DE69303109D1 - Verbesserter Schlammpolierer unter Verwendung der Ultraschall-Bewegung - Google Patents

Verbesserter Schlammpolierer unter Verwendung der Ultraschall-Bewegung

Info

Publication number
DE69303109D1
DE69303109D1 DE69303109T DE69303109T DE69303109D1 DE 69303109 D1 DE69303109 D1 DE 69303109D1 DE 69303109 T DE69303109 T DE 69303109T DE 69303109 T DE69303109 T DE 69303109T DE 69303109 D1 DE69303109 D1 DE 69303109D1
Authority
DE
Germany
Prior art keywords
ultrasonic motion
improved slurry
polisher
slurry polisher
improved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69303109T
Other languages
English (en)
Other versions
DE69303109T2 (de
Inventor
Gabriel Lorimer Miller
Eric Richard Wagner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of DE69303109D1 publication Critical patent/DE69303109D1/de
Application granted granted Critical
Publication of DE69303109T2 publication Critical patent/DE69303109T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
DE69303109T 1992-04-02 1993-03-25 Verbesserter Schlammpolierer unter Verwendung der Ultraschall-Bewegung Expired - Fee Related DE69303109T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/862,044 US5245796A (en) 1992-04-02 1992-04-02 Slurry polisher using ultrasonic agitation

Publications (2)

Publication Number Publication Date
DE69303109D1 true DE69303109D1 (de) 1996-07-18
DE69303109T2 DE69303109T2 (de) 1996-10-10

Family

ID=25337489

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69303109T Expired - Fee Related DE69303109T2 (de) 1992-04-02 1993-03-25 Verbesserter Schlammpolierer unter Verwendung der Ultraschall-Bewegung

Country Status (8)

Country Link
US (1) US5245796A (de)
EP (1) EP0566258B1 (de)
JP (1) JP2981079B2 (de)
KR (1) KR930022483A (de)
DE (1) DE69303109T2 (de)
ES (1) ES2088228T3 (de)
HK (1) HK180296A (de)
TW (1) TW197531B (de)

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US5932486A (en) * 1996-08-16 1999-08-03 Rodel, Inc. Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers
US5782675A (en) * 1996-10-21 1998-07-21 Micron Technology, Inc. Apparatus and method for refurbishing fixed-abrasive polishing pads used in chemical-mechanical planarization of semiconductor wafers
US6769967B1 (en) 1996-10-21 2004-08-03 Micron Technology, Inc. Apparatus and method for refurbishing polishing pads used in chemical-mechanical planarization of semiconductor wafers
KR19980064179A (ko) * 1996-12-19 1998-10-07 윌리엄비.켐플러 웨이퍼 연마 공정시 실리콘 제거율을 안정화하는 방법
JPH10217149A (ja) * 1997-02-05 1998-08-18 Ebara Corp ターンテーブル用クロスの剥離治具
JP3130000B2 (ja) 1997-09-04 2001-01-31 松下電子工業株式会社 半導体ウェハ研磨装置及び研磨方法
US5968841A (en) * 1997-05-06 1999-10-19 International Business Machines Corporation Device and method for preventing settlement of particles on a chemical-mechanical polishing pad
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US5904615A (en) * 1997-07-18 1999-05-18 Hankook Machine Tools Co., Ltd. Pad conditioner for chemical mechanical polishing apparatus
US6406364B1 (en) * 1997-08-12 2002-06-18 Ebara Corporation Polishing solution feeder
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US5957754A (en) * 1997-08-29 1999-09-28 Applied Materials, Inc. Cavitational polishing pad conditioner
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JP4030247B2 (ja) 1999-05-17 2008-01-09 株式会社荏原製作所 ドレッシング装置及びポリッシング装置
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US6306008B1 (en) * 1999-08-31 2001-10-23 Micron Technology, Inc. Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization
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US6306768B1 (en) 1999-11-17 2001-10-23 Micron Technology, Inc. Method for planarizing microelectronic substrates having apertures
US6313038B1 (en) 2000-04-26 2001-11-06 Micron Technology, Inc. Method and apparatus for controlling chemical interactions during planarization of microelectronic substrates
US6387289B1 (en) 2000-05-04 2002-05-14 Micron Technology, Inc. Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6612901B1 (en) * 2000-06-07 2003-09-02 Micron Technology, Inc. Apparatus for in-situ optical endpointing of web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies
US6554688B2 (en) * 2001-01-04 2003-04-29 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
US6875091B2 (en) * 2001-01-04 2005-04-05 Lam Research Corporation Method and apparatus for conditioning a polishing pad with sonic energy
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US6666749B2 (en) * 2001-08-30 2003-12-23 Micron Technology, Inc. Apparatus and method for enhanced processing of microelectronic workpieces
KR20030053375A (ko) * 2001-12-22 2003-06-28 동부전자 주식회사 초음파 발생장치를 구비한 패드 컨디셔닝 장치
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US6869335B2 (en) * 2002-07-08 2005-03-22 Micron Technology, Inc. Retaining rings, planarizing apparatuses including retaining rings, and methods for planarizing micro-device workpieces
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US6841991B2 (en) * 2002-08-29 2005-01-11 Micron Technology, Inc. Planarity diagnostic system, E.G., for microelectronic component test systems
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Also Published As

Publication number Publication date
EP0566258A1 (de) 1993-10-20
ES2088228T3 (es) 1996-08-01
EP0566258B1 (de) 1996-06-12
JPH068134A (ja) 1994-01-18
US5245796A (en) 1993-09-21
KR930022483A (ko) 1993-11-24
JP2981079B2 (ja) 1999-11-22
TW197531B (de) 1993-01-01
HK180296A (en) 1996-10-04
DE69303109T2 (de) 1996-10-10

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