DE69312894D1 - Pyrometer mit Emissionsmesser - Google Patents

Pyrometer mit Emissionsmesser

Info

Publication number
DE69312894D1
DE69312894D1 DE69312894T DE69312894T DE69312894D1 DE 69312894 D1 DE69312894 D1 DE 69312894D1 DE 69312894 T DE69312894 T DE 69312894T DE 69312894 T DE69312894 T DE 69312894T DE 69312894 D1 DE69312894 D1 DE 69312894D1
Authority
DE
Germany
Prior art keywords
pyrometer
emission meter
meter
emission
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69312894T
Other languages
English (en)
Other versions
DE69312894T2 (de
Inventor
Sipke Wadman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronics NV filed Critical Philips Electronics NV
Application granted granted Critical
Publication of DE69312894D1 publication Critical patent/DE69312894D1/de
Publication of DE69312894T2 publication Critical patent/DE69312894T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0801—Means for wavelength selection or discrimination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0801—Means for wavelength selection or discrimination
    • G01J5/0802—Optical filters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0808—Convex mirrors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0814—Particular reflectors, e.g. faceted or dichroic mirrors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0846—Optical arrangements having multiple detectors for performing different types of detection, e.g. using radiometry and reflectometry channels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0878—Diffusers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0896—Optical arrangements using a light source, e.g. for illuminating a surface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/80—Calibration
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/27—Control of temperature characterised by the use of electric means with sensing element responsive to radiation
DE69312894T 1992-12-29 1993-12-24 Pyrometer mit Emissionsmesser Expired - Fee Related DE69312894T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP92204102 1992-12-29

Publications (2)

Publication Number Publication Date
DE69312894D1 true DE69312894D1 (de) 1997-09-11
DE69312894T2 DE69312894T2 (de) 1998-02-12

Family

ID=8211182

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69312894T Expired - Fee Related DE69312894T2 (de) 1992-12-29 1993-12-24 Pyrometer mit Emissionsmesser

Country Status (3)

Country Link
US (1) US5460451A (de)
JP (1) JPH06229832A (de)
DE (1) DE69312894T2 (de)

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US5823681A (en) * 1994-08-02 1998-10-20 C.I. Systems (Israel) Ltd. Multipoint temperature monitoring apparatus for semiconductor wafers during processing
US5601366A (en) * 1994-10-25 1997-02-11 Texas Instruments Incorporated Method for temperature measurement in rapid thermal process systems
US5597237A (en) * 1995-05-30 1997-01-28 Quantum Logic Corp Apparatus for measuring the emissivity of a semiconductor wafer
DE19654773C1 (de) * 1996-12-31 1998-04-23 Schott Glaswerke Verfahren und Vorrichtung zur betrieblichen Messung der Temperatur in mindestens einer Kochzone eines Kochfeldes mit einer Glaskeramikplatte
FR2760528B1 (fr) * 1997-03-05 1999-05-21 Framatome Sa Procede et dispositif d'examen photothermique d'un materiau
FR2760529B1 (fr) * 1997-03-05 1999-05-28 Framatome Sa Procede d'examen photothermique d'une piece
US6635501B1 (en) 1998-06-25 2003-10-21 Advanced Micro Devices, Inc. Low temperature cobalt silicidation process monitor
DE19832833C2 (de) * 1998-07-21 2002-01-31 Fraunhofer Ges Forschung Verfahren zur thermographischen Untersuchung eines Werkstückes und Vorrichtung hierfür
JP3186721B2 (ja) * 1998-12-07 2001-07-11 三菱電機株式会社 溶接品質判定装置及びその装置を備えた溶接機
JP3516922B2 (ja) 1999-03-08 2004-04-05 シィー．アイ．システムズ リミテッド 放射率が波長により変化する物体の温度のアクティブパイロメトリーのための方法および装置
US6303411B1 (en) 1999-05-03 2001-10-16 Vortek Industries Ltd. Spatially resolved temperature measurement and irradiance control
DE19959862A1 (de) * 1999-12-10 2001-06-13 Forschungszentrum Juelich Gmbh Lasersystem mit steuerbarer Pulsdauer
DE10203476A1 (de) * 2001-01-18 2002-09-12 Amtron Gmbh Lasermodul
US7044386B2 (en) * 2002-02-05 2006-05-16 William Berson Information encoding on surfaces by varying spectral emissivity
US6833536B2 (en) 2002-05-22 2004-12-21 Applera Corporation Non-contact radiant heating and temperature sensing device for a chemical reaction chamber
US7056012B2 (en) * 2002-10-03 2006-06-06 Extech Instruments Corporation Multimeter with non-contact temperature measurement
CN1729554B (zh) 2002-12-20 2014-05-07 马特森技术有限公司 用来支撑工件和用来热处理工件的方法和系统
US7407195B2 (en) 2004-04-14 2008-08-05 William Berson Label for receiving indicia having variable spectral emissivity values
US20050276308A1 (en) * 2004-06-10 2005-12-15 Pint Charles S Method and apparatus for measuring temperature and emissivity
JP2006098295A (ja) * 2004-09-30 2006-04-13 Ube Ind Ltd 放射率測定装置
US7186978B2 (en) * 2004-10-15 2007-03-06 Millennium Enginerring And Integration Company Compact emissivity and temperature measuring infrared detector
US7651031B2 (en) 2004-10-25 2010-01-26 William Berson Systems and methods for reading indicium
US7438468B2 (en) * 2004-11-12 2008-10-21 Applied Materials, Inc. Multiple band pass filtering for pyrometry in laser based annealing systems
US7619520B2 (en) 2005-01-14 2009-11-17 William Berson Radio frequency identification labels and systems and methods for making the same
US7931413B2 (en) * 2005-01-14 2011-04-26 William Berson Printing system ribbon including print transferable circuitry and elements
US7621451B2 (en) 2005-01-14 2009-11-24 William Berson Radio frequency identification labels and systems and methods for making the same
US7728726B2 (en) 2005-01-14 2010-06-01 William Berson Radio frequency identification labels
JP5967859B2 (ja) 2006-11-15 2016-08-10 マトソン テクノロジー、インコーポレイテッド 熱処理中の被加工物を支持するシステムおよび方法
ATE479316T1 (de) * 2007-06-05 2010-09-15 Miele & Cie Verfahren zur kochfeldsteuerung und kochfeld zur durchführung des verfahrens
US20090061752A1 (en) * 2007-08-28 2009-03-05 Current Energy Controls, Lp Autonomous Ventilation System
US7696500B2 (en) * 2008-03-20 2010-04-13 Electro Optical Industries, Inc. Fused test source
US8193802B2 (en) * 2008-04-09 2012-06-05 Milwaukee Electric Tool Corporation Slidably attachable non-contact voltage detector
CN102089873A (zh) 2008-05-16 2011-06-08 加拿大马特森技术有限公司 工件破损防止方法及设备
US9217731B2 (en) 2010-05-21 2015-12-22 Kabushiki Kaisha Toshiba Welding inspection method and apparatus thereof
US20110284508A1 (en) * 2010-05-21 2011-11-24 Kabushiki Kaisha Toshiba Welding system and welding method
DK3094469T3 (da) 2014-01-16 2019-12-16 Hewlett Packard Development Co Generering af en tredimensional genstand
JP6353547B2 (ja) 2014-01-16 2018-07-04 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． ３次元物体の生成
CN106061714B (zh) 2014-01-16 2019-07-12 惠普发展公司，有限责任合伙企业 基于辐射率的温度确定
US10889059B2 (en) 2014-01-16 2021-01-12 Hewlett-Packard Development Company, L.P. Generating three-dimensional objects
US11154946B2 (en) * 2014-06-30 2021-10-26 Illinois Tool Works Inc. Systems and methods for the control of welding parameters
ES2566077B2 (es) * 2014-07-18 2017-03-10 Alberto ADARVE LOZANO Sistema y procedimiento para la generación de una zona de temperatura constante en una superficie
CN111347157B (zh) * 2018-12-21 2023-04-28 松下知识产权经营株式会社 激光焊接装置以及激光焊接方法
DE102020111293A1 (de) * 2019-04-24 2020-10-29 Laytec Aktiengesellschaft Verfahren und Vorrichtung zur in-situ Bestimmung der Temperatur eines Wafers
CN112404632B (zh) * 2019-08-22 2022-09-02 台达电子工业股份有限公司 焊锡装置及其系统控制器

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JPS5234230B2 (de) * 1971-12-27 1977-09-02
CH547487A (de) * 1972-07-27 1974-03-29 Bbc Brown Boveri & Cie Verfahren zur beruehrungslosen und materialunabhaengigen temperaturmessung an oberflaechen mittels infrarot-pyrometer.
SE458724B (sv) * 1981-03-16 1989-04-24 Peter Perten Infraroedanalysator foer relativ maengdbestaemning av visst eller vissa aemnen i ett prov, saerskilt i livsmedel saasom mjoel
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US4956538A (en) * 1988-09-09 1990-09-11 Texas Instruments, Incorporated Method and apparatus for real-time wafer temperature measurement using infrared pyrometry in advanced lamp-heated rapid thermal processors
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Also Published As

Publication number Publication date
JPH06229832A (ja) 1994-08-19
DE69312894T2 (de) 1998-02-12
US5460451A (en) 1995-10-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V., EINDHOVEN, N

8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee