DE68926033T2 - Herstellungsverfahren für Gross-Matrix-Halbleiterbauelemente - Google Patents
Herstellungsverfahren für Gross-Matrix-HalbleiterbauelementeInfo
- Publication number
- DE68926033T2 DE68926033T2 DE68926033T DE68926033T DE68926033T2 DE 68926033 T2 DE68926033 T2 DE 68926033T2 DE 68926033 T DE68926033 T DE 68926033T DE 68926033 T DE68926033 T DE 68926033T DE 68926033 T2 DE68926033 T2 DE 68926033T2
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- semiconductor devices
- large matrix
- matrix semiconductor
- devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000011159 matrix material Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1604—Production of bubble jet print heads of the edge shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
- H01L21/30608—Anisotropic liquid etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/028—Dicing
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/280,104 US4851371A (en) | 1988-12-05 | 1988-12-05 | Fabricating process for large array semiconductive devices |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68926033D1 DE68926033D1 (de) | 1996-04-25 |
DE68926033T2 true DE68926033T2 (de) | 1996-10-02 |
Family
ID=23071692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68926033T Expired - Fee Related DE68926033T2 (de) | 1988-12-05 | 1989-12-05 | Herstellungsverfahren für Gross-Matrix-Halbleiterbauelemente |
Country Status (4)
Country | Link |
---|---|
US (1) | US4851371A (un) |
EP (1) | EP0376514B1 (un) |
JP (1) | JP2806576B2 (un) |
DE (1) | DE68926033T2 (un) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4985710A (en) * | 1989-11-29 | 1991-01-15 | Xerox Corporation | Buttable subunits for pagewidth "Roofshooter" printheads |
US5098503A (en) * | 1990-05-01 | 1992-03-24 | Xerox Corporation | Method of fabricating precision pagewidth assemblies of ink jet subunits |
GB9010289D0 (en) * | 1990-05-08 | 1990-06-27 | Xaar Ltd | Drop-on-demand printing apparatus and method of manufacture |
US5041190A (en) * | 1990-05-16 | 1991-08-20 | Xerox Corporation | Method of fabricating channel plates and ink jet printheads containing channel plates |
US5079189A (en) * | 1990-06-18 | 1992-01-07 | Xerox Corporation | Method of making RIS or ROS array bars using replaceable subunits |
US5097274A (en) * | 1990-06-18 | 1992-03-17 | Xerox Corporation | Overlapping chip replaceable subunits, methods of making same, and methods of making RIS or ROS array bars incorporating these subunits |
US5068006A (en) * | 1990-09-04 | 1991-11-26 | Xerox Corporation | Thermal ink jet printhead with pre-diced nozzle face and method of fabrication therefor |
US5151389A (en) * | 1990-09-10 | 1992-09-29 | Rockwell International Corporation | Method for dicing semiconductor substrates using an excimer laser beam |
US5136310A (en) * | 1990-09-28 | 1992-08-04 | Xerox Corporation | Thermal ink jet nozzle treatment |
US5160945A (en) * | 1991-05-10 | 1992-11-03 | Xerox Corporation | Pagewidth thermal ink jet printhead |
US5192959A (en) * | 1991-06-03 | 1993-03-09 | Xerox Corporation | Alignment of pagewidth bars |
US5160403A (en) * | 1991-08-09 | 1992-11-03 | Xerox Corporation | Precision diced aligning surfaces for devices such as ink jet printheads |
US5218754A (en) * | 1991-11-08 | 1993-06-15 | Xerox Corporation | Method of manufacturing page wide thermal ink-jet heads |
JP2759165B2 (ja) * | 1992-04-28 | 1998-05-28 | カシオ計算機株式会社 | ウェハ載置用シート拡張方法およびその装置 |
US5387314A (en) | 1993-01-25 | 1995-02-07 | Hewlett-Packard Company | Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining |
US5308442A (en) * | 1993-01-25 | 1994-05-03 | Hewlett-Packard Company | Anisotropically etched ink fill slots in silicon |
US5461406A (en) * | 1994-01-03 | 1995-10-24 | Xerox Corporation | Method and apparatus for elimination of misdirected satellite drops in thermal ink jet printhead |
EP0678904A1 (en) * | 1994-04-12 | 1995-10-25 | Lsi Logic Corporation | Multicut wafer saw process |
US5511428A (en) * | 1994-06-10 | 1996-04-30 | Massachusetts Institute Of Technology | Backside contact of sensor microstructures |
JP3397473B2 (ja) * | 1994-10-21 | 2003-04-14 | キヤノン株式会社 | 液体噴射ヘッド用素子基板を用いた液体噴射ヘッド、該ヘッドを用いた液体噴射装置 |
EP0709201B1 (en) | 1994-10-31 | 2004-03-10 | Canon Kabushiki Kaisha | Ink jet head production method |
EP0709202B1 (en) | 1994-10-31 | 2002-07-03 | Canon Kabushiki Kaisha | Manufacturing method of ink jet head, ink jet head manufactured by same and ink jet device having ink jet head |
US5620614A (en) * | 1995-01-03 | 1997-04-15 | Xerox Corporation | Printhead array and method of producing a printhead die assembly that minimizes end channel damage |
US5729261A (en) * | 1996-03-28 | 1998-03-17 | Xerox Corporation | Thermal ink jet printhead with improved ink resistance |
US5751316A (en) * | 1996-07-01 | 1998-05-12 | Xerox Corporation | Thermal ink jet printhead with ink resistant heat sink coating |
US5901425A (en) | 1996-08-27 | 1999-05-11 | Topaz Technologies Inc. | Inkjet print head apparatus |
US5801727A (en) * | 1996-11-04 | 1998-09-01 | Xerox Corporation | Apparatus and method for printing device |
US5719605A (en) * | 1996-11-20 | 1998-02-17 | Lexmark International, Inc. | Large array heater chips for thermal ink jet printheads |
DE19720892C2 (de) * | 1997-05-17 | 2002-08-08 | Bosch Gmbh Robert | Sensorelement |
US6322201B1 (en) | 1997-10-22 | 2001-11-27 | Hewlett-Packard Company | Printhead with a fluid channel therethrough |
US6339881B1 (en) | 1997-11-17 | 2002-01-22 | Xerox Corporation | Ink jet printhead and method for its manufacture |
US6293270B1 (en) | 1998-06-17 | 2001-09-25 | Canon Kabushiki Kaisha | Manufacturing method of liquid jet recording head, liquid jet recording head manufactured by this manufacturing method, and manufacturing method of element substrate for liquid jet recording head |
US6413839B1 (en) * | 1998-10-23 | 2002-07-02 | Emcore Corporation | Semiconductor device separation using a patterned laser projection |
US6820966B1 (en) | 1998-10-24 | 2004-11-23 | Xaar Technology Limited | Droplet deposition apparatus |
JP2000195827A (ja) * | 1998-12-25 | 2000-07-14 | Oki Electric Ind Co Ltd | Ledアレイチップおよびその製造方法ならびにダイシング装置 |
US6428883B1 (en) | 1999-05-13 | 2002-08-06 | Xerox Corporation | Resinoid dicing blade including a dry lubricant |
JP2001274006A (ja) * | 2000-03-24 | 2001-10-05 | Nippon Sheet Glass Co Ltd | 半導体チップおよびその製造方法 |
US6482574B1 (en) | 2000-04-20 | 2002-11-19 | Hewlett-Packard Co. | Droplet plate architecture in ink-jet printheads |
US6627159B1 (en) * | 2000-06-28 | 2003-09-30 | 3M Innovative Properties Company | Centrifugal filling of sample processing devices |
US8097471B2 (en) * | 2000-11-10 | 2012-01-17 | 3M Innovative Properties Company | Sample processing devices |
US6291317B1 (en) | 2000-12-06 | 2001-09-18 | Xerox Corporation | Method for dicing of micro devices |
DE10127917C1 (de) * | 2001-06-08 | 2002-12-12 | Bosch Gmbh Robert | Gassensor, insbesondere Lambdasonde |
US7125731B2 (en) * | 2001-10-31 | 2006-10-24 | Hewlett-Packard Development Company, L.P. | Drop generator for ultra-small droplets |
US6627467B2 (en) | 2001-10-31 | 2003-09-30 | Hewlett-Packard Development Company, Lp. | Fluid ejection device fabrication |
TWI309074B (en) * | 2002-02-07 | 2009-04-21 | Advanced Epitaxy Technology | Method of forming semiconductor device |
US6871942B2 (en) * | 2002-04-15 | 2005-03-29 | Timothy R. Emery | Bonding structure and method of making |
US7135147B2 (en) * | 2002-07-26 | 2006-11-14 | Applera Corporation | Closing blade for deformable valve in a microfluidic device and method |
AU2003265285A1 (en) * | 2002-07-26 | 2004-02-16 | Applera Corporation | Closing blade for deformable valve in a microfluidic device, and method |
TWI248244B (en) * | 2003-02-19 | 2006-01-21 | J P Sercel Associates Inc | System and method for cutting using a variable astigmatic focal beam spot |
JP4515790B2 (ja) * | 2004-03-08 | 2010-08-04 | 株式会社東芝 | 半導体装置の製造方法及びその製造装置 |
US7087463B2 (en) * | 2004-08-04 | 2006-08-08 | Gelcore, Llc | Laser separation of encapsulated submount |
US20080259134A1 (en) * | 2007-04-20 | 2008-10-23 | Hewlett-Packard Development Company Lp | Print head laminate |
EP2075840B1 (en) * | 2007-12-28 | 2014-08-27 | Semiconductor Energy Laboratory Co., Ltd. | Method for dicing a wafer with semiconductor elements formed thereon and corresponding device |
TW201017863A (en) * | 2008-10-03 | 2010-05-01 | Versitech Ltd | Semiconductor color-tunable broadband light sources and full-color microdisplays |
JP5404331B2 (ja) * | 2008-12-17 | 2014-01-29 | キヤノン株式会社 | インクジェット記録ヘッド、記録素子基板、インクジェット記録ヘッドの製造方法、および記録素子基板の製造方法 |
US8087752B2 (en) * | 2009-01-30 | 2012-01-03 | Fujifilm Corporation | Apparatus for printhead mounting |
US20130256286A1 (en) * | 2009-12-07 | 2013-10-03 | Ipg Microsystems Llc | Laser processing using an astigmatic elongated beam spot and using ultrashort pulses and/or longer wavelengths |
CN102639280A (zh) * | 2009-12-07 | 2012-08-15 | Jp赛席尔联合股份有限公司 | 激光加工及切割系统与方法 |
JP2012096459A (ja) * | 2010-11-02 | 2012-05-24 | Tdk Corp | サーマルヘッド及びこれを用いたサーマルプリンタ |
TWI678289B (zh) * | 2018-12-07 | 2019-12-01 | 謙華科技股份有限公司 | 熱印頭之製造方法 |
JP2022027112A (ja) * | 2020-07-31 | 2022-02-10 | キヤノン株式会社 | 液体吐出ヘッドおよびその製造方法 |
KR102502122B1 (ko) * | 2020-10-08 | 2023-02-23 | 아이티팜 주식회사 | 웨이퍼의 소잉 각도 정합성을 계산하고 판정하는 방법 및 이를 수행하는 시스템 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US32572A (en) * | 1861-06-18 | Safety-guard for steam-boilers | ||
JPS55135673A (en) * | 1979-04-11 | 1980-10-22 | Canon Inc | Recording device |
US4463359A (en) * | 1979-04-02 | 1984-07-31 | Canon Kabushiki Kaisha | Droplet generating method and apparatus thereof |
US4542397A (en) * | 1984-04-12 | 1985-09-17 | Xerox Corporation | Self aligning small scale integrated circuit semiconductor chips to form large area arrays |
US4571599A (en) * | 1984-12-03 | 1986-02-18 | Xerox Corporation | Ink cartridge for an ink jet printer |
USRE32572E (en) * | 1985-04-03 | 1988-01-05 | Xerox Corporation | Thermal ink jet printhead and process therefor |
US4604161A (en) * | 1985-05-02 | 1986-08-05 | Xerox Corporation | Method of fabricating image sensor arrays |
US4612554A (en) * | 1985-07-29 | 1986-09-16 | Xerox Corporation | High density thermal ink jet printhead |
US4638337A (en) * | 1985-08-02 | 1987-01-20 | Xerox Corporation | Thermal ink jet printhead |
JPH0740609B2 (ja) * | 1985-12-20 | 1995-05-01 | セイコー電子工業株式会社 | 半導体装置の製造方法 |
US4678529A (en) * | 1986-07-02 | 1987-07-07 | Xerox Corporation | Selective application of adhesive and bonding process for ink jet printheads |
JPS63108706A (ja) * | 1986-10-27 | 1988-05-13 | Toshiba Corp | 半導体装置の製造方法 |
US4774530A (en) * | 1987-11-02 | 1988-09-27 | Xerox Corporation | Ink jet printhead |
US4829324A (en) * | 1987-12-23 | 1989-05-09 | Xerox Corporation | Large array thermal ink jet printhead |
-
1988
- 1988-12-05 US US07/280,104 patent/US4851371A/en not_active Expired - Lifetime
-
1989
- 1989-11-28 JP JP1308826A patent/JP2806576B2/ja not_active Expired - Fee Related
- 1989-12-05 DE DE68926033T patent/DE68926033T2/de not_active Expired - Fee Related
- 1989-12-05 EP EP89312676A patent/EP0376514B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0376514B1 (en) | 1996-03-20 |
JP2806576B2 (ja) | 1998-09-30 |
US4851371A (en) | 1989-07-25 |
EP0376514A2 (en) | 1990-07-04 |
DE68926033D1 (de) | 1996-04-25 |
EP0376514A3 (en) | 1990-11-22 |
JPH02212162A (ja) | 1990-08-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE68926033D1 (de) | Herstellungsverfahren für Gross-Matrix-Halbleiterbauelemente | |
KR900017166A (ko) | 액티브매트릭스기판의 제조방법 | |
DE69131762T2 (de) | Herstellungsverfahren für Halbleitereinrichtungen | |
KR880701461A (ko) | 반도체 소자 제조공정 | |
DE59406621D1 (de) | Herstellungsverfahren für vertikal kontaktierte halbleiterbauelemente | |
KR880701023A (ko) | 반도체 장치 제조 방법 | |
DE68928847D1 (de) | Fabrikationsverfahren für photonische, integrierte Schaltkreise | |
KR880004552A (ko) | 반도체장치 제조방법 | |
DE69333619D1 (de) | Herstellungsverfahren für Halbleitersubstrate | |
KR900012368A (ko) | 반도체 장치의 제조 방법 | |
KR850006258A (ko) | 반도체장치 제조방법 | |
KR900008644A (ko) | 반도체 장치 제조 방법 | |
DE68925374T2 (de) | Halbleiterherstellungsvorrichtung | |
KR890015368A (ko) | 반도체장치 제조방법 | |
KR880701457A (ko) | 반도체 장치 제조 방법 | |
DE69131241D1 (de) | Herstellungsverfahren für Halbleiteranordnungen | |
DE68928087T2 (de) | Substratsstruktur für zusammengesetztes Halbleiterbauelement | |
KR900008628A (ko) | 반도체 제조장치 | |
KR860000710A (ko) | 반도체장치 제조방법 | |
KR900008697A (ko) | 반도체 웨이퍼 제조방법 | |
KR910001871A (ko) | 반도체 소자 제조방법 | |
BR8707876A (pt) | Processo de fabricacao de dispositivos semicondutores | |
DE69030433D1 (de) | Herstellungsmethode für Halbleiterspeicher | |
KR910005477A (ko) | 반도체 장치의 제조방법 | |
DE69029687T2 (de) | Dotierungsverfahren für Halbleiterbauelemente |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |