DE69107685D1 - Vorrichtung zum Abscheiden von Dispersionsüberzügen. - Google Patents

Vorrichtung zum Abscheiden von Dispersionsüberzügen.

Info

Publication number
DE69107685D1
DE69107685D1 DE69107685T DE69107685T DE69107685D1 DE 69107685 D1 DE69107685 D1 DE 69107685D1 DE 69107685 T DE69107685 T DE 69107685T DE 69107685 T DE69107685 T DE 69107685T DE 69107685 D1 DE69107685 D1 DE 69107685D1
Authority
DE
Germany
Prior art keywords
dispersion coatings
depositing
depositing dispersion
coatings
dispersion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69107685T
Other languages
English (en)
Other versions
DE69107685T2 (de
Inventor
Sowjun Matsumura
Tadashi Chiba
Takayuki Nakamura
Masahiro Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Original Assignee
Uemera Kogyo Co Ltd
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uemera Kogyo Co Ltd, C Uyemura and Co Ltd filed Critical Uemera Kogyo Co Ltd
Application granted granted Critical
Publication of DE69107685D1 publication Critical patent/DE69107685D1/de
Publication of DE69107685T2 publication Critical patent/DE69107685T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
DE69107685T 1990-06-06 1991-06-05 Vorrichtung zum Abscheiden von Dispersionsüberzügen. Expired - Fee Related DE69107685T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14798990 1990-06-06

Publications (2)

Publication Number Publication Date
DE69107685D1 true DE69107685D1 (de) 1995-04-06
DE69107685T2 DE69107685T2 (de) 1995-06-29

Family

ID=15442646

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69107685T Expired - Fee Related DE69107685T2 (de) 1990-06-06 1991-06-05 Vorrichtung zum Abscheiden von Dispersionsüberzügen.

Country Status (3)

Country Link
US (1) US5217536A (de)
EP (1) EP0460645B1 (de)
DE (1) DE69107685T2 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3391113B2 (ja) * 1994-10-07 2003-03-31 豊田合成株式会社 複合めっき方法
US5938845A (en) * 1995-10-20 1999-08-17 Aiwa Co., Ltd. Uniform heat distribution apparatus and method for electroless nickel plating in fabrication of thin film head gaps
US5597460A (en) * 1995-11-13 1997-01-28 Reynolds Tech Fabricators, Inc. Plating cell having laminar flow sparger
ES2109893B1 (es) * 1996-07-26 1998-08-16 Urquima Sa Procedimiento de preparacion industrial mediante fosforilacion con pentoxido de fosforo.
US5683564A (en) * 1996-10-15 1997-11-04 Reynolds Tech Fabricators Inc. Plating cell and plating method with fluid wiper
US6036837A (en) * 1998-11-02 2000-03-14 Celex, Incorporated Process and machine for partially plating test probes
US6428857B1 (en) * 2001-02-20 2002-08-06 Xerox Corporation Method for purging stagnant coating solution
US7341634B2 (en) * 2002-08-27 2008-03-11 Ebara Corporation Apparatus for and method of processing substrate
JP3930832B2 (ja) * 2003-06-06 2007-06-13 株式会社山本鍍金試験器 水槽
DE10345379B3 (de) * 2003-09-30 2005-06-02 Advanced Micro Devices, Inc., Sunnyvale Vorratstank für Prozessflüssigkeiten mit einer reduzierten Menge an Blasen und Verfahren zum Betreiben desselben
DE102005004361B4 (de) 2005-01-31 2006-12-07 Advanced Micro Devices, Inc., Sunnyvale Vorrichtung und Verfahren zum Entfernen von Blasen aus einer Prozessflüssigkeit
US7842176B2 (en) * 2006-07-17 2010-11-30 Yen-Chen Liao Method for horizontally electroplating, electro deposition and electroless-plating thin film on substrate
WO2011003957A1 (de) * 2009-07-07 2011-01-13 Herbert Schmidt Gmbh & Co. Kg Nickelsystem
DE102013020391A1 (de) * 2013-12-10 2015-06-11 Polysecure Gmbh Markierter Schichtaufbau, Verfahren zu dessen Herstellung und Verwendung desselben
CN105363646A (zh) * 2015-10-08 2016-03-02 遵义市润丰源钢铁铸造有限公司 一种循环搅拌的涂料槽
JP6895927B2 (ja) 2018-05-28 2021-06-30 三菱電機株式会社 半導体装置の製造装置および半導体装置の製造方法
CN109989096A (zh) * 2019-03-22 2019-07-09 广州明毅电子机械有限公司 一种电镀子母槽装置
CN112853434B (zh) * 2020-12-21 2022-06-03 温州佳宝电镀设备有限公司 一种具有搅拌结构的电镀池
CN113668034B (zh) * 2021-06-29 2023-10-10 安徽理工大学 一种镁合金微弧氧化处理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1740979A (en) * 1927-03-05 1929-12-24 Midland Bank Method for mixing pigments
US3045315A (en) * 1960-11-02 1962-07-24 Du Pont Apparatus for orienting continuous filament yarns
US3117064A (en) * 1961-07-03 1964-01-07 Consolidation Coal Co Shock heater
JPS55121250A (en) * 1979-03-12 1980-09-18 Mitsubishi Electric Corp Fluorescence
JPS6045716B2 (ja) * 1982-05-21 1985-10-11 上村工業株式会社 複合めつき方法
DE3333121A1 (de) * 1983-09-14 1985-03-28 AHC-Oberflächentechnik, Friebe & Reininghaus GmbH & Co KG, 5014 Kerpen Dispersionsschichten
US4634503A (en) * 1984-06-27 1987-01-06 Daniel Nogavich Immersion electroplating system
US4805553A (en) * 1986-10-27 1989-02-21 Morton Thiokol, Inc. Apparatus for bailout elimination and for enhancing plating bath stability in electrosynthesis/electrodialysis electroless copper purification process

Also Published As

Publication number Publication date
US5217536A (en) 1993-06-08
EP0460645A1 (de) 1991-12-11
DE69107685T2 (de) 1995-06-29
EP0460645B1 (de) 1995-03-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee