DE69133193D1 - Verfahren zur Herstellung eines kapazitiven Detektors mit drei Substraten, sich umgebenden Regionen und einem Arbeitskörper ( Kraft, Beschleunigung, magnetisch ) - Google Patents
Verfahren zur Herstellung eines kapazitiven Detektors mit drei Substraten, sich umgebenden Regionen und einem Arbeitskörper ( Kraft, Beschleunigung, magnetisch )Info
- Publication number
- DE69133193D1 DE69133193D1 DE69133193T DE69133193T DE69133193D1 DE 69133193 D1 DE69133193 D1 DE 69133193D1 DE 69133193 T DE69133193 T DE 69133193T DE 69133193 T DE69133193 T DE 69133193T DE 69133193 D1 DE69133193 D1 DE 69133193D1
- Authority
- DE
- Germany
- Prior art keywords
- acceleration
- substrates
- magnetic
- producing
- force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001133 acceleration Effects 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
- G01L1/144—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors with associated circuitry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
- G01L5/165—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using variations in capacitance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/16—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force
- G01L5/167—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring several components of force using piezoelectric means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/09—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up
- G01P15/0922—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by piezoelectric pick-up of the bending or flexing mode type
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/105—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by magnetically sensitive devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S73/00—Measuring and testing
- Y10S73/04—Piezoelectric
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49007—Indicating transducer
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2274299A JP2841240B2 (ja) | 1990-10-12 | 1990-10-12 | 力・加速度・磁気の検出装置 |
JP2416188A JP3025313B2 (ja) | 1990-12-31 | 1990-12-31 | 静電容量の変化を利用したセンサの製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69133193D1 true DE69133193D1 (de) | 2003-02-27 |
DE69133193T2 DE69133193T2 (de) | 2003-10-09 |
Family
ID=26550975
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69133193T Expired - Lifetime DE69133193T2 (de) | 1990-10-12 | 1991-10-11 | Verfahren zur Herstellung eines kapazitiven Detektors mit drei Substraten, sich umgebenden Regionen und einem Arbeitskörper ( Kraft, Beschleunigung, magnetisch ) |
DE69126501T Expired - Lifetime DE69126501T2 (de) | 1990-10-12 | 1991-10-11 | Kraftdetektor und Beschleunigungsdetektor |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69126501T Expired - Lifetime DE69126501T2 (de) | 1990-10-12 | 1991-10-11 | Kraftdetektor und Beschleunigungsdetektor |
Country Status (3)
Country | Link |
---|---|
US (8) | US5421213A (de) |
EP (2) | EP0480471B1 (de) |
DE (2) | DE69133193T2 (de) |
Families Citing this family (147)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0461265B1 (de) | 1989-12-28 | 1995-05-10 | Wacoh Corporation | Beschleunigungssensoren |
US6864677B1 (en) * | 1993-12-15 | 2005-03-08 | Kazuhiro Okada | Method of testing a sensor |
US6314823B1 (en) * | 1991-09-20 | 2001-11-13 | Kazuhiro Okada | Force detector and acceleration detector and method of manufacturing the same |
US5421213A (en) * | 1990-10-12 | 1995-06-06 | Okada; Kazuhiro | Multi-dimensional force detector |
JP3027457B2 (ja) * | 1991-10-25 | 2000-04-04 | 和廣 岡田 | 多次元方向に関する力・加速度・磁気の検出装置 |
FR2700013B1 (fr) * | 1992-12-30 | 1995-03-17 | Akebono Brake Ind | Procédé et appareil de détection d'accélération suivant trois dimensions. |
US5646346A (en) * | 1994-11-10 | 1997-07-08 | Okada; Kazuhiro | Multi-axial angular velocity sensor |
US6282956B1 (en) * | 1994-12-29 | 2001-09-04 | Kazuhiro Okada | Multi-axial angular velocity sensor |
JP3401252B2 (ja) * | 1993-03-30 | 2003-04-28 | 和廣 岡田 | 角速度センサ |
US5661235A (en) * | 1993-10-01 | 1997-08-26 | Hysitron Incorporated | Multi-dimensional capacitive transducer |
US6026677A (en) * | 1993-10-01 | 2000-02-22 | Hysitron, Incorporated | Apparatus for microindentation hardness testing and surface imaging incorporating a multi-plate capacitor system |
US5851851A (en) * | 1994-03-07 | 1998-12-22 | Nippondenso Co., Ltd. | Method for fabricating a semiconductor acceleration sensor |
JP3549590B2 (ja) | 1994-09-28 | 2004-08-04 | 和廣 岡田 | 加速度・角速度センサ |
JP3585980B2 (ja) * | 1995-02-21 | 2004-11-10 | 株式会社ワコー | 角速度センサ |
US6003371A (en) * | 1995-02-21 | 1999-12-21 | Wacoh Corporation | Angular velocity sensor |
JP3433401B2 (ja) * | 1995-05-18 | 2003-08-04 | アイシン精機株式会社 | 静電容量型加速度センサ |
JPH0949856A (ja) * | 1995-05-31 | 1997-02-18 | Wako:Kk | 加速度センサ |
EP0880671A2 (de) * | 1995-07-20 | 1998-12-02 | Cornell Research Foundation, Inc. | Mikrohergestelltes torsionsausleger für empfindliche krafterfassung |
US6000280A (en) * | 1995-07-20 | 1999-12-14 | Cornell Research Foundation, Inc. | Drive electrodes for microfabricated torsional cantilevers |
EP0762128B1 (de) * | 1995-09-04 | 2000-05-17 | Murata Manufacturing Co., Ltd. | Beschleunigungsdetektionsvorrichtung |
JPH09119943A (ja) * | 1995-10-24 | 1997-05-06 | Wako:Kk | 加速度センサ |
JPH09320996A (ja) * | 1996-03-29 | 1997-12-12 | Denso Corp | 半導体装置の製造方法 |
US6940405B2 (en) * | 1996-05-30 | 2005-09-06 | Guardit Technologies Llc | Portable motion detector and alarm system and method |
US6076401A (en) * | 1996-07-10 | 2000-06-20 | Wacoh Corporation | Angular velocity sensor |
US6367326B1 (en) | 1996-07-10 | 2002-04-09 | Wacoh Corporation | Angular velocity sensor |
US5917264A (en) * | 1996-09-05 | 1999-06-29 | Nagano Keiki Co Ltd | Electrostatic capacitance type transducer and method for producing the same |
US6476620B2 (en) * | 1996-09-06 | 2002-11-05 | Ks Techno Co., Ltd. | Electrostatic capacity sensor |
JP4176849B2 (ja) * | 1997-05-08 | 2008-11-05 | 株式会社ワコー | センサの製造方法 |
US6269687B1 (en) * | 1997-09-22 | 2001-08-07 | Seagate Technology Llc | Force sensing slider |
US5886256A (en) * | 1998-03-18 | 1999-03-23 | The United States Of America As Represented By The Secretary Of The Army | Ice detection sensor |
DE19858826A1 (de) * | 1998-12-19 | 2000-06-29 | Micronas Intermetall Gmbh | Kapazitiver Magnetfeldsensor |
US7906875B2 (en) | 1999-01-19 | 2011-03-15 | Touchsensor Technologies, Llc | Touch switches and practical applications therefor |
JP2000249609A (ja) * | 1999-03-01 | 2000-09-14 | Wakoo:Kk | 静電容量式センサ |
JP2000346865A (ja) | 1999-03-26 | 2000-12-15 | Ngk Insulators Ltd | 加速度センサ素子の感度調整方法 |
JP2000305709A (ja) | 1999-04-26 | 2000-11-02 | Alps Electric Co Ltd | 電子機器 |
US6497141B1 (en) | 1999-06-07 | 2002-12-24 | Cornell Research Foundation Inc. | Parametric resonance in microelectromechanical structures |
DE19964218C2 (de) * | 1999-10-08 | 2003-04-10 | Hahn Schickard Ges | Elektromechanisches Bauelement mit einem Polymerkörper und Verfahren zur Herstellung desselben |
JP4295883B2 (ja) | 1999-12-13 | 2009-07-15 | 株式会社ワコー | 力検出装置 |
US6504115B2 (en) | 2000-03-07 | 2003-01-07 | Alps Electric Co., Ltd. | Multidirectional input device |
EP1136939A3 (de) | 2000-03-14 | 2004-04-14 | Alps Electric Co., Ltd. | Auf Kapazitätsänderung basierte Eingabevorrichtung und Erfassungseinrichtung |
US6430023B1 (en) | 2000-06-16 | 2002-08-06 | Alps Electric Co., Ltd. | Input device |
JP4136655B2 (ja) * | 2000-11-30 | 2008-08-20 | ニッタ株式会社 | 静電容量式センサ |
EP1243930A1 (de) * | 2001-03-08 | 2002-09-25 | EADS Deutschland Gmbh | Mikromechanischer kapazitiver Beschleunigungssensor |
JP3839267B2 (ja) * | 2001-03-08 | 2006-11-01 | 株式会社ルネサステクノロジ | 半導体装置及びそれを用いた通信端末装置 |
CN1225642C (zh) * | 2001-03-14 | 2005-11-02 | 新田株式会社 | 电容式传感器 |
US6809529B2 (en) | 2001-08-10 | 2004-10-26 | Wacoh Corporation | Force detector |
JP2003329444A (ja) * | 2002-03-07 | 2003-11-19 | Alps Electric Co Ltd | 静電容量式センサ |
US7024947B2 (en) | 2002-03-07 | 2006-04-11 | Alps Electric Co., Ltd. | Detection device including circuit component |
JP4155775B2 (ja) * | 2002-03-07 | 2008-09-24 | アルプス電気株式会社 | 静電容量式センサ |
AU2003224982A1 (en) * | 2002-04-12 | 2003-10-27 | Fritz H. Obermeyer | Multi-axis joystick and transducer means therefore |
JP4216525B2 (ja) * | 2002-05-13 | 2009-01-28 | 株式会社ワコー | 加速度センサおよびその製造方法 |
JP4090939B2 (ja) * | 2002-05-29 | 2008-05-28 | ニッタ株式会社 | 静電容量式センサおよびその製造方法 |
DE10224790B4 (de) * | 2002-06-04 | 2004-10-21 | Infineon Technologies Ag | Beschleunigungssensor und Verfahren zum Herstellen eines Beschleunigungssensors |
DE10225714A1 (de) * | 2002-06-11 | 2004-01-08 | Eads Deutschland Gmbh | Mehrachsiger monolithischer Beschleunigungssensor |
JP4125931B2 (ja) * | 2002-08-26 | 2008-07-30 | 株式会社ワコー | 回転操作量の入力装置およびこれを利用した操作装置 |
JP2004140029A (ja) * | 2002-10-15 | 2004-05-13 | Sharp Corp | 半導体装置、半導体モジュール、半導体装置の製造方法、及び、半導体モジュールの製造方法 |
JP4907050B2 (ja) * | 2003-03-31 | 2012-03-28 | 株式会社ワコー | 力検出装置 |
JP4271475B2 (ja) * | 2003-03-31 | 2009-06-03 | 株式会社ワコー | 力検出装置 |
JP4387691B2 (ja) * | 2003-04-28 | 2009-12-16 | 株式会社ワコー | 力検出装置 |
JP4359757B2 (ja) * | 2003-09-17 | 2009-11-04 | ソニー株式会社 | 情報表示装置 |
US7032454B2 (en) * | 2004-03-05 | 2006-04-25 | Agilent Technologies, Inc. | Piezoelectric cantilever pressure sensor array |
US7104134B2 (en) * | 2004-03-05 | 2006-09-12 | Agilent Technologies, Inc. | Piezoelectric cantilever pressure sensor |
US7644628B2 (en) * | 2005-12-16 | 2010-01-12 | Loadstar Sensors, Inc. | Resistive force sensing device and method with an advanced communication interface |
GB2417326B (en) * | 2004-08-20 | 2008-05-21 | Autoliv Dev | A position sensor |
US20060049001A1 (en) * | 2004-09-09 | 2006-03-09 | Mark Streitman | Driven pendulum apparatus and method of operation thereof |
US8448326B2 (en) * | 2005-04-08 | 2013-05-28 | Microsoft Corporation | Method of manufacturing an accelerometer |
US7337671B2 (en) | 2005-06-03 | 2008-03-04 | Georgia Tech Research Corp. | Capacitive microaccelerometers and fabrication methods |
DE112007000303A5 (de) * | 2006-03-10 | 2008-10-30 | Conti Temic Microelectronic Gmbh | Mikromechanischer Drehratensensor |
US7578189B1 (en) | 2006-05-10 | 2009-08-25 | Qualtre, Inc. | Three-axis accelerometers |
JP2008132583A (ja) * | 2006-10-24 | 2008-06-12 | Seiko Epson Corp | Memsデバイス |
US8970503B2 (en) * | 2007-01-05 | 2015-03-03 | Apple Inc. | Gestures for devices having one or more touch sensitive surfaces |
US8144129B2 (en) * | 2007-01-05 | 2012-03-27 | Apple Inc. | Flexible touch sensing circuits |
JP2008190931A (ja) * | 2007-02-02 | 2008-08-21 | Wacoh Corp | 加速度と角速度との双方を検出するセンサ |
JP2008241448A (ja) * | 2007-03-27 | 2008-10-09 | Nitta Ind Corp | センサ駆動回路 |
US7520170B2 (en) | 2007-07-10 | 2009-04-21 | Freescale Semiconductor, Inc. | Output correction circuit for three-axis accelerometer |
DE102007046017B4 (de) * | 2007-09-26 | 2021-07-01 | Robert Bosch Gmbh | Sensorelement |
JP5044348B2 (ja) * | 2007-09-26 | 2012-10-10 | 株式会社東芝 | センサ装置、及びこれを用いたセンサシステムと電子機器 |
US20100257948A1 (en) * | 2007-10-16 | 2010-10-14 | Siemens Ag | Eccentric Load Compensated Load Cell |
US8018009B2 (en) | 2007-12-07 | 2011-09-13 | METAMEMS Corp. | Forming large planar structures from substrates using edge Coulomb forces |
US8008070B2 (en) * | 2007-12-07 | 2011-08-30 | METAMEMS Corp. | Using coulomb forces to study charateristics of fluids and biological samples |
US7946174B2 (en) * | 2007-12-07 | 2011-05-24 | METAMEMS Corp. | Decelerometer formed by levitating a substrate into equilibrium |
US8159809B2 (en) * | 2007-12-07 | 2012-04-17 | METAMEMS Corp. | Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter |
US7965489B2 (en) | 2007-12-07 | 2011-06-21 | METAMEMS Corp. | Using coulomb forces to form 3-D reconfigurable antenna structures |
US20090149038A1 (en) * | 2007-12-07 | 2009-06-11 | Metamems Llc | Forming edge metallic contacts and using coulomb forces to improve ohmic contact |
US7812336B2 (en) * | 2007-12-07 | 2010-10-12 | METAMEMS Corp. | Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire |
US7728427B2 (en) * | 2007-12-07 | 2010-06-01 | Lctank Llc | Assembling stacked substrates that can form cylindrical inductors and adjustable transformers |
US8096196B2 (en) * | 2007-12-14 | 2012-01-17 | Siemens Ag | Load cell |
US20100112743A1 (en) * | 2008-11-05 | 2010-05-06 | Rohm Co., Ltd. | Method of manufacturing semiconductor device including vibrator which is provided with side insulating film and insulating separation region formed by thermal oxidation |
FR2943129B1 (fr) * | 2009-03-12 | 2011-09-30 | Commissariat Energie Atomique | Dispositif de caracterisation tactile de texture de surface |
AU2010238186B2 (en) | 2009-04-13 | 2014-05-15 | Enhanced Surface Dynamics, Inc. | System and method for preventing decubitus ulcers |
JP5267504B2 (ja) | 2009-05-19 | 2013-08-21 | ミツミ電機株式会社 | 操作入力装置及び操作入力検出装置 |
US8217790B2 (en) * | 2009-05-26 | 2012-07-10 | Script Michael H | Portable motion detector and alarm system and method |
DE102009030540A1 (de) * | 2009-06-24 | 2010-12-30 | Zollner Elektronik Ag | Vorrichtung und Verfahren zum zerstörungsfreien Prüfen von elektronischen Bauteilen |
JP5439068B2 (ja) * | 2009-07-08 | 2014-03-12 | 株式会社ワコー | 力検出装置 |
EP2467689B1 (de) | 2009-08-21 | 2019-12-25 | St. Jude Medical, Cardiology Division, Inc. | Biegsame sensoren und zugehörige systeme zur bestimmung von auf ein objekt, etwa ein chirurgisches instrument, angewandten kräften |
KR101119283B1 (ko) * | 2009-12-22 | 2012-06-05 | 삼성전기주식회사 | 관성 센서 및 그 제조 방법 |
EP2363717B1 (de) * | 2010-02-12 | 2012-11-14 | Nxp B.V. | Beschleunigungsmesser und Herstellungsverfahren |
CN102892354A (zh) | 2010-03-12 | 2013-01-23 | 茵汉斯瑟菲斯动力公司 | 用于从压力感测系统中的压力传感器快速收集数据的系统和方法 |
US9109966B2 (en) | 2010-12-22 | 2015-08-18 | Aktiebolaget Skf | Two dimension external force sensor |
GB2492798B (en) * | 2011-07-12 | 2013-08-14 | Weston Aerospace Ltd | Dual output accelerometer system |
EP2732235A4 (de) | 2011-07-13 | 2015-03-04 | Enhanced Surface Dynamics Inc | Verfahren und systeme zur herstellung und aktivierung einer druckerfassungsmatte |
JP2013131360A (ja) * | 2011-12-21 | 2013-07-04 | Panasonic Corp | 多方向入力装置 |
CH706635A1 (de) * | 2012-06-20 | 2013-12-31 | Kistler Holding Ag | Messelement, Messkörper und Messanordnung zum Messen einer Kraft und Verwendung eines solchen Messkörpers. |
WO2014076295A2 (de) * | 2012-11-19 | 2014-05-22 | Behr-Hella Thermocontrol Gmbh | Kapazitiver sensor zur erfassung einer relativbewegung zweier benachbarter körper |
JP6155832B2 (ja) | 2013-05-16 | 2017-07-05 | セイコーエプソン株式会社 | センサー素子、電子機器、および移動体 |
WO2015042700A1 (en) | 2013-09-24 | 2015-04-02 | Motion Engine Inc. | Mems components and method of wafer-level manufacturing thereof |
JP6339669B2 (ja) | 2013-07-08 | 2018-06-06 | モーション・エンジン・インコーポレーテッド | Memsデバイスおよび製造する方法 |
US9383277B2 (en) | 2013-07-17 | 2016-07-05 | Wacoh Corporation | Force sensor |
WO2015013827A1 (en) | 2013-08-02 | 2015-02-05 | Motion Engine Inc. | Mems motion sensor for sub-resonance angular rate sensing |
JP5529328B1 (ja) | 2013-09-04 | 2014-06-25 | 株式会社トライフォース・マネジメント | 発電素子 |
JP6153446B2 (ja) * | 2013-10-17 | 2017-06-28 | 株式会社オーディオテクニカ | 咽喉マイクロホン |
JP6590812B2 (ja) | 2014-01-09 | 2019-10-16 | モーション・エンジン・インコーポレーテッド | 集積memsシステム |
WO2015154173A1 (en) | 2014-04-10 | 2015-10-15 | Motion Engine Inc. | Mems pressure sensor |
US11674803B2 (en) | 2014-06-02 | 2023-06-13 | Motion Engine, Inc. | Multi-mass MEMS motion sensor |
JP5911936B1 (ja) * | 2014-09-30 | 2016-04-27 | ファナック株式会社 | 変位検出方式の6軸力センサ |
CN104296799B (zh) | 2014-10-30 | 2016-08-24 | 京东方科技集团股份有限公司 | 微型传感器本体及其制造方法、微型传感器 |
WO2016090467A1 (en) | 2014-12-09 | 2016-06-16 | Motion Engine Inc. | 3d mems magnetometer and associated methods |
CN104580856A (zh) * | 2014-12-25 | 2015-04-29 | 南昌欧菲光电技术有限公司 | 摄像头模组及具有所述摄像头模组的摄像设备 |
US10407299B2 (en) | 2015-01-15 | 2019-09-10 | Motion Engine Inc. | 3D MEMS device with hermetic cavity |
WO2016121129A1 (ja) | 2015-01-26 | 2016-08-04 | 株式会社ワコーテック | 力覚センサ |
KR101653914B1 (ko) * | 2015-03-11 | 2016-09-05 | 성균관대학교산학협력단 | 힘 센서 및 이를 이용한 다축 힘/토크 측정 장치 |
US10436812B2 (en) * | 2015-03-20 | 2019-10-08 | Nxp Usa, Inc. | Micro-electro-mechanical acceleration sensor device |
JP6002868B1 (ja) | 2015-04-07 | 2016-10-05 | 株式会社トライフォース・マネジメント | 力覚センサおよびこれに用いる構造体 |
KR101685800B1 (ko) * | 2015-04-10 | 2016-12-13 | 성균관대학교산학협력단 | 다축 힘 센서 및 이를 이용한 다축 힘을 감지할 수 있는 집게 |
US10295558B2 (en) | 2015-05-15 | 2019-05-21 | Invensense, Inc. | Offset rejection electrodes |
US11231441B2 (en) * | 2015-05-15 | 2022-01-25 | Invensense, Inc. | MEMS structure for offset minimization of out-of-plane sensing accelerometers |
US9952252B2 (en) * | 2015-05-15 | 2018-04-24 | Invensense, Inc. | Offset rejection electrodes |
TWI575232B (zh) * | 2015-06-12 | 2017-03-21 | 財團法人工業技術研究院 | 感測裝置 |
US9766140B2 (en) * | 2015-08-11 | 2017-09-19 | Uneo Inc. | Surface mount force sensing module |
JP5996078B1 (ja) | 2015-10-19 | 2016-09-21 | 株式会社トライフォース・マネジメント | 発電素子 |
EP3513300A4 (de) * | 2016-09-16 | 2020-06-03 | Verb Surgical Inc. | Sensor mit mehreren freiheitsgraden |
US11083418B2 (en) | 2016-11-04 | 2021-08-10 | Wellsense, Inc. | Patient visualization system |
US10492734B2 (en) | 2016-11-04 | 2019-12-03 | Wellsense, Inc. | Patient visualization system |
JP6546368B2 (ja) * | 2017-03-25 | 2019-07-17 | アルプスアルパイン株式会社 | 力覚センサ |
US10429254B2 (en) * | 2017-04-27 | 2019-10-01 | Universal Cement Corporation | Piezo force sensor with solid-state bonding spacer |
GB2563908A (en) * | 2017-06-29 | 2019-01-02 | Impact Tech Labs Ag | A force sensitive resistor |
JP6257017B1 (ja) | 2017-09-26 | 2018-01-10 | 株式会社トライフォース・マネジメント | 力覚センサ |
DE102018205159A1 (de) | 2018-04-05 | 2019-10-10 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | 3D-Eingabegerät |
CN108759968A (zh) * | 2018-08-13 | 2018-11-06 | 三川智慧科技股份有限公司 | 一种两半式拼装水表壳体及其加工方法 |
CN110411615B (zh) * | 2019-07-01 | 2021-08-03 | 杭州电子科技大学 | 一种高灵敏度的mems触觉传感器结构 |
US11693021B2 (en) | 2020-06-09 | 2023-07-04 | Infineon Technologies Ag | Combined corrugated piezoelectric microphone and corrugated piezoelectric vibration sensor |
US11611835B2 (en) | 2020-06-09 | 2023-03-21 | Infineon Technologies Ag | Combined corrugated piezoelectric microphone and corrugated piezoelectric vibration sensor |
CN112649076A (zh) * | 2020-12-21 | 2021-04-13 | 合肥京东方显示技术有限公司 | 一种标准流量元件及其制备方法、标准流量系统 |
CN113280955B (zh) * | 2021-05-11 | 2022-07-05 | 华中科技大学 | 一种具有切向力各向异性响应的柔性传感器及其制备方法 |
US11691871B2 (en) | 2021-06-18 | 2023-07-04 | Infineon Technologies Ag | Microelectromechanical system (MEMS) vibration sensor having a segmented backplate |
EP4219390A1 (de) * | 2022-02-01 | 2023-08-02 | Infineon Technologies AG | Halbleiter-membransensor |
CN114839398A (zh) * | 2022-04-27 | 2022-08-02 | 东南大学 | 一种电容式柔性加速度传感器及其制备方法 |
Family Cites Families (97)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3270260A (en) * | 1963-11-18 | 1966-08-30 | Measurement Systems Inc | Stick-operated diaphragm control |
US3509583A (en) * | 1965-09-09 | 1970-05-05 | Bendix Corp | Electro-mechanical hand having tactile sensing means |
GB1450709A (en) * | 1973-12-31 | 1976-09-29 | Birchall D J | Pressure transducers |
US3915015A (en) * | 1974-03-18 | 1975-10-28 | Stanford Research Inst | Strain gauge transducer system |
DK139644B (da) * | 1976-12-30 | 1979-03-19 | Nils Aage Juul Eilersen | Kapacitiv kraftmåler. |
US4261086A (en) * | 1979-09-04 | 1981-04-14 | Ford Motor Company | Method for manufacturing variable capacitance pressure transducers |
DE2945200C2 (de) * | 1979-11-09 | 1983-05-26 | Krautkrämer GmbH, 5000 Köln | Verfahren und Schaltungsvorrichtung zur Erzeugung von Sägezahnimpulsen sowie Verwendung derartiger Schaltungsvorrichtungen in Ultraschall-Meßgeräten |
DE3008441A1 (de) * | 1980-03-05 | 1981-09-10 | Siemens AG, 1000 Berlin und 8000 München | Sensor zur druck-, kraft- bzw. beschleunigungs-messung |
JPS5780532A (en) * | 1980-11-07 | 1982-05-20 | Hitachi Ltd | Semiconductor load converter |
US4373399A (en) * | 1981-02-05 | 1983-02-15 | Beloglazov Alexei V | Semiconductor strain gauge transducer |
JPS57190241A (en) * | 1981-05-20 | 1982-11-22 | Kyowa Dengiyou:Kk | Pressure converter and manufacture thereof |
US4372162A (en) | 1981-08-13 | 1983-02-08 | Rockwell International Corporation | Three-axis accelerometer having dynamic bias compensation |
US4415948A (en) * | 1981-10-13 | 1983-11-15 | United Technologies Corporation | Electrostatic bonded, silicon capacitive pressure transducer |
US4384899A (en) * | 1981-11-09 | 1983-05-24 | Motorola Inc. | Bonding method adaptable for manufacturing capacitive pressure sensing elements |
GB2122842B (en) * | 1982-05-29 | 1985-08-29 | Tokyo Shibaura Electric Co | An electroacoustic transducer and a method of manufacturing an electroacoustic transducer |
DE3226386A1 (de) * | 1982-07-15 | 1984-01-19 | Battelle-Institut E.V., 6000 Frankfurt | Vorrichtung zur dreidimensionalen kraftmessung |
CH651928A5 (fr) * | 1983-02-23 | 1985-10-15 | Christof W Burckhardt | Dispositif de mesure de force. |
JPS59155734A (ja) * | 1983-02-25 | 1984-09-04 | Nec Corp | 力変換器 |
JPS59166829A (ja) * | 1983-03-14 | 1984-09-20 | Copal Takeda Medical Kenkyusho:Kk | 調整手段を備えた静電容量型圧力センサ− |
JPS6034295A (ja) * | 1983-08-03 | 1985-02-21 | 株式会社日立製作所 | 皮膚感覚センサ |
JPS6055655A (ja) * | 1983-09-07 | 1985-03-30 | Nissan Motor Co Ltd | 梁構造体を有する半導体装置 |
JPS60147622A (ja) * | 1984-01-12 | 1985-08-03 | Mitsubishi Petrochem Co Ltd | 感圧トランスジユ−サ |
JPH0663892B2 (ja) * | 1984-01-31 | 1994-08-22 | 株式会社富士電機総合研究所 | 圧覚認識制御装置 |
FR2560997B1 (fr) | 1984-03-06 | 1987-06-05 | Sfena | Capteur accelerometrique a structure pendulaire plane |
JPS60190828A (ja) * | 1984-03-12 | 1985-09-28 | Fujita Corp | 二成分土圧および間隙水圧測定用検出器 |
US4699006A (en) * | 1984-03-19 | 1987-10-13 | The Charles Stark Draper Laboratory, Inc. | Vibratory digital integrating accelerometer |
US4542436A (en) * | 1984-04-10 | 1985-09-17 | Johnson Service Company | Linearized capacitive pressure transducer |
US4680606A (en) * | 1984-06-04 | 1987-07-14 | Tactile Perceptions, Inc. | Semiconductor transducer |
JPS6126834A (ja) * | 1984-07-17 | 1986-02-06 | Shimadzu Corp | 静電容量型圧力センサ |
JPS6184711A (ja) * | 1984-10-01 | 1986-04-30 | Fujitsu Ltd | 教示操作装置 |
US4586109A (en) * | 1985-04-01 | 1986-04-29 | Bourns Instruments, Inc. | Batch-process silicon capacitive pressure sensor |
FR2580389B2 (fr) | 1985-04-16 | 1989-03-03 | Sfena | Accelerometre micro-usine a rappel electrostatique |
JPS6211257A (ja) * | 1985-07-08 | 1987-01-20 | Matsushita Electronics Corp | マイクロ波集積回路 |
US4891985A (en) * | 1985-07-22 | 1990-01-09 | Honeywell Inc. | Force sensor with attached mass |
JPH0821722B2 (ja) * | 1985-10-08 | 1996-03-04 | 日本電装株式会社 | 半導体振動・加速度検出装置 |
JPH07112014B2 (ja) * | 1986-07-09 | 1995-11-29 | 株式会社日立製作所 | 半導体記憶装置 |
JPS63108763A (ja) * | 1986-10-27 | 1988-05-13 | Nec Corp | 半導体集積回路 |
US4719538A (en) * | 1986-12-02 | 1988-01-12 | Cox John D | Force responsive capacitive transducer |
EP0312605A4 (en) * | 1987-04-24 | 1992-06-17 | Kabushiki Kaisha Nexy Kenkyusho | Detector for force, acceleration and magnetism using resistor element |
DE3852271T2 (de) | 1987-04-24 | 1995-07-06 | Enplas Lab Inc | Kraft- und momentendetektor unter verwendung eines widerstandes. |
US5182515A (en) * | 1987-04-24 | 1993-01-26 | Wacoh Corporation | Detector for magnetism using a resistance element |
US4855866A (en) * | 1987-06-06 | 1989-08-08 | Murata Manufacturing Co., Ltd. | Capacitor network |
JPH0663875B2 (ja) * | 1987-08-31 | 1994-08-22 | 松下電器産業株式会社 | 重量検出装置 |
US5263375A (en) * | 1987-09-18 | 1993-11-23 | Wacoh Corporation | Contact detector using resistance elements and its application |
US5092645A (en) * | 1987-09-18 | 1992-03-03 | Wacoh Corporation | Robotic gripper having strain sensors formed on a semiconductor substrate |
JPS6486508A (en) * | 1987-09-29 | 1989-03-31 | Toshiba Corp | Manufacture of chip capacitor |
NL8702589A (nl) * | 1987-10-30 | 1989-05-16 | Microtel Bv | Elektro-akoestische transducent van de als elektreet aangeduide soort, en een werkwijze voor het vervaardigen van een dergelijke transducent. |
EP0316498B1 (de) * | 1987-11-09 | 1992-03-04 | Vibro-Meter Sa | Accelerometer |
GB8728442D0 (en) | 1987-12-04 | 1988-01-13 | Russell M K | Triaxial accelerometers |
JPH01150383A (ja) * | 1987-12-07 | 1989-06-13 | Mitsutoyo Corp | パターン配線用電極体 |
US4864463A (en) * | 1988-04-19 | 1989-09-05 | Allied-Signal Inc. | Capacitive pressure sensor |
JPH0242761A (ja) * | 1988-04-20 | 1990-02-13 | Matsushita Electric Ind Co Ltd | アクティブマトリクス基板の製造方法 |
JPH0218932A (ja) * | 1988-07-07 | 1990-01-23 | Mitsubishi Electric Corp | 半導体装置の製造方法 |
JPH0663885B2 (ja) * | 1988-09-19 | 1994-08-22 | 工業技術院長 | 分布型圧覚センサの製造方法 |
JPH0623782B2 (ja) * | 1988-11-15 | 1994-03-30 | 株式会社日立製作所 | 静電容量式加速度センサ及び半導体圧力センサ |
JPH0834297B2 (ja) * | 1988-12-28 | 1996-03-29 | 三菱電機株式会社 | 半導体装置 |
US5035148A (en) * | 1989-02-01 | 1991-07-30 | Wacoh Corporation | Force detector using resistance elements |
US5054323A (en) * | 1989-04-04 | 1991-10-08 | The Charles Stark Draper Laboratory, Inc. | Pressure distribution characterization system |
JP2681215B2 (ja) * | 1989-05-29 | 1997-11-26 | 株式会社ワコー | 積層基板を用いたセンサの製造方法 |
JPH0350809A (ja) * | 1989-07-19 | 1991-03-05 | Matsushita Electric Ind Co Ltd | 厚膜コンデンサ |
JPH0748566B2 (ja) * | 1989-09-27 | 1995-05-24 | 山武ハネウエル株式会社 | 加速度センサおよびその製造方法 |
JPH03165552A (ja) * | 1989-11-24 | 1991-07-17 | Sony Corp | スタックトキャパシタ型dramとその製造方法 |
EP0461265B1 (de) * | 1989-12-28 | 1995-05-10 | Wacoh Corporation | Beschleunigungssensoren |
US5531092A (en) * | 1989-12-28 | 1996-07-02 | Okada; Kazuhiro | Device for moving a suspended weight body |
US6864677B1 (en) * | 1993-12-15 | 2005-03-08 | Kazuhiro Okada | Method of testing a sensor |
US5122755A (en) | 1990-05-11 | 1992-06-16 | New Sd, Inc. | Capacitive position detector |
US5421213A (en) * | 1990-10-12 | 1995-06-06 | Okada; Kazuhiro | Multi-dimensional force detector |
US6314823B1 (en) * | 1991-09-20 | 2001-11-13 | Kazuhiro Okada | Force detector and acceleration detector and method of manufacturing the same |
JP3040816B2 (ja) * | 1991-03-30 | 2000-05-15 | 和廣 岡田 | 電極間距離の変化を利用して物理量を検出する装置における動作試験方法、およびこの方法を実施する機能を備えた物理量の検出装置 |
JP3141954B2 (ja) * | 1991-07-17 | 2001-03-07 | 株式会社ワコー | 圧電素子を用いた力・加速度・磁気のセンサ |
JP3027457B2 (ja) * | 1991-10-25 | 2000-04-04 | 和廣 岡田 | 多次元方向に関する力・加速度・磁気の検出装置 |
JPH05215627A (ja) * | 1992-02-04 | 1993-08-24 | Kazuhiro Okada | 多次元方向に関する力・加速度・磁気の検出装置 |
