DE68922817D1 - Halbleiteranordnungen mit eng beabstandeten Gebieten, hergestellt unter Verwendung eines selbstausrichtenden Umkehrbildverfahrens. - Google Patents

Halbleiteranordnungen mit eng beabstandeten Gebieten, hergestellt unter Verwendung eines selbstausrichtenden Umkehrbildverfahrens.

Info

Publication number
DE68922817D1
DE68922817D1 DE68922817T DE68922817T DE68922817D1 DE 68922817 D1 DE68922817 D1 DE 68922817D1 DE 68922817 T DE68922817 T DE 68922817T DE 68922817 T DE68922817 T DE 68922817T DE 68922817 D1 DE68922817 D1 DE 68922817D1
Authority
DE
Germany
Prior art keywords
manufactured
self
semiconductor devices
closely spaced
image process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68922817T
Other languages
English (en)
Other versions
DE68922817T2 (de
Inventor
Shao-Fu Sanford Chu
San-Mei Ku
Russell C Lange
Joseph Francis Shepard
Paul Ja-Min Tsang
Wen-Yuan Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE68922817D1 publication Critical patent/DE68922817D1/de
Publication of DE68922817T2 publication Critical patent/DE68922817T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8248—Combination of bipolar and field-effect technology
    • H01L21/8249—Bipolar and MOS technology
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/009—Bi-MOS
DE68922817T 1988-10-24 1989-09-26 Halbleiteranordnungen mit eng beabstandeten Gebieten, hergestellt unter Verwendung eines selbstausrichtenden Umkehrbildverfahrens. Expired - Fee Related DE68922817T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/261,952 US5015594A (en) 1988-10-24 1988-10-24 Process of making BiCMOS devices having closely spaced device regions

Publications (2)

Publication Number Publication Date
DE68922817D1 true DE68922817D1 (de) 1995-06-29
DE68922817T2 DE68922817T2 (de) 1995-11-30

Family

ID=22995583

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68922817T Expired - Fee Related DE68922817T2 (de) 1988-10-24 1989-09-26 Halbleiteranordnungen mit eng beabstandeten Gebieten, hergestellt unter Verwendung eines selbstausrichtenden Umkehrbildverfahrens.

Country Status (5)

Country Link
US (1) US5015594A (de)
EP (1) EP0366587B1 (de)
JP (1) JPH07105457B2 (de)
CA (1) CA1300764C (de)
DE (1) DE68922817T2 (de)

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US5223449A (en) * 1989-02-16 1993-06-29 Morris Francis J Method of making an integrated circuit composed of group III-V compound field effect and bipolar semiconductors
US5138420A (en) * 1989-11-24 1992-08-11 Mitsubishi Denki Kabushiki Kaisha Semiconductor device having first and second type field effect transistors separated by a barrier
US5234847A (en) * 1990-04-02 1993-08-10 National Semiconductor Corporation Method of fabricating a BiCMOS device having closely spaced contacts
US5198374A (en) * 1990-04-03 1993-03-30 Oki Electric Industry Co., Ltd. Method of making biCMOS integrated circuit with shallow N-wells
JPH03286562A (ja) * 1990-04-03 1991-12-17 Oki Electric Ind Co Ltd 半導体装置およびその製造方法
US5102809A (en) * 1990-10-11 1992-04-07 Texas Instruments Incorporated SOI BICMOS process
JP2625602B2 (ja) * 1991-01-18 1997-07-02 インターナショナル・ビジネス・マシーンズ・コーポレイション 集積回路デバイスの製造プロセス
US5202591A (en) * 1991-08-09 1993-04-13 Hughes Aircraft Company Dynamic circuit disguise for microelectronic integrated digital logic circuits
JPH05110003A (ja) * 1991-10-16 1993-04-30 Nec Corp 半導体集積回路装置およびその製造方法
JP3175973B2 (ja) * 1992-04-28 2001-06-11 株式会社東芝 半導体装置およびその製造方法
US5376816A (en) * 1992-06-24 1994-12-27 Nec Corporation Bi-cmos integrated circuit device having buried region use in common for bipolar and mos transistors
US5407841A (en) * 1992-10-30 1995-04-18 Hughes Aircraft Company CBiCMOS fabrication method using sacrificial gate poly
JPH07169771A (ja) * 1993-12-15 1995-07-04 Nec Corp 半導体装置及びその製造方法
US5376578A (en) * 1993-12-17 1994-12-27 International Business Machines Corporation Method of fabricating a semiconductor device with raised diffusions and isolation
KR0137974B1 (ko) * 1994-01-19 1998-06-15 김주용 반도체 장치 및 그 제조방법
US5604159A (en) 1994-01-31 1997-02-18 Motorola, Inc. Method of making a contact structure
KR0120572B1 (ko) * 1994-05-04 1997-10-20 김주용 반도체 소자 및 그 제조방법
KR0131723B1 (ko) * 1994-06-08 1998-04-14 김주용 반도체소자 및 그 제조방법
US5432105A (en) * 1994-09-19 1995-07-11 United Microelectronics Corporation Method for fabricating self-aligned polysilicon contacts on FET source/drain areas
US6445043B1 (en) * 1994-11-30 2002-09-03 Agere Systems Isolated regions in an integrated circuit
JPH08172100A (ja) * 1994-12-16 1996-07-02 Mitsubishi Electric Corp 半導体装置
US5571733A (en) * 1995-05-12 1996-11-05 Micron Technology, Inc. Method of forming CMOS integrated circuitry
KR0155536B1 (ko) * 1995-06-24 1998-10-15 양승택 BiCMOS 소자의 제조방법
US5627097A (en) * 1995-07-03 1997-05-06 Motorola, Inc. Method for making CMOS device having reduced parasitic capacitance
US5637525A (en) * 1995-10-20 1997-06-10 Micron Technology, Inc. Method of forming a CMOS circuitry
US5718800A (en) * 1995-11-08 1998-02-17 Micron Technology, Inc. Self-aligned N+/P+ doped polysilicon plugged contacts to N+/P+ doped polysilicon gates and to N+/P+ doped source/drain regions
US5731619A (en) * 1996-05-22 1998-03-24 International Business Machines Corporation CMOS structure with FETS having isolated wells with merged depletions and methods of making same
FR2756101B1 (fr) * 1996-11-19 1999-02-12 Sgs Thomson Microelectronics Procede de fabrication d'un transistor npn dans une technologie bicmos
FR2756103B1 (fr) * 1996-11-19 1999-05-14 Sgs Thomson Microelectronics Fabrication de circuits integres bipolaires/cmos et d'un condensateur
FR2756100B1 (fr) 1996-11-19 1999-02-12 Sgs Thomson Microelectronics Transistor bipolaire a emetteur inhomogene dans un circuit integre bicmos
FR2756104B1 (fr) * 1996-11-19 1999-01-29 Sgs Thomson Microelectronics Fabrication de circuits integres bipolaires/cmos
US5874328A (en) * 1997-06-30 1999-02-23 Advanced Micro Devices, Inc. Reverse CMOS method for dual isolation semiconductor device
US5937287A (en) 1997-07-22 1999-08-10 Micron Technology, Inc. Fabrication of semiconductor structures by ion implantation
US6395623B1 (en) * 1998-08-27 2002-05-28 Micron Technology, Inc. Semiconductor processing methods of forming a contact opening to a conductive line and methods of forming substrate active area source/drain regions
US6177339B1 (en) * 1998-08-27 2001-01-23 Micron Technology, Inc. Semiconductor processing methods of forming integrated circuitry and semiconductor processing methods of forming dynamic random access memory (DRAM) circuitry
US6331481B1 (en) 1999-01-04 2001-12-18 International Business Machines Corporation Damascene etchback for low ε dielectric
US6399993B1 (en) 1999-07-07 2002-06-04 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method for fabricating the same
JP2001085442A (ja) * 1999-09-09 2001-03-30 Mitsubishi Electric Corp トランジスタを備えた半導体装置
CN1252809C (zh) * 1999-09-17 2006-04-19 因芬尼昂技术股份公司 在浅槽中形成深槽以隔离半导体器件的自对准方法
JP4382321B2 (ja) * 1999-12-08 2009-12-09 サムスン エレクトロニクス カンパニー リミテッド 自己整列コンタクト構造体を有する半導体素子及びその製造方法
JP2002237575A (ja) * 2001-02-08 2002-08-23 Sharp Corp 半導体装置及びその製造方法
SE0103036D0 (sv) * 2001-05-04 2001-09-13 Ericsson Telefon Ab L M Semiconductor process and integrated circuit
US6492238B1 (en) 2001-06-22 2002-12-10 International Business Machines Corporation Bipolar transistor with raised extrinsic base fabricated in an integrated BiCMOS circuit
US6566208B2 (en) * 2001-07-25 2003-05-20 Chartered Semiconductor Manufacturing Ltd. Method to form elevated source/drain using poly spacer
US6927476B2 (en) 2001-09-25 2005-08-09 Internal Business Machines Corporation Bipolar device having shallow junction raised extrinsic base and method for making the same
JP4531343B2 (ja) * 2003-03-26 2010-08-25 株式会社半導体エネルギー研究所 駆動回路
US6809024B1 (en) 2003-05-09 2004-10-26 International Business Machines Corporation Method to fabricate high-performance NPN transistors in a BiCMOS process
US6777302B1 (en) * 2003-06-04 2004-08-17 International Business Machines Corporation Nitride pedestal for raised extrinsic base HBT process
US6936522B2 (en) * 2003-06-26 2005-08-30 International Business Machines Corporation Selective silicon-on-insulator isolation structure and method
US20050179111A1 (en) * 2004-02-12 2005-08-18 Iwen Chao Semiconductor device with low resistive path barrier
KR101118652B1 (ko) * 2004-12-17 2012-03-07 삼성전자주식회사 씨모스 공정과 통합될 수 있는 높은 이득을 갖는 바이폴라접합 트랜지스터 및 그 형성 방법
US7648869B2 (en) * 2006-01-12 2010-01-19 International Business Machines Corporation Method of fabricating semiconductor structures for latch-up suppression
US20070158779A1 (en) * 2006-01-12 2007-07-12 International Business Machines Corporation Methods and semiconductor structures for latch-up suppression using a buried damage layer
US7491618B2 (en) * 2006-01-26 2009-02-17 International Business Machines Corporation Methods and semiconductor structures for latch-up suppression using a conductive region
US7276768B2 (en) * 2006-01-26 2007-10-02 International Business Machines Corporation Semiconductor structures for latch-up suppression and methods of forming such semiconductor structures
US20070194403A1 (en) * 2006-02-23 2007-08-23 International Business Machines Corporation Methods for fabricating semiconductor device structures with reduced susceptibility to latch-up and semiconductor device structures formed by the methods
US7754513B2 (en) * 2007-02-28 2010-07-13 International Business Machines Corporation Latch-up resistant semiconductor structures on hybrid substrates and methods for forming such semiconductor structures
US7818702B2 (en) * 2007-02-28 2010-10-19 International Business Machines Corporation Structure incorporating latch-up resistant semiconductor device structures on hybrid substrates
US7808055B2 (en) * 2007-06-21 2010-10-05 Gigadevice Semiconductor Inc. Methods and apparatus for semiconductor memory devices manufacturable using bulk CMOS process manufacturing
US7812367B2 (en) * 2008-10-15 2010-10-12 Semiconductor Components Industries, Llc Two terminal low capacitance multi-channel ESD device
US8039326B2 (en) * 2009-08-20 2011-10-18 Globalfoundries Inc. Methods for fabricating bulk FinFET devices having deep trench isolation
US8581347B2 (en) * 2010-07-22 2013-11-12 Taiwan Semiconductor Manufacturing Company, Ltd. Forming bipolar transistor through fast EPI-growth on polysilicon
US9401410B2 (en) * 2014-11-26 2016-07-26 Texas Instruments Incorporated Poly sandwich for deep trench fill
US20160372360A1 (en) * 2015-06-17 2016-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor structure with junction leakage reduction
CN114695113A (zh) * 2020-12-28 2022-07-01 芯恩（青岛）集成电路有限公司 一种BiCMOS器件及其中的异质结双极晶体管制造方法

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CA1186808A (en) * 1981-11-06 1985-05-07 Sidney I. Soclof Method of fabrication of dielectrically isolated cmos device with an isolated slot
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Also Published As

Publication number Publication date
EP0366587A2 (de) 1990-05-02
EP0366587A3 (de) 1991-04-17
EP0366587B1 (de) 1995-05-24
DE68922817T2 (de) 1995-11-30
JPH02164059A (ja) 1990-06-25
CA1300764C (en) 1992-05-12
JPH07105457B2 (ja) 1995-11-13
US5015594A (en) 1991-05-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee