DE68918729T2 - Untereinheit für optoelektronische Bauelemente. - Google Patents

Untereinheit für optoelektronische Bauelemente.

Info

Publication number
DE68918729T2
DE68918729T2 DE68918729T DE68918729T DE68918729T2 DE 68918729 T2 DE68918729 T2 DE 68918729T2 DE 68918729 T DE68918729 T DE 68918729T DE 68918729 T DE68918729 T DE 68918729T DE 68918729 T2 DE68918729 T2 DE 68918729T2
Authority
DE
Germany
Prior art keywords
subunit
optoelectronic components
optoelectronic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
DE68918729T
Other languages
English (en)
Other versions
DE68918729D1 (de
Inventor
Greg E Blonder
Bertrand Harold Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22591028&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE68918729(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of DE68918729D1 publication Critical patent/DE68918729D1/de
Publication of DE68918729T2 publication Critical patent/DE68918729T2/de
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/4277Protection against electromagnetic interference [EMI], e.g. shielding means
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4234Passive alignment along the optical axis and active alignment perpendicular to the optical axis
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G02B6/4231Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
DE68918729T 1988-03-03 1989-02-22 Untereinheit für optoelektronische Bauelemente. Revoked DE68918729T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/163,664 US4897711A (en) 1988-03-03 1988-03-03 Subassembly for optoelectronic devices

Publications (2)

Publication Number Publication Date
DE68918729D1 DE68918729D1 (de) 1994-11-17
DE68918729T2 true DE68918729T2 (de) 1995-02-16

Family

ID=22591028

Family Applications (2)

Application Number Title Priority Date Filing Date
DE68918729T Revoked DE68918729T2 (de) 1988-03-03 1989-02-22 Untereinheit für optoelektronische Bauelemente.
DE68929065T Expired - Fee Related DE68929065T2 (de) 1988-03-03 1989-02-22 Unterbaugruppe für optoelektronische Bauelemente

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE68929065T Expired - Fee Related DE68929065T2 (de) 1988-03-03 1989-02-22 Unterbaugruppe für optoelektronische Bauelemente

Country Status (9)

Country Link
US (1) US4897711A (de)
EP (2) EP0611975B1 (de)
JP (1) JPH0766985B2 (de)
KR (1) KR920003708B1 (de)
CA (1) CA1311042C (de)
DE (2) DE68918729T2 (de)
ES (1) ES2060751T3 (de)
HK (1) HK188795A (de)
SG (1) SG59861G (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10488595B2 (en) 2016-08-12 2019-11-26 Sicoya Gmbh Photonic component and method for producing same

Families Citing this family (177)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8728342D0 (en) * 1987-12-03 1988-01-06 Bt & D Technologies Ltd Light sources
US5037765A (en) * 1988-05-18 1991-08-06 Harris Corporation Method of fabricating integrated circuits including photo optical devices and pressure transducers
US5070596A (en) * 1988-05-18 1991-12-10 Harris Corporation Integrated circuits including photo-optical devices and pressure transducers and method of fabrication
US5073003A (en) * 1988-12-23 1991-12-17 At&T Bell Laboratories Optoelectronic device package method and apparatus
EP1187227A3 (de) * 1989-05-31 2002-08-28 Osram Opto Semiconductors GmbH & Co. OHG Oberflächenmontierbares Opto-Bauelement und Verfahren zum Herstellen desselben
DE58908841D1 (de) * 1989-05-31 1995-02-09 Siemens Ag Oberflächenmontierbares Opto-Bauelement.
US4969712A (en) * 1989-06-22 1990-11-13 Northern Telecom Limited Optoelectronic apparatus and method for its fabrication
US5066090A (en) * 1989-09-12 1991-11-19 Siemens Aktiengesellschaft Optical coupling element having a convex microlens and the method of manufacture
DE3939723C1 (en) * 1989-12-01 1991-02-14 Ant Nachrichtentechnik Gmbh, 7150 Backnang, De Optical or opto-electronic coupling - uses spherical lens received in frusto-pyramidal recess of one part and groove of other part
US5047835A (en) * 1989-12-26 1991-09-10 At&T Bell Laboratories Lightwave packaging for pairs of optical devices
US5006922A (en) * 1990-02-14 1991-04-09 Motorola, Inc. Packaged semiconductor device having a low cost ceramic PGA package
US5181263A (en) * 1990-05-21 1993-01-19 Motorola, Inc. Wave-guide I/O for optical or electro-optical components
GB9014639D0 (en) * 1990-07-02 1990-08-22 British Telecomm Optical component packaging
US5264392A (en) * 1990-07-05 1993-11-23 At&T Bell Laboratories Fabrication technique for silicon-based optical subassemblies
US5113404A (en) * 1990-07-05 1992-05-12 At&T Bell Laboratories Silicon-based optical subassembly
US5109455A (en) * 1990-08-03 1992-04-28 Cts Corporation Optic interface hybrid
US5124281A (en) * 1990-08-27 1992-06-23 At&T Bell Laboratories Method of fabricating a photonics module comprising a spherical lens
US5071213A (en) * 1990-10-31 1991-12-10 The Boeing Company Optical coupler and method of making optical coupler
US5178319A (en) * 1991-04-02 1993-01-12 At&T Bell Laboratories Compression bonding methods
US5241614A (en) * 1991-04-29 1993-08-31 International Business Machines Corporation Apparatus and a method for an optical fiber interface
US5155786A (en) * 1991-04-29 1992-10-13 International Business Machines Corporation Apparatus and a method for an optical fiber interface
US5179609A (en) * 1991-08-30 1993-01-12 At&T Bell Laboratories Optical assembly including fiber attachment
EP0565999A2 (de) * 1992-04-16 1993-10-20 Siemens Aktiengesellschaft Anordnung zur optischen Kopplung von zwei Gruppen von Wellenleitern
DE4220135A1 (de) * 1992-06-15 1993-12-16 Bosch Gmbh Robert Verfahren zum Ankoppeln von Photoelementen an integriert-optische Schaltungen in Polymertechnologie
US5257336A (en) * 1992-08-21 1993-10-26 At&T Bell Laboratories Optical subassembly with passive optical alignment
DE4313486C2 (de) * 1992-11-25 1994-09-01 Ant Nachrichtentech Anordnung zur Ankopplung eines Lichtwellenleiters an mindestens ein lichtaussendendes oder -empfangendes Element
ES2147190T3 (es) * 1992-11-25 2000-09-01 Bosch Gmbh Robert Dispositivo optico.
DE4313493A1 (de) * 1992-11-25 1994-05-26 Ant Nachrichtentech Anordnung zur Ankopplung eines Lichtwellenleiters an ein lichtaussendendes oder -empfangendes Element
US5337398A (en) * 1992-11-30 1994-08-09 At&T Bell Laboratories Single in-line optical package
DE4300652C1 (de) * 1993-01-13 1994-03-31 Bosch Gmbh Robert Verfahren zur Herstellung einer hybrid integrierten optischen Schaltung und Vorrichtung zur Emission von Lichtwellen
DE4301456C1 (de) * 1993-01-20 1994-06-23 Ant Nachrichtentech Anordnung zur Ankopplung eines Lichtwellenleiters
EP0613032B1 (de) * 1993-02-23 1999-01-20 The Whitaker Corporation Faseroptische Kopplungseinrichtung
JP3484543B2 (ja) * 1993-03-24 2004-01-06 富士通株式会社 光結合部材の製造方法及び光装置
CA2117003A1 (en) * 1993-04-13 1994-10-14 Dana Craig Bookbinder Method of encapsulating optical components and products produced by that method
US5390271A (en) * 1993-05-03 1995-02-14 Litton Systems, Inc. Optical interface for hybrid circuit
ES2078863B1 (es) * 1993-09-10 1996-08-01 Telefonica Nacional Espana Co Cabeza optica fotodetectora.
US5625732A (en) * 1993-11-05 1997-04-29 Motorola Optical interface unit with detachable photonic device
US5416870A (en) * 1993-12-03 1995-05-16 Motorola, Inc. Optoelectronic interface device and method with reflective surface
CA2139086C (en) * 1993-12-27 2000-06-13 Kiyoto Matsumoto Light-receiving structure for waveguide type optical devices
US5420953A (en) * 1994-02-17 1995-05-30 The Whitaker Corporation Optoelectronic integration of holograms using (110) oriented silicon on (100) oriented silicon waferboard
US5434940A (en) * 1994-03-24 1995-07-18 The Whitaker Corporation Active fiber needle
DE4416563C1 (de) * 1994-05-11 1995-07-20 Ant Nachrichtentech Anordnung zur Ankopplung von optoelektronischen Komponenten und Lichtwellenleitern aneinander
US5500910A (en) * 1994-06-30 1996-03-19 The Whitaker Corporation Passively aligned holographic WDM
US5479540A (en) * 1994-06-30 1995-12-26 The Whitaker Corporation Passively aligned bi-directional optoelectronic transceiver module assembly
JP3345518B2 (ja) * 1994-09-28 2002-11-18 株式会社東芝 光半導体モジュールの製造方法
DE4436204C1 (de) * 1994-09-29 1996-03-21 Siemens Ag Optische Kopplungsanordnung
US5911022A (en) * 1994-09-29 1999-06-08 Siemens Aktiengesellschaft Optical coupling arrangement
DE4440935A1 (de) * 1994-11-17 1996-05-23 Ant Nachrichtentech Optische Sende- und Empfangseinrichtung
US5717533A (en) 1995-01-13 1998-02-10 Methode Electronics Inc. Removable optoelectronic module
US5546281A (en) 1995-01-13 1996-08-13 Methode Electronics, Inc. Removable optoelectronic transceiver module with potting box
US6220878B1 (en) 1995-10-04 2001-04-24 Methode Electronics, Inc. Optoelectronic module with grounding means
WO1996022177A1 (de) * 1995-01-18 1996-07-25 Robert Bosch Gmbh Anordnung zur umsetzung von optischen in elektrische signale und verfahren zur herstellung
US5694048A (en) * 1995-02-24 1997-12-02 The Whitaker Corporation Monitor-detector assembly on silicon wafer board
US5617036A (en) * 1995-02-24 1997-04-01 The Whitaker Corporation Laser/pin assembly with integrated burn-in assembly
JP3592406B2 (ja) * 1995-07-10 2004-11-24 富士通株式会社 光モジュール及び光モジュールの製造方法
US5604836A (en) * 1995-12-11 1997-02-18 United Technologies Corporation Optical fiber entry strain relief interface for compression-molded structures
WO1997032344A1 (en) * 1996-02-28 1997-09-04 The Whitaker Corporation Packaging for optoelectronic device
US5692084A (en) * 1996-06-11 1997-11-25 The Whitaker Corporation Package for an optoelectronic device
US5692083A (en) * 1996-03-13 1997-11-25 The Whitaker Corporation In-line unitary optical device mount and package therefor
SE510049C2 (sv) * 1996-03-25 1999-04-12 Ericsson Telefon Ab L M Anordning för att ansluta minst en vågledare till en optisk sändare eller mottagare
JPH09307134A (ja) * 1996-05-13 1997-11-28 Fujitsu Ltd 受光素子及びその光モジュール並びに光ユニット
US5764836A (en) * 1996-06-11 1998-06-09 The Whitaker Corporation Pigtailed package for an optoelectronic device
US6178150B1 (en) 1996-07-30 2001-01-23 Seagate Technology Inc. Offset optics for use with optical heads
US6850475B1 (en) 1996-07-30 2005-02-01 Seagate Technology, Llc Single frequency laser source for optical data storage system
US5940549A (en) * 1996-07-30 1999-08-17 Seagate Technology, Incorporated Optical system and method using optical fibers for storage and retrieval of information
US6034938A (en) * 1996-07-30 2000-03-07 Seagate Technology, Inc. Data storage system having an optical processing flying head
US6226233B1 (en) 1996-07-30 2001-05-01 Seagate Technology, Inc. Magneto-optical system utilizing MSR media
US6061323A (en) * 1996-07-30 2000-05-09 Seagate Technology, Inc. Data storage system having an improved surface micro-machined mirror
US6044056A (en) * 1996-07-30 2000-03-28 Seagate Technology, Inc. Flying optical head with dynamic mirror
US6081499A (en) * 1997-05-05 2000-06-27 Seagate Technology, Inc. Magneto-optical data storage system having an optical-processing flying head
US5872880A (en) * 1996-08-12 1999-02-16 Ronald S. Maynard Hybrid-optical multi-axis beam steering apparatus
JP3417767B2 (ja) * 1996-08-29 2003-06-16 株式会社東芝 単結晶部品の製造方法
JP4090512B2 (ja) * 1997-04-08 2008-05-28 日本オプネクスト株式会社 光モジュール
JPH10303466A (ja) 1997-04-28 1998-11-13 Nec Corp 光半導体装置及び製造方法
US5889641A (en) * 1997-05-05 1999-03-30 Seagate Technology, Inc. Magneto-resistive magneto-optical head
WO1998050809A1 (de) * 1997-05-06 1998-11-12 Ascom Tech Ag Ein-/auskoppeleinrichtungen für strahlungsleiter in einem kommunikationsnetz
US6020628A (en) * 1997-07-21 2000-02-01 Olin Corporation Optical component package with a hermetic seal
US6072815A (en) * 1998-02-27 2000-06-06 Litton Systems, Inc. Microlaser submount assembly and associates packaging method
US6240113B1 (en) 1998-02-27 2001-05-29 Litton Systems, Inc. Microlaser-based electro-optic system and associated fabrication method
JPH11274546A (ja) * 1998-03-20 1999-10-08 Oki Electric Ind Co Ltd 半導体受光素子
US6179627B1 (en) 1998-04-22 2001-01-30 Stratos Lightwave, Inc. High speed interface converter module
US6203333B1 (en) 1998-04-22 2001-03-20 Stratos Lightwave, Inc. High speed interface converter module
GB2335504B (en) * 1998-05-28 2000-01-26 Bookham Technology Ltd Assembly of optical component and optical fibre
US6328482B1 (en) 1998-06-08 2001-12-11 Benjamin Bin Jian Multilayer optical fiber coupler
US6521989B2 (en) * 1998-10-08 2003-02-18 Honeywell Inc. Methods and apparatus for hermetically sealing electronic packages
DE19861162A1 (de) 1998-11-06 2000-06-29 Harting Elektrooptische Bauteile Gmbh & Co Kg Verfahren zur Herstellung einer Leiterplatte sowie Leiterplatte
US7208725B2 (en) * 1998-11-25 2007-04-24 Rohm And Haas Electronic Materials Llc Optoelectronic component with encapsulant
US6588949B1 (en) * 1998-12-30 2003-07-08 Honeywell Inc. Method and apparatus for hermetically sealing photonic devices
TW460717B (en) * 1999-03-30 2001-10-21 Toppan Printing Co Ltd Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same
US6213651B1 (en) 1999-05-26 2001-04-10 E20 Communications, Inc. Method and apparatus for vertical board construction of fiber optic transmitters, receivers and transceivers
US7013088B1 (en) 1999-05-26 2006-03-14 Jds Uniphase Corporation Method and apparatus for parallel optical interconnection of fiber optic transmitters, receivers and transceivers
US6873800B1 (en) 1999-05-26 2005-03-29 Jds Uniphase Corporation Hot pluggable optical transceiver in a small form pluggable package
US6632030B2 (en) 1999-05-27 2003-10-14 E20 Communications, Inc. Light bending optical block for fiber optic modules
US6952532B2 (en) * 1999-05-27 2005-10-04 Jds Uniphase Corporation Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US20020030872A1 (en) * 1999-05-27 2002-03-14 Edwin Dair Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US20020033979A1 (en) * 1999-05-27 2002-03-21 Edwin Dair Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US7116912B2 (en) * 1999-05-27 2006-10-03 Jds Uniphase Corporation Method and apparatus for pluggable fiber optic modules
US20040069997A1 (en) * 1999-05-27 2004-04-15 Edwin Dair Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US20010048793A1 (en) * 1999-05-27 2001-12-06 Edwin Dair Method and apparatus for multiboard fiber optic modules and fiber optic module arrays
US20010030789A1 (en) * 1999-05-27 2001-10-18 Wenbin Jiang Method and apparatus for fiber optic modules
US7004644B1 (en) 1999-06-29 2006-02-28 Finisar Corporation Hermetic chip-scale package for photonic devices
DE19929878A1 (de) * 1999-06-29 2001-01-04 Bosch Gmbh Robert Träger zur Montage optoelektronischer Bauteile und Verfahren zur Herstellung
US6220873B1 (en) 1999-08-10 2001-04-24 Stratos Lightwave, Inc. Modified contact traces for interface converter
DE19947113C2 (de) * 1999-09-30 2002-11-14 Infineon Technologies Ag Oberflächenmontierbares faseroptisches Sende- und Empfangsbauelement mit beim Zusammenbau justierbarem Umlenkreceptacle
US6325551B1 (en) 1999-12-08 2001-12-04 New Focus, Inc. Method and apparatus for optically aligning optical fibers with optical devices
US6632029B1 (en) 1999-12-22 2003-10-14 New Focus, Inc. Method & apparatus for packaging high frequency components
US6792178B1 (en) 2000-01-12 2004-09-14 Finisar Corporation Fiber optic header with integrated power monitor
US6642613B1 (en) * 2000-05-09 2003-11-04 National Semiconductor Corporation Techniques for joining an opto-electronic module to a semiconductor package
US6477303B1 (en) * 2000-05-15 2002-11-05 Litton Systems, Inc. MEMS optical backplane interface
US7345316B2 (en) * 2000-10-25 2008-03-18 Shipley Company, L.L.C. Wafer level packaging for optoelectronic devices
US6913400B2 (en) * 2000-11-03 2005-07-05 Tyco Electronics Corporation Optoelectric module for multi-fiber arrays
US6932519B2 (en) 2000-11-16 2005-08-23 Shipley Company, L.L.C. Optical device package
EP1207412A3 (de) * 2000-11-16 2004-03-17 Infineon Technologies AG Optoelektronisches Mikromodul
US6827503B2 (en) * 2000-12-01 2004-12-07 Shipley Company, L.L.C. Optical device package having a configured frame
US6883977B2 (en) * 2000-12-14 2005-04-26 Shipley Company, L.L.C. Optical device package for flip-chip mounting
