DE69130205T2 - Heizungsapparat für eine Halbleiterscheibe und Verfahren zum Herstellen desselben - Google Patents

Heizungsapparat für eine Halbleiterscheibe und Verfahren zum Herstellen desselben

Info

Publication number
DE69130205T2
DE69130205T2 DE69130205T DE69130205T DE69130205T2 DE 69130205 T2 DE69130205 T2 DE 69130205T2 DE 69130205 T DE69130205 T DE 69130205T DE 69130205 T DE69130205 T DE 69130205T DE 69130205 T2 DE69130205 T2 DE 69130205T2
Authority
DE
Germany
Prior art keywords
manufacturing
same
semiconductor wafer
wafer heater
heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69130205T
Other languages
English (en)
Other versions
DE69130205D1 (de
Inventor
Yusuke Niori
Kazuhiro Nobori
Ryusuke Ushikoshi
Koichi Umemoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP30328991A external-priority patent/JPH0750736B2/ja
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of DE69130205D1 publication Critical patent/DE69130205D1/de
Application granted granted Critical
Publication of DE69130205T2 publication Critical patent/DE69130205T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/23—Chucks or sockets with magnetic or electrostatic means
DE69130205T 1990-12-25 1991-12-23 Heizungsapparat für eine Halbleiterscheibe und Verfahren zum Herstellen desselben Expired - Lifetime DE69130205T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP41800690 1990-12-25
JP30328991A JPH0750736B2 (ja) 1990-12-25 1991-11-19 ウエハー加熱装置及びその製造方法

Publications (2)

Publication Number Publication Date
DE69130205D1 DE69130205D1 (de) 1998-10-22
DE69130205T2 true DE69130205T2 (de) 1999-03-25

Family

ID=26563477

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69130205T Expired - Lifetime DE69130205T2 (de) 1990-12-25 1991-12-23 Heizungsapparat für eine Halbleiterscheibe und Verfahren zum Herstellen desselben

Country Status (3)

Country Link
US (1) US5280156A (de)
EP (1) EP0493089B1 (de)
DE (1) DE69130205T2 (de)

