DE69228369D1 - Berührungslose Testsonde - Google Patents

Berührungslose Testsonde

Info

Publication number
DE69228369D1
DE69228369D1 DE69228369T DE69228369T DE69228369D1 DE 69228369 D1 DE69228369 D1 DE 69228369D1 DE 69228369 T DE69228369 T DE 69228369T DE 69228369 T DE69228369 T DE 69228369T DE 69228369 D1 DE69228369 D1 DE 69228369D1
Authority
DE
Germany
Prior art keywords
test probe
contact test
contact
probe
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69228369T
Other languages
English (en)
Other versions
DE69228369T2 (de
Inventor
John M Heumann
Ed O Schlotzhauer
David T Crook
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE69228369D1 publication Critical patent/DE69228369D1/de
Publication of DE69228369T2 publication Critical patent/DE69228369T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/07—Non contact-making probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
    • F02P17/00—Testing of ignition installations, e.g. in combination with adjusting; Testing of ignition timing in compression-ignition engines
    • F02P2017/006—Testing of ignition installations, e.g. in combination with adjusting; Testing of ignition timing in compression-ignition engines using a capacitive sensor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/3025—Wireless interface with the DUT
DE69228369T 1992-01-14 1992-09-07 Berührungslose Testsonde Expired - Fee Related DE69228369T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/820,711 US5274336A (en) 1992-01-14 1992-01-14 Capacitively-coupled test probe

Publications (2)

Publication Number Publication Date
DE69228369D1 true DE69228369D1 (de) 1999-03-18
DE69228369T2 DE69228369T2 (de) 1999-08-26

Family

ID=25231526

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69228369T Expired - Fee Related DE69228369T2 (de) 1992-01-14 1992-09-07 Berührungslose Testsonde

Country Status (4)

Country Link
US (1) US5274336A (de)
EP (1) EP0551564B1 (de)
JP (1) JP3708971B2 (de)
DE (1) DE69228369T2 (de)

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JP2994259B2 (ja) 1996-03-28 1999-12-27 オー・エイチ・ティー株式会社 基板検査方法および基板検査装置
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US6091236A (en) * 1997-04-28 2000-07-18 Csi Technology, Inc. System and method for measuring and analyzing electrical signals on the shaft of a machine
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US6545484B1 (en) * 2000-05-24 2003-04-08 Oht Inc. Board inspection apparatus and board inspection method
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US6600325B2 (en) * 2001-02-06 2003-07-29 Sun Microsystems, Inc. Method and apparatus for probing an integrated circuit through capacitive coupling
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US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7170394B2 (en) * 2003-07-31 2007-01-30 Agilent Technologies, Inc. Remote current sensing and communication over single pair of power feed wires
US7319341B1 (en) 2003-08-28 2008-01-15 Altera Corporation Method of maintaining signal integrity across a capacitive coupled solder bump
US6930494B2 (en) * 2003-08-29 2005-08-16 Agilent Technologies, Inc. Capacitive probe assembly with flex circuit
US6998849B2 (en) * 2003-09-27 2006-02-14 Agilent Technologies, Inc. Capacitive sensor measurement method for discrete time sampled system for in-circuit test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
DE112004002554T5 (de) * 2003-12-24 2006-11-23 Cascade Microtech, Inc., Beaverton Active wafer probe
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
WO2006031646A2 (en) 2004-09-13 2006-03-23 Cascade Microtech, Inc. Double sided probing structures
US7224169B2 (en) 2004-11-02 2007-05-29 Agilent Technologies, Inc. Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US20060192545A1 (en) * 2005-02-28 2006-08-31 Static Control Components, Inc. Voltage detection pole
FR2885446B1 (fr) * 2005-05-09 2007-07-20 St Microelectronics Sa Sonde coaxiale, son procede de fabrication et dispositif de mesure en champ proche electromagnetique sur des systemes a distance submicrometrique
US7622931B2 (en) * 2005-10-03 2009-11-24 University Of Utah Research Foundation Non-contact reflectometry system and method
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US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7795860B2 (en) * 2006-08-16 2010-09-14 Tektronix, Inc. Multiple probe acquisition system
US7378832B2 (en) * 2006-08-22 2008-05-27 Lecroy Corporation Probing high-frequency signals
US7659790B2 (en) * 2006-08-22 2010-02-09 Lecroy Corporation High speed signal transmission line having reduced thickness regions
US7733107B1 (en) * 2006-09-11 2010-06-08 Barth Jon E Charged device model contact plate
JP4847396B2 (ja) * 2007-03-23 2011-12-28 日置電機株式会社 プローブ、信号検出用のプローブ装置、信号供給用のプローブ装置、および検査装置
JP2008232963A (ja) * 2007-03-23 2008-10-02 Hioki Ee Corp プローブ、プローブ装置および検査装置
JP4936125B2 (ja) * 2007-04-12 2012-05-23 横河電機株式会社 プローブ
JP4938557B2 (ja) * 2007-06-12 2012-05-23 日置電機株式会社 プローブ、信号検出用のプローブ装置、信号供給用のプローブ装置、および検査装置
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US7728607B2 (en) * 2007-12-28 2010-06-01 Leonard Forbes Electrical probe
US7866784B2 (en) * 2008-08-19 2011-01-11 Silverbrook Research Pty Ltd Diagnostic probe assembly for printhead integrated circuitry
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
JP2010223934A (ja) * 2009-02-27 2010-10-07 Fujitsu Ltd 電界感知プローブ、電界の検出方法及び回路基板の製造方法
US8564308B2 (en) * 2009-09-30 2013-10-22 Tektronix, Inc. Signal acquisition system having reduced probe loading of a device under test
US8436624B2 (en) 2009-09-30 2013-05-07 Tektronix, Inc. Signal acquisition system having reduced probe loading of a device under test
US8278940B2 (en) * 2009-09-30 2012-10-02 Tektronix, Inc. Signal acquisition system having a compensation digital filter
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US9316669B2 (en) * 2013-06-28 2016-04-19 Keysight Technologies, Inc. Measurement probe providing different levels of amplification for signals of different magnitude
US10067162B2 (en) * 2014-10-30 2018-09-04 Tongfu Microelectronics Co., Ltd. Testing probe, semiconductor testing fixture and fabrication method thereof
JP6665007B2 (ja) * 2016-03-29 2020-03-13 日置電機株式会社 電圧検出プローブおよび測定装置
EP3115792A1 (de) * 2015-06-24 2017-01-11 Hioki Denki Kabushiki Kaisha Spannungsdetektionssonde und messvorrichtung
JP6636372B2 (ja) * 2015-06-24 2020-01-29 日置電機株式会社 電圧検出プローブおよび測定装置
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Also Published As

Publication number Publication date
JP3708971B2 (ja) 2005-10-19
EP0551564A3 (en) 1993-12-15
EP0551564B1 (de) 1999-02-03
US5274336A (en) 1993-12-28
JPH05264672A (ja) 1993-10-12
DE69228369T2 (de) 1999-08-26
EP0551564A2 (de) 1993-07-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES DELA

8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D. STAATES, US

8339 Ceased/non-payment of the annual fee