DE69034090D1 - Halbleitervorrichtung zur Detektion oder Emission von Magnetfeldlinien oder Licht - Google Patents
Halbleitervorrichtung zur Detektion oder Emission von Magnetfeldlinien oder LichtInfo
- Publication number
- DE69034090D1 DE69034090D1 DE69034090T DE69034090T DE69034090D1 DE 69034090 D1 DE69034090 D1 DE 69034090D1 DE 69034090 T DE69034090 T DE 69034090T DE 69034090 T DE69034090 T DE 69034090T DE 69034090 D1 DE69034090 D1 DE 69034090D1
- Authority
- DE
- Germany
- Prior art keywords
- emission
- detection
- light
- semiconductor device
- magnetic field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001514 detection method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0403—Mechanical elements; Supports for optical elements; Scanning arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02216—Butterfly-type, i.e. with electrode pins extending horizontally from the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0232—Lead-frames
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
- Y10S425/228—Injection plunger or ram: transfer molding type
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12531189 | 1989-05-18 | ||
JP1125311A JPH0783082B2 (ja) | 1989-05-18 | 1989-05-18 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69034090D1 true DE69034090D1 (de) | 2003-08-21 |
DE69034090T2 DE69034090T2 (de) | 2004-04-15 |
Family
ID=14906966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69034090T Expired - Fee Related DE69034090T2 (de) | 1989-05-18 | 1990-05-04 | Halbleitervorrichtung zur Detektion oder Emission von Magnetfeldlinien oder Licht |
Country Status (5)
Country | Link |
---|---|
US (2) | US5025305A (de) |
EP (1) | EP0398088B1 (de) |
JP (1) | JPH0783082B2 (de) |
KR (1) | KR930002802B1 (de) |
DE (1) | DE69034090T2 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3127555B2 (ja) * | 1992-04-02 | 2001-01-29 | 富士電機株式会社 | 透明樹脂封止形半導体素子の成形用金型、およびその半導体素子の成形方法 |
EP0741395A1 (de) | 1995-05-04 | 1996-11-06 | AT&T IPM Corp. | Anschluss-montierbare planare magnetischen Vorrichtung und ihr Herstellungsverfahren |
EP0741396A1 (de) * | 1995-05-04 | 1996-11-06 | AT&T IPM Corp. | Magnetische Leistungsvorrichtung mit drahtlose Leiterplattenanschluss und ihr Herstellungsverfahren |
DE19518027C2 (de) * | 1995-05-17 | 1997-05-15 | Lust Hybrid Technik Gmbh | Verfahren zur abstandsgenauen Umhüllung mit funktionstragenden Schichten versehener Bauelemente und danach hergestellte Bauelemente |
US6384407B1 (en) | 1998-11-12 | 2002-05-07 | Tab Products Co | Infrared receiver mount with directional reception capabilities |
US6740870B1 (en) * | 1998-11-18 | 2004-05-25 | Micron Technology, Inc. | Clear plastic packaging in a CMOS active pixel image sensor |
TWI255346B (en) * | 2002-07-29 | 2006-05-21 | Yamaha Corp | Manufacturing method for magnetic sensor and lead frame therefor |
DE10234585B4 (de) * | 2002-07-30 | 2004-07-22 | Behr-Hella Thermocontrol Gmbh | Optoelektronisches SMD-Bauteil für den Empfang von elektromagnetischer Strahlung, insbesondere Sonnenlicht, und dessen Verwendung in einem Strahlungssensor |
US7016802B2 (en) | 2003-09-05 | 2006-03-21 | Tyco Electronics Corporation | Photocontrol devices having flexible mounted photosensors and methods of calibrating the same |
US7547876B2 (en) | 2007-08-23 | 2009-06-16 | Tyco Electronics Corporation | Photocontrol devices and methods for forming the same |
US20100038519A1 (en) * | 2008-08-12 | 2010-02-18 | Cho-Yi Lin | Image Sensing Module |
DE102008048259A1 (de) * | 2008-09-22 | 2010-04-08 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauteil |
EP2590236A1 (de) * | 2011-11-07 | 2013-05-08 | Odelo GmbH | Leuchtdiode und Leuchtmittel mit wenigstens zwei Leuchtdioden als Lichtquellen |
JP5814863B2 (ja) * | 2012-06-07 | 2015-11-17 | 株式会社村田製作所 | 電子部品の製造方法 |
JP2016039213A (ja) | 2014-08-06 | 2016-03-22 | ローム株式会社 | 基板内蔵パッケージ、半導体装置およびモジュール |
CN211297011U (zh) * | 2019-06-15 | 2020-08-18 | 徐晓军 | 一种低成本且便于使用的插脚式灯珠 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1950354A (en) * | 1932-01-16 | 1934-03-06 | Bats Jean Hubert Louis De | Improved pressure molding method |
US2378480A (en) * | 1943-10-15 | 1945-06-19 | Tennessee Coal | Anode mold |
US3740672A (en) * | 1971-11-22 | 1973-06-19 | Rca Corp | Semiconductor carrier for microwave applications |
JPS6080357A (ja) * | 1983-10-08 | 1985-05-08 | Ricoh Co Ltd | 電子回路担持装置 |
JPS6256111A (ja) * | 1985-09-05 | 1987-03-11 | Sony Corp | 樹脂封止金型 |
JPS62260384A (ja) * | 1986-05-06 | 1987-11-12 | Mitsubishi Electric Corp | 半導体装置 |
JPS6384054A (ja) * | 1986-09-29 | 1988-04-14 | Hitachi Ltd | 樹脂封止型半導体装置 |
JPH01270256A (ja) * | 1988-04-21 | 1989-10-27 | Mitsubishi Electric Corp | 半導体装置 |
-
1989
- 1989-05-18 JP JP1125311A patent/JPH0783082B2/ja not_active Expired - Fee Related
-
1990
- 1990-05-01 US US07/517,294 patent/US5025305A/en not_active Expired - Lifetime
- 1990-05-04 DE DE69034090T patent/DE69034090T2/de not_active Expired - Fee Related
- 1990-05-04 EP EP90108435A patent/EP0398088B1/de not_active Expired - Lifetime
- 1990-05-17 KR KR1019900007078A patent/KR930002802B1/ko not_active IP Right Cessation
-
1991
- 1991-05-09 US US07/698,159 patent/US5122045A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5025305A (en) | 1991-06-18 |
EP0398088B1 (de) | 2003-07-16 |
US5122045A (en) | 1992-06-16 |
JPH0783082B2 (ja) | 1995-09-06 |
EP0398088A1 (de) | 1990-11-22 |
DE69034090T2 (de) | 2004-04-15 |
JPH02303176A (ja) | 1990-12-17 |
KR900019205A (ko) | 1990-12-24 |
KR930002802B1 (ko) | 1993-04-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |