DE69129888T2 - Wärmesenke für elektronische Schaltung - Google Patents

Wärmesenke für elektronische Schaltung

Info

Publication number
DE69129888T2
DE69129888T2 DE69129888T DE69129888T DE69129888T2 DE 69129888 T2 DE69129888 T2 DE 69129888T2 DE 69129888 T DE69129888 T DE 69129888T DE 69129888 T DE69129888 T DE 69129888T DE 69129888 T2 DE69129888 T2 DE 69129888T2
Authority
DE
Germany
Prior art keywords
heat sink
electronic circuit
electronic
circuit
sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69129888T
Other languages
English (en)
Other versions
DE69129888D1 (de
Inventor
D W Dahringer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of DE69129888D1 publication Critical patent/DE69129888D1/de
Application granted granted Critical
Publication of DE69129888T2 publication Critical patent/DE69129888T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
DE69129888T 1990-10-19 1991-10-15 Wärmesenke für elektronische Schaltung Expired - Fee Related DE69129888T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/599,947 US5049981A (en) 1990-10-19 1990-10-19 Heat sink for electronic circitry

Publications (2)

Publication Number Publication Date
DE69129888D1 DE69129888D1 (de) 1998-09-03
DE69129888T2 true DE69129888T2 (de) 1998-12-24

Family

ID=24401772

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69129888T Expired - Fee Related DE69129888T2 (de) 1990-10-19 1991-10-15 Wärmesenke für elektronische Schaltung

Country Status (9)

Country Link
US (1) US5049981A (de)
EP (1) EP0481721B1 (de)
JP (1) JP3046416B2 (de)
KR (1) KR100231222B1 (de)
CN (1) CN1060924A (de)
CA (1) CA2050374C (de)
DE (1) DE69129888T2 (de)
HK (1) HK1003462A1 (de)
SG (1) SG46633A1 (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2708191B2 (ja) * 1988-09-20 1998-02-04 株式会社日立製作所 半導体装置
KR0158868B1 (ko) * 1988-09-20 1998-12-01 미다 가쓰시게 반도체장치
GB9014491D0 (en) * 1990-06-29 1990-08-22 Digital Equipment Int Mounting silicon chips
US5434524A (en) * 1992-09-16 1995-07-18 International Business Machines Corporation Method of clocking integrated circuit chips
US5313097A (en) * 1992-11-16 1994-05-17 International Business Machines, Corp. High density memory module
US5299090A (en) * 1993-06-29 1994-03-29 At&T Bell Laboratories Pin-fin heat sink
US5550326A (en) * 1994-07-13 1996-08-27 Parker-Hannifin Corporation Heat dissipator for electronic components
US5745344A (en) * 1995-11-06 1998-04-28 International Business Machines Corporation Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device
US5778523A (en) * 1996-11-08 1998-07-14 W. L. Gore & Associates, Inc. Method for controlling warp of electronic assemblies by use of package stiffener
US6705388B1 (en) 1997-11-10 2004-03-16 Parker-Hannifin Corporation Non-electrically conductive thermal dissipator for electronic components
US6177728B1 (en) * 1998-04-28 2001-01-23 International Business Machines Corporation Integrated circuit chip device having balanced thermal expansion
US20080019097A1 (en) * 2005-10-11 2008-01-24 General Electric Company Thermal transport structure
US7440280B2 (en) * 2006-03-31 2008-10-21 Hong Kong Applied Science & Technology Research Institute Co., Ltd Heat exchange enhancement
US20070230185A1 (en) * 2006-03-31 2007-10-04 Shuy Geoffrey W Heat exchange enhancement
US7593229B2 (en) * 2006-03-31 2009-09-22 Hong Kong Applied Science & Technology Research Institute Co. Ltd Heat exchange enhancement
EP2232656A4 (de) 2007-12-17 2014-04-16 Ii Vi Laser Entpr Gmbh Laseremittermodule und zusammenbauverfahren
US8804246B2 (en) 2008-05-08 2014-08-12 Ii-Vi Laser Enterprise Gmbh High brightness diode output methods and devices
US20100177796A1 (en) * 2009-01-09 2010-07-15 Newport Corporation Laser device and heat sink with core to manage stress due to thermal expansion
JP5740654B2 (ja) 2010-01-22 2015-06-24 トゥー−シックス レイザー エンタープライズ ゲーエムベーハー 遠視野ファイバ結合放射の均質化
JP5384443B2 (ja) * 2010-07-28 2014-01-08 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
US8644357B2 (en) 2011-01-11 2014-02-04 Ii-Vi Incorporated High reliability laser emitter modules
CN103369745B (zh) * 2012-03-30 2015-09-02 张鸿鸣 耐腐蚀散热片和耐腐蚀发热片
CN110447166B (zh) 2017-04-10 2022-03-29 株式会社村田制作所 热电变换元件模块

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4227036A (en) * 1978-09-18 1980-10-07 Microwave Semiconductor Corp. Composite flanged ceramic package for electronic devices
US4408220A (en) * 1981-01-29 1983-10-04 Calabro Anthony Denis Heat dissipator for a dual in line integrated circuit package
GB8818957D0 (en) * 1988-08-10 1988-09-14 Marconi Electronic Devices Semiconductor devices

Also Published As

Publication number Publication date
DE69129888D1 (de) 1998-09-03
CN1060924A (zh) 1992-05-06
EP0481721B1 (de) 1998-07-29
KR920008902A (ko) 1992-05-28
JP3046416B2 (ja) 2000-05-29
US5049981A (en) 1991-09-17
HK1003462A1 (en) 1998-10-30
SG46633A1 (en) 1998-02-20
KR100231222B1 (ko) 1999-11-15
JPH04298068A (ja) 1992-10-21
CA2050374A1 (en) 1992-04-20
EP0481721A1 (de) 1992-04-22
CA2050374C (en) 1996-06-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee