DE69322819D1 - Piezoelektrischer Schwinger und sein Herstellungsverfahren - Google Patents

Piezoelektrischer Schwinger und sein Herstellungsverfahren

Info

Publication number
DE69322819D1
DE69322819D1 DE69322819T DE69322819T DE69322819D1 DE 69322819 D1 DE69322819 D1 DE 69322819D1 DE 69322819 T DE69322819 T DE 69322819T DE 69322819 T DE69322819 T DE 69322819T DE 69322819 D1 DE69322819 D1 DE 69322819D1
Authority
DE
Germany
Prior art keywords
manufacturing process
piezoelectric transducer
piezoelectric
transducer
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69322819T
Other languages
English (en)
Other versions
DE69322819T2 (de
Inventor
Kazuo Eda
Takashi Nagata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69322819D1 publication Critical patent/DE69322819D1/de
Publication of DE69322819T2 publication Critical patent/DE69322819T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/13—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/132—Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0595—Holders; Supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
DE69322819T 1992-07-08 1993-07-08 Piezoelektrischer Schwinger und sein Herstellungsverfahren Expired - Fee Related DE69322819T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4180856A JPH06291587A (ja) 1992-07-08 1992-07-08 圧電振動子

Publications (2)

Publication Number Publication Date
DE69322819D1 true DE69322819D1 (de) 1999-02-11
DE69322819T2 DE69322819T2 (de) 1999-08-19

Family

ID=16090561

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69330499T Expired - Fee Related DE69330499T2 (de) 1992-07-08 1993-07-08 Piezoelektrischer Resonator und Herstellungsverfahren derselben
DE69322819T Expired - Fee Related DE69322819T2 (de) 1992-07-08 1993-07-08 Piezoelektrischer Schwinger und sein Herstellungsverfahren

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69330499T Expired - Fee Related DE69330499T2 (de) 1992-07-08 1993-07-08 Piezoelektrischer Resonator und Herstellungsverfahren derselben

Country Status (4)

Country Link
US (1) US5548178A (de)
EP (2) EP0580025B1 (de)
JP (1) JPH06291587A (de)
DE (2) DE69330499T2 (de)

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DE19928179B4 (de) * 1999-06-19 2008-07-31 Robert Bosch Gmbh Piezoaktor
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US6563133B1 (en) * 2000-08-09 2003-05-13 Ziptronix, Inc. Method of epitaxial-like wafer bonding at low temperature and bonded structure
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US7990025B1 (en) * 2004-09-01 2011-08-02 Pablo Ferreiro Silicon package with embedded oscillator
JP4997780B2 (ja) * 2005-05-16 2012-08-08 セイコーエプソン株式会社 圧電振動片の製造方法
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US7568377B2 (en) * 2005-07-28 2009-08-04 University Of South Florida High frequency thickness shear mode acoustic wave sensor for gas and organic vapor detection
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JP4855816B2 (ja) * 2006-03-31 2012-01-18 京セラキンセキ株式会社 ラーメモード水晶振動子の製造方法
EP2015449A1 (de) * 2007-07-13 2009-01-14 ETA SA Manufacture Horlogère Suisse Verpackung für einen piezoelektrischen Resonator
JP5198135B2 (ja) * 2008-04-30 2013-05-15 日本電波工業株式会社 圧電振動子及び電子部品
US8242664B2 (en) * 2008-12-26 2012-08-14 Nihon Dempa Kogyo Co., Ltd. Elastic wave device and electronic component
JP5637839B2 (ja) * 2010-12-22 2014-12-10 日本電波工業株式会社 圧電デバイス及び圧電デバイスの製造方法
US20130235001A1 (en) * 2012-03-06 2013-09-12 Qualcomm Mems Technologies, Inc. Piezoelectric resonator with airgap
EP2974014A4 (de) * 2013-03-11 2016-11-02 Nokia Technologies Oy Vorrichtung und verfahren zum abstimmen einer resonanzfrequenz
WO2015084456A2 (en) * 2013-09-18 2015-06-11 The Regents Of The University Of California Tunable q resonator
WO2017075413A1 (en) 2015-10-28 2017-05-04 Georgia Tech Research Corporation Comb-driven substrate decoupled annulus pitch/roll baw gyroscope with slanted quadrature tuning electrode
US10921123B2 (en) 2016-06-07 2021-02-16 Georgia Tech Research Corporation Pitch/roll annulus gyroscope with slanted quadrature tuning electrodes and related fabrication methods
CN109668952A (zh) * 2018-12-19 2019-04-23 中国科学院苏州生物医学工程技术研究所 压电传感芯片、压电传感器及其制备方法
DE102019113797A1 (de) * 2019-05-23 2020-12-10 RF360 Europe GmbH BAW-Resonator mit reduzierten Verlusten, HF-Filter, Multiplexer und Verfahren zum Herstellen eines BAW-Resonators
CN113395053B (zh) * 2021-03-02 2022-12-09 广州乐仪投资有限公司 石英薄膜谐振器及其制造方法

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Also Published As

Publication number Publication date
EP0580025B1 (de) 1998-12-30
JPH06291587A (ja) 1994-10-18
EP0580025A1 (de) 1994-01-26
EP0797300B1 (de) 2001-07-25
DE69322819T2 (de) 1999-08-19
DE69330499D1 (de) 2001-08-30
EP0797300A1 (de) 1997-09-24
DE69330499T2 (de) 2002-06-06
US5548178A (en) 1996-08-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee