DE69329431T2 - Plattes lüftergehäuse mit wärmeleitenden charakteristiken - Google Patents
Plattes lüftergehäuse mit wärmeleitenden charakteristikenInfo
- Publication number
- DE69329431T2 DE69329431T2 DE69329431T DE69329431T DE69329431T2 DE 69329431 T2 DE69329431 T2 DE 69329431T2 DE 69329431 T DE69329431 T DE 69329431T DE 69329431 T DE69329431 T DE 69329431T DE 69329431 T2 DE69329431 T2 DE 69329431T2
- Authority
- DE
- Germany
- Prior art keywords
- heat transfer
- fan
- frame
- depth region
- axial blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
- F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/40—Casings; Connections of working fluid
- F04D29/52—Casings; Connections of working fluid for axial pumps
- F04D29/522—Casings; Connections of working fluid for axial pumps especially adapted for elastic fluid pumps
- F04D29/526—Details of the casing section radially opposing blade tips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/58—Cooling; Heating; Diminishing heat transfer
- F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/965,654 US5288203A (en) | 1992-10-23 | 1992-10-23 | Low profile fan body with heat transfer characteristics |
PCT/US1993/009266 WO1994010451A1 (en) | 1992-10-23 | 1993-09-29 | Low profile fan body with heat transfer characteristics |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69329431D1 DE69329431D1 (de) | 2000-10-19 |
DE69329431T2 true DE69329431T2 (de) | 2001-02-22 |
Family
ID=25510285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69329431T Expired - Lifetime DE69329431T2 (de) | 1992-10-23 | 1993-09-29 | Plattes lüftergehäuse mit wärmeleitenden charakteristiken |
Country Status (7)
Country | Link |
---|---|
US (1) | US5288203A (de) |
EP (1) | EP0746688B1 (de) |
JP (1) | JP3400801B2 (de) |
AT (1) | ATE196346T1 (de) |
CA (1) | CA2147752C (de) |
DE (1) | DE69329431T2 (de) |
WO (1) | WO1994010451A1 (de) |
Families Citing this family (70)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3069819B2 (ja) * | 1992-05-28 | 2000-07-24 | 富士通株式会社 | ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置 |
US5484262A (en) * | 1992-10-23 | 1996-01-16 | Nidec Corporation | Low profile fan body with heat transfer characteristics |
JP2901867B2 (ja) * | 1993-03-19 | 1999-06-07 | 富士通株式会社 | ヒートシンク及びヒートシンクの取付構造 |
US5484013A (en) * | 1993-05-27 | 1996-01-16 | Nippon Densan Corporation | Heat sink fan |
JP2765801B2 (ja) * | 1993-08-20 | 1998-06-18 | 山洋電気株式会社 | 電子部品冷却装置 |
US5377745A (en) * | 1993-11-30 | 1995-01-03 | Hsieh; Hsin M. | Cooling device for central processing unit |
US5407324A (en) * | 1993-12-30 | 1995-04-18 | Compaq Computer Corporation | Side-vented axial fan and associated fabrication methods |
US5452181A (en) * | 1994-02-07 | 1995-09-19 | Nidec Corporation | Detachable apparatus for cooling integrated circuits |
US5437327A (en) * | 1994-04-18 | 1995-08-01 | Chiou; Ming Der | CPU heat dissipating fan device |
US5409352A (en) * | 1994-04-18 | 1995-04-25 | Lin; Mike | CPU heat dissipating device |
US5430610A (en) * | 1994-06-15 | 1995-07-04 | Hung; Chin-Ping | Separable positioning device for the heat sink on computer chips |
JP2918810B2 (ja) * | 1994-07-12 | 1999-07-12 | 山洋電気株式会社 | 電子部品冷却装置 |
US5506752A (en) * | 1994-07-25 | 1996-04-09 | Kong; Edmund Y. | Apparatus for cooling an integrated circuit chip |
US5526875A (en) * | 1994-10-14 | 1996-06-18 | Lin; Shih-Jen | Cooling device for CPU |
US5460571A (en) * | 1994-10-31 | 1995-10-24 | Kato; Junichi | Electro-magnetically shielded ventilation system |
US5421402A (en) * | 1994-11-22 | 1995-06-06 | Lin; Chuen-Sheng | Heat sink apparatus |
US5583746A (en) * | 1994-12-12 | 1996-12-10 | Tennmax Trading Corp. | Heat sink assembly for a central processing unit of a computer |
US5502619A (en) * | 1994-12-12 | 1996-03-26 | Tennmax Trading Corp. | Heat sink assembly for computer chips |
US5519575A (en) * | 1995-02-14 | 1996-05-21 | Chiou; Ming D. | CPU cooling fan mounting structure |
GB2298520B (en) * | 1995-03-03 | 1999-09-08 | Hong Chen Fu In | Heat sink device for integrated circuit |
US5810554A (en) * | 1995-05-31 | 1998-09-22 | Sanyo Denki Co., Ltd. | Electronic component cooling apparatus |
JP3058818B2 (ja) * | 1995-10-05 | 2000-07-04 | 山洋電気株式会社 | 電子部品冷却用ヒートシンク |
US5785116A (en) * | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
US5896917A (en) * | 1996-02-22 | 1999-04-27 | Lemont Aircraft Corporation | Active heat sink structure with flow augmenting rings and method for removing heat |
US5740013A (en) * | 1996-07-03 | 1998-04-14 | Hewlett-Packard Company | Electronic device enclosure having electromagnetic energy containment and heat removal characteristics |
JP3188397B2 (ja) * | 1996-07-04 | 2001-07-16 | 松下電器産業株式会社 | 送風装置 |
US6047765A (en) * | 1996-08-20 | 2000-04-11 | Zhan; Xiao | Cross flow cooling device for semiconductor components |
DE29615089U1 (de) * | 1996-08-29 | 1996-10-17 | Lee Richard | Bürstenloser Gleichstromlüfter |
US5794685A (en) * | 1996-12-17 | 1998-08-18 | Hewlett-Packard Company | Heat sink device having radial heat and airflow paths |
US6501652B2 (en) | 1997-02-24 | 2002-12-31 | Fujitsu Limited | Heat sink and information processor using it |
JP4290232B2 (ja) * | 1997-02-24 | 2009-07-01 | 富士通株式会社 | ヒートシンクとそれを使用する情報処理装置 |
US5727624A (en) * | 1997-03-18 | 1998-03-17 | Liken Lin | CPU heat dissipating device with airguiding units |
US6132171A (en) * | 1997-06-10 | 2000-10-17 | Matsushita Electric Industrial Co., Ltd. | Blower and method for molding housing thereof |
TW464733B (en) * | 1997-06-27 | 2001-11-21 | Mitsubishi Electric Corp | Blower, casing of blower, motor, vibration control mounting device |
USD408514S (en) * | 1997-10-07 | 1999-04-20 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat dissipation fan |
US6125920A (en) * | 1997-10-16 | 2000-10-03 | Herbert; Edward | Fan with heat sink using stamped heat sink fins |
US6211566B1 (en) | 1998-03-24 | 2001-04-03 | Sun Microsystems, Inc. | Method and apparatus to improve the thermal interface between a heat sink and a semiconductor |
US6050326A (en) * | 1998-05-12 | 2000-04-18 | International Business Machines Corporation | Method and apparatus for cooling an electronic device |
JP3188417B2 (ja) | 1998-05-14 | 2001-07-16 | 松下電器産業株式会社 | 送風装置 |
JP2000012751A (ja) * | 1998-06-24 | 2000-01-14 | Nippon Densan Corp | 冷却ファン装置 |
US6206641B1 (en) * | 1998-06-29 | 2001-03-27 | Samsung Electro-Mechanics Co., Ltd. | Micro fan |
US7584780B1 (en) | 1998-12-09 | 2009-09-08 | Lemont Aircraft Corporation | Active heat sink structure with flow augmenting rings and method for removing heat |
US6176299B1 (en) | 1999-02-22 | 2001-01-23 | Agilent Technologies, Inc. | Cooling apparatus for electronic devices |
US6186739B1 (en) * | 1999-09-09 | 2001-02-13 | Hsieh Hsin-Mao | Support for a cooling fan |
TW562087U (en) * | 2000-06-16 | 2003-11-11 | Delta Electronics Inc | Frame structure for fan |
JP3503822B2 (ja) * | 2001-01-16 | 2004-03-08 | ミネベア株式会社 | 軸流ファンモータおよび冷却装置 |
US6505680B1 (en) | 2001-07-27 | 2003-01-14 | Hewlett-Packard Company | High performance cooling device |
US6702001B2 (en) * | 2001-08-21 | 2004-03-09 | Agilent Technologies, Inc. | Heat transfer apparatus and method of manufacturing an integrated circuit and heat sink assembly |
TW592343U (en) * | 2002-04-30 | 2004-06-11 | Delta Electronics Inc | Improved cooling fan |
US6955215B2 (en) * | 2004-03-09 | 2005-10-18 | King Fahd University Of Petroleum And Minerals | Hybrid cooling system and method for cooling electronic devices |
US6844641B1 (en) * | 2004-03-15 | 2005-01-18 | Sunonwealth Electric Machine Industry Co., Ltd. | Casing for heat-dissipating fan |
US8020608B2 (en) * | 2004-08-31 | 2011-09-20 | Hewlett-Packard Development Company, L.P. | Heat sink fin with stator blade |
US7198464B2 (en) * | 2004-10-08 | 2007-04-03 | Asia Vital Component Co., Ltd. | Frame device of a fan |
US7296619B2 (en) * | 2004-10-21 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Twin fin arrayed cooling device with heat spreader |
US7028757B1 (en) | 2004-10-21 | 2006-04-18 | Hewlett-Packard Development Company, L.P. | Twin fin arrayed cooling device with liquid chamber |
US7164582B2 (en) * | 2004-10-29 | 2007-01-16 | Hewlett-Packard Development Company, L.P. | Cooling system with submerged fan |
US20070231142A1 (en) * | 2006-03-31 | 2007-10-04 | Wen-Hao Liu | Fan frame structure |
US20070242430A1 (en) * | 2006-04-15 | 2007-10-18 | Wen-Hao Liu | Fan frame device |
JP2008267176A (ja) * | 2007-04-17 | 2008-11-06 | Sony Corp | 軸流ファン装置、ハウジング及び電子機器 |
US8740562B2 (en) * | 2007-10-30 | 2014-06-03 | Nidec Corporation | Axial fan and method of manufacturing the same |
JP5636792B2 (ja) * | 2010-07-30 | 2014-12-10 | 日本電産株式会社 | 軸流ファンおよびそれを備えた電子機器 |
JP5668352B2 (ja) * | 2010-07-30 | 2015-02-12 | 日本電産株式会社 | 軸流ファン及びスライド金型 |
US9039362B2 (en) * | 2011-03-14 | 2015-05-26 | Minebea Co., Ltd. | Impeller and centrifugal fan using the same |
KR101326515B1 (ko) * | 2011-12-12 | 2013-11-08 | 기아자동차주식회사 | 방열형 캔드 모터 펌프 |
US8944148B2 (en) * | 2012-07-23 | 2015-02-03 | King Fahd University Of Petroleum And Minerals | Add-on heat sink |
TW201426263A (zh) * | 2012-12-26 | 2014-07-01 | Hon Hai Prec Ind Co Ltd | 導熱膏保護罩 |
GB2545414B (en) * | 2015-12-11 | 2019-03-13 | Dyson Technology Ltd | A handheld product having a motor |
JP6928434B2 (ja) * | 2016-09-30 | 2021-09-01 | ミネベアミツミ株式会社 | 軸流ファン装置 |
KR102067271B1 (ko) * | 2018-07-23 | 2020-01-16 | 엘지전자 주식회사 | 조리기기 |
US11859915B1 (en) * | 2019-01-31 | 2024-01-02 | Advanced Thermal Solutions, Inc. | Fluid mover enclosure |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2120197A5 (de) * | 1970-08-04 | 1972-08-18 | Lannionnais Electronique | |
LU68101A1 (de) * | 1973-07-26 | 1973-11-22 | ||
CH612736A5 (de) * | 1976-04-27 | 1979-08-15 | Papst Motoren Kg | |
DE2743708A1 (de) * | 1977-09-28 | 1979-04-05 | Siemens Ag | Einrichtung zur ableitung der waerme aus einem hermetisch gekapselten geraet |
JPS6047453B2 (ja) * | 1978-01-13 | 1985-10-22 | トヨタ自動車株式会社 | 内燃機関の冷却装置 |
US4233644A (en) * | 1979-06-28 | 1980-11-11 | International Business Machines Corporation | Dual-pull air cooling for a computer frame |
US4611238A (en) * | 1982-05-05 | 1986-09-09 | Burroughs Corporation | Integrated circuit package incorporating low-stress omnidirectional heat sink |
US4541004A (en) * | 1982-11-24 | 1985-09-10 | Burroughs Corporation | Aerodynamically enhanced heat sink |
US4489363A (en) * | 1983-01-31 | 1984-12-18 | Sperry Corporation | Apparatus for cooling integrated circuit chips |
US4620216A (en) * | 1983-04-29 | 1986-10-28 | International Business Machines Corporation | Unitary slotted heat sink for semiconductor packages |
US4546405A (en) * | 1983-05-25 | 1985-10-08 | International Business Machines Corporation | Heat sink for electronic package |
US4639829A (en) * | 1984-06-29 | 1987-01-27 | International Business Machines Corporation | Thermal conduction disc-chip cooling enhancement means |
US4662830A (en) * | 1985-09-06 | 1987-05-05 | Magnetic Peripherals Inc. | Quiet centrifugal fan |
US4784928A (en) * | 1986-09-02 | 1988-11-15 | Eastman Kodak Company | Reusable electrophotographic element |
US4682651A (en) * | 1986-09-08 | 1987-07-28 | Burroughs Corporation (Now Unisys Corporation) | Segmented heat sink device |
US4715430A (en) * | 1986-10-27 | 1987-12-29 | International Business Machines Corporation | Environmentally secure and thermally efficient heat sink assembly |
US4733293A (en) * | 1987-02-13 | 1988-03-22 | Unisys Corporation | Heat sink device assembly for encumbered IC package |
US4885488A (en) * | 1988-05-23 | 1989-12-05 | Texas Instruments Incorporated | Miniaturized fan for printed circuit boards |
JPH0286900A (ja) * | 1988-06-25 | 1990-03-27 | Nippon Spindle Mfg Co Ltd | 研削廃液の濾過方法及びその装置 |
US4970579A (en) * | 1988-09-21 | 1990-11-13 | International Business Machines Corp. | Integrated circuit package with improved cooling means |
US5191230A (en) * | 1989-01-30 | 1993-03-02 | Heung Lap Yan | Circuit module fan assembly |
JPH03229492A (ja) * | 1990-02-05 | 1991-10-11 | Seiko Electronic Components Ltd | 遠心送風機 |
-
1992
- 1992-10-23 US US07/965,654 patent/US5288203A/en not_active Expired - Lifetime
-
1993
- 1993-09-29 WO PCT/US1993/009266 patent/WO1994010451A1/en active IP Right Grant
- 1993-09-29 AT AT93923741T patent/ATE196346T1/de not_active IP Right Cessation
- 1993-09-29 EP EP93923741A patent/EP0746688B1/de not_active Expired - Lifetime
- 1993-09-29 CA CA002147752A patent/CA2147752C/en not_active Expired - Lifetime
- 1993-09-29 JP JP51106394A patent/JP3400801B2/ja not_active Expired - Fee Related
- 1993-09-29 DE DE69329431T patent/DE69329431T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CA2147752A1 (en) | 1994-05-11 |
EP0746688A1 (de) | 1996-12-11 |
CA2147752C (en) | 1998-12-08 |
US5288203A (en) | 1994-02-22 |
ATE196346T1 (de) | 2000-09-15 |
EP0746688A4 (de) | 1998-05-13 |
WO1994010451A1 (en) | 1994-05-11 |
EP0746688B1 (de) | 2000-09-13 |
DE69329431D1 (de) | 2000-10-19 |
JPH08502804A (ja) | 1996-03-26 |
JP3400801B2 (ja) | 2003-04-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: ACKMANN MENGES PATENT- UND RECHTSANWAELTE, 80469 M |
|
R082 | Change of representative |
Ref document number: 746688 Country of ref document: EP Representative=s name: SCHUMACHER & WILLSAU PATENTANWALTSGESELLSCHAFT, DE |