DE69322206D1 - Wafer Prüfstation mit integrierten einrichtungen für Erdung, Kelvinverbindung und Abschirmung - Google Patents

Wafer Prüfstation mit integrierten einrichtungen für Erdung, Kelvinverbindung und Abschirmung

Info

Publication number
DE69322206D1
DE69322206D1 DE69322206T DE69322206T DE69322206D1 DE 69322206 D1 DE69322206 D1 DE 69322206D1 DE 69322206 T DE69322206 T DE 69322206T DE 69322206 T DE69322206 T DE 69322206T DE 69322206 D1 DE69322206 D1 DE 69322206D1
Authority
DE
Germany
Prior art keywords
earthing
shielding
test station
wafer test
kelvin connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69322206T
Other languages
English (en)
Other versions
DE69322206T2 (de
Inventor
Randy J Schwindt
Warren K Harwood
Paul A Tervo
Kenneth R Smith
Richard H Warner
Peter D Andrews
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Beaverton Inc
Original Assignee
Cascade Microtech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25406961&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69322206(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cascade Microtech Inc filed Critical Cascade Microtech Inc
Application granted granted Critical
Publication of DE69322206D1 publication Critical patent/DE69322206D1/de
Publication of DE69322206T2 publication Critical patent/DE69322206T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • A—HUMAN NECESSITIES
    • A46—BRUSHWARE
    • A46D—MANUFACTURE OF BRUSHES
    • A46D1/00—Bristles; Selection of materials for bristles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06705—Apparatus for holding or moving single probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06794—Devices for sensing when probes are in contact, or in position to contact, with measured object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07392—Multiple probes manipulating each probe element or tip individually
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
DE69322206T 1992-06-11 1993-05-20 Wafer Prüfstation mit integrierten einrichtungen für Erdung, Kelvinverbindung und Abschirmung Expired - Lifetime DE69322206T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/896,853 US5345170A (en) 1992-06-11 1992-06-11 Wafer probe station having integrated guarding, Kelvin connection and shielding systems

Publications (2)

Publication Number Publication Date
DE69322206D1 true DE69322206D1 (de) 1999-01-07
DE69322206T2 DE69322206T2 (de) 1999-04-22

Family

ID=25406961

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69322206T Expired - Lifetime DE69322206T2 (de) 1992-06-11 1993-05-20 Wafer Prüfstation mit integrierten einrichtungen für Erdung, Kelvinverbindung und Abschirmung

Country Status (4)

Country Link
US (14) US5345170A (de)
EP (1) EP0574149B1 (de)
JP (1) JP3227026B2 (de)
DE (1) DE69322206T2 (de)

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US6335628B2 (en) 2002-01-01
US20020043981A1 (en) 2002-04-18
US5663653A (en) 1997-09-02
JP3227026B2 (ja) 2001-11-12
US5604444A (en) 1997-02-18
DE69322206T2 (de) 1999-04-22
US20050194983A1 (en) 2005-09-08
US20040061514A1 (en) 2004-04-01
US6980012B2 (en) 2005-12-27
JPH0653293A (ja) 1994-02-25
US5434512A (en) 1995-07-18
US6720782B2 (en) 2004-04-13
EP0574149A1 (de) 1993-12-15
US20070290700A1 (en) 2007-12-20
US6232788B1 (en) 2001-05-15
US7492147B2 (en) 2009-02-17
US5457398A (en) 1995-10-10
US20010009377A1 (en) 2001-07-26
US5532609A (en) 1996-07-02
US5345170A (en) 1994-09-06
US20030057979A1 (en) 2003-03-27
US6492822B2 (en) 2002-12-10
US20050184744A1 (en) 2005-08-25
EP0574149B1 (de) 1998-11-25
US7589518B2 (en) 2009-09-15
US7330023B2 (en) 2008-02-12

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