DE69317875T2 - Lot apparat mit verbessertem lot strom anordnung - Google Patents

Lot apparat mit verbessertem lot strom anordnung

Info

Publication number: DE69317875T2
Authority: DE; Germany
Prior art keywords: lot; improved; current arrangement; arrangement; lot apparatus
Prior art date: 1992-01-14
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE69317875T

Other languages

English (en)

Other versions

DE69317875D1 (de

Inventor

Schaik Michiel Van

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Soltec BV

Original Assignee

Soltec BV

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1992-01-14

Filing date

1993-01-07

Publication date

1998-07-30

1993-01-07 Application filed by Soltec BV filed Critical Soltec BV

1998-05-14 Publication of DE69317875D1 publication Critical patent/DE69317875D1/de

1998-07-30 Application granted granted Critical

1998-07-30 Publication of DE69317875T2 publication Critical patent/DE69317875T2/de

2013-01-08 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

DE69317875T 1992-01-14 1993-01-07 Lot apparat mit verbessertem lot strom anordnung Expired - Fee Related DE69317875T2 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
NL9200060A NL9200060A (nl)	1992-01-14	1992-01-14	Soldeermachine met verbeterde configuratie van soldeerstromen.
PCT/NL1993/000003 WO1993013904A1 (en)	1992-01-14	1993-01-07	Soldering apparatus with improved configuration of solder streams

Publications (2)

Publication Number	Publication Date
DE69317875D1 DE69317875D1 (de)	1998-05-14
DE69317875T2 true DE69317875T2 (de)	1998-07-30

Family

ID=19860293

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE69317875T Expired - Fee Related DE69317875T2 (de)	1992-01-14	1993-01-07	Lot apparat mit verbessertem lot strom anordnung

Country Status (5)

Country	Link
US (1)	US5379931A (de)
EP (1)	EP0621814B1 (de)
DE (1)	DE69317875T2 (de)
NL (1)	NL9200060A (de)
WO (1)	WO1993013904A1 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5630542A (en) *	1994-12-05	1997-05-20	Soltec B.V.	Soldering apparatus with abrupt separation of solder streams
DE19512902A1 (de) *	1995-04-06	1996-10-10	Philips Patentverwaltung	Verfahren zum Wellenlöten von Baugruppen
US5772101A (en) *	1995-08-07	1998-06-30	Ns Tekuno Co., Ltd.	Wave soldering machine
US5988480A (en) *	1997-12-12	1999-11-23	Micron Technology, Inc.	Continuous mode solder jet apparatus
JP3306468B2 (ja) *	1997-10-30	2002-07-24	セレスティカ・ジャパン・イーエムエス株式会社	自動ハンダ付け機構及びその機構を用いる装置並びにそのハンダ付け方法
US6814778B1 (en)	1997-12-12	2004-11-09	Micron Technology, Inc.	Method for continuous mode solder jet apparatus
US6257480B1 (en) *	1998-07-07	2001-07-10	Denso Corporation	Jet soldering method and apparatus
JP2004259963A (ja) *	2003-02-26	2004-09-16	Minebea Co Ltd	噴流式半田付け装置
US8146792B2 (en) *	2010-03-16	2012-04-03	Flextronics Ap, Llc	Solder return for wave solder nozzle
JP7141001B1 (ja) *	2021-05-14	2022-09-22	千住金属工業株式会社	噴流はんだ付け装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
GB1325403A (en) *	1970-10-20	1973-08-01	Heberlein & Co Ag	Soldering appliance
US4824010A (en) *	1980-12-26	1989-04-25	Matsushita Electric Industrial Co., Ltd.	Process and apparatus for soldering printed circuit boards
EP0055323B1 (de) *	1980-12-26	1987-11-11	Matsushita Electric Industrial Co., Ltd.	Einrichtung zum Löten von chipartigen Bauteilen
US4530457A (en) *	1982-01-12	1985-07-23	Electrovert Ltd.	Wave-soldering of printed circuit boards
DE3612361A1 (de) *	1985-04-25	1986-11-06	Ernst 6983 Kreuzwertheim Hohnerlein	Loetvorrichtung
KR920008948B1 (ko) *	1987-02-12	1992-10-12	니혼 덴네쯔 게이기 가부시끼가이샤	프린트 기판의 납땜방법 및 그의 장치
JPS63281768A (ja) *	1987-05-13	1988-11-18	Tamura Seisakusho Co Ltd	噴流式はんだ付け装置
US4802617A (en) *	1988-02-19	1989-02-07	Electrovert Limited	Restriction of dross formation in a soldering apparatus
US5156324A (en) *	1992-03-17	1992-10-20	Electrovert Lgd	Solder apparatus with dual hollow wave nozzles

1992
- 1992-01-14 NL NL9200060A patent/NL9200060A/nl not_active Application Discontinuation
1993
- 1993-01-07 EP EP93902574A patent/EP0621814B1/de not_active Expired - Lifetime
- 1993-01-07 DE DE69317875T patent/DE69317875T2/de not_active Expired - Fee Related
- 1993-01-07 WO PCT/NL1993/000003 patent/WO1993013904A1/en active IP Right Grant
- 1993-01-07 US US08/108,593 patent/US5379931A/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
DE69317875D1 (de)	1998-05-14
WO1993013904A1 (en)	1993-07-22
EP0621814A1 (de)	1994-11-02
US5379931A (en)	1995-01-10
EP0621814B1 (de)	1998-04-08
NL9200060A (nl)	1993-08-02

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Legal Events

Date	Code	Title	Description
1999-05-06	8364	No opposition during term of opposition
2002-12-19	8339	Ceased/non-payment of the annual fee