DE69013428D1 - Verfahren zum Feststellen von Lageabweichungen. - Google Patents

Verfahren zum Feststellen von Lageabweichungen.

Info

Publication number
DE69013428D1
DE69013428D1 DE69013428T DE69013428T DE69013428D1 DE 69013428 D1 DE69013428 D1 DE 69013428D1 DE 69013428 T DE69013428 T DE 69013428T DE 69013428 T DE69013428 T DE 69013428T DE 69013428 D1 DE69013428 D1 DE 69013428D1
Authority
DE
Germany
Prior art keywords
procedure
determining position
position deviations
deviations
determining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69013428T
Other languages
English (en)
Other versions
DE69013428T2 (de
Inventor
Shigeyuki Suda
Naoto Abe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69013428D1 publication Critical patent/DE69013428D1/de
Publication of DE69013428T2 publication Critical patent/DE69013428T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
DE69013428T 1989-07-18 1990-07-17 Verfahren zum Feststellen von Lageabweichungen. Expired - Fee Related DE69013428T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1186937A JP2704002B2 (ja) 1989-07-18 1989-07-18 位置検出方法

Publications (2)

Publication Number Publication Date
DE69013428D1 true DE69013428D1 (de) 1994-11-24
DE69013428T2 DE69013428T2 (de) 1995-03-30

Family

ID=16197331

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69013428T Expired - Fee Related DE69013428T2 (de) 1989-07-18 1990-07-17 Verfahren zum Feststellen von Lageabweichungen.

Country Status (4)

Country Link
US (1) US5114235A (de)
EP (1) EP0409573B1 (de)
JP (1) JP2704002B2 (de)
DE (1) DE69013428T2 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5294980A (en) * 1988-03-24 1994-03-15 Canon Kabushiki Kaisha Positioning detecting method and apparatus
US5235408A (en) * 1988-09-05 1993-08-10 Canon Kabushiki Kaisha Position detecting method and apparatus
EP0455443B1 (de) * 1990-05-01 1997-11-12 Canon Kabushiki Kaisha Verfahren und Apparat zur Detektion von Lageabweichungen
US5200800A (en) * 1990-05-01 1993-04-06 Canon Kabushiki Kaisha Position detecting method and apparatus
JPH0540013A (ja) * 1991-08-05 1993-02-19 Canon Inc ずれ測定方法及びこの方法を用いた露光装置
US5495336A (en) * 1992-02-04 1996-02-27 Canon Kabushiki Kaisha Position detecting method for detecting a positional relationship between a first object and a second object
JP3008654B2 (ja) * 1992-02-21 2000-02-14 キヤノン株式会社 位置検出装置
US5455679A (en) * 1993-02-22 1995-10-03 Canon Kabushiki Kaisha Position detecting system
JP3306972B2 (ja) * 1993-02-26 2002-07-24 キヤノン株式会社 位置検出装置及びそれを用いた半導体素子の製造方法
US6689519B2 (en) 2000-05-04 2004-02-10 Kla-Tencor Technologies Corp. Methods and systems for lithography process control
US7317531B2 (en) * 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US7541201B2 (en) 2000-08-30 2009-06-02 Kla-Tencor Technologies Corporation Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
US7130029B2 (en) * 2000-09-20 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for determining an adhesion characteristic and a thickness of a specimen
US7106425B1 (en) 2000-09-20 2006-09-12 Kla-Tencor Technologies Corp. Methods and systems for determining a presence of defects and a thin film characteristic of a specimen
US6694284B1 (en) 2000-09-20 2004-02-17 Kla-Tencor Technologies Corp. Methods and systems for determining at least four properties of a specimen
EP1319244A1 (de) 2000-09-20 2003-06-18 Kla-Tencor Inc. Methode und system zur halbleiterherstellung
US7349090B2 (en) * 2000-09-20 2008-03-25 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US6782337B2 (en) 2000-09-20 2004-08-24 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension an a presence of defects on a specimen
US6673637B2 (en) 2000-09-20 2004-01-06 Kla-Tencor Technologies Methods and systems for determining a presence of macro defects and overlay of a specimen
US6919957B2 (en) * 2000-09-20 2005-07-19 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen
US6812045B1 (en) 2000-09-20 2004-11-02 Kla-Tencor, Inc. Methods and systems for determining a characteristic of a specimen prior to, during, or subsequent to ion implantation
US20030002043A1 (en) 2001-04-10 2003-01-02 Kla-Tencor Corporation Periodic patterns and technique to control misalignment
US6731380B2 (en) * 2001-06-18 2004-05-04 Applied Optics Center Of Delaware, Inc. Method and apparatus for simultaneous measurement of the refractive index and thickness of thin films
US6724479B2 (en) * 2001-09-28 2004-04-20 Infineon Technologies Ag Method for overlay metrology of low contrast features
US7440105B2 (en) * 2002-12-05 2008-10-21 Kla-Tencor Technologies Corporation Continuously varying offset mark and methods of determining overlay
WO2008007363A2 (en) * 2006-07-11 2008-01-17 Camtek Ltd System and method for probe mark analysis
US10451412B2 (en) 2016-04-22 2019-10-22 Kla-Tencor Corporation Apparatus and methods for detecting overlay errors using scatterometry
US20200402871A1 (en) * 2019-06-24 2020-12-24 Magic Leap, Inc. Polymer patterned disk stack manufacturing

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4037969A (en) * 1976-04-02 1977-07-26 Bell Telephone Laboratories, Incorporated Zone plate alignment marks
US4326805A (en) * 1980-04-11 1982-04-27 Bell Telephone Laboratories, Incorporated Method and apparatus for aligning mask and wafer members
FR2538923A1 (fr) * 1982-12-30 1984-07-06 Thomson Csf Procede et dispositif d'alignement optique de motifs dans deux plans rapproches dans un appareil d'exposition comprenant une source de rayonnement divergent
US4614433A (en) * 1984-07-09 1986-09-30 At&T Bell Laboratories Mask-to-wafer alignment utilizing zone plates
US4838693A (en) * 1986-06-11 1989-06-13 Kabushiki Kaisha Toshiba Method and apparatus for setting a gap between first and second objects to a predetermined distance
JPH01285803A (ja) * 1988-05-13 1989-11-16 Fujitsu Ltd フレネル・ゾーン・プレートおよびそれを用いる位置合せ方法

Also Published As

Publication number Publication date
EP0409573A3 (en) 1991-10-23
EP0409573A2 (de) 1991-01-23
DE69013428T2 (de) 1995-03-30
EP0409573B1 (de) 1994-10-19
US5114235A (en) 1992-05-19
JP2704002B2 (ja) 1998-01-26
JPH0348706A (ja) 1991-03-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee