DE69308390D1 - Packung für integrierte Schaltungschips - Google Patents
Packung für integrierte SchaltungschipsInfo
- Publication number
- DE69308390D1 DE69308390D1 DE69308390T DE69308390T DE69308390D1 DE 69308390 D1 DE69308390 D1 DE 69308390D1 DE 69308390 T DE69308390 T DE 69308390T DE 69308390 T DE69308390 T DE 69308390T DE 69308390 D1 DE69308390 D1 DE 69308390D1
- Authority
- DE
- Germany
- Prior art keywords
- package
- integrated circuit
- circuit chips
- chips
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06551—Conductive connections on the side of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06596—Structural arrangements for testing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09172—Notches between edge pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10484—Obliquely mounted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/903,838 US5343366A (en) | 1992-06-24 | 1992-06-24 | Packages for stacked integrated circuit chip cubes |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69308390D1 true DE69308390D1 (de) | 1997-04-10 |
Family
ID=25418149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69308390T Expired - Lifetime DE69308390D1 (de) | 1992-06-24 | 1993-06-07 | Packung für integrierte Schaltungschips |
Country Status (4)
Country | Link |
---|---|
US (1) | US5343366A (de) |
EP (1) | EP0575806B1 (de) |
JP (1) | JPH0767002B2 (de) |
DE (1) | DE69308390D1 (de) |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6355976B1 (en) * | 1992-05-14 | 2002-03-12 | Reveo, Inc | Three-dimensional packaging technology for multi-layered integrated circuits |
US5495397A (en) * | 1993-04-27 | 1996-02-27 | International Business Machines Corporation | Three dimensional package and architecture for high performance computer |
JP2856642B2 (ja) * | 1993-07-16 | 1999-02-10 | 株式会社東芝 | 半導体装置及びその製造方法 |
US5545924A (en) * | 1993-08-05 | 1996-08-13 | Honeywell Inc. | Three dimensional package for monolithic microwave/millimeterwave integrated circuits |
FR2709020B1 (fr) * | 1993-08-13 | 1995-09-08 | Thomson Csf | Procédé d'interconnexion de pastilles semi-conductrices en trois dimensions, et composant en résultant. |
US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US5668702A (en) * | 1994-04-21 | 1997-09-16 | Nassimi; Shary | Combination axial and surface mount cylindrical package containing one or more electronic components |
US5802699A (en) * | 1994-06-07 | 1998-09-08 | Tessera, Inc. | Methods of assembling microelectronic assembly with socket for engaging bump leads |
US5632631A (en) * | 1994-06-07 | 1997-05-27 | Tessera, Inc. | Microelectronic contacts with asperities and methods of making same |
US5983492A (en) | 1996-11-27 | 1999-11-16 | Tessera, Inc. | Low profile socket for microelectronic components and method for making the same |
US5567654A (en) * | 1994-09-28 | 1996-10-22 | International Business Machines Corporation | Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging |
US5644475A (en) * | 1994-09-30 | 1997-07-01 | Allen-Bradley Company, Inc. | Solder mask for a finger connector on a single in-line package module |
JP2944449B2 (ja) * | 1995-02-24 | 1999-09-06 | 日本電気株式会社 | 半導体パッケージとその製造方法 |
US5514907A (en) * | 1995-03-21 | 1996-05-07 | Simple Technology Incorporated | Apparatus for stacking semiconductor chips |
US5644473A (en) * | 1995-08-21 | 1997-07-01 | Mitsubishi Semiconductor America, Inc. | Carriers for IC packages |
US5664681A (en) * | 1995-08-24 | 1997-09-09 | Mitsubishi Semiconductor America, Inc. | Multiple device carrier |
US5629839A (en) * | 1995-09-12 | 1997-05-13 | Allen-Bradley Company, Inc. | Module interconnect adapter for reduced parasitic inductance |
ATE213872T1 (de) * | 1995-11-13 | 2002-03-15 | Micron Technology Inc | Schutzstruktur mit versetzten kontakten zum schutz vor elektrostatischer entladung |
US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
US6551857B2 (en) | 1997-04-04 | 2003-04-22 | Elm Technology Corporation | Three dimensional structure integrated circuits |
KR20010020454A (ko) * | 1997-05-23 | 2001-03-15 | 샘미 케이. 브라운 | 집적회로 패키징을 위한 시스템 및 방법 |
JP3012555B2 (ja) * | 1997-05-29 | 2000-02-21 | 神戸日本電気ソフトウェア株式会社 | 多面体icパッケージ |
US6215192B1 (en) * | 1997-06-12 | 2001-04-10 | Matsushita Electric Industrial Co., Ltd. | Integrated circuit package and integrated circuit package control system |
US5944199A (en) * | 1997-11-25 | 1999-08-31 | Micron Technology, Inc. | Integrated circuit package support system |
JP3718039B2 (ja) * | 1997-12-17 | 2005-11-16 | 株式会社日立製作所 | 半導体装置およびそれを用いた電子装置 |
DE19801312A1 (de) * | 1998-01-15 | 1999-07-22 | Siemens Ag | Halbleiterbauelement mit mehreren Substratlagen und zumindest einem Halbleiterchip und einem Verfahren zum Herstellen eines solchen Halbleiterbauelementes |
DE19808986A1 (de) * | 1998-03-03 | 1999-09-09 | Siemens Ag | Halbleiterbauelement mit mehreren Halbleiterchips |
KR100265566B1 (ko) * | 1998-05-12 | 2000-09-15 | 김영환 | 칩 스택 패키지 |
KR100285664B1 (ko) | 1998-05-15 | 2001-06-01 | 박종섭 | 스택패키지및그제조방법 |
KR100293815B1 (ko) * | 1998-06-30 | 2001-07-12 | 박종섭 | 스택형 패키지 |
US6153929A (en) | 1998-08-21 | 2000-11-28 | Micron Technology, Inc. | Low profile multi-IC package connector |
US6392296B1 (en) | 1998-08-31 | 2002-05-21 | Micron Technology, Inc. | Silicon interposer with optical connections |
US6219237B1 (en) | 1998-08-31 | 2001-04-17 | Micron Technology, Inc. | Structure and method for an electronic assembly |
US6281042B1 (en) | 1998-08-31 | 2001-08-28 | Micron Technology, Inc. | Structure and method for a high performance electronic packaging assembly |
US6586835B1 (en) * | 1998-08-31 | 2003-07-01 | Micron Technology, Inc. | Compact system module with built-in thermoelectric cooling |
US6320253B1 (en) * | 1998-09-01 | 2001-11-20 | Micron Technology, Inc. | Semiconductor device comprising a socket and method for forming same |
US6190425B1 (en) | 1998-11-03 | 2001-02-20 | Zomaya Group, Inc. | Memory bar and related circuits and methods |
US6295220B1 (en) | 1998-11-03 | 2001-09-25 | Zomaya Group, Inc. | Memory bar and related circuits and methods |
US6255852B1 (en) | 1999-02-09 | 2001-07-03 | Micron Technology, Inc. | Current mode signal interconnects and CMOS amplifier |
DE50002850D1 (de) * | 1999-05-31 | 2003-08-14 | Tyco Electronics Logistics Ag | Intelligentes leistungsmodul |
US6617671B1 (en) | 1999-06-10 | 2003-09-09 | Micron Technology, Inc. | High density stackable and flexible substrate-based semiconductor device modules |
US7554829B2 (en) | 1999-07-30 | 2009-06-30 | Micron Technology, Inc. | Transmission lines for CMOS integrated circuits |
US6414396B1 (en) | 2000-01-24 | 2002-07-02 | Amkor Technology, Inc. | Package for stacked integrated circuits |
US6608763B1 (en) | 2000-09-15 | 2003-08-19 | Staktek Group L.P. | Stacking system and method |
US6780770B2 (en) | 2000-12-13 | 2004-08-24 | Medtronic, Inc. | Method for stacking semiconductor die within an implanted medical device |
US6462408B1 (en) | 2001-03-27 | 2002-10-08 | Staktek Group, L.P. | Contact member stacking system and method |
JP4166035B2 (ja) * | 2001-06-18 | 2008-10-15 | 富士通テン株式会社 | 高周波回路部品の実装構造、実装方法及び実装装置 |
US7656678B2 (en) | 2001-10-26 | 2010-02-02 | Entorian Technologies, Lp | Stacked module systems |
US7026708B2 (en) * | 2001-10-26 | 2006-04-11 | Staktek Group L.P. | Low profile chip scale stacking system and method |
US20030234443A1 (en) | 2001-10-26 | 2003-12-25 | Staktek Group, L.P. | Low profile stacking system and method |
US6914324B2 (en) | 2001-10-26 | 2005-07-05 | Staktek Group L.P. | Memory expansion and chip scale stacking system and method |
US20060255446A1 (en) | 2001-10-26 | 2006-11-16 | Staktek Group, L.P. | Stacked modules and method |
US6940729B2 (en) | 2001-10-26 | 2005-09-06 | Staktek Group L.P. | Integrated circuit stacking system and method |
US7310458B2 (en) | 2001-10-26 | 2007-12-18 | Staktek Group L.P. | Stacked module systems and methods |
US6956284B2 (en) | 2001-10-26 | 2005-10-18 | Staktek Group L.P. | Integrated circuit stacking system and method |
US7485951B2 (en) | 2001-10-26 | 2009-02-03 | Entorian Technologies, Lp | Modularized die stacking system and method |
US7371609B2 (en) | 2001-10-26 | 2008-05-13 | Staktek Group L.P. | Stacked module systems and methods |
US7101770B2 (en) | 2002-01-30 | 2006-09-05 | Micron Technology, Inc. | Capacitive techniques to reduce noise in high speed interconnections |
US7235457B2 (en) | 2002-03-13 | 2007-06-26 | Micron Technology, Inc. | High permeability layered films to reduce noise in high speed interconnects |
KR100439128B1 (ko) * | 2002-04-16 | 2004-07-07 | 삼성전자주식회사 | 테이프 캐리어 패키지용 탭 테이프 |
WO2004015764A2 (en) | 2002-08-08 | 2004-02-19 | Leedy Glenn J | Vertical system integration |
US7542304B2 (en) | 2003-09-15 | 2009-06-02 | Entorian Technologies, Lp | Memory expansion and integrated circuit stacking system and method |
US7100814B2 (en) * | 2004-02-18 | 2006-09-05 | Cardiac Pacemakers, Inc. | Method for preparing integrated circuit modules for attachment to printed circuit substrates |
US7616452B2 (en) * | 2004-09-03 | 2009-11-10 | Entorian Technologies, Lp | Flex circuit constructions for high capacity circuit module systems and methods |
US7443023B2 (en) * | 2004-09-03 | 2008-10-28 | Entorian Technologies, Lp | High capacity thin module system |
US7542297B2 (en) * | 2004-09-03 | 2009-06-02 | Entorian Technologies, Lp | Optimized mounting area circuit module system and method |
US7033861B1 (en) * | 2005-05-18 | 2006-04-25 | Staktek Group L.P. | Stacked module systems and method |
JP4728708B2 (ja) * | 2005-06-17 | 2011-07-20 | 日本電気株式会社 | 配線基板及びその製造方法 |
KR100725363B1 (ko) * | 2005-07-25 | 2007-06-07 | 삼성전자주식회사 | 회로 기판 및 그 제조 방법 |
US7466562B2 (en) * | 2006-07-20 | 2008-12-16 | International Business Machines Corporation | Toolless method for alignment, retention, connection, termination and test on printed circuit boards |
US7417310B2 (en) | 2006-11-02 | 2008-08-26 | Entorian Technologies, Lp | Circuit module having force resistant construction |
US7672142B2 (en) * | 2007-01-05 | 2010-03-02 | Apple Inc. | Grounded flexible circuits |
US7968989B2 (en) * | 2008-06-27 | 2011-06-28 | Integrated Device Technology, Inc | Multi-package slot array |
US20120119345A1 (en) * | 2010-11-15 | 2012-05-17 | Cho Sungwon | Integrated circuit packaging system with device mount and method of manufacture thereof |
KR102190382B1 (ko) | 2012-12-20 | 2020-12-11 | 삼성전자주식회사 | 반도체 패키지 |
US8754518B1 (en) * | 2013-01-22 | 2014-06-17 | Freescale Semiconductor, Inc. | Devices and methods for configuring conductive elements for a semiconductor package |
JP6331266B2 (ja) * | 2013-05-24 | 2018-05-30 | セイコーエプソン株式会社 | センサーユニット並びに電子機器および運動体 |
US9107316B2 (en) * | 2013-09-11 | 2015-08-11 | Eastman Kodak Company | Multi-layer micro-wire substrate structure |
KR102244279B1 (ko) * | 2019-06-14 | 2021-04-26 | 제엠제코(주) | 반도체 패키지 |
PL238716B1 (pl) * | 2019-07-30 | 2021-09-27 | Golofit Krzysztof | Przestrzenny układ scalony |
Family Cites Families (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2602413A (en) * | 1948-08-13 | 1952-07-08 | Aluminum Co Of America | Aluminous brazing product and method of brazing |
US2568242A (en) * | 1948-11-08 | 1951-09-18 | Metals & Controls Corp | Electrical contact |
US3113248A (en) * | 1960-07-13 | 1963-12-03 | Sperry Rand Corp | Electrical assembly of modules |
US3152288A (en) * | 1962-04-06 | 1964-10-06 | Mittler Sheldon | Circuit assembly |
US3316455A (en) * | 1965-08-31 | 1967-04-25 | Westinghouse Electric Corp | Flat-pack circuit modules assembly |
US3492538A (en) * | 1967-09-07 | 1970-01-27 | Thomas & Betts Corp | Removable stack interconnection system |
US3515949A (en) * | 1967-11-22 | 1970-06-02 | Bunker Ramo | 3-d flatpack module packaging technique |
US3705332A (en) * | 1970-06-25 | 1972-12-05 | Howard L Parks | Electrical circuit packaging structure and method of fabrication thereof |
US3766439A (en) * | 1972-01-12 | 1973-10-16 | Gen Electric | Electronic module using flexible printed circuit board with heat sink means |
US4426689A (en) * | 1979-03-12 | 1984-01-17 | International Business Machines Corporation | Vertical semiconductor integrated circuit chip packaging |
US4266282A (en) * | 1979-03-12 | 1981-05-05 | International Business Machines Corporation | Vertical semiconductor integrated circuit chip packaging |
US4237522A (en) * | 1979-06-29 | 1980-12-02 | International Business Machines Corporation | Chip package with high capacitance, stacked vlsi/power sheets extending through slots in substrate |
US4396140A (en) * | 1981-01-27 | 1983-08-02 | Bell Telephone Laboratories, Incorporated | Method of bonding electronic components |
DE3209914A1 (de) * | 1982-03-18 | 1983-09-29 | Robert Bosch Gmbh, 7000 Stuttgart | Hoergeraet mit einer verstaerkerschaltung |
US4549200A (en) * | 1982-07-08 | 1985-10-22 | International Business Machines Corporation | Repairable multi-level overlay system for semiconductor device |
US4658332A (en) * | 1983-04-04 | 1987-04-14 | Raytheon Company | Compliant layer printed circuit board |
US4574331A (en) * | 1983-05-31 | 1986-03-04 | Trw Inc. | Multi-element circuit construction |
US4770640A (en) * | 1983-06-24 | 1988-09-13 | Walter Howard F | Electrical interconnection device for integrated circuits |
US4517625A (en) * | 1983-11-09 | 1985-05-14 | Lockheed Corporation | Circuit board housing with zero insertion force connector |
JPS6188547A (ja) * | 1984-10-05 | 1986-05-06 | Fujitsu Ltd | 半導体装置 |
US4894706A (en) * | 1985-02-14 | 1990-01-16 | Nippon Telegraph And Telephone Corporation | Three-dimensional packaging of semiconductor device chips |
JPS61288455A (ja) * | 1985-06-17 | 1986-12-18 | Fujitsu Ltd | 多層半導体装置の製造方法 |
US4703984A (en) * | 1985-10-28 | 1987-11-03 | Burroughs Corporation | Flexible access connector with miniature slotted pads |
US4661887A (en) * | 1985-10-31 | 1987-04-28 | Motorola, Inc. | Surface mountable integrated circuit packages having solder bearing leads |
DE3609170C1 (de) * | 1986-03-19 | 1987-10-08 | Chemie Filter Gmbh Verfahren | Elektronisches Geraet mit aufeinandergestapelten Hauptmodulen |
JPS62260354A (ja) * | 1986-05-06 | 1987-11-12 | Mitsubishi Electric Corp | 半導体装置 |
US5031072A (en) * | 1986-08-01 | 1991-07-09 | Texas Instruments Incorporated | Baseboard for orthogonal chip mount |
EP0263222B1 (de) * | 1986-10-08 | 1992-03-25 | International Business Machines Corporation | Verfahren zum Herstellen von Lötkontakten für ein keramisches Modul ohne Steckerstifte |
GB8626827D0 (en) * | 1986-10-11 | 1986-12-10 | Microelectronics & Computer | Minimodule connector |
US4764846A (en) * | 1987-01-05 | 1988-08-16 | Irvine Sensors Corporation | High density electronic package comprising stacked sub-modules |
US4868712A (en) * | 1987-02-04 | 1989-09-19 | Woodman John K | Three dimensional integrated circuit package |
US4790894A (en) * | 1987-02-19 | 1988-12-13 | Hitachi Condenser Co., Ltd. | Process for producing printed wiring board |
US4755866A (en) * | 1987-02-27 | 1988-07-05 | United Technologies Corporation | Electronic circuit module |
US4983533A (en) * | 1987-10-28 | 1991-01-08 | Irvine Sensors Corporation | High-density electronic modules - process and product |
US5040052A (en) * | 1987-12-28 | 1991-08-13 | Texas Instruments Incorporated | Compact silicon module for high density integrated circuits |
JPH01289191A (ja) * | 1988-05-16 | 1989-11-21 | Pioneer Electron Corp | 三次元プリント配線基板構造 |
US4916575A (en) * | 1988-08-08 | 1990-04-10 | Asten Francis C Van | Multiple circuit board module |
EP0354708A3 (de) * | 1988-08-08 | 1990-10-31 | Texas Instruments Incorporated | Allgemeine dreidimensionale Packung |
US4956694A (en) * | 1988-11-04 | 1990-09-11 | Dense-Pac Microsystems, Inc. | Integrated circuit chip stacking |
US4956746A (en) * | 1989-03-29 | 1990-09-11 | Hughes Aircraft Company | Stacked wafer electronic package |
US4922376A (en) * | 1989-04-10 | 1990-05-01 | Unistructure, Inc. | Spring grid array interconnection for active microelectronic elements |
US5037311A (en) * | 1989-05-05 | 1991-08-06 | International Business Machines Corporation | High density interconnect strip |
US4953058A (en) * | 1989-09-01 | 1990-08-28 | General Dynamics Corporation, Space Systems Div. | Modular segment adapted to provide a passively cooled housing for heat generating electronic modules |
US4972298A (en) * | 1989-09-08 | 1990-11-20 | International Business Machines Corporation | High density circuit assembly |
DE3931238A1 (de) * | 1989-09-19 | 1991-03-28 | Siemens Ag | Vielfach-chip-modul und verfahren zu dessen herstellung |
WO1991011824A1 (fr) * | 1990-01-24 | 1991-08-08 | Nauchno-Proizvodstvenny Tsentr Elektronnoi Mikrotekhnologii Akademii Nauk Sssr | Unite electronique tridimensionnelle et son procede de fabrication |
US5041903A (en) * | 1990-06-11 | 1991-08-20 | National Semiconductor Corp. | Vertical semiconductor interconnection method and structure |
US5057907A (en) * | 1990-06-11 | 1991-10-15 | National Semiconductor Corp. | Method and structure for forming vertical semiconductor interconnection |
US5050039A (en) * | 1990-06-26 | 1991-09-17 | Digital Equipment Corporation | Multiple circuit chip mounting and cooling arrangement |
US5003429A (en) * | 1990-07-09 | 1991-03-26 | International Business Machines Corporation | Electronic assembly with enhanced heat sinking |
US5113314A (en) * | 1991-01-24 | 1992-05-12 | Hewlett-Packard Company | High-speed, high-density chip mounting |
-
1992
- 1992-06-24 US US07/903,838 patent/US5343366A/en not_active Expired - Fee Related
-
1993
- 1993-05-19 JP JP5117467A patent/JPH0767002B2/ja not_active Expired - Lifetime
- 1993-06-07 EP EP93109124A patent/EP0575806B1/de not_active Expired - Lifetime
- 1993-06-07 DE DE69308390T patent/DE69308390D1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0767002B2 (ja) | 1995-07-19 |
US5343366A (en) | 1994-08-30 |
JPH0661606A (ja) | 1994-03-04 |
EP0575806A3 (de) | 1994-03-16 |
EP0575806A2 (de) | 1993-12-29 |
EP0575806B1 (de) | 1997-03-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69308390D1 (de) | Packung für integrierte Schaltungschips | |
DE69429949T2 (de) | Kühlapparat für integrierte Schaltungschips | |
DE69425930T2 (de) | Integrierte Halbleiterschaltung | |
DE69327357T2 (de) | Integrierte Halbleiterschaltungsanordnung | |
DE68911434D1 (de) | Hermetische packung für integrierte schaltungschips. | |
DE69212189D1 (de) | Verbinder für leitungslose integrierte Schaltungspackung | |
DE69518935T2 (de) | Halbleiterpackung | |
DE29500447U1 (de) | Packungsträger für Halbleiter-Bauteile | |
DE69322140D1 (de) | Halbleiterpackung | |
DE69408362D1 (de) | Halbleiterintegrierte Schaltung | |
DE69319273D1 (de) | Testverfahren für integrierte Halbleiter-Schaltung | |
DE69416192D1 (de) | Integrierte Halbleiterschaltung | |
DE69528869D1 (de) | Flachgehäuse für Halbleiter-IC | |
NO174410C (no) | Pakkeoppbygging for elektroniske kretser | |
DE69231501D1 (de) | Packungsstruktur für integrierte Schaltungschips | |
DE69128014T2 (de) | Herstellungsverfahren für integrierte Schaltungschip Packung | |
DE9417734U1 (de) | Halbleiteranordnung für Chip-Module | |
DE69317853D1 (de) | Integrierte Halbleiterschaltung | |
KR940013668U (ko) | 리드 온 칩 패키지 | |
KR880001342U (ko) | 집적회로용 패키지 | |
KR930022595U (ko) | Ic 반도체 땜납용 지그 | |
DE69404702T2 (de) | Integrierte Halbleiterschaltung | |
KR940013675U (ko) | 반도체 패키지 | |
KR930024367U (ko) | 반도체 패키지 | |
KR960003135U (ko) | 버텀 리드형 반도체 패키지 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |