DE69026925D1 - Vorrichtung mit trockener Thermoschnittstelle zur Prüfung von Halbleiterchips - Google Patents

Vorrichtung mit trockener Thermoschnittstelle zur Prüfung von Halbleiterchips

Info

Publication number
DE69026925D1
DE69026925D1 DE69026925T DE69026925T DE69026925D1 DE 69026925 D1 DE69026925 D1 DE 69026925D1 DE 69026925 T DE69026925 T DE 69026925T DE 69026925 T DE69026925 T DE 69026925T DE 69026925 D1 DE69026925 D1 DE 69026925D1
Authority
DE
Germany
Prior art keywords
semiconductor chips
thermal interface
testing semiconductor
dry thermal
dry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69026925T
Other languages
English (en)
Inventor
Anthony John Abrami
Stuart Howard Bullard
Puerto Santiago Ernesto Del
Paul Matthew Gaschke
Mark Raymond Laforce
Paul Joseph Roggemann
Kort Foster Longenbach
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69026925D1 publication Critical patent/DE69026925D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
DE69026925T 1990-01-24 1990-12-12 Vorrichtung mit trockener Thermoschnittstelle zur Prüfung von Halbleiterchips Expired - Lifetime DE69026925D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/469,110 US5001423A (en) 1990-01-24 1990-01-24 Dry interface thermal chuck temperature control system for semiconductor wafer testing

Publications (1)

Publication Number Publication Date
DE69026925D1 true DE69026925D1 (de) 1996-06-13

Family

ID=23862465

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69026925T Expired - Lifetime DE69026925D1 (de) 1990-01-24 1990-12-12 Vorrichtung mit trockener Thermoschnittstelle zur Prüfung von Halbleiterchips

Country Status (4)

Country Link
US (1) US5001423A (de)
EP (1) EP0438957B1 (de)
JP (1) JPH07105423B2 (de)
DE (1) DE69026925D1 (de)

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Also Published As

Publication number Publication date
EP0438957A2 (de) 1991-07-31
EP0438957A3 (en) 1992-07-22
US5001423A (en) 1991-03-19
JPH0653298A (ja) 1994-02-25
JPH07105423B2 (ja) 1995-11-13
EP0438957B1 (de) 1996-05-08

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