DE69307223D1 - Vorrichtung zum Polieren von Fasen auf Halbleiterscheiben - Google Patents

Vorrichtung zum Polieren von Fasen auf Halbleiterscheiben

Info

Publication number
DE69307223D1
DE69307223D1 DE69307223T DE69307223T DE69307223D1 DE 69307223 D1 DE69307223 D1 DE 69307223D1 DE 69307223 T DE69307223 T DE 69307223T DE 69307223 T DE69307223 T DE 69307223T DE 69307223 D1 DE69307223 D1 DE 69307223D1
Authority
DE
Germany
Prior art keywords
semiconductor wafers
chamfers
polishing
polishing chamfers
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69307223T
Other languages
English (en)
Other versions
DE69307223T2 (de
Inventor
Fumihiko Hasegawa
Yasuyoshi Kuroda
Tatsuo Ohtani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5388692U external-priority patent/JPH0615957U/ja
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69307223D1 publication Critical patent/DE69307223D1/de
Application granted granted Critical
Publication of DE69307223T2 publication Critical patent/DE69307223T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
DE69307223T 1992-07-31 1993-06-03 Vorrichtung zum Polieren von Fasen auf Halbleiterscheiben Expired - Fee Related DE69307223T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP4205275A JP3027882B2 (ja) 1992-07-31 1992-07-31 ウエーハ面取部研磨装置
JP5388692U JPH0615957U (ja) 1992-07-31 1992-07-31 回転割出式ウエーハ面取部研磨装置

Publications (2)

Publication Number Publication Date
DE69307223D1 true DE69307223D1 (de) 1997-02-20
DE69307223T2 DE69307223T2 (de) 1997-08-14

Family

ID=26394611

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69307223T Expired - Fee Related DE69307223T2 (de) 1992-07-31 1993-06-03 Vorrichtung zum Polieren von Fasen auf Halbleiterscheiben

Country Status (4)

Country Link
US (2) US5547415A (de)
EP (1) EP0584905B1 (de)
JP (1) JP3027882B2 (de)
DE (1) DE69307223T2 (de)

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JP2882458B2 (ja) * 1994-11-28 1999-04-12 株式会社東京精密 ウェーハ面取り機
TW303487B (de) * 1995-05-29 1997-04-21 Shinetsu Handotai Co Ltd
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DE19732433A1 (de) * 1996-07-29 1998-02-12 Mitsubishi Material Silicon Verfahren und Gerät zum Polieren von Schrägkanten von Halbleiterwafern
DE19719503C2 (de) * 1997-05-07 2002-05-02 Wolters Peter Werkzeugmasch Vorrichtung zum chemisch-mechanischen Polieren von Oberflächen von Halbleiterwafern und Verfahren zum Betrieb der Vorrichtung
JPH10309666A (ja) * 1997-05-09 1998-11-24 Speedfam Co Ltd エッジポリッシング装置及びその方法
JPH1190803A (ja) * 1997-09-11 1999-04-06 Speedfam Co Ltd ワークエッジの鏡面研磨装置
US6110011A (en) 1997-11-10 2000-08-29 Applied Materials, Inc. Integrated electrodeposition and chemical-mechanical polishing tool
JP3411202B2 (ja) * 1997-12-05 2003-05-26 ニトマック・イーアール株式会社 円盤状ワーク外周部の研磨方法
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US6080050A (en) 1997-12-31 2000-06-27 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
JP3990073B2 (ja) * 1999-06-17 2007-10-10 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
US6267649B1 (en) 1999-08-23 2001-07-31 Industrial Technology Research Institute Edge and bevel CMP of copper wafer
US6257954B1 (en) 2000-02-23 2001-07-10 Memc Electronic Materials, Inc. Apparatus and process for high temperature wafer edge polishing
US6517130B1 (en) 2000-03-14 2003-02-11 Applied Materials, Inc. Self positioning vacuum chuck
US6722964B2 (en) * 2000-04-04 2004-04-20 Ebara Corporation Polishing apparatus and method
US7066814B2 (en) * 2001-09-21 2006-06-27 Igt Gaming device having regenerating multiple award opportunities
US7351146B2 (en) * 2001-10-05 2008-04-01 Igt Gaming device and method for activating multiple paylines upon the wager of a single credit
JP4162892B2 (ja) * 2002-01-11 2008-10-08 日鉱金属株式会社 半導体ウェハおよびその製造方法
JP2003209075A (ja) 2002-01-15 2003-07-25 Speedfam Co Ltd ウェハエッジ研磨システム及びウェハエッジ研磨制御方法
US7485043B2 (en) 2002-06-19 2009-02-03 Igt Elimination games for gaming machines
GB0313012D0 (en) 2003-06-06 2003-07-09 Igt Uk Ltd Entertainment machines
US7731582B2 (en) * 2003-09-08 2010-06-08 Igt Gaming device having an offer and acceptance game with multiple offers
AU2005208971B2 (en) 2004-01-28 2011-02-24 Igt Gaming device having a partial selectable symbol matrix
CA2576506A1 (en) 2004-08-03 2006-02-16 Wagerworks, Inc. Gaming method and device involving progressive wagers
US7950994B2 (en) * 2004-09-10 2011-05-31 Igt Replacement reel gaming device and method
US7690982B2 (en) 2004-09-21 2010-04-06 Igt Gaming device having free spin game with terminators and anti-terminators
US7322887B2 (en) * 2004-10-01 2008-01-29 Igt Gaming device having sequential activations of a game and replay of previous activations of the game
JP4561982B2 (ja) * 2005-01-06 2010-10-13 Ｔｄｋ株式会社 加工機
JP5196709B2 (ja) * 2005-04-19 2013-05-15 株式会社荏原製作所 半導体ウエハ周縁研磨装置及び方法
US20070060241A1 (en) * 2005-09-12 2007-03-15 Low Michael N Methods and apparatus for providing free-play credits in a video poker game
US8070597B2 (en) 2006-08-03 2011-12-06 Igt Gaming device and method having multiple progressive award levels and a secondary game for advancing through the progressive award levels
US7758416B2 (en) 2006-09-08 2010-07-20 Igt Gaming system having a plurality of simultaneously played wagering games that may trigger a plurality of free games which may be played simultaneously with the wagering games
JP2008091665A (ja) * 2006-10-03 2008-04-17 Nec Electronics Corp Ｃｍｐ装置
US20080108430A1 (en) 2006-11-08 2008-05-08 Igt Gaming system and method which provides players an opportunity to win a progressive award
US8105149B2 (en) 2006-11-10 2012-01-31 Igt Gaming system and method providing venue wide simultaneous player participation based bonus game
US8033903B2 (en) 2006-11-10 2011-10-11 Igt Gaming system and method having progressive free games
US8231456B2 (en) 2007-10-17 2012-07-31 Igt Gaming device and method providing side bet for winning free activations
US8419546B2 (en) 2009-08-31 2013-04-16 Igt Gaming system and method for selectively providing an elimination tournament that funds an award through expected values of unplayed tournament games of eliminated players
US8613474B2 (en) * 2011-07-06 2013-12-24 Tel Nexx, Inc. Substrate loader and unloader having a Bernoulli support
US8684818B2 (en) 2012-02-14 2014-04-01 Igt Gaming system, gaming device, and method for providing a replay of previously played games
US9214067B2 (en) 2012-09-06 2015-12-15 Igt Gaming system and method for providing a streaming symbols game
US8992301B2 (en) 2012-09-27 2015-03-31 Igt Gaming system and method for providing a game which populates symbols along a path
US9039512B2 (en) 2012-09-27 2015-05-26 Igt Gaming system and method for providing a game which populates symbols along a path
US9028318B2 (en) 2012-09-27 2015-05-12 Igt Gaming system and method for providing a game which populates symbols along a path
US8851979B2 (en) 2013-03-07 2014-10-07 Igt Gaming system and method for providing a symbol elimination game
US8784191B1 (en) 2013-03-07 2014-07-22 Igt Gaming system and method for providing a symbol elimination game
US20150087208A1 (en) * 2013-09-26 2015-03-26 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for manufacturing a semiconductor wafer
US10147281B2 (en) 2014-07-24 2018-12-04 Igt Gaming system and method having matching symbol stacks and additional award opportunities
CN106002528B (zh) * 2016-07-12 2018-01-30 苏州宏泉高压电容器有限公司 一种基于高压陶瓷电容器瓷介质芯片的在线毛刺去除机
US10186106B2 (en) 2016-09-21 2019-01-22 Igt Gaming system and method for determining awards based on interacting symbols
CN109333337A (zh) * 2018-11-19 2019-02-15 深圳市华星光电技术有限公司 研磨装置及研磨方法
CN109877694B (zh) * 2019-03-04 2023-08-08 天通日进精密技术有限公司 晶圆边缘抛光装置及晶圆边缘抛光方法
CN110181393B (zh) * 2019-06-17 2020-11-24 温州澳鼎建材有限公司 一种汽车轮毂的翻转装置
CN112139926A (zh) * 2020-10-22 2020-12-29 方红兵 一种高效型水晶打磨抛光设备
CN115319560B (zh) * 2022-08-24 2023-04-25 广西博强建筑科技有限公司 一种建筑铝模板用校直装置

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CH74767A (de) * 1916-08-03 1917-09-01 Bogoljub Dawidowatz Apparat zum Schleifen von Fasetten an kreisrunden Glasscheiben, wie Uhrengläsern etc.
US1437234A (en) * 1920-06-11 1922-11-28 Le Roy B Fraser Method of finishing spinning rings
US2693063A (en) * 1949-08-13 1954-11-02 American Optical Corp Bevel edging machine and method
US2745225A (en) * 1955-06-27 1956-05-15 Phillip A Vonada Lapidary wheel
JPS57189767A (en) * 1981-05-12 1982-11-22 Nec Corp Continuous grinding device
JPS59227361A (ja) * 1983-06-07 1984-12-20 Supiide Fuamu Kk 平面研削装置
US4680893A (en) * 1985-09-23 1987-07-21 Motorola, Inc. Apparatus for polishing semiconductor wafers
JPS63256342A (ja) * 1987-04-10 1988-10-24 Sumitomo Electric Ind Ltd 半導体ウエ−ハの研削方法
JPS6420959A (en) * 1987-07-15 1989-01-24 Toshiba Ceramics Co Chamfering device
JPH0637025B2 (ja) * 1987-09-14 1994-05-18 スピードファム株式会社 ウエハの鏡面加工装置
DE3819193A1 (de) * 1988-06-06 1989-12-07 Henkel Kgaa Verfahren zur herstellung stabiler, niedrigviskoser oel-in-wasser-emulsionen polarer oelkomponenten
US5117590A (en) * 1988-08-12 1992-06-02 Shin-Etsu Handotai Co., Ltd. Method of automatically chamfering a wafer and apparatus therefor
DE3838898A1 (de) * 1988-10-22 1990-04-26 Lippert Masch Stahlbau J Schleifmaschine fuer keramisches gut
JPH0716865B2 (ja) * 1989-10-03 1995-03-01 スピードファム株式会社 エッジポリッシャー
US5094037A (en) * 1989-10-03 1992-03-10 Speedfam Company, Ltd. Edge polisher
US5044123A (en) * 1990-03-22 1991-09-03 Douglas Hoffman Concave-convex faceting method and apparatus

Also Published As

Publication number Publication date
EP0584905A1 (de) 1994-03-02
JPH0647655A (ja) 1994-02-22
DE69307223T2 (de) 1997-08-14
US5547415A (en) 1996-08-20
EP0584905B1 (de) 1997-01-08
US6234879B1 (en) 2001-05-22
JP3027882B2 (ja) 2000-04-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee