DE69410301T2 - Verfahren zur Herstellung funktioneller niedergeschlagener Schichten - Google Patents

Verfahren zur Herstellung funktioneller niedergeschlagener Schichten

Info

Publication number
DE69410301T2
DE69410301T2 DE69410301T DE69410301T DE69410301T2 DE 69410301 T2 DE69410301 T2 DE 69410301T2 DE 69410301 T DE69410301 T DE 69410301T DE 69410301 T DE69410301 T DE 69410301T DE 69410301 T2 DE69410301 T2 DE 69410301T2
Authority
DE
Germany
Prior art keywords
production
deposited layers
functional deposited
functional
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69410301T
Other languages
English (en)
Other versions
DE69410301D1 (de
Inventor
Yasushi Fujioka
Shotaro Okabe
Masahiro Kanai
Hideo Tamura
Atsushi Yasuno
Akira Sakai
Tadashi Hori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP05013478A external-priority patent/JP3093502B2/ja
Priority claimed from JP05013562A external-priority patent/JP3093504B2/ja
Priority claimed from JP01356393A external-priority patent/JP3297487B2/ja
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69410301D1 publication Critical patent/DE69410301D1/de
Application granted granted Critical
Publication of DE69410301T2 publication Critical patent/DE69410301T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/075Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PIN type
    • H01L31/076Multiple junction or tandem solar cells
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02373Group 14 semiconducting materials
    • H01L21/02381Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02439Materials
    • H01L21/02441Group 14 semiconducting materials
    • H01L21/0245Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02436Intermediate layers between substrates and deposited layers
    • H01L21/02494Structure
    • H01L21/02496Layer structure
    • H01L21/02505Layer structure consisting of more than two layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
    • H01L31/075Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PIN type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/202Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic System
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/202Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic System
    • H01L31/204Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials including only elements of Group IV of the Periodic System including AIVBIV alloys, e.g. SiGe, SiC
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/20Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
    • H01L31/206Particular processes or apparatus for continuous treatment of the devices, e.g. roll-to roll processes, multi-chamber deposition
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/548Amorphous silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
DE69410301T 1993-01-29 1994-01-28 Verfahren zur Herstellung funktioneller niedergeschlagener Schichten Expired - Fee Related DE69410301T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP05013478A JP3093502B2 (ja) 1993-01-29 1993-01-29 光起電力素子及びその形成方法及びその形成装置
JP05013562A JP3093504B2 (ja) 1993-01-29 1993-01-29 光起電力素子及びその形成方法及びその形成装置
JP01356393A JP3297487B2 (ja) 1993-01-29 1993-01-29 光起電力素子及びその形成方法及びその形成装置

Publications (2)

Publication Number Publication Date
DE69410301D1 DE69410301D1 (de) 1998-06-25
DE69410301T2 true DE69410301T2 (de) 1998-09-24

Family

ID=27280268

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69410301T Expired - Fee Related DE69410301T2 (de) 1993-01-29 1994-01-28 Verfahren zur Herstellung funktioneller niedergeschlagener Schichten

Country Status (4)

Country Link
US (1) US5589007A (de)
EP (1) EP0609104B1 (de)
AU (1) AU663987B2 (de)
DE (1) DE69410301T2 (de)

Families Citing this family (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5942788A (en) * 1995-05-09 1999-08-24 Minolta Co., Ltd. Solid state image sensing device
JP3169337B2 (ja) * 1995-05-30 2001-05-21 キヤノン株式会社 光起電力素子及びその製造方法
US5716480A (en) * 1995-07-13 1998-02-10 Canon Kabushiki Kaisha Photovoltaic device and method of manufacturing the same
US6273955B1 (en) * 1995-08-28 2001-08-14 Canon Kabushiki Kaisha Film forming apparatus
JPH0992860A (ja) * 1995-09-28 1997-04-04 Canon Inc 光起電力素子
JP3437386B2 (ja) * 1996-09-05 2003-08-18 キヤノン株式会社 光起電力素子、並びにその製造方法
US6159763A (en) * 1996-09-12 2000-12-12 Canon Kabushiki Kaisha Method and device for forming semiconductor thin film, and method and device for forming photovoltaic element
US6159300A (en) 1996-12-17 2000-12-12 Canon Kabushiki Kaisha Apparatus for forming non-single-crystal semiconductor thin film, method for forming non-single-crystal semiconductor thin film, and method for producing photovoltaic device
JP3754815B2 (ja) * 1997-02-19 2006-03-15 キヤノン株式会社 光起電力素子、光電変換素子、光起電力素子の製造方法及び光電変換素子の製造方法
CN1097299C (zh) 1997-03-10 2002-12-25 佳能株式会社 淀积膜形成工艺
JPH1154773A (ja) * 1997-08-01 1999-02-26 Canon Inc 光起電力素子及びその製造方法
AU756834B2 (en) * 1997-08-01 2003-01-23 Canon Kabushiki Kaisha Method of producing a microcrystal semiconductor thin film
JP2000133736A (ja) * 1998-10-26 2000-05-12 Furukawa Electric Co Ltd:The 半導体レーザ素子の気密封止方法及び気密封止装置
JP3160263B2 (ja) * 1999-05-14 2001-04-25 キヤノン販売株式会社 プラズマドーピング装置及びプラズマドーピング方法
JP2001288572A (ja) * 2000-01-31 2001-10-19 Canon Inc 堆積膜形成装置および堆積膜形成方法
US6638359B2 (en) * 2000-01-31 2003-10-28 Canon Kabushiki Kaisha Deposited film forming apparatus and deposited film forming method
JP2001214276A (ja) * 2000-01-31 2001-08-07 Canon Inc 堆積膜形成装置
JP2001214277A (ja) 2000-01-31 2001-08-07 Canon Inc 堆積膜形成装置および堆積膜形成方法
JP3990867B2 (ja) * 2000-01-31 2007-10-17 キヤノン株式会社 堆積膜形成装置および堆積膜形成方法
JP2002020863A (ja) 2000-05-01 2002-01-23 Canon Inc 堆積膜の形成方法及び形成装置、及び基板処理方法
JP4510242B2 (ja) 2000-07-11 2010-07-21 キヤノン株式会社 薄膜形成方法
JP3989205B2 (ja) * 2000-08-31 2007-10-10 松下電器産業株式会社 Cvd膜の形成方法
JP4651072B2 (ja) * 2001-05-31 2011-03-16 キヤノン株式会社 堆積膜形成方法、および堆積膜形成装置
US6719848B2 (en) * 2001-08-16 2004-04-13 First Solar, Llc Chemical vapor deposition system
JP3960775B2 (ja) * 2001-11-08 2007-08-15 シャープ株式会社 プラズマプロセス装置および処理装置
US6977775B2 (en) * 2002-05-17 2005-12-20 Sharp Kabushiki Kaisha Method and apparatus for crystallizing semiconductor with laser beams
JP3862615B2 (ja) * 2002-06-10 2006-12-27 キヤノン株式会社 シリコン系薄膜形成装置およびシリコン系薄膜形成方法
US20040011290A1 (en) * 2002-06-10 2004-01-22 Takaharu Kondo Apparatus and process for forming deposited film
US20060063680A1 (en) * 2002-07-26 2006-03-23 Metal Oxide Technologies, Inc. System and method for joining superconductivity tape
US20060278163A1 (en) * 2002-08-27 2006-12-14 Ovshinsky Stanford R High throughput deposition apparatus with magnetic support
JP2004335706A (ja) * 2003-05-07 2004-11-25 Canon Inc 半導体素子の形成方法
US20040231590A1 (en) * 2003-05-19 2004-11-25 Ovshinsky Stanford R. Deposition apparatus for the formation of polycrystalline materials on mobile substrates
US7115304B2 (en) * 2004-02-19 2006-10-03 Nanosolar, Inc. High throughput surface treatment on coiled flexible substrates
DE102004024461A1 (de) * 2004-05-14 2005-12-01 Konarka Technologies, Inc., Lowell Vorrichtung und Verfahren zur Herstellung eines elektronischen Bauelements mit zumindest einer aktiven organischen Schicht
US7413670B2 (en) * 2004-06-25 2008-08-19 Mutual-Pak Technology Co., Ltd. Method for forming wiring on a substrate
JP2006032670A (ja) * 2004-07-16 2006-02-02 Matsushita Electric Ind Co Ltd 半導体受光素子及びその製造方法
US20090032108A1 (en) * 2007-03-30 2009-02-05 Craig Leidholm Formation of photovoltaic absorber layers on foil substrates
US20130025532A1 (en) * 2004-09-18 2013-01-31 Nanosolar, Inc. Formation of photovoltaic absorber layers on foil substrates
US7666766B2 (en) * 2005-09-27 2010-02-23 Semiconductor Energy Laboratory Co., Ltd. Film formation apparatus, method for forming film, and method for manufacturing photoelectric conversion device
US7703765B2 (en) * 2006-08-04 2010-04-27 Xerox Corporation Transport belt cooling
US7501305B2 (en) * 2006-10-23 2009-03-10 Canon Kabushiki Kaisha Method for forming deposited film and photovoltaic element
WO2008065804A1 (fr) * 2006-12-01 2008-06-05 Sharp Kabushiki Kaisha Appareil et procédé permettant la fabrication d'un élément semi-conducteur et élément semi-conducteur fabrique par le procédé
US8951632B2 (en) 2007-01-03 2015-02-10 Applied Nanostructured Solutions, Llc CNT-infused carbon fiber materials and process therefor
US20120189846A1 (en) * 2007-01-03 2012-07-26 Lockheed Martin Corporation Cnt-infused ceramic fiber materials and process therefor
US9005755B2 (en) 2007-01-03 2015-04-14 Applied Nanostructured Solutions, Llc CNS-infused carbon nanomaterials and process therefor
US20100279569A1 (en) * 2007-01-03 2010-11-04 Lockheed Martin Corporation Cnt-infused glass fiber materials and process therefor
US8951631B2 (en) 2007-01-03 2015-02-10 Applied Nanostructured Solutions, Llc CNT-infused metal fiber materials and process therefor
US8203071B2 (en) 2007-01-18 2012-06-19 Applied Materials, Inc. Multi-junction solar cells and methods and apparatuses for forming the same
US7687300B2 (en) * 2007-10-22 2010-03-30 Applied Materials, Inc. Method of dynamic temperature control during microcrystalline SI growth
JP2011503848A (ja) * 2007-11-02 2011-01-27 アプライド マテリアルズ インコーポレイテッド 堆積プロセス間のプラズマ処置
US20090255467A1 (en) * 2008-04-15 2009-10-15 Global Solar Energy, Inc. Apparatus and methods for manufacturing thin-film solar cells
DE102008029379A1 (de) * 2008-06-23 2009-08-13 Von Ardenne Anlagentechnik Gmbh Anordnung zum Beschichten bandförmiger Foliensubstrate
US20110283934A1 (en) * 2009-02-03 2011-11-24 Sidrabe Inc. Highly productive apparatus for vacuum coating roll substrates
CN101818331B (zh) * 2009-02-26 2013-10-09 富士胶片株式会社 功能性膜和用于制备功能性膜的方法
US20100227134A1 (en) 2009-03-03 2010-09-09 Lockheed Martin Corporation Method for the prevention of nanoparticle agglomeration at high temperatures
JP2010238871A (ja) * 2009-03-31 2010-10-21 Sanyo Electric Co Ltd 太陽電池の製造方法及びプラズマ処理装置
BR112012002216A2 (pt) 2009-08-03 2016-05-31 Applied Nanostructured Sols método de incorporação de nanopartículas em fibras compósitas, fibra de vidro e tapete de fibra picada ou compósito
JP5371680B2 (ja) * 2009-10-15 2013-12-18 富士フイルム株式会社 機能性フィルムの製造方法
US20110088760A1 (en) * 2009-10-20 2011-04-21 Applied Materials, Inc. Methods of forming an amorphous silicon layer for thin film solar cell application
DE102010000002B4 (de) * 2010-01-04 2013-02-21 Roth & Rau Ag Verfahren zur Abscheidung von Mehrlagenschichten und/oder Gradientenschichten
DE102010000001A1 (de) * 2010-01-04 2011-07-07 Roth & Rau AG, 09337 Inline-Beschichtungsanlage
EP2395567B1 (de) * 2010-06-10 2018-10-03 Solarwave AB Verfahren Zur Herstellung eines Solarzellenmoduls
US20150027372A1 (en) * 2013-07-26 2015-01-29 First Solar, Inc. Vapor Deposition Apparatus for Continuous Deposition of Multiple Thin Film Layers on a Substrate
EP2916350A1 (de) * 2014-03-05 2015-09-09 Applied Materials, Inc. Durchschussblattstruktur für eine Verarbeitungsvorrichtung und Verarbeitungsvorrichtung mit der Durchschussblattstruktur
US20180037487A1 (en) * 2015-03-03 2018-02-08 Corning Incorporated Continuous glass processing apparatus and method of processing flexible glass ribbon
US20230272526A1 (en) * 2021-11-11 2023-08-31 Soliyarn, Llc System, method and composition for producing liquid repellant materials

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4400409A (en) * 1980-05-19 1983-08-23 Energy Conversion Devices, Inc. Method of making p-doped silicon films
JPS6037129A (ja) * 1983-08-10 1985-02-26 Hitachi Ltd 半導体製造装置
US4566403A (en) * 1985-01-30 1986-01-28 Sovonics Solar Systems Apparatus for microwave glow discharge deposition
US5126169A (en) * 1986-08-28 1992-06-30 Canon Kabushiki Kaisha Process for forming a deposited film from two mutually reactive active species
KR930003857B1 (ko) * 1987-08-05 1993-05-14 마쯔시다덴기산교 가부시기가이샤 플라즈마 도우핑방법
US4816082A (en) * 1987-08-19 1989-03-28 Energy Conversion Devices, Inc. Thin film solar cell including a spatially modulated intrinsic layer
JPH02148715A (ja) * 1988-11-29 1990-06-07 Canon Inc 半導体デバイスの連続形成装置
US5192717A (en) * 1989-04-28 1993-03-09 Canon Kabushiki Kaisha Process for the formation of a polycrystalline semiconductor film by microwave plasma chemical vapor deposition method
JP2722115B2 (ja) * 1989-06-28 1998-03-04 キヤノン株式会社 マイクロ波プラズマcvd法により大面積の機能性堆積膜を連続的に形成する方法及び装置
JP2722114B2 (ja) * 1989-06-28 1998-03-04 キヤノン株式会社 マイクロ波プラズマcvd法により大面積の機能性堆積膜を連続的に形成する方法及び装置
JPH0330421A (ja) * 1989-06-28 1991-02-08 Canon Inc マイクロ波プラズマcvd法により大面積の機能性堆積膜を連続的に形成する方法及び装置
JPH03110798A (ja) * 1989-09-25 1991-05-10 Ryohei Itaya マイクロ波プラズマ発生装置
AU632241B2 (en) * 1990-09-06 1992-12-17 Mitsui Toatsu Chemicals Inc. Amorphous silicon solar cell and method for manufacturing the same
US5180434A (en) * 1991-03-11 1993-01-19 United Solar Systems Corporation Interfacial plasma bars for photovoltaic deposition apparatus
JPH04299576A (ja) * 1991-03-27 1992-10-22 Sanyo Electric Co Ltd 光起電力素子及びその製造方法
JP2975151B2 (ja) * 1991-03-28 1999-11-10 キヤノン株式会社 半導体素子の連続的製造装置
US5256576A (en) * 1992-02-14 1993-10-26 United Solar Systems Corporation Method of making pin junction semiconductor device with RF deposited intrinsic buffer layer

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DE69410301D1 (de) 1998-06-25
US5589007A (en) 1996-12-31
AU5480994A (en) 1994-08-04
EP0609104A2 (de) 1994-08-03
EP0609104B1 (de) 1998-05-20
EP0609104A3 (de) 1994-12-21
AU663987B2 (en) 1995-10-26

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