Corp 半導体素子構造
US4835583A (en) * 1985-08-30 1989-05-30 Hitachi, Ltd. Semiconductor device having strained superlattice buffer layers with In-doped GaAs substrate
DE3676019D1 (de) * 1985-09-03 1991-01-17 Daido Steel Co Ltd Epitaktische gallium-arsenid-halbleiterscheibe und verfahren zu ihrer herstellung.
JPH0643500B2 (ja) * 1985-12-04 1994-06-08 住友精化株式会社 吸水性樹脂の造粒方法
US4829022A (en) * 1985-12-09 1989-05-09 Nippon Telegraph And Telephone Corporation Method for forming thin films of compound semiconductors by flow rate modulation epitaxy
US4806996A (en) * 1986-04-10 1989-02-21 American Telephone And Telegraph Company, At&T Bell Laboratories Dislocation-free epitaxial layer on a lattice-mismatched porous or otherwise submicron patterned single crystal substrate
US4767492A (en) * 1986-04-18 1988-08-30 Pola Chemical Industries, Inc. Ultrasonic fuse-bonding sealing apparatus with improved contact surfaces
JPS62291909A (ja) * 1986-06-11 1987-12-18 Sharp Corp GaAsエピタキシヤル成長方法
US4767494A (en) * 1986-07-04 1988-08-30 Nippon Telegraph & Telephone Corporation Preparation process of compound semiconductor
US4933300A (en) * 1987-02-12 1990-06-12 Hideomi Koinuma Process for forming multilayer thin film
JPS63228714A (ja) * 1987-03-18 1988-09-22 Matsushita Electric Ind Co Ltd 半導体結晶膜の製造方法
JPH0727861B2 (ja) * 1987-03-27 1995-03-29 富士通株式会社 ▲iii▼−▲v▼族化合物半導体結晶の成長方法
GB2204066A (en) * 1987-04-06 1988-11-02 Philips Electronic Associated A method for manufacturing a semiconductor device having a layered structure
JPS63289812A (ja) * 1987-05-21 1988-11-28 Ricoh Co Ltd 半導体積層体
US4833103A (en) * 1987-06-16 1989-05-23 Eastman Kodak Company Process for depositing a III-V compound layer on a substrate
JPH0666274B2 (ja) * 1987-07-01 1994-08-24 日本電気株式会社 ▲iii▼−v族化合物半導体の形成方法
EP0297867B1 (de) * 1987-07-01 1993-10-06 Nec Corporation Verfahren zur Züchtung eines Halbleiterkristalles aus III-V-Gruppen-Verbindung auf einem Si-Substrat
US4835116A (en) * 1987-11-13 1989-05-30 Kopin Corporation Annealing method for III-V deposition
US5130269A (en) * 1988-04-27 1992-07-14 Fujitsu Limited Hetero-epitaxially grown compound semiconductor substrate and a method of growing the same
KR930003555B1 (ko) * 1988-12-16 1993-05-06 산켄 덴끼 가부시끼가이샤 반도체 장치의 제조방법
JP2817995B2 (ja) * 1990-03-15 1998-10-30 富士通株式会社 ▲iii▼―▲v▼族化合物半導体ヘテロ構造基板および▲iii▼―▲v▼族化合物ヘテロ構造半導体装置

Also Published As

Publication number Publication date
JPH07118450B2 (ja) 1995-12-18
US5130269A (en) 1992-07-14
US5300186A (en) 1994-04-05
JPH02191318A (ja) 1990-07-27
EP0340113A1 (de) 1989-11-02
US5484664A (en) 1996-01-16
EP0340113B1 (de) 1994-09-14

Similar Documents

Publication Publication Date Title
DE68918150D1 (de) Verfahren zum Aufwachsen einer Galliumarsenid-Schicht auf einem Silizium-Substrat.
DE3879143D1 (de) Verfahren zur zuechtung einer beta-siliziumcarbid-einkristall-schicht auf einem siliziumsubstrat.
DE3884682T2 (de) Verfahren zur Züchtung eines Halbleiterkristalles aus III-V-Gruppen-Verbindung auf einem Si-Substrat.
DE69200771D1 (de) Verfahren zum Bilden einer gemusterten Oberfläche auf einem Substrat.
DE3788155D1 (de) Verfahren zum Entfernen von überschüssigem Material auf einer Halbleiterscheibe.
DE3779672T2 (de) Verfahren zum herstellen einer monokristallinen halbleiterschicht.
DE69430097T2 (de) Verfahren zum Kristallisieren einer Siliziumschicht
DE3750169D1 (de) Verfahren zum Ebnen eines Halbleitersubstrates.
DE3686453D1 (de) Verfahren zum herstellen einer duennen halbleiterschicht.
DE69030541T2 (de) Verfahren zum Anbringen einer Wolframschicht auf einem Halbleiterplättchen
DE68928402T2 (de) Verfahren zur Entfernung einer Oxidschicht auf einem Substrat
DE3583183D1 (de) Verfahren zur herstellung eines halbleitersubstrates.
DE3788678T2 (de) Vorrichtung und Verfahren zur Herstellung einer Schicht auf einem Substrat.
DE3784796D1 (de) Verfahren zum verbinden eines halbleiterchips mit einem substrat.
DE69421467T2 (de) Verfahren zum Ablegen einer Dünnschicht auf Basis von einem Titannitrid auf einem transparenten Substrat
DE3581626D1 (de) Photochemisches verfahren zum behandeln einer substratoberflaeche.
DE68914061D1 (de) Verfahren zum Niederschlagen einer Wolframschicht.
DE69222347D1 (de) Verfahren zum selektiven Abscheiden einer TiNx-Schicht durch MOCVD auf einem Halbleiterbauelement
DE69211175D1 (de) Sputterverfahren zum Bilden einer Aluminiumschicht auf einem gestuften Wafer
DE68903008T2 (de) Verfahren zur ziehung eines halbleiter-kristalls.
DE3685279D1 (de) Verfahren zur waermebehandlung eines verbindungshalbleitersubstrats.
DE68912638T2 (de) Verfahren zur Herstellung einer Kristallschicht auf einem Substrat.
DE68908325D1 (de) Verfahren zur herstellung einer indiumphosphid-epitaxialschicht auf einer substratoberflaeche.
DE68921253T2 (de) Verfahren zur Abscheidung einer dünnen Supraleiterschicht.
DE69318271T2 (de) Verfahren zum Wachstum von Verbundhalbleitern auf einer Siliziumscheibe

Legal Events

Date Code Title Description
8332 No legal effect for de