DE68921234D1 - Vakuum-Bearbeitungsreaktor. - Google Patents

Vakuum-Bearbeitungsreaktor.

Info

Publication number
DE68921234D1
DE68921234D1 DE68921234T DE68921234T DE68921234D1 DE 68921234 D1 DE68921234 D1 DE 68921234D1 DE 68921234 T DE68921234 T DE 68921234T DE 68921234 T DE68921234 T DE 68921234T DE 68921234 D1 DE68921234 D1 DE 68921234D1
Authority
DE
Germany
Prior art keywords
wafer
gas
electrode
clamp ring
reactor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68921234T
Other languages
English (en)
Other versions
DE68921234T2 (de
Inventor
David Cheng
Dan Maydan
Sasson Somekh
Kenneth R Stalder
Dana L Andrews
Mei Chang
John M White
Jerry Yuen Kui Wong
Vladimir J Zeitlin
David Nin-Kou Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22680079&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE68921234(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of DE68921234D1 publication Critical patent/DE68921234D1/de
Application granted granted Critical
Publication of DE68921234T2 publication Critical patent/DE68921234T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67069Apparatus for fluid treatment for etching for drying etching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32458Vessel
    • H01J37/32477Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32623Mechanical discharge control means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32733Means for moving the material to be treated
    • H01J37/32743Means for moving the material to be treated for introducing the material into processing chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32733Means for moving the material to be treated
    • H01J37/32788Means for moving the material to be treated for extracting the material from the process chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32853Hygiene
    • H01J37/32862In situ cleaning of vessels and/or internal parts
DE68921234T 1988-04-25 1989-04-25 Vakuum-Bearbeitungsreaktor. Expired - Fee Related DE68921234T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/185,215 US4842683A (en) 1986-12-19 1988-04-25 Magnetic field-enhanced plasma etch reactor

Publications (2)

Publication Number Publication Date
DE68921234D1 true DE68921234D1 (de) 1995-03-30
DE68921234T2 DE68921234T2 (de) 1995-06-22

Family

ID=22680079

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68921234T Expired - Fee Related DE68921234T2 (de) 1988-04-25 1989-04-25 Vakuum-Bearbeitungsreaktor.

Country Status (5)

Country Link
US (1) US4842683A (de)
EP (1) EP0339580B1 (de)
JP (2) JP2824079B2 (de)
AT (1) ATE118923T1 (de)
DE (1) DE68921234T2 (de)

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EP0339580A2 (de) 1989-11-02
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EP0339580A3 (en) 1990-11-22
EP0339580B1 (de) 1995-02-22
JPH0215623A (ja) 1990-01-19
DE68921234T2 (de) 1995-06-22
JP2824079B2 (ja) 1998-11-11
US4842683A (en) 1989-06-27

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