DE69220629D1 - Verfahren und Vorrichtung zur Herstellung eines Musters eines Aufzeichnungselementes - Google Patents

Verfahren und Vorrichtung zur Herstellung eines Musters eines Aufzeichnungselementes

Info

Publication number
DE69220629D1
DE69220629D1 DE69220629T DE69220629T DE69220629D1 DE 69220629 D1 DE69220629 D1 DE 69220629D1 DE 69220629 T DE69220629 T DE 69220629T DE 69220629 T DE69220629 T DE 69220629T DE 69220629 D1 DE69220629 D1 DE 69220629D1
Authority
DE
Germany
Prior art keywords
pattern
making
recording element
recording
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69220629T
Other languages
English (en)
Other versions
DE69220629T2 (de
Inventor
William E Nelson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE69220629D1 publication Critical patent/DE69220629D1/de
Application granted granted Critical
Publication of DE69220629T2 publication Critical patent/DE69220629T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70283—Mask effects on the imaging process
    • G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
DE69220629T 1991-08-08 1992-08-07 Verfahren und Vorrichtung zur Herstellung eines Musters eines Aufzeichnungselementes Expired - Fee Related DE69220629T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US74213391A 1991-08-08 1991-08-08

Publications (2)

Publication Number Publication Date
DE69220629D1 true DE69220629D1 (de) 1997-08-07
DE69220629T2 DE69220629T2 (de) 1997-12-18

Family

ID=24983622

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69220629T Expired - Fee Related DE69220629T2 (de) 1991-08-08 1992-08-07 Verfahren und Vorrichtung zur Herstellung eines Musters eines Aufzeichnungselementes

Country Status (5)

Country Link
US (3) US5330878A (de)
EP (1) EP0528285B1 (de)
JP (1) JP3254248B2 (de)
CA (1) CA2075026A1 (de)
DE (1) DE69220629T2 (de)

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JP2002072491A (ja) * 2000-09-01 2002-03-12 Airex Inc プリント基板製造装置
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US6624880B2 (en) 2001-01-18 2003-09-23 Micronic Laser Systems Ab Method and apparatus for microlithography
US6707591B2 (en) 2001-04-10 2004-03-16 Silicon Light Machines Angled illumination for a single order light modulator based projection system
US6753947B2 (en) * 2001-05-10 2004-06-22 Ultratech Stepper, Inc. Lithography system and method for device manufacture
US6782205B2 (en) 2001-06-25 2004-08-24 Silicon Light Machines Method and apparatus for dynamic equalization in wavelength division multiplexing
US6747781B2 (en) 2001-06-25 2004-06-08 Silicon Light Machines, Inc. Method, apparatus, and diffuser for reducing laser speckle
US7095484B1 (en) * 2001-06-27 2006-08-22 University Of South Florida Method and apparatus for maskless photolithography
US6829092B2 (en) 2001-08-15 2004-12-07 Silicon Light Machines, Inc. Blazed grating light valve
US6785001B2 (en) * 2001-08-21 2004-08-31 Silicon Light Machines, Inc. Method and apparatus for measuring wavelength jitter of light signal
JP4068838B2 (ja) * 2001-12-07 2008-03-26 株式会社日立製作所 半導体装置の製造方法
US6800238B1 (en) 2002-01-15 2004-10-05 Silicon Light Machines, Inc. Method for domain patterning in low coercive field ferroelectrics
US6665048B2 (en) 2002-01-22 2003-12-16 Creo Inc. Method for imaging a continuously moving object
JP3938714B2 (ja) 2002-05-16 2007-06-27 大日本スクリーン製造株式会社 露光装置
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US6728023B1 (en) 2002-05-28 2004-04-27 Silicon Light Machines Optical device arrays with optimized image resolution
JP4201178B2 (ja) 2002-05-30 2008-12-24 大日本スクリーン製造株式会社 画像記録装置
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US6813059B2 (en) 2002-06-28 2004-11-02 Silicon Light Machines, Inc. Reduced formation of asperities in contact micro-structures
US6714337B1 (en) 2002-06-28 2004-03-30 Silicon Light Machines Method and device for modulating a light beam and having an improved gamma response
US6801354B1 (en) 2002-08-20 2004-10-05 Silicon Light Machines, Inc. 2-D diffraction grating for substantially eliminating polarization dependent losses
US7057795B2 (en) * 2002-08-20 2006-06-06 Silicon Light Machines Corporation Micro-structures with individually addressable ribbon pairs
KR101049608B1 (ko) * 2002-08-24 2011-07-14 매스크리스 리소그래피 인코퍼레이티드 연속적인 직접-기록 광 리쏘그래피 장치 및 방법
US6712480B1 (en) 2002-09-27 2004-03-30 Silicon Light Machines Controlled curvature of stressed micro-structures
US6806997B1 (en) 2003-02-28 2004-10-19 Silicon Light Machines, Inc. Patterned diffractive light modulator ribbon for PDL reduction
US6829077B1 (en) 2003-02-28 2004-12-07 Silicon Light Machines, Inc. Diffractive light modulator with dynamically rotatable diffraction plane
JP4390189B2 (ja) 2003-04-10 2009-12-24 大日本スクリーン製造株式会社 パターン描画装置
JPWO2005081034A1 (ja) * 2004-02-25 2007-10-25 株式会社ニコン 二次元調光デバイス、露光装置、及び露光方法
JP2005311084A (ja) * 2004-04-21 2005-11-04 Canon Inc 露光装置、デバイス製造方法、パターン生成装置及びメンテナンス方法
JP4601482B2 (ja) * 2004-07-29 2010-12-22 新光電気工業株式会社 描画装置および描画方法
JP2006128194A (ja) * 2004-10-26 2006-05-18 Canon Inc 露光装置及びデバイス製造方法
DE102004059973A1 (de) * 2004-12-13 2006-06-22 Imi Intelligent Medical Implants Ag Vorrichtung zur Steuerung der elektrischen Ladung an Stimulationselektroden
WO2006105911A2 (de) * 2005-04-02 2006-10-12 Punch Graphix Prepress Germany Gmbh Belichtungsvorrichtung für druckplatten
EP1877869A2 (de) 2005-05-02 2008-01-16 Radove GmbH Lithographieverfahren zur maskenlosen musterübertragung auf ein lichtempfindliches substrat
JP4753625B2 (ja) 2005-05-31 2011-08-24 大日本スクリーン製造株式会社 パターン描画装置およびブロック数決定方法
JP2009109550A (ja) 2007-10-26 2009-05-21 Adtec Engineeng Co Ltd 直描露光装置
NL2007577A (en) 2010-11-10 2012-05-14 Asml Netherlands Bv Optimization of source, mask and projection optics.
JP6106970B2 (ja) * 2012-07-02 2017-04-05 株式会社ニコン 空間光変調器および露光装置
US10328685B2 (en) 2013-12-16 2019-06-25 General Electric Company Diode laser fiber array for powder bed fabrication or repair
US10532556B2 (en) 2013-12-16 2020-01-14 General Electric Company Control of solidification in laser powder bed fusion additive manufacturing using a diode laser fiber array
RU2606607C2 (ru) * 2015-05-27 2017-01-10 3М Инновейтив Пропертиз Компани Полирующие композиции, устойчивые к воздействию отрицательных температур

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CA2075026A1 (en) * 1991-08-08 1993-02-09 William E. Nelson Method and apparatus for patterning an imaging member
US5530878A (en) * 1994-11-17 1996-06-25 Sun Microsystems, Inc. Simplified power system with a single power converter providing low power consumption and a soft on/off feature

Also Published As

Publication number Publication date
JP3254248B2 (ja) 2002-02-04
JPH05206006A (ja) 1993-08-13
CA2075026A1 (en) 1993-02-09
EP0528285B1 (de) 1997-07-02
EP0528285A1 (de) 1993-02-24
DE69220629T2 (de) 1997-12-18
US5482818A (en) 1996-01-09
US5672464A (en) 1997-09-30
US5330878A (en) 1994-07-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee