DE68920370T2 - Verfahren zur Herstellung eines piezoelektrischen zusammengesetzten Wandlers. - Google Patents
Verfahren zur Herstellung eines piezoelektrischen zusammengesetzten Wandlers.Info
- Publication number
- DE68920370T2 DE68920370T2 DE68920370T DE68920370T DE68920370T2 DE 68920370 T2 DE68920370 T2 DE 68920370T2 DE 68920370 T DE68920370 T DE 68920370T DE 68920370 T DE68920370 T DE 68920370T DE 68920370 T2 DE68920370 T2 DE 68920370T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing
- piezoelectric composite
- composite transducer
- transducer
- piezoelectric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0633—Cylindrical array
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
- B29C53/02—Bending or folding
- B29C53/04—Bending or folding of plates or sheets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/092—Forming composite materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S84/00—Music
- Y10S84/24—Piezoelectrical transducers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1064—Partial cutting [e.g., grooving or incising]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/108—Flash, trim or excess removal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/219,520 US4869768A (en) | 1988-07-15 | 1988-07-15 | Ultrasonic transducer arrays made from composite piezoelectric materials |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68920370D1 DE68920370D1 (de) | 1995-02-16 |
DE68920370T2 true DE68920370T2 (de) | 1995-07-27 |
Family
ID=22819603
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68920370T Expired - Fee Related DE68920370T2 (de) | 1988-07-15 | 1989-07-10 | Verfahren zur Herstellung eines piezoelektrischen zusammengesetzten Wandlers. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4869768A (de) |
EP (1) | EP0351015B1 (de) |
JP (1) | JPH0267099A (de) |
DE (1) | DE68920370T2 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022003089A1 (de) | 2022-08-23 | 2024-02-29 | Mercedes-Benz Group AG | Signalausgabevorrichtung und Kraftfahrzeug mit einer solchen Signalausgabevorrichtung |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5131382A (en) * | 1989-03-27 | 1992-07-21 | Meyer William F | Endoscopic percutaneous discectomy device |
US5065068A (en) * | 1989-06-07 | 1991-11-12 | Oakley Clyde G | Ferroelectric ceramic transducer |
DE3932959C1 (de) * | 1989-10-03 | 1991-04-11 | Richard Wolf Gmbh, 7134 Knittlingen, De | |
US5044053A (en) * | 1990-05-21 | 1991-09-03 | Acoustic Imaging Technologies Corporation | Method of manufacturing a curved array ultrasonic transducer assembly |
US5424596A (en) * | 1992-10-05 | 1995-06-13 | Trw Inc. | Activated structure |
US5525853A (en) * | 1993-01-21 | 1996-06-11 | Trw Inc. | Smart structures for vibration suppression |
US6252334B1 (en) | 1993-01-21 | 2001-06-26 | Trw Inc. | Digital control of smart structures |
US5423220A (en) * | 1993-01-29 | 1995-06-13 | Parallel Design | Ultrasonic transducer array and manufacturing method thereof |
US5412854A (en) * | 1993-06-18 | 1995-05-09 | Humphrey Instruments, Inc. | Method of making a high frequency focused transducer |
US5415175A (en) * | 1993-09-07 | 1995-05-16 | Acuson Corporation | Broadband phased array transducer design with frequency controlled two dimension capability and methods for manufacture thereof |
US5792058A (en) * | 1993-09-07 | 1998-08-11 | Acuson Corporation | Broadband phased array transducer with wide bandwidth, high sensitivity and reduced cross-talk and method for manufacture thereof |
US5743855A (en) * | 1995-03-03 | 1998-04-28 | Acuson Corporation | Broadband phased array transducer design with frequency controlled two dimension capability and methods for manufacture thereof |
DE69516444T2 (de) | 1994-03-11 | 2001-01-04 | Intravascular Res Ltd | Ultraschall Wandleranordnung und Verfahren zu dessen Herstellung |
US5684884A (en) * | 1994-05-31 | 1997-11-04 | Hitachi Metals, Ltd. | Piezoelectric loudspeaker and a method for manufacturing the same |
US5730113A (en) * | 1995-12-11 | 1998-03-24 | General Electric Company | Dicing saw alignment for array ultrasonic transducer fabrication |
US7226417B1 (en) | 1995-12-26 | 2007-06-05 | Volcano Corporation | High resolution intravascular ultrasound transducer assembly having a flexible substrate |
US5942137A (en) * | 1997-08-29 | 1999-08-24 | Scitex Corporation Ltd. | Method and apparatus for laser scribing grooves on hard crystals |
DE19954020C2 (de) * | 1999-11-10 | 2002-02-28 | Fraunhofer Ges Forschung | Verfahren zur Herstellung eines piezoelektrischen Wandlers |
US6726631B2 (en) * | 2000-08-08 | 2004-04-27 | Ge Parallel Designs, Inc. | Frequency and amplitude apodization of transducers |
US7867178B2 (en) | 2003-02-26 | 2011-01-11 | Sanuwave, Inc. | Apparatus for generating shock waves with piezoelectric fibers integrated in a composite |
US7348712B2 (en) * | 2004-04-16 | 2008-03-25 | Kabushiki Kaisha Toshiba | Ultrasonic probe and ultrasonic diagnostic apparatus |
JP4469928B2 (ja) * | 2004-09-22 | 2010-06-02 | ベックマン・コールター・インコーポレーテッド | 攪拌容器 |
EP2006675B1 (de) * | 2006-04-05 | 2017-11-01 | Nippon Steel & Sumitomo Metal Corporation | Ultraschallfehlernachweisverfahren für einen metallischen röhrenförmigen Körper |
US8093782B1 (en) | 2007-08-14 | 2012-01-10 | University Of Virginia Patent Foundation | Specialized, high performance, ultrasound transducer substrates and related method thereof |
US7804228B2 (en) * | 2007-12-18 | 2010-09-28 | Boston Scientific Scimed, Inc. | Composite passive materials for ultrasound transducers |
US20100171395A1 (en) * | 2008-10-24 | 2010-07-08 | University Of Southern California | Curved ultrasonic array transducers |
US9364863B2 (en) * | 2013-01-23 | 2016-06-14 | Siemens Medical Solutions Usa, Inc. | Method for forming an ultrasound transducer array |
CN105702851B (zh) * | 2014-11-28 | 2018-09-25 | 中国科学院深圳先进技术研究院 | 2-2型压电复合材料及其制备方法 |
DE102017111624A1 (de) | 2017-05-29 | 2018-11-29 | Endress + Hauser Flowtec Ag | Ultraschallwandler |
CN109760243B (zh) * | 2018-12-28 | 2021-04-27 | 广州瑞派医疗器械有限责任公司 | 凸阵式超声波换能器制造设备及方法 |
CN112008959B (zh) * | 2020-08-18 | 2022-02-18 | 长安大学 | 一种用于现场弯折frp筋的装置及弯折方法 |
CN112206004B (zh) * | 2020-09-25 | 2023-08-25 | 飞依诺科技股份有限公司 | 超声探头及其制造方法 |
CN116973458B (zh) * | 2023-09-25 | 2023-12-15 | 中北大学 | 一种压电复合材料阵列结构的制备方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3496617A (en) * | 1967-11-08 | 1970-02-24 | Us Navy | Technique for curving piezoelectric ceramics |
US4250603A (en) * | 1979-04-30 | 1981-02-17 | Honeywell Inc. | Method of making electroded wafer for electro-optic devices |
US4281550A (en) * | 1979-12-17 | 1981-08-04 | North American Philips Corporation | Curved array of sequenced ultrasound transducers |
JPS59229999A (ja) * | 1983-06-10 | 1984-12-24 | Matsushita Electric Ind Co Ltd | 超音波探触子の製造方法 |
DE3437862A1 (de) * | 1983-10-17 | 1985-05-23 | Hitachi Medical Corp., Tokio/Tokyo | Ultraschallwandler und verfahren zu seiner herstellung |
SU1235431A1 (ru) * | 1984-01-27 | 1987-10-07 | Всесоюзный Научно-Исследовательский Институт По Разработке Неразрушающих Методов И Средств Контроля Качества Материалов | Способ изготовлени фокусирующих акустических преобразователей |
US4658176A (en) * | 1984-07-25 | 1987-04-14 | Hitachi, Ltd. | Ultrasonic transducer using piezoelectric composite |
JPH0660896B2 (ja) * | 1984-11-02 | 1994-08-10 | 株式会社日立製作所 | 超音波探触子 |
US4788096A (en) * | 1985-06-06 | 1988-11-29 | Hoechst Celanese Corporation | Devices for making piezoelectric ceramic or ceramic-base composite sensors |
-
1988
- 1988-07-15 US US07/219,520 patent/US4869768A/en not_active Expired - Fee Related
-
1989
- 1989-07-10 DE DE68920370T patent/DE68920370T2/de not_active Expired - Fee Related
- 1989-07-10 EP EP89201819A patent/EP0351015B1/de not_active Expired - Lifetime
- 1989-07-12 JP JP1178183A patent/JPH0267099A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022003089A1 (de) | 2022-08-23 | 2024-02-29 | Mercedes-Benz Group AG | Signalausgabevorrichtung und Kraftfahrzeug mit einer solchen Signalausgabevorrichtung |
Also Published As
Publication number | Publication date |
---|---|
EP0351015A3 (de) | 1991-09-25 |
DE68920370D1 (de) | 1995-02-16 |
EP0351015A2 (de) | 1990-01-17 |
EP0351015B1 (de) | 1995-01-04 |
US4869768A (en) | 1989-09-26 |
JPH0267099A (ja) | 1990-03-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |