DE69308979D1 - Laminierter Verbinder mit langen Durchführungen und hoher Durchführungsdichte - Google Patents
Laminierter Verbinder mit langen Durchführungen und hoher DurchführungsdichteInfo
- Publication number
- DE69308979D1 DE69308979D1 DE69308979T DE69308979T DE69308979D1 DE 69308979 D1 DE69308979 D1 DE 69308979D1 DE 69308979 T DE69308979 T DE 69308979T DE 69308979 T DE69308979 T DE 69308979T DE 69308979 D1 DE69308979 D1 DE 69308979D1
- Authority
- DE
- Germany
- Prior art keywords
- density
- laminated connector
- long bushings
- bushing
- high bushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US95771292A | 1992-10-07 | 1992-10-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69308979D1 true DE69308979D1 (de) | 1997-04-24 |
DE69308979T2 DE69308979T2 (de) | 1997-06-26 |
Family
ID=25500015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69308979T Expired - Fee Related DE69308979T2 (de) | 1992-10-07 | 1993-09-23 | Laminierter Verbinder mit langen Durchführungen und hoher Durchführungsdichte |
Country Status (4)
Country | Link |
---|---|
US (1) | US5374196A (de) |
EP (1) | EP0591772B1 (de) |
JP (1) | JP3338527B2 (de) |
DE (1) | DE69308979T2 (de) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5456004A (en) * | 1994-01-04 | 1995-10-10 | Dell Usa, L.P. | Anisotropic interconnect methodology for cost effective manufacture of high density printed circuit boards |
US5561593A (en) * | 1994-01-27 | 1996-10-01 | Vicon Enterprises, Inc. | Z-interface-board |
DE19502408A1 (de) * | 1995-01-26 | 1996-08-01 | Siemens Ag | Leiterplatten-Anschlußeinrichtung mit einer Vielzahl von elektrischen Kontaktierungsstellen in der Bestückungsebene der Leiterplatte |
US5529504A (en) * | 1995-04-18 | 1996-06-25 | Hewlett-Packard Company | Electrically anisotropic elastomeric structure with mechanical compliance and scrub |
US5890915A (en) * | 1996-05-17 | 1999-04-06 | Minnesota Mining And Manufacturing Company | Electrical and thermal conducting structure with resilient conducting paths |
US6403226B1 (en) | 1996-05-17 | 2002-06-11 | 3M Innovative Properties Company | Electronic assemblies with elastomeric members made from cured, room temperature curable silicone compositions having improved stress relaxation resistance |
US6024584A (en) | 1996-10-10 | 2000-02-15 | Berg Technology, Inc. | High density connector |
US6093035A (en) * | 1996-06-28 | 2000-07-25 | Berg Technology, Inc. | Contact for use in an electrical connector |
EP1311032B1 (de) * | 1996-10-10 | 2006-09-20 | Fci | Steckverbinder hoher Kontaktdichte und Herstellungsverfahren |
TW406454B (en) | 1996-10-10 | 2000-09-21 | Berg Tech Inc | High density connector and method of manufacture |
US6042389A (en) * | 1996-10-10 | 2000-03-28 | Berg Technology, Inc. | Low profile connector |
US6241535B1 (en) | 1996-10-10 | 2001-06-05 | Berg Technology, Inc. | Low profile connector |
US6139336A (en) * | 1996-11-14 | 2000-10-31 | Berg Technology, Inc. | High density connector having a ball type of contact surface |
US6183301B1 (en) * | 1997-01-16 | 2001-02-06 | Berg Technology, Inc. | Surface mount connector with integrated PCB assembly |
TW411721B (en) * | 1997-09-03 | 2000-11-11 | Shinetsu Polymer Co | Integral holder-connector for capacitor microphone |
US5975921A (en) | 1997-10-10 | 1999-11-02 | Berg Technology, Inc. | High density connector system |
KR100492444B1 (en) * | 1998-01-15 | 2005-08-04 | Surface mount connector with integrated pcb assembly | |
EP1105942B1 (de) | 1998-08-17 | 2002-06-05 | Infineon Technologies AG | Kontaktiervorrichtung, insbesondere zum ankontaktieren von elektrischen bauelementen und schaltungsträgern, sowie verfahren zu deren herstellung |
US6424034B1 (en) | 1998-08-31 | 2002-07-23 | Micron Technology, Inc. | High performance packaging for microprocessors and DRAM chips which minimizes timing skews |
US6506979B1 (en) * | 2000-05-12 | 2003-01-14 | Shipley Company, L.L.C. | Sequential build circuit board |
GB0100774D0 (en) * | 2001-01-11 | 2001-02-21 | Koninkl Philips Electronics Nv | Connector device |
US6979238B1 (en) | 2004-06-28 | 2005-12-27 | Samtec, Inc. | Connector having improved contacts with fusible members |
US8366485B2 (en) | 2009-03-19 | 2013-02-05 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate |
US20130229776A1 (en) * | 2011-12-23 | 2013-09-05 | Wisconsin Alumni Research Foundation | High-speed, flexible integrated circuits and methods for making high-speed, flexible integrated circuits |
EP2624034A1 (de) | 2012-01-31 | 2013-08-07 | Fci | Abbaubare optische Kupplungsvorrichtung |
USD727852S1 (en) | 2012-04-13 | 2015-04-28 | Fci Americas Technology Llc | Ground shield for a right angle electrical connector |
USD727268S1 (en) | 2012-04-13 | 2015-04-21 | Fci Americas Technology Llc | Vertical electrical connector |
USD718253S1 (en) | 2012-04-13 | 2014-11-25 | Fci Americas Technology Llc | Electrical cable connector |
US9257778B2 (en) | 2012-04-13 | 2016-02-09 | Fci Americas Technology | High speed electrical connector |
US8944831B2 (en) | 2012-04-13 | 2015-02-03 | Fci Americas Technology Llc | Electrical connector having ribbed ground plate with engagement members |
USD751507S1 (en) | 2012-07-11 | 2016-03-15 | Fci Americas Technology Llc | Electrical connector |
US9543703B2 (en) | 2012-07-11 | 2017-01-10 | Fci Americas Technology Llc | Electrical connector with reduced stack height |
USD745852S1 (en) | 2013-01-25 | 2015-12-22 | Fci Americas Technology Llc | Electrical connector |
USD720698S1 (en) | 2013-03-15 | 2015-01-06 | Fci Americas Technology Llc | Electrical cable connector |
JP5861724B2 (ja) * | 2014-01-31 | 2016-02-16 | 住友大阪セメント株式会社 | 光デバイス |
EP2911486A1 (de) | 2014-02-19 | 2015-08-26 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | PCB-basierte Verbindervorrichtung |
US9853383B2 (en) * | 2015-09-11 | 2017-12-26 | General Electric Company | Conductive polymer contacts for surface mount technology connectors |
JP7232006B2 (ja) * | 2018-09-21 | 2023-03-02 | 日本航空電子工業株式会社 | コネクタ、コネクタを備える装置及びコネクタの製造方法 |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3528174A (en) * | 1967-06-01 | 1970-09-15 | Electro Connective Systems Inc | Cable termination process |
US3680037A (en) * | 1970-11-05 | 1972-07-25 | Tech Wire Prod Inc | Electrical interconnector |
US3971610A (en) * | 1974-05-10 | 1976-07-27 | Technical Wire Products, Inc. | Conductive elastomeric contacts and connectors |
JPS5187787A (en) * | 1975-01-31 | 1976-07-31 | Shinetsu Polymer Co | Intaa konekutaa |
JPS5265892A (en) * | 1975-11-26 | 1977-05-31 | Shinetsu Polymer Co | Nonnisotropic conductiveesheet type composite materials and method of manufacture thereof |
US4201435A (en) * | 1976-07-26 | 1980-05-06 | Shin-Etsu Polymer Co. Ltd. | Interconnectors |
JPS5915376B2 (ja) * | 1977-10-18 | 1984-04-09 | 信越ポリマ−株式会社 | 電子回路部品 |
JPS5482699A (en) * | 1977-12-15 | 1979-07-02 | Shinetsu Polymer Co | Pressure sensitive resistance element |
JPS5951112B2 (ja) * | 1979-02-08 | 1984-12-12 | 信越ポリマ−株式会社 | コネクタ−の製造方法 |
US4252391A (en) * | 1979-06-19 | 1981-02-24 | Shin-Etsu Polymer Co., Ltd. | Anisotropically pressure-sensitive electroconductive composite sheets and method for the preparation thereof |
JPS57184296A (en) * | 1981-05-09 | 1982-11-12 | Hitachi Ltd | Ceramic circuit board |
US4770640A (en) * | 1983-06-24 | 1988-09-13 | Walter Howard F | Electrical interconnection device for integrated circuits |
US4727410A (en) * | 1983-11-23 | 1988-02-23 | Cabot Technical Ceramics, Inc. | High density integrated circuit package |
US5006916A (en) * | 1984-07-11 | 1991-04-09 | Texas Instruments Incorporated | Vertical-walled contacts for VLSI semiconductor devices |
US4663831A (en) * | 1985-10-08 | 1987-05-12 | Motorola, Inc. | Method of forming transistors with poly-sidewall contacts utilizing deposition of polycrystalline and insulating layers combined with selective etching and oxidation of said layers |
JPS6293961A (ja) * | 1985-10-21 | 1987-04-30 | Hitachi Ltd | 多層配線回路板 |
US4740657A (en) * | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
US4734825A (en) * | 1986-09-05 | 1988-03-29 | Motorola Inc. | Integrated circuit stackable package |
US4868712A (en) * | 1987-02-04 | 1989-09-19 | Woodman John K | Three dimensional integrated circuit package |
US5136471A (en) * | 1987-02-26 | 1992-08-04 | Nec Corporation | Laminate wiring board |
DE3735455A1 (de) * | 1987-03-18 | 1988-09-29 | Telefonbau & Normalzeit Gmbh | Elektrische bauelemente |
JPS63249394A (ja) * | 1987-04-06 | 1988-10-17 | 日本電気株式会社 | 多層回路基板 |
JPS63277549A (ja) * | 1987-05-08 | 1988-11-15 | Fujitsu Ltd | 超伝導セラミックスペ−スト組成物 |
JPS63292504A (ja) * | 1987-05-26 | 1988-11-29 | Matsushita Electric Works Ltd | 導体ペ−スト |
JPH088332B2 (ja) * | 1987-10-20 | 1996-01-29 | アーヴィン・センサーズ・コーポレーション | 高密度電子モジュール及びその製造方法 |
US4983533A (en) * | 1987-10-28 | 1991-01-08 | Irvine Sensors Corporation | High-density electronic modules - process and product |
JPH0212894A (ja) * | 1988-06-30 | 1990-01-17 | Taiyo Yuden Co Ltd | セラミック配線基板の裁断方法 |
JPH0232595A (ja) * | 1988-07-22 | 1990-02-02 | Mitsubishi Electric Corp | セラミック多層配線基板の製造方法 |
JPH0291993A (ja) * | 1988-09-29 | 1990-03-30 | Asahi Glass Co Ltd | 低温焼成多層基板 |
US4871316A (en) * | 1988-10-17 | 1989-10-03 | Microelectronics And Computer Technology Corporation | Printed wire connector |
US4928061A (en) * | 1989-03-29 | 1990-05-22 | International Business Machines Corporation | Multi-layer printed circuit board |
ATE109311T1 (de) * | 1989-05-12 | 1994-08-15 | Siemens Ag | Anordnung zur mechanischen und elektrischen verbindung einer ergänzungsleiterplatte an einer grundleiterplatte. |
US4999311A (en) * | 1989-08-16 | 1991-03-12 | Unisys Corporation | Method of fabricating interconnections to I/O leads on layered electronic assemblies |
JPH03283594A (ja) * | 1990-03-30 | 1991-12-13 | Toshiba Lighting & Technol Corp | 回路基板 |
US5026290A (en) * | 1990-08-06 | 1991-06-25 | Amp Incorporated | Electrical connector for electrically interconnecting non-parallel substrates |
US5059899A (en) * | 1990-08-16 | 1991-10-22 | Micron Technology, Inc. | Semiconductor dies and wafers and methods for making |
JP3025334B2 (ja) * | 1991-04-19 | 2000-03-27 | 旭テクノグラス株式会社 | 結晶性ガラスフリット、多層回路基板用組成物及び多層回路基板 |
DE4136355A1 (de) * | 1991-11-05 | 1993-05-06 | Smt & Hybrid Gmbh, O-8010 Dresden, De | Verfahren und anordnung zur dreidimensionalen montage von elektronischen bauteilen und sensoren |
-
1993
- 1993-09-20 JP JP23272193A patent/JP3338527B2/ja not_active Expired - Fee Related
- 1993-09-23 EP EP93115344A patent/EP0591772B1/de not_active Expired - Lifetime
- 1993-09-23 DE DE69308979T patent/DE69308979T2/de not_active Expired - Fee Related
-
1994
- 1994-05-02 US US08/236,675 patent/US5374196A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH06208859A (ja) | 1994-07-26 |
US5374196A (en) | 1994-12-20 |
EP0591772B1 (de) | 1997-03-19 |
EP0591772A1 (de) | 1994-04-13 |
JP3338527B2 (ja) | 2002-10-28 |
DE69308979T2 (de) | 1997-06-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |