DE69420474T2 - Verfahren zum Spülen und Auspumpen einer Vakuumkammer bis Ultra-Hoch-Vakuum - Google Patents

Verfahren zum Spülen und Auspumpen einer Vakuumkammer bis Ultra-Hoch-Vakuum

Info

Publication number
DE69420474T2
DE69420474T2 DE69420474T DE69420474T DE69420474T2 DE 69420474 T2 DE69420474 T2 DE 69420474T2 DE 69420474 T DE69420474 T DE 69420474T DE 69420474 T DE69420474 T DE 69420474T DE 69420474 T2 DE69420474 T2 DE 69420474T2
Authority
DE
Germany
Prior art keywords
rinsing
ultra
pumping out
vacuum
vacuum chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69420474T
Other languages
English (en)
Other versions
DE69420474D1 (de
Inventor
Aihua Chen
Robert A Chapman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22188158&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69420474(T2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69420474D1 publication Critical patent/DE69420474D1/de
Publication of DE69420474T2 publication Critical patent/DE69420474T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4408Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber by purging residual gases from the reaction chamber or gas lines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/006Processes utilising sub-atmospheric pressure; Apparatus therefor
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00Single-crystal growth by condensing evaporated or sublimed materials
    • C30B23/002Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/14Feed and outlet means for the gases; Modifying the flow of the reactive gases
DE69420474T 1993-06-30 1994-06-28 Verfahren zum Spülen und Auspumpen einer Vakuumkammer bis Ultra-Hoch-Vakuum Expired - Fee Related DE69420474T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8493893A 1993-06-30 1993-06-30

Publications (2)

Publication Number Publication Date
DE69420474D1 DE69420474D1 (de) 1999-10-14
DE69420474T2 true DE69420474T2 (de) 2000-05-18

Family

ID=22188158

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69420474T Expired - Fee Related DE69420474T2 (de) 1993-06-30 1994-06-28 Verfahren zum Spülen und Auspumpen einer Vakuumkammer bis Ultra-Hoch-Vakuum

Country Status (5)

Country Link
US (2) US5536330A (de)
EP (1) EP0632144B1 (de)
JP (1) JPH0778775A (de)
KR (1) KR100336917B1 (de)
DE (1) DE69420474T2 (de)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0632144B1 (de) * 1993-06-30 1999-09-08 Applied Materials, Inc. Verfahren zum Spülen und Auspumpen einer Vakuumkammer bis Ultra-Hoch-Vakuum
JP3158264B2 (ja) * 1993-08-11 2001-04-23 東京エレクトロン株式会社 ガス処理装置
WO1995020823A1 (en) * 1994-01-27 1995-08-03 Insync Systems, Inc. Methods for improving semiconductor processing
US5711821A (en) * 1995-04-13 1998-01-27 Texas Instruments Incorporated Cleansing process for wafer handling implements
US5843239A (en) * 1997-03-03 1998-12-01 Applied Materials, Inc. Two-step process for cleaning a substrate processing chamber
US5879467A (en) * 1997-09-02 1999-03-09 Applied Materials, Inc. Cycle purging a vacuum chamber during bakeout process
US6054862A (en) * 1997-09-02 2000-04-25 Applied Materials, Inc. Vacuum chamber bakeout procedure for preventing ion gauge failure
US6105435A (en) * 1997-10-24 2000-08-22 Cypress Semiconductor Corp. Circuit and apparatus for verifying a chamber seal, and method of depositing a material onto a substrate using the same
DE19756830A1 (de) * 1997-12-19 1999-07-01 Wacker Chemie Gmbh Vakuumtechnisches Trocknen von Halbleiterbruch
US6596091B1 (en) * 1998-04-29 2003-07-22 Applied Materials, Inc. Method for sweeping contaminants from a process chamber
US6016611A (en) * 1998-07-13 2000-01-25 Applied Komatsu Technology, Inc. Gas flow control in a substrate processing system
US6193811B1 (en) 1999-03-03 2001-02-27 Applied Materials, Inc. Method for improved chamber bake-out and cool-down
US6406553B1 (en) * 1999-08-03 2002-06-18 Applied Materials, Inc. Method to reduce contaminants from semiconductor wafers
KR20010044998A (ko) * 1999-11-02 2001-06-05 박종섭 불순물 도핑 장치의 세정방법
US6323463B1 (en) 2000-03-29 2001-11-27 Applied Materials, Inc. Method and apparatus for reducing contamination in a wafer loadlock of a semiconductor wafer processing system
US6408860B1 (en) * 2000-09-21 2002-06-25 Trw Inc. Method for cleaning phosphorus from an MBE chamber
US6926776B1 (en) 2000-10-12 2005-08-09 General Electric Company Method for cleaning pressurized containers containing chlorine gas or sulfur dioxide gas
US6635119B1 (en) 2000-10-12 2003-10-21 General Electric Company Method of cleaning pressurized containers containing liquified petroleum gas
US6539961B1 (en) 2000-10-12 2003-04-01 General Electric Company System for cleaning pressurized containers such as mobile railcars
US6758913B1 (en) 2000-10-12 2004-07-06 General Electric Company Method of cleaning pressurized containers containing anhydrous ammonia
US6443166B1 (en) 2000-10-12 2002-09-03 General Electric Company Method of cleaning a pressurized container
US6793740B1 (en) 2000-10-12 2004-09-21 General Electric Company Method for cleaning pressurized containers containing moisture sensitive chemicals
US6532684B1 (en) * 2000-10-12 2003-03-18 General Electric Company System for cleaning pressurized containers
KR100336274B1 (ko) * 2000-12-28 2002-05-13 오학수 반도체 챔버내부의 불순물 제거장치
US20030013212A1 (en) * 2001-07-10 2003-01-16 Mitchell Bradley Dale System and method for removing deposited material from within a semiconductor fabrication device
US6531415B1 (en) 2002-01-30 2003-03-11 Taiwan Semiconductor Manufacturing Company Silicon nitride furnace tube low temperature cycle purge for attenuated particle formation
US20080223409A1 (en) * 2003-12-12 2008-09-18 Horsky Thomas N Method and apparatus for extending equipment uptime in ion implantation
EP1695369A4 (de) * 2003-12-12 2009-11-04 Semequip Inc Verfahren und vorrichtung zum erweitern der gerätelaufzeit bei der ionenimplantation
US20080073559A1 (en) * 2003-12-12 2008-03-27 Horsky Thomas N Controlling the flow of vapors sublimated from solids
JP4666576B2 (ja) 2004-11-08 2011-04-06 東京エレクトロン株式会社 セラミック溶射部材の洗浄方法、該方法を実行するためのプログラム、記憶媒体、及びセラミック溶射部材
US8460519B2 (en) * 2005-10-28 2013-06-11 Applied Materials Inc. Protective offset sputtering
US7884032B2 (en) * 2005-10-28 2011-02-08 Applied Materials, Inc. Thin film deposition
US8454804B2 (en) * 2005-10-28 2013-06-04 Applied Materials Inc. Protective offset sputtering
US7846257B2 (en) * 2005-12-14 2010-12-07 Tokyo Electron Limited Method for cleaning substrate processing apparatus, substrate processing apparatus, program and recording medium having program recorded therein
WO2008030501A2 (en) * 2006-09-06 2008-03-13 Ultra Clean Holdings, Incorporated Pre-certified process chamber and method
JP4605718B2 (ja) * 2006-09-14 2011-01-05 株式会社不二越 真空浸炭炉加熱室の前処理方法
US8069817B2 (en) * 2007-03-30 2011-12-06 Lam Research Corporation Showerhead electrodes and showerhead electrode assemblies having low-particle performance for semiconductor material processing apparatuses
JP5064119B2 (ja) * 2007-06-07 2012-10-31 東京エレクトロン株式会社 真空引き方法及び記憶媒体
US7611930B2 (en) * 2007-08-17 2009-11-03 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing display device
US7875125B2 (en) * 2007-09-21 2011-01-25 Semequip, Inc. Method for extending equipment uptime in ion implantation
JP4855366B2 (ja) * 2007-10-04 2012-01-18 株式会社アルバック 静電チャックのクリーニング方法
US8158530B2 (en) * 2008-09-10 2012-04-17 Globalfoundries Inc. Methods for retaining metal-comprising materials using liquid chemistry dispense systems from which oxygen has been removed
US20120298998A1 (en) * 2011-05-25 2012-11-29 Semiconductor Energy Laboratory Co., Ltd. Method for forming oxide semiconductor film, semiconductor device, and method for manufacturing semiconductor device
US9595695B2 (en) 2012-06-13 2017-03-14 Joled Inc. Method for removing impurities from inside of vacuum chamber, method for using vacuum apparatus, and method for manufacturing product
CN103853055B (zh) * 2012-11-28 2016-12-28 北京北方微电子基地设备工艺研究中心有限责任公司 反应腔室烘烤的实时控制方法及装置
CN103050267B (zh) * 2012-12-31 2016-01-20 厦门钨业股份有限公司 一种基于细粉热处理的烧结Nd-Fe-B系磁铁制作方法
US20150360247A1 (en) * 2013-01-22 2015-12-17 Essilor International (Compagnie Generale D'optique) Machine for coating an optical article with a predetermined coating composition and method for using the machine
CN103981571B (zh) * 2014-05-28 2017-06-23 英利能源(中国)有限公司 一种检测多晶铸锭炉设备气密性的方法
JP2017017277A (ja) * 2015-07-06 2017-01-19 株式会社Screenホールディングス 熱処理装置および熱処理方法
US20170062192A1 (en) * 2015-08-28 2017-03-02 Semiconductor Energy Laboratory Co., Ltd. Film forming apparatus
US10533264B1 (en) 2015-12-02 2020-01-14 General Graphene Corp. Apparatus for producing graphene and other 2D materials
US10892143B2 (en) 2016-10-21 2021-01-12 Applied Materials, Inc. Technique to prevent aluminum fluoride build up on the heater
KR20190002318A (ko) * 2017-06-29 2019-01-08 가부시키가이샤 에바라 세이사꾸쇼 배기계 설비 시스템
WO2021030336A1 (en) 2019-08-12 2021-02-18 Kurt J. Lesker Company Ultra high purity conditions for atomic scale processing
US11757020B2 (en) * 2020-01-31 2023-09-12 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device and method
US11512387B2 (en) 2020-04-13 2022-11-29 Applied Materials, Inc. Methods and apparatus for passivating a target
US20230330716A1 (en) * 2022-04-13 2023-10-19 General Electric Company System and method for cleaning turbine components

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3479679A (en) * 1967-10-23 1969-11-25 Us Navy Apparatus for cleansing a contaminated chamber
FR2138539B1 (de) * 1971-05-27 1973-05-25 Alsthom
US4017330A (en) * 1976-02-27 1977-04-12 Aidlin Samuel S Method and apparatus for internal spray cleaning of containers
US4045253A (en) * 1976-03-15 1977-08-30 Halliburton Company Passivating metal surfaces
US4423622A (en) * 1980-03-22 1984-01-03 Elan Pressure Clean Limited Pipe pressure testing and cleaning apparatus
US4402997A (en) * 1982-05-17 1983-09-06 Motorola, Inc. Process for improving nitride deposition on a semiconductor wafer by purging deposition tube with oxygen
US4432808A (en) * 1982-05-26 1984-02-21 Textron Inc. Treatment of stainless steel apparatus used in the manufacture, transport or storage of nitrogen oxides
US4512812A (en) * 1983-09-22 1985-04-23 Varian Associates, Inc. Method for reducing phosphorous contamination in a vacuum processing chamber
US4590100A (en) * 1983-10-28 1986-05-20 The United States Of America As Represented By The Secretary Of The Navy Passivation of steel with aqueous amine solutions preparatory to application of non-aqueous protective coatings
JPS61178187U (de) * 1985-04-26 1986-11-06
US4668530A (en) * 1985-07-23 1987-05-26 Massachusetts Institute Of Technology Low pressure chemical vapor deposition of refractory metal silicides
IT1198290B (it) * 1986-12-02 1988-12-21 Sgs Microelettronica Spa Metodo di decontaminazione di una camera utilizzata nei processi sotto vuoto di deposizione,attacco o crescita di films di elevata purezza,di particolare applicazione nella tecnologia dei semiconduttori
US4816081A (en) * 1987-02-17 1989-03-28 Fsi Corporation Apparatus and process for static drying of substrates
US4828760A (en) * 1987-03-09 1989-05-09 Rockwell International Corporation Method of cleaning a spent fuel assembly
JPH02303115A (ja) * 1989-05-18 1990-12-17 Fujitsu Ltd 真空処理方法
JPH0757913B2 (ja) * 1989-10-27 1995-06-21 オリエンタルエンヂニアリング株式会社 脱脂洗浄方法および装置
US5238503A (en) * 1991-04-09 1993-08-24 International Business Machines Corporation Device for decontaminating a semiconductor wafer container
EP0632144B1 (de) * 1993-06-30 1999-09-08 Applied Materials, Inc. Verfahren zum Spülen und Auspumpen einer Vakuumkammer bis Ultra-Hoch-Vakuum

Also Published As

Publication number Publication date
EP0632144B1 (de) 1999-09-08
JPH0778775A (ja) 1995-03-20
EP0632144A3 (de) 1996-08-07
KR950001936A (ko) 1995-01-04
US5536330A (en) 1996-07-16
EP0632144A2 (de) 1995-01-04
US5759287A (en) 1998-06-02
DE69420474D1 (de) 1999-10-14
KR100336917B1 (ko) 2002-11-23

Similar Documents

Publication Publication Date Title
DE69420474T2 (de) Verfahren zum Spülen und Auspumpen einer Vakuumkammer bis Ultra-Hoch-Vakuum
DE69221702D1 (de) Verfahren zum Herstellen eines mit Plasma behandelten Gegenstandes
DE69106068D1 (de) Verfahren zum Verarbeiten der Endabschnitte eines Gestricks.
DE69009595D1 (de) Verfahren zum Reinigen der Filterplatten eines Saugtrockners.
DE69518710D1 (de) Verfahren zum Behandeln eines Substrats in einer Vakuumbehandlungskammer
DE69107119D1 (de) Verfahren zum Betreiben eines Staubsaugers.
DE69032824T2 (de) Verfahren zum Laseraufdampfen
DE69506675T2 (de) Verfahren zur Ausführung von modularen Reduktion nach der Montgomery-Methode
DE69430215T2 (de) Verfahren zum Herstellen von Doppelplüschgeweben
DE59408739D1 (de) Verfahren zum Herstellen von lackierten Teilen
DE69019521T2 (de) Verfahren zum Herstellen eines Plasmabildschirms.
DE69229195T2 (de) Verfahren zum reaktiven Ionenätzen
DE69409066D1 (de) Verfahren zur Behandlung einer Oberfläche
DE69016076D1 (de) Verfahren zur Behandlung einer Metallfläche.
DE68920615T2 (de) Verfahren zur Regenerierung eines Permanganatbeizbades.
DE59300750D1 (de) Verfahren zum Herstellen einer Abdichtung.
DE69114371D1 (de) Verfahren zum Gasphasenabscheiden.
DE59409429D1 (de) Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE69410703T2 (de) Verfahren zum Vakuumdruckgiessen
DE69405670D1 (de) Verfahren zum Herstellen von Diestern ungesättigter Glykole
DE69317332T2 (de) Partikeln-Entfernungsverfahren in einer Plasma-Bearbeitungskammer
DE59306715D1 (de) Verfahren zum Herstellen voluminöser Gestricke
DE69523638T2 (de) Verfahren zum Reinigen von Methacrylat
DE69115387T2 (de) Verfahren zum Herstellen eines Glasgegenstandes
DE69125583T2 (de) Verfahren zur Herstellung von Industriegewebe

Legal Events

Date Code Title Description
8363 Opposition against the patent
8365 Fully valid after opposition proceedings
8339 Ceased/non-payment of the annual fee