Families Citing this family (202)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180061B1 (en) 1992-05-11 2001-01-30 Cytologix Corporation Moving platform slide stainer with heating elements
US20040191128A1 (en) * 1992-05-11 2004-09-30 Cytologix Corporation Slide stainer with heating
US5345170A (en) * 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US6380751B2 (en) * 1992-06-11 2002-04-30 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
JP2938679B2 (ja) * 1992-06-26 1999-08-23 信越化学工業株式会社 セラミックス製静電チャック
US5600530A (en) * 1992-08-04 1997-02-04 The Morgan Crucible Company Plc Electrostatic chuck
US5800618A (en) * 1992-11-12 1998-09-01 Ngk Insulators, Ltd. Plasma-generating electrode device, an electrode-embedded article, and a method of manufacturing thereof
US5460684A (en) * 1992-12-04 1995-10-24 Tokyo Electron Limited Stage having electrostatic chuck and plasma processing apparatus using same
JPH06326175A (ja) * 1993-04-22 1994-11-25 Applied Materials Inc 集積回路処理装置において使用されるウエハサポートの誘電材への保護被覆とその形成方法
GB9309249D0 (en) * 1993-05-05 1993-06-16 Weber Manufacturing Limited Method of producing nickel shell moulds
JP2749759B2 (ja) * 1993-06-23 1998-05-13 信越化学工業株式会社 静電チャック付セラミックスヒーター
JP2642858B2 (ja) * 1993-12-20 1997-08-20 日本碍子株式会社 セラミックスヒーター及び加熱装置
JPH07297268A (ja) * 1993-12-27 1995-11-10 Shin Etsu Chem Co Ltd 静電チャック付セラミックスヒーター
US5668524A (en) * 1994-02-09 1997-09-16 Kyocera Corporation Ceramic resistor and electrostatic chuck having an aluminum nitride crystal phase
US5801915A (en) * 1994-01-31 1998-09-01 Applied Materials, Inc. Electrostatic chuck having a unidirectionally conducting coupler layer
US5729423A (en) * 1994-01-31 1998-03-17 Applied Materials, Inc. Puncture resistant electrostatic chuck
US6278600B1 (en) 1994-01-31 2001-08-21 Applied Materials, Inc. Electrostatic chuck with improved temperature control and puncture resistance
EP0669644B1 (de) * 1994-02-28 1997-08-20 Applied Materials, Inc. Elektrostatische Halteplatte
US5883778A (en) * 1994-02-28 1999-03-16 Applied Materials, Inc. Electrostatic chuck with fluid flow regulator
US5554224A (en) * 1994-03-31 1996-09-10 Foltyn; Steve R. Substrate heater for thin film deposition
JP2720420B2 (ja) * 1994-04-06 1998-03-04 キヤノン販売株式会社 成膜／エッチング装置
US5792562A (en) * 1995-01-12 1998-08-11 Applied Materials, Inc. Electrostatic chuck with polymeric impregnation and method of making
US6133557A (en) * 1995-01-31 2000-10-17 Kyocera Corporation Wafer holding member
US5691876A (en) * 1995-01-31 1997-11-25 Applied Materials, Inc. High temperature polyimide electrostatic chuck
US5982986A (en) * 1995-02-03 1999-11-09 Applied Materials, Inc. Apparatus and method for rotationally aligning and degassing semiconductor substrate within single vacuum chamber
JPH08264465A (ja) * 1995-03-23 1996-10-11 Tokyo Electron Ltd 処理装置
US5561377A (en) * 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
US6232789B1 (en) * 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5886863A (en) * 1995-05-09 1999-03-23 Kyocera Corporation Wafer support member
US5817406A (en) * 1995-07-14 1998-10-06 Applied Materials, Inc. Ceramic susceptor with embedded metal electrode and brazing material connection
US5633073A (en) * 1995-07-14 1997-05-27 Applied Materials, Inc. Ceramic susceptor with embedded metal electrode and eutectic connection
JP3457477B2 (ja) * 1995-09-06 2003-10-20 日本碍子株式会社 静電チャック
US6095084A (en) * 1996-02-02 2000-08-01 Applied Materials, Inc. High density plasma process chamber
JPH09260474A (ja) * 1996-03-22 1997-10-03 Sony Corp 静電チャックおよびウエハステージ
US6108189A (en) 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
EP0899986B1 (de) 1996-05-05 2004-11-24 Tateho Chemical Industries Co., Ltd. Elektrisches heizelement und mit diesem versehehe spannnvorrichtung
US5914613A (en) * 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US5835334A (en) * 1996-09-30 1998-11-10 Lam Research Variable high temperature chuck for high density plasma chemical vapor deposition
US6184158B1 (en) * 1996-12-23 2001-02-06 Lam Research Corporation Inductively coupled plasma CVD
US6189482B1 (en) 1997-02-12 2001-02-20 Applied Materials, Inc. High temperature, high flow rate chemical vapor deposition apparatus and related methods
US6002263A (en) * 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
US6106630A (en) * 1997-08-07 2000-08-22 Applied Materials, Inc. Ceramic-coated heating assembly for high temperature processing chamber
US6051122A (en) * 1997-08-21 2000-04-18 Applied Materials, Inc. Deposition shield assembly for a semiconductor wafer processing system
US6074488A (en) * 1997-09-16 2000-06-13 Applied Materials, Inc Plasma chamber support having an electrically coupled collar ring
TW493215B (en) * 1997-11-06 2002-07-01 Applied Materials Inc Method and apparatus for reducing thermal gradients within a ceramic wafer support pedestal
US5901030A (en) * 1997-12-02 1999-05-04 Dorsey Gage, Inc. Electrostatic chuck employing thermoelectric cooling
JPH11157953A (ja) * 1997-12-02 1999-06-15 Nhk Spring Co Ltd セラミックスと金属との構造体及びそれを用いた静電チャック装置
JPH11260534A (ja) 1998-01-09 1999-09-24 Ngk Insulators Ltd 加熱装置およびその製造方法
US6183693B1 (en) * 1998-02-27 2001-02-06 Cytologix Corporation Random access slide stainer with independent slide heating regulation
US6582962B1 (en) 1998-02-27 2003-06-24 Ventana Medical Systems, Inc. Automated molecular pathology apparatus having independent slide heaters
DE69942975D1 (de) 1998-02-27 2011-01-05 Ventana Med Syst Inc Automatisierter molekularer pathologieapparat mit unabhängigen objektträgerwärmern
US6140236A (en) * 1998-04-21 2000-10-31 Kabushiki Kaisha Toshiba High throughput A1-Cu thin film sputtering process on small contact via for manufacturable beol wiring
JPH11343571A (ja) * 1998-05-29 1999-12-14 Ngk Insulators Ltd サセプター
JPH11354260A (ja) * 1998-06-11 1999-12-24 Shin Etsu Chem Co Ltd 複層セラミックスヒータ
US5886866A (en) * 1998-07-06 1999-03-23 Applied Materials, Inc. Electrostatic chuck having a combination electrode structure for substrate chucking, heating and biasing
US6256882B1 (en) * 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6263829B1 (en) 1999-01-22 2001-07-24 Applied Materials, Inc. Process chamber having improved gas distributor and method of manufacture
US6094334A (en) * 1999-03-02 2000-07-25 Applied Materials, Inc. Polymer chuck with heater and method of manufacture
US6310755B1 (en) 1999-05-07 2001-10-30 Applied Materials, Inc. Electrostatic chuck having gas cavity and method
US6490146B2 (en) 1999-05-07 2002-12-03 Applied Materials Inc. Electrostatic chuck bonded to base with a bond layer and method
US6462928B1 (en) 1999-05-07 2002-10-08 Applied Materials, Inc. Electrostatic chuck having improved electrical connector and method
KR100519256B1 (ko) * 1999-05-27 2005-10-06 삼성전자주식회사 웨이퍼 베이킹 장치
US6445202B1 (en) * 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6100506A (en) * 1999-07-26 2000-08-08 International Business Machines Corporation Hot plate with in situ surface temperature adjustment
EP1120829A4 (de) * 1999-08-10 2009-05-27 Ibiden Co Ltd Keramische platte für halbleiterproduktionsanordnung
EP1124404B1 (de) * 1999-11-19 2005-08-10 Ibiden Co., Ltd. Keramisches heizgerät
US6410172B1 (en) * 1999-11-23 2002-06-25 Advanced Ceramics Corporation Articles coated with aluminum nitride by chemical vapor deposition
US6490144B1 (en) 1999-11-29 2002-12-03 Applied Materials, Inc. Support for supporting a substrate in a process chamber
JP4209057B2 (ja) * 1999-12-01 2009-01-14 東京エレクトロン株式会社 セラミックスヒーターならびにそれを用いた基板処理装置および基板処理方法
US6723274B1 (en) 1999-12-09 2004-04-20 Saint-Gobain Ceramics & Plastics, Inc. High-purity low-resistivity electrostatic chucks
KR20020059438A (ko) 1999-12-09 2002-07-12 보스트 스티븐 엘. 편평한 막 전극을 갖는 정전 척
US6603650B1 (en) 1999-12-09 2003-08-05 Saint-Gobain Ceramics And Plastics, Inc. Electrostatic chuck susceptor and method for fabrication
US6377437B1 (en) 1999-12-22 2002-04-23 Lam Research Corporation High temperature electrostatic chuck
US6494955B1 (en) 2000-02-15 2002-12-17 Applied Materials, Inc. Ceramic substrate support
US20030098299A1 (en) * 2000-03-06 2003-05-29 Ibiden Co., Ltd. Ceramic heater
JP2001247382A (ja) * 2000-03-06 2001-09-11 Ibiden Co Ltd セラミック基板
US6478924B1 (en) 2000-03-07 2002-11-12 Applied Materials, Inc. Plasma chamber support having dual electrodes
US6598559B1 (en) 2000-03-24 2003-07-29 Applied Materials, Inc. Temperature controlled chamber
US6693789B2 (en) * 2000-04-05 2004-02-17 Sumitomo Osaka Cement Co., Ltd. Susceptor and manufacturing method thereof
US20040081439A1 (en) * 2000-05-04 2004-04-29 Applied Materials, Inc. Actively-controlled electrostatic chuck heater
JP4398064B2 (ja) * 2000-05-12 2010-01-13 日本発條株式会社 加熱装置
US6494958B1 (en) 2000-06-29 2002-12-17 Applied Materials Inc. Plasma chamber support with coupled electrode
US6965226B2 (en) * 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) * 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US20030000938A1 (en) * 2000-12-01 2003-01-02 Yanling Zhou Ceramic heater, and ceramic heater resistor paste
DE10143173A1 (de) * 2000-12-04 2002-06-06 Cascade Microtech Inc Wafersonde
US6581275B2 (en) 2001-01-22 2003-06-24 Applied Materials Inc. Fabricating an electrostatic chuck having plasma resistant gas conduits
KR100922241B1 (ko) * 2001-02-09 2009-10-15 도쿄엘렉트론가부시키가이샤 성막 장치 및 샤워헤드 구조체
DE10122036B4 (de) * 2001-05-07 2009-12-24 Karl Suss Dresden Gmbh Substrathaltevorrichtung für Prober zum Testen von Schaltungsanordnungen auf scheibenförmigen Substraten
WO2003052435A1 (en) 2001-08-21 2003-06-26 Cascade Microtech, Inc. Membrane probing system
WO2003020467A1 (en) * 2001-08-31 2003-03-13 Cascade Microtech, Inc. Optical testing device
JP4252231B2 (ja) * 2001-09-05 2009-04-08 日本碍子株式会社 半導体ウェハー支持部材接合体の製造方法および半導体ウェハー支持部材接合体
US7425306B1 (en) 2001-09-11 2008-09-16 Ventana Medical Systems, Inc. Slide heater
US6682627B2 (en) 2001-09-24 2004-01-27 Applied Materials, Inc. Process chamber having a corrosion-resistant wall and method
JP4331427B2 (ja) * 2001-10-03 2009-09-16 住友電気工業株式会社 半導体製造装置に使用される給電用電極部材
US7270785B1 (en) * 2001-11-02 2007-09-18 Ventana Medical Systems, Inc. Automated molecular pathology apparatus having fixed slide platforms
US6538872B1 (en) 2001-11-05 2003-03-25 Applied Materials, Inc. Electrostatic chuck having heater and method
US6730175B2 (en) 2002-01-22 2004-05-04 Applied Materials, Inc. Ceramic substrate support
US6777964B2 (en) * 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
US7352258B2 (en) * 2002-03-28 2008-04-01 Cascade Microtech, Inc. Waveguide adapter for probe assembly having a detachable bias tee
EP1494808B1 (de) * 2002-04-15 2013-07-03 Ventana Medical Systems, Inc. Automatisiertes objektträgeranfärbesystem mit hohem durchsatz
US11249095B2 (en) 2002-04-15 2022-02-15 Ventana Medical Systems, Inc. Automated high volume slide processing system
US7468161B2 (en) 2002-04-15 2008-12-23 Ventana Medical Systems, Inc. Automated high volume slide processing system
EP2420814B1 (de) * 2002-04-26 2015-08-26 Ventana Medical Systems, Inc. Automatische Objektträgerverarbeitungsvorrichtung
US7354501B2 (en) * 2002-05-17 2008-04-08 Applied Materials, Inc. Upper chamber for high density plasma CVD
AU2003233659A1 (en) * 2002-05-23 2003-12-12 Cascade Microtech, Inc. Probe for testing a device under test
US6847219B1 (en) * 2002-11-08 2005-01-25 Cascade Microtech, Inc. Probe station with low noise characteristics
US6724205B1 (en) * 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7250779B2 (en) * 2002-11-25 2007-07-31 Cascade Microtech, Inc. Probe station with low inductance path
US6861856B2 (en) * 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
JP2006517740A (ja) * 2003-01-17 2006-07-27 ゼネラル・エレクトリック・カンパニイ ウェーハ加工装置及びその製造方法
JP2004235483A (ja) * 2003-01-31 2004-08-19 Sumitomo Electric Ind Ltd 半導体製造装置用ウェハ保持体およびそれを搭載した半導体製造装置
FR2850790B1 (fr) * 2003-02-05 2005-04-08 Semco Engineering Sa Semelle de collage electrostatique avec electrode radiofrequence et moyens thermostatiques integres
JP4257576B2 (ja) * 2003-03-25 2009-04-22 ローム株式会社 成膜装置
US20040187787A1 (en) * 2003-03-31 2004-09-30 Dawson Keith E. Substrate support having temperature controlled substrate support surface
KR100890493B1 (ko) * 2003-04-18 2009-03-26 가부시키가이샤 히다치 고쿠사이 덴키 반도체 제조 장치
US7221172B2 (en) * 2003-05-06 2007-05-22 Cascade Microtech, Inc. Switched suspended conductor and connection
US20040222210A1 (en) * 2003-05-08 2004-11-11 Hongy Lin Multi-zone ceramic heating system and method of manufacture thereof
CN1310285C (zh) * 2003-05-12 2007-04-11 东京毅力科创株式会社 处理装置
US7492172B2 (en) * 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7057404B2 (en) * 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7250626B2 (en) * 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7910218B2 (en) 2003-10-22 2011-03-22 Applied Materials, Inc. Cleaning and refurbishing chamber components having metal coatings
JP2007514275A (ja) * 2003-10-28 2007-05-31 ノードソン　コーポレーション プラズマ処理装置及びプラズマ処理方法
EP1697719B1 (de) 2003-12-23 2018-09-19 Ventana Medical Systems, Inc. Verfahren und vorrichtung für effiziente dünnfilmfluid-bearbeitung auf ebenen flächen
DE202004021093U1 (de) * 2003-12-24 2006-09-28 Cascade Microtech, Inc., Beaverton Aktiver Halbleiterscheibenmessfühler
US7187188B2 (en) * 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US8007591B2 (en) * 2004-01-30 2011-08-30 Tokyo Electron Limited Substrate holder having a fluid gap and method of fabricating the substrate holder
US7697260B2 (en) * 2004-03-31 2010-04-13 Applied Materials, Inc. Detachable electrostatic chuck
EP1754072A2 (de) * 2004-06-07 2007-02-21 CASCADE MICROTECH, INC. (an Oregon corporation) Thermische optische einspannvorrichtung
US7330041B2 (en) * 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
EP1766426B1 (de) * 2004-07-07 2013-09-11 Cascade Microtech, Inc. Tastkopf mit einem an der membran aufgehängten fühler
WO2006013931A1 (ja) * 2004-08-04 2006-02-09 Ibiden Co., Ltd. 焼成炉及びその焼成炉を用いた多孔質セラミック焼成体の製造方法
DE202005021435U1 (de) * 2004-09-13 2008-02-28 Cascade Microtech, Inc., Beaverton Doppelseitige Prüfaufbauten
US20060092505A1 (en) * 2004-11-02 2006-05-04 Umech Technologies, Co. Optically enhanced digital imaging system
US7670436B2 (en) 2004-11-03 2010-03-02 Applied Materials, Inc. Support ring assembly
JP4350695B2 (ja) * 2004-12-01 2009-10-21 株式会社フューチャービジョン 処理装置
US8038796B2 (en) * 2004-12-30 2011-10-18 Lam Research Corporation Apparatus for spatial and temporal control of temperature on a substrate
US20060144337A1 (en) * 2005-01-06 2006-07-06 Hsien-Che Teng Heater for heating a wafer and method for preventing contamination of the heater
US20060169897A1 (en) * 2005-01-31 2006-08-03 Cascade Microtech, Inc. Microscope system for testing semiconductors
US7656172B2 (en) * 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) * 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US20080314320A1 (en) * 2005-02-04 2008-12-25 Component Re-Engineering Company, Inc. Chamber Mount for High Temperature Application of AIN Heaters
US7449899B2 (en) * 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
WO2006137979A2 (en) * 2005-06-13 2006-12-28 Cascade Microtech, Inc. Wideband active-passive differential signal probe
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
US7762114B2 (en) * 2005-09-09 2010-07-27 Applied Materials, Inc. Flow-formed chamber component having a textured surface
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
TWM292147U (en) * 2005-11-23 2006-06-11 Celetech Semiconductor Inc Radio frequency grounding apparatus
US8647484B2 (en) * 2005-11-25 2014-02-11 Applied Materials, Inc. Target for sputtering chamber
US7446284B2 (en) * 2005-12-21 2008-11-04 Momentive Performance Materials Inc. Etch resistant wafer processing apparatus and method for producing the same
EP1972878B1 (de) * 2006-01-13 2016-09-28 NGK Insulators, Ltd. Stützstruktur für heizung
US20070169703A1 (en) * 2006-01-23 2007-07-26 Brent Elliot Advanced ceramic heater for substrate processing
JP2007227442A (ja) * 2006-02-21 2007-09-06 Sumitomo Electric Ind Ltd ウェハ保持体およびそれを搭載したウェハプローバ
US7520969B2 (en) * 2006-03-07 2009-04-21 Applied Materials, Inc. Notched deposition ring
US8226769B2 (en) * 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
US7763147B1 (en) * 2006-05-15 2010-07-27 Lam Research Corporation Arc suppression plate for a plasma processing chamber
US20070283884A1 (en) * 2006-05-30 2007-12-13 Applied Materials, Inc. Ring assembly for substrate processing chamber
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7443186B2 (en) * 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
JP5245268B2 (ja) * 2006-06-16 2013-07-24 東京エレクトロン株式会社 載置台構造及び熱処理装置
US20080006204A1 (en) * 2006-07-06 2008-01-10 General Electric Company Corrosion resistant wafer processing apparatus and method for making thereof
US9275887B2 (en) 2006-07-20 2016-03-01 Applied Materials, Inc. Substrate processing with rapid temperature gradient control
DE102006038925A1 (de) * 2006-08-18 2008-02-21 Forschungszentrum Jülich GmbH Vorrichtung zum Heizen einer Probe
US7589950B2 (en) * 2006-10-13 2009-09-15 Applied Materials, Inc. Detachable electrostatic chuck having sealing assembly
KR100867191B1 (ko) * 2006-11-02 2008-11-06 주식회사 유진테크 기판처리장치 및 기판처리방법
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US7942969B2 (en) 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US7876114B2 (en) * 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US20090084317A1 (en) * 2007-09-28 2009-04-02 Applied Materials, Inc. Atomic layer deposition chamber and components
JP5236927B2 (ja) * 2007-10-26 2013-07-17 信越化学工業株式会社 耐腐食性積層セラミックス部材
WO2009058235A2 (en) * 2007-10-31 2009-05-07 Lam Research Corporation High lifetime consumable silicon nitride-silicon dioxide plasma processing components
JP5171584B2 (ja) * 2008-03-26 2013-03-27 株式会社日立国際電気 基板処理装置の基板載置台、基板処理装置及び半導体デバイスの製造方法
US8372238B2 (en) 2008-05-20 2013-02-12 Nordson Corporation Multiple-electrode plasma processing systems with confined process chambers and interior-bussed electrical connections with the electrodes
DE102008035240B4 (de) * 2008-07-29 2017-07-06 Ivoclar Vivadent Ag Vorrichtung zur Erwärmung von Formteilen, insbesondere dentalkeramischen Formteilen
US20110174797A1 (en) * 2008-09-05 2011-07-21 Japan Advanced Institute Of Science And Technology Cantilever heating mechanism, and a cantilever holder and cantilever heating method that use the same
US7888957B2 (en) * 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
AU2009313985B2 (en) 2008-11-12 2014-07-31 Ventana Medical Systems, Inc. Methods and apparatuses for heating slides carrying specimens
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) * 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
US20100177454A1 (en) * 2009-01-09 2010-07-15 Component Re-Engineering Company, Inc. Electrostatic chuck with dielectric inserts
US8226795B2 (en) * 2009-02-03 2012-07-24 Nordson Corporation Magnetic clips and substrate holders for use in a plasma processing system
WO2010090948A1 (en) * 2009-02-04 2010-08-12 Mattson Technology, Inc. Electrostatic chuck system and process for radially tuning the temperature profile across the surface of a substrate
JP2011225949A (ja) * 2010-04-21 2011-11-10 Ibiden Co Ltd 炭素部品および炭素部品の製造方法
US20120037068A1 (en) * 2010-08-11 2012-02-16 Applied Materials, Inc. Composite substrates for direct heating and increased temperature uniformity
EP2434528A1 (de) * 2010-09-28 2012-03-28 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Aktiver Träger zum Tragen eines Wafer und Freisetzungsverfahren
US20120234240A1 (en) * 2011-03-17 2012-09-20 Nps Corporation Graphene synthesis chamber and method of synthesizing graphene by using the same
EP2527309B1 (de) * 2011-05-24 2016-08-03 Rohm and Haas Company Multispektrales Zinksulfid mit verbesserter Qualität
US9869392B2 (en) 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US9859142B2 (en) 2011-10-20 2018-01-02 Lam Research Corporation Edge seal for lower electrode assembly
US20130269613A1 (en) * 2012-03-30 2013-10-17 Applied Materials, Inc. Methods and apparatus for generating and delivering a process gas for processing a substrate
US20150004400A1 (en) * 2013-06-28 2015-01-01 Watlow Electric Manufacturing Company Support assembly for use in semiconductor manufacturing tools with a fusible bond
EP4095509A1 (de) 2013-12-13 2022-11-30 Ventana Medical Systems, Inc. Automatisierte histologische verarbeitung biologischer proben und entsprechende technologie
US10090211B2 (en) 2013-12-26 2018-10-02 Lam Research Corporation Edge seal for lower electrode assembly
JP6219229B2 (ja) * 2014-05-19 2017-10-25 東京エレクトロン株式会社 ヒータ給電機構
US10655226B2 (en) * 2017-05-26 2020-05-19 Applied Materials, Inc. Apparatus and methods to improve ALD uniformity
CN109561526B (zh) * 2017-09-26 2023-04-25 杜邦电子公司 加热元件和加热装置
JP7241540B2 (ja) * 2018-12-28 2023-03-17 東京エレクトロン株式会社 測定方法及び測定治具
TWI811307B (zh) * 2019-03-12 2023-08-11 鴻創應用科技有限公司 陶瓷電路複合結構及其製造方法
US20210287929A1 (en) * 2020-03-16 2021-09-16 Applied Materials, Inc. Heater uniformity in substrate supports

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7201273A (de) * 1972-02-08 1973-08-03
GB2106325A (en) * 1981-09-14 1983-04-07 Philips Electronic Associated Electrostatic chuck
JPS6059104B2 (ja) * 1982-02-03 1985-12-23 株式会社東芝 静電チヤツク板
US4561006A (en) * 1982-07-06 1985-12-24 Sperry Corporation Integrated circuit package with integral heating circuit
GB2147459A (en) * 1983-09-30 1985-05-09 Philips Electronic Associated Electrostatic chuck for semiconductor wafers
JPS6131636U (ja) * 1984-07-31 1986-02-26 株式会社 徳田製作所 静電チヤツク
JPH0727961B2 (ja) * 1986-06-05 1995-03-29 東陶機器株式会社 静電チャック板の製造方法
US4872835A (en) * 1986-07-24 1989-10-10 Hewlett-Packard Company Hot chuck assembly for integrated circuit wafers
JPS6372877A (ja) * 1986-09-12 1988-04-02 Tokuda Seisakusho Ltd 真空処理装置
JPH01152639A (ja) * 1987-12-10 1989-06-15 Canon Inc 吸着保持装置
JPH01241839A (ja) * 1988-03-24 1989-09-26 Toshiba Corp 半導体ウエハ保持装置
JPH01315935A (ja) * 1988-06-15 1989-12-20 Nec Corp 静電チャックによるウエハ固定方法
JP2665242B2 (ja) * 1988-09-19 1997-10-22 東陶機器株式会社 静電チャック
FR2638050B1 (fr) * 1988-10-18 1996-03-01 Thomson Hybrides Dispositif de report de composant sur un circuit hybride
US4962441A (en) * 1989-04-10 1990-10-09 Applied Materials, Inc. Isolated electrostatic wafer blade clamp
JPH03240961A (ja) * 1990-02-19 1991-10-28 Toshiba Corp 基板加熱装置
DE69111493T2 (de) * 1990-03-12 1996-03-21 Ngk Insulators Ltd Wafer-Heizgeräte für Apparate, zur Halbleiterherstellung Heizanlage mit diesen Heizgeräten und Herstellung von Heizgeräten.
EP0460955A1 (de) * 1990-06-08 1991-12-11 Varian Associates, Inc. Spannen eines Werkstückes unter Verwendung einer mehrphasigen Haltespannung

Also Published As

Publication number Publication date
US5280156A (en) 1994-01-18
DE69130205D1 (de) 1998-10-22
EP0493089A1 (de) 1992-07-01
EP0493089B1 (de) 1998-09-16

Similar Documents

Publication Publication Date Title
DE69130205D1 (de) Heizungsapparat für eine Halbleiterscheibe und Verfahren zum Herstellen desselben
DE69631919D1 (de) Halbleiter-Speicherbauelement und Verfahren zum Herstellen desselben
DE3575241D1 (de) Halbleiteranordnung und verfahren zum herstellen derselben.
DE69018846D1 (de) Keramische Packung vom Halbleiteranordnungstyp und Verfahren zum Zusammensetzen derselben.
DE69322644D1 (de) Stent und verfahren zum herstellen
DE69315606D1 (de) Dreidimensionale gestapelte Mehrchip-Halbleiteranordnung und Verfahren zum Herstellen derselben
KR880701454A (ko) 반도체 웨이퍼 세정 방법 및 장치
DE69132934D1 (de) Strahlungsemittierende Halbleiteranordnung und Verfahren zum Herstellen derselben
DE3884282D1 (de) Makro-Struktur und Verfahren zum Herstellen von Makros für VLSI-Halbleiterschaltungen.
DE69024077D1 (de) Einrichtung und Verfahren zur Behandlung von Halbleiterscheiben
DE69410514D1 (de) Verfahren zum Herstellen von Halbleiterscheiben
DE69029596D1 (de) Halbleitendes Siliciumwafer und sein Herstellungsverfahren
DE69409347D1 (de) Verfahren zum Herstellen von Halbleitervorrichtungen
DE3772490D1 (de) Halbleiteranordnung sowie verfahren zum herstellen und testen derselben.
DE68916045D1 (de) Halbleiteranordnung und Verfahren zum Herstellen derselben.
AT352566B (de) Schleifkoerper und verfahren zum herstellen der- selben
DE68914572T2 (de) Verfahren zum Herstellen von Halbleitervorrichtungen.
DE69017949D1 (de) Verfahren zum Herstellen von Halbleiteranordnungen.
DE69528683T2 (de) Halbleiterbauteil und Verfahren zur Herstellung desselben
DE69033662D1 (de) Integrierte Halbleitervorrichtung und Verfahren zu ihrer Herstellung
DE69221379D1 (de) Halbleiter-Speicherbauteil und Verfahren zur Herstellung desselben
DE69115395D1 (de) Verfahren zum Herstellen eines oxydischen Hochtemperatursupraleiters
DE69118720D1 (de) Gehäuse für eine Halbleitervorrichtung und Herstellungsverfahren dafür
DE69230162T2 (de) Halbleiteranordnung vom Filmträgertyp und Verfahren zum Herstellen derselben
DE69031935D1 (de) Druckkontakt-Halbleiteranordnung und Verfahren zum Herstellen derselben

Legal Events

Date Code Title Description
8364 No opposition during term of opposition