US5317922A (en) * | 1992-04-30 | 1994-06-07 | Ford Motor Company | Capacitance transducer article and method of fabrication |
US5420395A (en) * | 1992-11-09 | 1995-05-30 | American Roller Company | Ceramic heater roller with zone heating |
US5646346A (en) * | 1994-11-10 | 1997-07-08 | Okada; Kazuhiro | Multi-axial angular velocity sensor |
US6282956B1 (en) * | 1994-12-29 | 2001-09-04 | Kazuhiro Okada | Multi-axial angular velocity sensor |
JP3256346B2 (ja) * | 1993-07-29 | 2002-02-12 | 和廣 岡田 | 圧電素子を用いた力・加速度・磁気のセンサ |
US5661235A (en) * | 1993-10-01 | 1997-08-26 | Hysitron Incorporated | Multi-dimensional capacitive transducer |
US5538359A (en) * | 1994-07-08 | 1996-07-23 | Wadle; Barry | Quick release boom connector |
JP3549590B2 (ja) * | 1994-09-28 | 2004-08-04 | 和廣 岡田 | 加速度・角速度センサ |
JP3585980B2 (ja) * | 1995-02-21 | 2004-11-10 | 株式会社ワコー | 角速度センサ |
US6003371A (en) | 1995-02-21 | 1999-12-21 | Wacoh Corporation | Angular velocity sensor |
JPH0949856A (ja) * | 1995-05-31 | 1997-02-18 | Wako:Kk | 加速度センサ |
US5687080A (en) * | 1995-06-20 | 1997-11-11 | Ziba Design, Inc. | Multiple axis data input apparatus and method |
JPH09119943A (ja) * | 1995-10-24 | 1997-05-06 | Wako:Kk | 加速度センサ |
US6076401A (en) * | 1996-07-10 | 2000-06-20 | Wacoh Corporation | Angular velocity sensor |
US6367326B1 (en) * | 1996-07-10 | 2002-04-09 | Wacoh Corporation | Angular velocity sensor |
JP4176849B2 (ja) * | 1997-05-08 | 2008-11-05 | 株式会社ワコー | センサの製造方法 |
US6003057A (en) * | 1997-12-24 | 1999-12-14 | Motorola, Inc. | Galois field arithmetic logic unit circuit |
JP2000249609A (ja) * | 1999-03-01 | 2000-09-14 | Wakoo:Kk | 静電容量式センサ |
JP4295883B2 (ja) * | 1999-12-13 | 2009-07-15 | 株式会社ワコー | 力検出装置 |
US6809529B2 (en) * | 2001-08-10 | 2004-10-26 | Wacoh Corporation | Force detector |
JP4216525B2 (ja) * | 2002-05-13 | 2009-01-28 | 株式会社ワコー | 加速度センサおよびその製造方法 |
JP4125931B2 (ja) * | 2002-08-26 | 2008-07-30 | 株式会社ワコー | 回転操作量の入力装置およびこれを利用した操作装置 |
JP4907050B2 (ja) * | 2003-03-31 | 2012-03-28 | 株式会社ワコー | 力検出装置 |
JP4271475B2 (ja) * | 2003-03-31 | 2009-06-03 | 株式会社ワコー | 力検出装置 |
JP4387691B2 (ja) * | 2003-04-28 | 2009-12-16 | 株式会社ワコー | 力検出装置 |
-
1991
- 1991-09-20 US US07/764,159 patent/US5421213A/en not_active Expired - Lifetime
- 1991-10-11 DE DE69133193T patent/DE69133193T2/de not_active Expired - Lifetime
- 1991-10-11 EP EP91117418A patent/EP0480471B1/de not_active Expired - Lifetime
- 1991-10-11 EP EP96119715A patent/EP0767363B1/de not_active Expired - Lifetime
- 1991-10-11 DE DE69126501T patent/DE69126501T2/de not_active Expired - Lifetime
-
1994
- 1994-08-18 US US08/292,496 patent/US5406848A/en not_active Expired - Lifetime
-
1995
- 1995-02-24 US US08/394,310 patent/US5531002A/en not_active Expired - Lifetime
-
1996
- 1996-05-09 US US08/647,178 patent/US5639973A/en not_active Expired - Lifetime
-
1997
- 1997-03-18 US US08/819,357 patent/US5811693A/en not_active Expired - Lifetime
-
1998
- 1998-07-02 US US09/109,560 patent/US6053057A/en not_active Expired - Fee Related
-
1999
- 1999-08-16 US US09/375,334 patent/US6158291A/en not_active Expired - Fee Related
-
2008
- 2008-03-14 US US12/075,916 patent/US7533582B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0480471A3 (en) | 1993-12-29 |
EP0767363B1 (de) | 2003-01-22 |
EP0767363A2 (de) | 1997-04-09 |
US6053057A (en) | 2000-04-25 |
US5531002A (en) | 1996-07-02 |
EP0480471B1 (de) | 1997-06-11 |
US5406848A (en) | 1995-04-18 |
US5811693A (en) | 1998-09-22 |
EP0767363A3 (de) | 1997-07-02 |
US5421213A (en) | 1995-06-06 |
DE69126501D1 (de) | 1997-07-17 |
DE69133193T2 (de) | 2003-10-09 |
US7533582B2 (en) | 2009-05-19 |
EP0480471A2 (de) | 1992-04-15 |
DE69126501T2 (de) | 1997-09-25 |
US6158291A (en) | 2000-12-12 |
US20080178675A1 (en) | 2008-07-31 |
US5639973A (en) | 1997-06-17 |
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