DE10065624C2 (de) * 2000-12-29 2002-11-14 Hans Kragl Kopplungsanordnung zum optischen Koppeln eines Lichtwellenleiters mit einem elektro-optischen oder opto-elektrischen Halbleiterwandler
US6829419B1 (en) * 2001-03-14 2004-12-07 Zygo Corporation Fiber array alignment
NL1017619C2 (nl) * 2001-03-16 2002-10-07 Koninkl Kpn Nv Methode voor het in een gebouw aanbrengen van een breedband infrastructuur door middel van optische vezels.
US7167499B2 (en) * 2001-04-18 2007-01-23 Tcz Pte. Ltd. Very high energy, high stability gas discharge laser surface treatment system
US20020195417A1 (en) * 2001-04-20 2002-12-26 Steinberg Dan A. Wet and dry etching process on <110> silicon and resulting structures
US6798136B2 (en) * 2001-06-19 2004-09-28 Gelcore Llc Phosphor embedded die epoxy and lead frame modifications
DE10130892C1 (de) * 2001-06-27 2003-03-27 Siemens Ag Gehäuse für elektrische Baugruppen
US7078671B1 (en) 2001-08-06 2006-07-18 Shipley Company, L.L.C. Silicon optical microbench devices and wafer-level testing thereof
US6818464B2 (en) * 2001-10-17 2004-11-16 Hymite A/S Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes
JP2003207694A (ja) * 2002-01-15 2003-07-25 Nec Corp 光モジュール
US6944377B2 (en) 2002-03-15 2005-09-13 Hitachi Maxell, Ltd. Optical communication device and laminated optical communication module
EP1345298A1 (de) * 2002-03-16 2003-09-17 Agilent Technologies, Inc. (a Delaware corporation) Wellenlängenkontrollgerät und Verfahren dafür
US6786654B2 (en) * 2002-08-21 2004-09-07 Hymite A/S Encapsulated optical fiber end-coupled device
KR100624405B1 (ko) * 2002-10-01 2006-09-18 삼성전자주식회사 광부품 실장용 기판 및 그 제조방법
US6856749B2 (en) 2002-10-10 2005-02-15 Fitel Technologies, Inc. Optical coupling and alignment device
KR100499273B1 (ko) * 2002-10-21 2005-07-01 한국전자통신연구원 광 스위치 소자의 패키징을 위한 실리콘 광학 벤치 및이를 이용한 광 스위치 패키지와 그 제조 방법
US20050094949A1 (en) * 2002-10-25 2005-05-05 Jan Mink Hermetically sealed package for an electro-optic device
US6969204B2 (en) * 2002-11-26 2005-11-29 Hymite A/S Optical package with an integrated lens and optical assemblies incorporating the package
US7018580B2 (en) * 2002-12-18 2006-03-28 General Electric Company Method and apparatus for forming tapered waveguide structures
US7263248B2 (en) * 2003-02-11 2007-08-28 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Optical via to pass signals through a printed circuit board
JP3947481B2 (ja) * 2003-02-19 2007-07-18 浜松ホトニクス株式会社 光モジュール及びその製造方法
US7038900B2 (en) * 2003-02-27 2006-05-02 Greatbatch-Sierra, Inc. EMI filter terminal assembly with wire bond pads for human implant applications
DE112004000724B4 (de) 2003-04-30 2021-08-05 Fujikura Ltd. Optischer Transceiver
JP3807385B2 (ja) * 2003-05-14 2006-08-09 セイコーエプソン株式会社 光モジュール及びその製造方法、光通信装置、電子機器
CN100365775C (zh) * 2003-05-23 2008-01-30 罗姆和哈斯电子材料有限责任公司 用于显微机械加工晶体材料的蚀刻方法以及由此方法制备的器件
EP1515364B1 (de) 2003-09-15 2016-04-13 Nuvotronics, LLC Gehäuse und Verfahren zu seiner Herstellung und zu seiner Prüfung
TWM241892U (en) * 2003-10-03 2004-08-21 Foci Fiber Optic Communication A silicon optical bench based bi-directional transceiver module
US7157744B2 (en) * 2003-10-29 2007-01-02 M/A-Com, Inc. Surface mount package for a high power light emitting diode
US7146080B2 (en) * 2004-03-11 2006-12-05 Lambda Crossing, Ltd. Method of connecting an optical element to a PLC
US7224870B2 (en) * 2004-03-11 2007-05-29 Lambda Crossing Method of coupling fiber to waveguide
US20050201668A1 (en) * 2004-03-11 2005-09-15 Avi Neta Method of connecting an optical element at a slope
US7681306B2 (en) * 2004-04-28 2010-03-23 Hymite A/S Method of forming an assembly to house one or more micro components
US7306378B2 (en) * 2004-05-06 2007-12-11 Intel Corporation Method and apparatus providing an electrical-optical coupler
EP1602953A1 (de) * 2004-05-31 2005-12-07 STMicroelectronics S.r.l. Ein Gehäuse für mindestens ein elektro-optisches Element und dessen Montagemethode
US7543999B2 (en) * 2004-09-13 2009-06-09 Hymite A/S Optical module hermetically packaged in micro-machined structures
US7782921B2 (en) * 2005-03-28 2010-08-24 Intel Corporation Integrated optical detector in semiconductor reflector
JP2007003906A (ja) * 2005-06-24 2007-01-11 Toshiba Corp 光伝送路保持部材と光モジュール
CN101401332B (zh) * 2006-03-06 2012-05-30 莫列斯公司 光纤数据链
JP5328095B2 (ja) * 2006-10-27 2013-10-30 京セラ株式会社 光伝送基板、光電子混載基板、光モジュールおよび光電気回路システム
US20090154872A1 (en) * 2007-12-18 2009-06-18 Sherrer David S Electronic device package and method of formation
US8490678B2 (en) * 2008-06-02 2013-07-23 Gerald Ho Kim Silicon-based thermal energy transfer device and apparatus
US9008147B2 (en) * 2008-08-25 2015-04-14 Gerald Ho Kim Silicon-based lens support structure and cooling package with passive alignment for compact heat-generating devices
US9042424B2 (en) * 2008-08-25 2015-05-26 Gerald Ho Kim Silicon-based lens support structure and cooling package with passive alignment for compact heat-generating devices
US8238401B2 (en) * 2008-08-25 2012-08-07 Gerald Ho Kim Silicon-based lens support structure for diode laser
EP2541295B1 (de) 2010-02-23 2017-12-13 Panasonic Intellectual Property Management Co., Ltd. Optisches modul
JP5614724B2 (ja) * 2011-01-31 2014-10-29 日立金属株式会社 光電変換モジュール及び光電変換モジュールの製造方法
JP5610156B2 (ja) 2011-01-31 2014-10-22 日立金属株式会社 光電変換モジュール及び光電変換モジュールの製造方法
US9057850B2 (en) 2011-03-24 2015-06-16 Centera Photonics Inc. Optoelectronic module
US20120241600A1 (en) * 2011-03-24 2012-09-27 Centera Photonics Inc. Optical electrical module
US8940563B2 (en) 2011-03-24 2015-01-27 Centera Photonics Inc. Method for manufacturing optoelectronic module
US9046668B2 (en) 2011-06-22 2015-06-02 Panasonic Intellectual Property Management Co., Ltd. Optical module
US9581772B2 (en) * 2011-09-09 2017-02-28 Centera Photonics Inc. Optical electrical module used for optical communication
US11009788B2 (en) 2011-09-09 2021-05-18 Centera Photonics Inc. Method for manufacturing optical electrical module and substrate of an optical electrical module
TWI468754B (zh) * 2012-04-12 2015-01-11 Ct A Photonics Inc 光電模組
US20130270255A1 (en) * 2012-04-17 2013-10-17 Gerald Ho Kim Silicon-Based Cooling Package With Preheating Capability For Compact Heat-Generating Devices
US9389374B2 (en) * 2013-03-28 2016-07-12 Corning Cable Systems Llc Fiber optic sub-assembly with low profile
KR101741223B1 (ko) * 2015-06-11 2017-05-29 주식회사 지피 다채널 광수신 모듈 및 다채널 광수신 모듈의 광정렬 방법
CN114353022A (zh) 2016-02-04 2022-04-15 提爱思科技股份有限公司 照明装置
US10319654B1 (en) 2017-12-01 2019-06-11 Cubic Corporation Integrated chip scale packages
US10534143B1 (en) 2018-09-20 2020-01-14 Waymo Llc Methods for optical system manufacturing
US20220021179A1 (en) * 2020-07-20 2022-01-20 Apple Inc. Photonic Integrated Circuits with Controlled Collapse Chip Connections
CN114141887A (zh) * 2021-11-22 2022-03-04 纽威仕微电子(无锡)有限公司 一种光电转换电路封装工艺

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7505629A (nl) * 1975-05-14 1976-11-16 Philips Nv Inrichting voor het koppelen van een lichtbron met een optische vezel.
US4119363A (en) * 1976-03-18 1978-10-10 Bell Telephone Laboratories Incorporated Package for optical devices including optical fiber-to-metal hermetic seal
US4143385A (en) * 1976-09-30 1979-03-06 Hitachi, Ltd. Photocoupler
US4130343A (en) * 1977-02-22 1978-12-19 Bell Telephone Laboratories, Incorporated Coupling arrangements between a light-emitting diode and an optical fiber waveguide and between an optical fiber waveguide and a semiconductor optical detector
US4357072A (en) * 1978-01-28 1982-11-02 Plessey Handel Und Investments Ag Sealing optical fibres into packages
US4186994A (en) * 1978-04-21 1980-02-05 Bell Telephone Laboratories, Incorporated Arrangement for coupling between an electrooptic device and an optical fiber
FR2426347A1 (fr) * 1978-05-18 1979-12-14 Thomson Csf Source laser a semi-conducteur et son procede de fabrication
US4301462A (en) * 1978-08-03 1981-11-17 Westinghouse Electric Corp. Light activated silicon switch with etched channel in cathode base and anode emitter communicating with cladded optical fiber
CA1108899A (en) * 1978-08-17 1981-09-15 Paul P. Webb Light detector housing for fiber optic applications
US4210923A (en) * 1979-01-02 1980-07-01 Bell Telephone Laboratories, Incorporated Edge illuminated photodetector with optical fiber alignment
JPS571288A (en) * 1980-06-03 1982-01-06 Fujitsu Ltd Semiconductor light emitting device
JPS5758115A (en) * 1980-09-26 1982-04-07 Toshiba Corp Photocoupler
DE3142918A1 (de) * 1981-10-29 1983-05-11 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Opto-elektrische koppelanordnung
DE3381070D1 (de) * 1982-07-19 1990-02-08 Toshiba Kawasaki Kk Sendeempfangsmodul fuer optische nachrichtenuebermittlung.
JPS5925282A (ja) * 1982-08-02 1984-02-09 Fujitsu Ltd 光伝送路付光半導体パツケ−ジ
JPS5982779A (ja) * 1982-11-02 1984-05-12 Agency Of Ind Science & Technol 光集積回路実装方法
US4611884A (en) * 1982-11-24 1986-09-16 Magnetic Controls Company Bi-directional optical fiber coupler
JPS59185306A (ja) * 1983-04-07 1984-10-20 Agency Of Ind Science & Technol 光集積回路の実装法
JPS6024082A (ja) * 1983-07-19 1985-02-06 Matsushita Electric Ind Co Ltd レ−ザ発振器
US4611886A (en) * 1983-12-29 1986-09-16 At&T Bell Laboratories Integrated optical circuit package
US5009476A (en) * 1984-01-16 1991-04-23 Texas Instruments Incorporated Semiconductor layer with optical communication between chips disposed therein
US4608586A (en) * 1984-05-11 1986-08-26 At&T Bell Laboratories Back-illuminated photodiode with a wide bandgap cap layer
US4699449A (en) * 1985-03-05 1987-10-13 Canadian Patents And Development Limited-Societe Canadienne Des Brevets Et D'exploitation Limitee Optoelectronic assembly and method of making the same
US4695120A (en) * 1985-09-26 1987-09-22 The United States Of America As Represented By The Secretary Of The Army Optic-coupled integrated circuits
US4732446A (en) * 1985-10-02 1988-03-22 Lamar Gipson Electrical circuit and optical data buss
JP2514343B2 (ja) * 1985-10-16 1996-07-10 ブリティシュ・テレコミュニケ−ションズ・パブリック・リミテッド・カンパニ 光素子と光導波路の結合装置
DE3543558C2 (de) * 1985-12-10 1996-09-19 Licentia Gmbh Opto-elektrische Koppelanordnung
US4779946A (en) * 1986-02-14 1988-10-25 American Telephone And Telegraph Company, At&T Bell Laboratories Microminiature optical assembly
US4807238A (en) * 1986-03-12 1989-02-21 Ricoh Co., Ltd. A semiconductor laser device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10488595B2 (en) 2016-08-12 2019-11-26 Sicoya Gmbh Photonic component and method for producing same

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JPH0766985B2 (ja) 1995-07-19
SG59861G (en) 1995-09-01
EP0331331A3 (de) 1991-01-16
KR920003708B1 (ko) 1992-05-09
HK188795A (en) 1995-12-22
KR890015431A (ko) 1989-10-30
EP0611975A1 (de) 1994-08-24
DE68929065D1 (de) 1999-10-07
JPH029183A (ja) 1990-01-12
EP0331331B1 (de) 1994-10-12
EP0331331A2 (de) 1989-09-06
ES2060751T3 (es) 1994-12-01
CA1311042C (en) 1992-12-01
DE68918729D1 (de) 1994-11-17
US4897711A (en) 1990-01-30
EP0611975B1 (de) 1999-09-01
DE68929065T2 (de) 2000-09-28

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